CN109183002A - The plasma vacuum filming equipment and application method of a kind of electrode and workpiece motion s - Google Patents
The plasma vacuum filming equipment and application method of a kind of electrode and workpiece motion s Download PDFInfo
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- CN109183002A CN109183002A CN201811227791.6A CN201811227791A CN109183002A CN 109183002 A CN109183002 A CN 109183002A CN 201811227791 A CN201811227791 A CN 201811227791A CN 109183002 A CN109183002 A CN 109183002A
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- Prior art keywords
- plasma
- workpiece
- vacuum
- motion
- cavity
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4584—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally the substrate being rotated
Abstract
The invention discloses a kind of electrode and the plasma vacuum filming equipments and application method of workpiece motion s, the equipment includes moving electrodes, vacuum pumping hardware, plasma vacuum cavity and the telecontrol equipment, plasma discharge source, the admission line that drive workpiece, plasma discharge source and vacuum pumping hardware are arranged in the outside of plasma vacuum cavity, moving electrodes and drive the telecontrol equipment of workpiece in the inside of plasma vacuum cavity.The application method of the equipment treats film-coating workpiece progress plated film etc. the following steps are included: plasma vacuum cavity vacuumize.The present invention takes plasma enhanced chemical vapor deposition method to improve the rate of settling and plated film production efficiency of plated film, the uniformity and consistency for making plated film are improved, the protection effects such as waterproof, anti-sweat, moisture-proof, the corrosion-resistant, solvent resistant of coating are also improved simultaneously, can be used for the occasion of the plated films such as various PCB, PCBA, electronic product, electrical component, electronics semi-finished product, metal, electronic component, semiconductor, integrated circuit board, plasthetics.
Description
Technical field
The present invention relates to plasma chemical vapor deposition technique field, more particularly to a kind of electrode and workpiece motion s
Plasma vacuum filming equipment and application method.
Background technique
Plasma enhanced chemical vapor deposition PECVD: being to make by microwave or radio frequency etc. containing film composed atom
Gas ionization is being partially formed plasma, and plasma chemistry activity is very strong, it is easy to react, sink on substrate
Product goes out desired film.In order to carry out chemical reaction can at a lower temperature, the activity of plasma is utilized to promote
Into reaction, thus this CVD is known as plasma enhanced chemical vapor deposition (PECVD).It tests mechanism: being by microwave or to penetrate
Frequency etc. makes the gas containing film composed atom, is being partially formed plasma, and plasma chemistry activity is very strong, it is easy to
It reacts, goes out desired film in deposition on substrate.
That there is the rates of settling is low for existing filming equipment and method, production efficiency is low, plates film uniformity and consistency
The disadvantages of difference, the waterproof of coating, anti-sweat, moisture-proof, corrosion-resistant, solvent resistant and other effects are poor, chemical substance used in plated film etc.
Also it is easy to pollute the environment, this does not meet requirement of the country to Green Development yet.
Summary of the invention
The purpose of the present invention is to provide a kind of electrode and the plasma vacuum filming equipment and application method of workpiece motion s,
The plasma vacuum film plating process of electrode and workpiece motion s improves the rate of settling and plated film production efficiency of plating membrane substance, electrode
And the movement of workpiece is greatly improved the uniformity of plated film and consistency, and then improves the waterproof of coating, anti-sweat, prevents
The protection effects such as damp, corrosion-resistant, solvent resistant.
In order to achieve the above objectives, the present invention adopts the following technical scheme:
A kind of plasma vacuum filming equipment of electrode and workpiece motion s, including moving electrodes, vacuum pumping hardware, etc. from
Sub- vacuum cavity and telecontrol equipment, plasma discharge source, the admission line for driving workpiece, plasma discharge source, vacuum row
Device of air is arranged in the outside of plasma vacuum cavity, moving electrodes and drives the telecontrol equipment of workpiece in plasma vacuum cavity
Inside.
The moving electrodes are set to inside cavity, can by the motion of setting, moving electrodes be it is a pair of or
It is more than a pair.
The vacuum pumping hardware includes vacuum pump and exhaust pipe, and vacuum pump divides firsts and seconds, vacuum evacuation dress
It sets and is connected by pipeline with plasma vacuum cavity.
The plasma vacuum cavity is cylindrical cavity, cube shaped chamber or spherical fluid chamber, volume 30-
1200L。
The telecontrol equipment of the drive workpiece can carry place one or more workpiece to be coated and can wait from
By the motion of setting in sub- vacuum cavity, motion mode includes: space reciprocating motion, circular motion, oval week
Movement, spheric motion, planetary motion, planar reciprocating or other irregular routes.
The plasma discharge source discharge mode be microwave discharge, radio frequency discharge, spark discharge, high-frequency discharge,
Intermediate frequency electric discharge and the mixing of several discharge modes electric discharge.
