CN203536224U - Upper-lower epoxy resin seal structure for plastic housing capacitor - Google Patents

Abstract

The utility model discloses an upper-lower epoxy resin seal structure for a plastic housing capacitor. The structure comprises a capacitor plastic housing. A capacitor core package is arranged inside the capacitor plastic housing. Epoxy resin seal layers are injection molded at the upper end and lower end inside the capacitor plastic housing. The capacitor core package is arranged in a cavity between the two epoxy resin seal layers. A capacitor lead-out terminal wire passes through the epoxy resin seal layer at the upper end of the capacitor. According to the utility model, the upper-lower epoxy resin seal structure is simple in structure and reasonable in design, the capacitor core package can be sufficiently fixed inside the plastic housing, metal spraying layers at two ends of the core package can be protected by epoxy resin, and the area between the metal spraying layers at two ends of the core package and a cover plate is sealed and protected by epoxy resin with a corresponding thickness, so that the overall strength of the capacitor is improved, the sealing and fixing effects approach full irrigation effects, and the material consumption is low.

Description

Molded case capacitor upper and lower epoxy resin sealed structure

technical field

The utility model relates to the technical field of capacitors, in particular to an epoxy resin sealing structure for upper and lower parts of a plastic case capacitor.

Background technique

At present, epoxy resin perfusion is generally used in the assembly process of CBB60 plastic case capacitors. In order to achieve the function of sealing and fixing the core package. There are two methods of filling: ①full filling, that is, to fill all the gaps between the core package and the plastic case with epoxy resin. This method is very good for sealing and fixing the core package, but the cost of consumables is high. ②Inject epoxy resin about one-third of the volume of the gap between the core package and the plastic case into the shell, put it into the core package and cover it upside down, so that the epoxy resin forms a sealing layer at the opening of the shell . This operation is convenient and cost-saving, but the disadvantages are: ①The bottom of the plastic case capacitor is hollow, so it is easy to be damaged during transportation. ②When some users use screws to fix the capacitor, it is easy to pierce the bottom of the capacitor case. ③The cured epoxy resin cannot fix the core package, and the capacitor jingles when shaken, or the core package is too close to the plastic case cover, so that the sealing layer is too thin to achieve the ideal sealing effect.

Utility model content

The purpose of the utility model is to provide an epoxy resin sealing structure on the top and bottom of the plastic case capacitor in order to make up for the defects of the prior art.

The utility model is achieved through the following technical solutions:

An upper and lower epoxy resin sealing structure of a molded case capacitor, comprising a capacitor plastic case, a capacitor core package is placed inside the capacitor plastic case, and an epoxy resin sealing layer is injection molded at the upper end and the lower end of the capacitor plastic case respectively, the capacitor The core package is located in the cavity between the two layers of epoxy resin sealing layers, and the lead wires of the capacitor lead pass through the epoxy resin sealing layer at the upper end of the capacitor plastic case.

The utility model has the advantages of simple structure and reasonable design, the capacitor core package can be sufficiently fixed in the plastic case, the gold-sprayed layers at both ends of the core package can be fully protected by epoxy resin, and the two ends of the core package are sprayed with gold. There is a corresponding thickness of epoxy resin sealing protection between the gold layer and the cover plate, the overall strength of the capacitor is improved, the sealing and fixing effect is close to the full filling effect, and the consumables are less.

Description of drawings

Figure 1 is a schematic structural view of the utility model.

Detailed ways

As shown in Fig. 1, a type of epoxy resin sealing structure for the upper and lower sides of the plastic case capacitor includes a capacitor plastic case 1, a capacitor core bag 2 is placed in the capacitor plastic case 1, and injection molding is made at the upper end and the lower end of the capacitor plastic case 1 respectively. Epoxy resin sealing layer 3 , the capacitor core package 2 is located in the cavity between two layers of epoxy resin sealing layers 3 , and the capacitor lead wire 4 passes through the epoxy resin sealing layer 3 on the upper end of the capacitor plastic case 1 .

Claims (1)

1. An epoxy resin sealing structure up and down a molded case capacitor is characterized in that: it includes a capacitor plastic case, a capacitor core bag is placed in the capacitor plastic case, and an epoxy resin seal is injection molded at the upper end and the lower end of the capacitor plastic case respectively. layer, the capacitor core package is located in the cavity between the two layers of epoxy resin sealing layer, and the lead wire of the capacitor passes through the epoxy resin sealing layer at the upper end of the capacitor plastic case.

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