The admission line is the channel that gas or steam enter cavity.
The plasma vacuum cavity is connected to vacuum-pressure detection meter.
A kind of application method of the plasma vacuum filming equipment of electrode and workpiece motion s, comprising the following steps:
A, plasma vacuum cavity is opened, workpiece to be coated is placed on telecontrol equipment, closes plasma vacuum cavity；
B, starting operation program, the vacuum pump of vacuum pumping hardware continuously vacuumize plasma vacuum cavity, when
When plasma vacuum cavity internal pressure reaches 5-200 millitorr, opening movement device, electrode and workpiece setting in motion；
C, plasma discharge source is opened, admission line is passed through gas of carrier gas and formula gas or gas of carrier gas and formula steams
Vapour forms plasma in vacuum cavity, then carries out chemical vapor deposition, starts to carry out plated film；
D, after plated film end cycle, stopping is passed through gas of carrier gas and formula gas or gas of carrier gas and formula steam, is passed through
Inert gas or air carry out purging dilution to plasma vacuum cavity, then proceed to be passed through air, make plasma vacuum cavity
Pressure it is identical as external pressure；Telecontrol equipment stops, and opens plasma vacuum cavity, and the workpiece for completing plated film is taken out.
The formula gas or formula steam is one or more, can each lead into, reach multi-layer effect；According to
The coating film thickness and effect requirements of different product, plated film time continue 30s-9000s.
The present invention has an advantage that compared with other equipment and method
1, the present invention takes the plasma enhanced chemical vapor deposition method of electrode and workpiece motion s to improve plated film object
The rate of settling and plated film production efficiency of matter, the uniformity and consistency of plated film are improved, at the same also improve coating waterproof,
The protection effects such as anti-sweat, moisture-proof, corrosion-resistant, solvent resistant.
2, it is provided with moving electrodes in the invention cavity and drives the telecontrol equipment of workpiece, farthest ensure that electricity
The relative motion of pole, workpiece and gas makes the uniformity of plated film and consistency obtain very big improvement.Plasma chemical reaction
The polymerizate of generation is deposited on workpiece surface, generates nano thick film, and film layer alternating deposit reaches waterproof and dampproof, acid and alkali-resistance
The characteristics such as salt fog.
3, vacuum pump is by system software controls revolving speed with the intracorporal pressure of adjusting cavity.
4, the product to be coated is extensive, be PCB, PCBA, electronic product, electrical component, electronics semi-finished product, metal,
Electronic component, semiconductor, integrated circuit board, plasthetics etc..
5, according to the actual needs of subject matter, several formula gases, steam can be alternately passed through, and reach multi-layer effect.
Detailed description of the invention
Below in conjunction with drawings and examples, the present invention will be further described.
Fig. 1 is structural schematic diagram of the invention；
Specific embodiment
Embodiment 1
A kind of plasma vacuum filming equipment of electrode and workpiece motion s, for giving PCBA plated film, including moving electrodes 1,
Vacuum pumping hardware 2, plasma vacuum cavity 3, telecontrol equipment 4, plasma discharge source 5, the admission line 6 for driving workpiece,
The outside of plasma vacuum cavity 3, moving electrodes 1 and drive workpiece is arranged in plasma discharge source 5 and vacuum pumping hardware 2
Telecontrol equipment 4 in the inside of plasma vacuum cavity 3
The moving electrodes 1 are set to inside cavity 3, share a pair, electrode 1 is in cavity 3 along the circle close to cavity
Week moves reciprocatingly.
The vacuum pumping hardware 2 includes vacuum pump 21 and exhaust pipe, and vacuum pump 21 divides firsts and seconds, is vacuum-evacuated
Device 2 is connected by pipeline with plasma vacuum cavity 3.
The plasma vacuum cavity 3 is cylindrical cavity, volume 900L.
The telecontrol equipment 4 of the drive workpiece can carry more than one workpiece to be coated of placement and in plasma vacuum
Circumference and planetary motion are done in cavity.
5 discharge mode of plasma discharge source is radio frequency discharge.
The admission line 6 is the channel that gas or steam enter cavity.
The plasma vacuum cavity 3 is connected to vacuum-pressure detection meter.
A kind of application method of the plasma vacuum filming equipment of electrode and workpiece motion s, comprising the following steps:
A, plasma vacuum cavity 3 is opened, PCBA to be coated is placed on the telecontrol equipment 4 for driving workpiece, close etc.
Ion vacuum cavity 3；
B, starting operation program, the vacuum pump 21 of vacuum pumping hardware 2 continuously take out to plasma vacuum cavity 3 true
Sky, when pressure reaches 20 millitorr in plasma vacuum cavity 3, opening movement device, electrode and workpiece setting in motion；
C, plasma discharge source 5 is opened, admission line 6 is passed through gas of carrier gas and formula steam, the shape in vacuum cavity 3
At plasma, chemical vapor deposition is then carried out, starts to carry out plated film；
D, after plated film end cycle, stopping is passed through gas of carrier gas and formula gas, is passed through air to plasma vacuum cavity 3
Purging dilution is carried out, then proceedes to be passed through air, keeps the pressure of plasma vacuum cavity 3 identical as external pressure；Sportswear
4 stoppings are set, plasma vacuum cavity 3 is opened, the PCBA for completing plated film is taken out.
The formula gas is two kinds, and plated film time continues 6000s.
Embodiment 2
The plasma vacuum filming equipment of a kind of electrode and workpiece motion s, for giving bluetooth headset plated film, including movement electricity
Pole 1, vacuum pumping hardware 2, plasma vacuum cavity 3, telecontrol equipment 4, the plasma discharge source 5, air inlet pipe for driving workpiece
The outside of plasma vacuum cavity 3, moving electrodes 1 and drive is arranged in road 6, plasma discharge source 5 and vacuum pumping hardware 2
The telecontrol equipment 4 of workpiece is in the inside of plasma vacuum cavity 3.
The moving electrodes 1 are set to inside vacuum cavity 3, there is two pairs of electrodes, and electrode does flatness and reciprocator in cavity 3
Movement.
The vacuum pumping hardware 2 includes vacuum pump 21 and exhaust pipe, and vacuum pump 21 divides level-one second level, vacuum evacuation dress
2 are set to be connected by pipeline with plasma vacuum cavity 3.
The plasma vacuum cavity 3 is cubic chamber, volume 360L.
The telecontrol equipment 4 of the drive workpiece can carry more than one workpiece to be coated of placement and in plasma vacuum
It moves in a circle in cavity.
5 discharge mode of plasma discharge source is that radio frequency and intermediate frequency discharge.
The admission line 6 is the channel that gas or steam enter cavity.
The plasma vacuum cavity 3 is connected to vacuum-pressure detection meter.
A kind of application method of the plasma vacuum filming equipment of electrode and workpiece motion s, comprising the following steps:
A, plasma vacuum cavity 3 is opened, workpiece to be coated is placed on the telecontrol equipment 4 for driving workpiece, close etc.
Ion vacuum cavity 3；
B, starting operation program, the vacuum pump 21 of vacuum pumping hardware 2 continuously take out to plasma vacuum cavity 3 true
Sky, when pressure reaches 35 millitorr in plasma vacuum cavity 3, opening movement device, electrode and workpiece setting in motion；
C, plasma discharge source 5 is opened, admission line 6 is passed through gas of carrier gas and formula steam, the shape in vacuum cavity 3
At plasma, chemical vapor deposition is then carried out, starts to carry out plated film；
D, after plated film end cycle, stopping is passed through gas of carrier gas and formula gas, is passed through air to plasma vacuum cavity 3
Purging dilution is carried out, then proceedes to be passed through air, keeps the pressure of plasma vacuum cavity 3 identical as external pressure；Sportswear
4 stoppings are set, plasma vacuum cavity 3 is opened, the workpiece for completing plated film is taken out.
The formula gas is one kind, and plated film time continues 1800s.
Although those skilled in the art should manage the foregoing describe concrete technology of the invention and embodiment
Solution, protection scope of the present invention are defined by the appended claims.Those skilled in the art is without departing substantially from of the invention
Under the premise of principle and essence, many changes and modifications may be made, but these change and modification are fallen
Enter protection scope of the present invention.
Claims (10)
1. the plasma vacuum filming equipment of a kind of electrode and workpiece motion s, it is characterised in that: including moving electrodes, vacuum evacuation
Device, plasma vacuum cavity, telecontrol equipment, plasma discharge source, the admission line for driving workpiece, plasma discharge
Source, vacuum pumping hardware are arranged in the outside of plasma vacuum cavity, moving electrodes and drive the telecontrol equipment of workpiece wait from
The inside of sub- vacuum cavity.
2. the plasma vacuum filming equipment of a kind of electrode according to claim 1 and workpiece motion s, it is characterised in that: institute
The moving electrodes stated are set to inside cavity, can be a pair of or a pair or more by the motion of setting, moving electrodes.
3. the plasma vacuum filming equipment of a kind of electrode according to claim 1 and workpiece motion s, it is characterised in that: institute
The vacuum pumping hardware stated includes vacuum pump and exhaust pipe, and vacuum pump divides firsts and seconds, and vacuum pumping hardware passes through pipeline
It is connected with plasma vacuum cavity.
4. the plasma vacuum filming equipment of a kind of electrode according to claim 1 and workpiece motion s, it is characterised in that: institute
The plasma vacuum cavity stated is cylindrical cavity, cube shaped chamber or spherical fluid chamber, volume 30-1200L.
5. the plasma vacuum filming equipment of a kind of electrode according to claim 1 and workpiece motion s, it is characterised in that: institute
The telecontrol equipment for the drive workpiece stated can carry one or more workpiece to be coated of placement and can be in plasma vacuum cavity
The interior motion by setting, motion mode include: space reciprocating motion, circular motion, ellipse circular motion, spherical surface fortune
Dynamic, planetary motion, planar reciprocating or other irregular routes.
6. the plasma vacuum filming equipment of a kind of electrode according to claim 1 and workpiece motion s, it is characterised in that: institute
The plasma discharge source discharge mode stated be microwave discharge, radio frequency discharge, spark discharge, high-frequency discharge, intermediate frequency electric discharge and
The mixing of several discharge modes is discharged.
7. the plasma vacuum filming equipment of a kind of electrode according to claim 1 and workpiece motion s, it is characterised in that: institute
The admission line stated is the channel that gas or steam enter cavity.
8. the plasma vacuum filming equipment of a kind of electrode according to claim 1 and workpiece motion s, it is characterised in that: institute
The plasma vacuum containment portion stated is connected to vacuum-pressure detection meter.
9. according to a kind of method for the plasma vacuum filming equipment for using described in claim 1 electrode and workpiece motion s,
It is characterized in that: the following steps are included:
A, plasma vacuum cavity is opened, workpiece to be coated is placed on telecontrol equipment, closes plasma vacuum cavity；
B, starting operation program, the vacuum pump of vacuum pumping hardware continuously vacuumizes plasma vacuum cavity, when it is equal from
When pressure reaches 5-200 millitorr in sub- vacuum cavity, opening movement device, electrode and workpiece setting in motion；
C, plasma discharge source is opened, admission line is passed through gas of carrier gas and formula gas or gas of carrier gas and formula steam,
Plasma is formed in vacuum cavity, then carries out chemical vapor deposition, starts to carry out plated film；
D, after plated film end cycle, stopping is passed through gas of carrier gas and formula gas or gas of carrier gas and formula steam, is passed through inertia
Gas or air carry out purging dilution to plasma vacuum cavity, then proceed to be passed through air, make the pressure of plasma vacuum cavity
Power is identical as external pressure；Telecontrol equipment stops, and opens plasma vacuum cavity, and the workpiece for completing plated film is taken out.
10. the method for the plasma vacuum filming equipment of electrode according to claim 1 and workpiece motion s, feature exist
It is one or more in: the formula gas or steam, can each leads into, reach multi-layer effect；According to different product
Coating film thickness and effect requirements, plated film time continue 30s-9000s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811227791.6A CN109183002A (en) | 2018-10-22 | 2018-10-22 | The plasma vacuum filming equipment and application method of a kind of electrode and workpiece motion s |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811227791.6A CN109183002A (en) | 2018-10-22 | 2018-10-22 | The plasma vacuum filming equipment and application method of a kind of electrode and workpiece motion s |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109183002A true CN109183002A (en) | 2019-01-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811227791.6A Pending CN109183002A (en) | 2018-10-22 | 2018-10-22 | The plasma vacuum filming equipment and application method of a kind of electrode and workpiece motion s |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112538618A (en) * | 2019-09-20 | 2021-03-23 | 江苏菲沃泰纳米科技股份有限公司 | Moving electrode device, movable support device and application |
| WO2021051779A1 (en) * | 2019-09-20 | 2021-03-25 | 江苏菲沃泰纳米科技有限公司 | Coating apparatus, moving electrode device and movable support device therefor, and use thereof |
| US20210193441A1 (en) * | 2019-12-18 | 2021-06-24 | Jiangsu Favored Nanotechnology Co., Ltd. | Coating Apparatus and Coating Method |
| WO2021120540A1 (en) * | 2019-12-18 | 2021-06-24 | 江苏菲沃泰纳米科技有限公司 | Coating device and coating method thereof |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US11555247B2 (en) | 2019-09-20 | 2023-01-17 | Jiangsu Favored Nanotechnology Co., Ltd. | Coating apparatus and movable electrode arrangement, movable support arrangement, and application thereof |
| WO2021051779A1 (en) * | 2019-09-20 | 2021-03-25 | 江苏菲沃泰纳米科技有限公司 | Coating apparatus, moving electrode device and movable support device therefor, and use thereof |
| CN112538618B (en) * | 2019-09-20 | 2022-02-22 | 江苏菲沃泰纳米科技股份有限公司 | Moving electrode device, movable support device and application |
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| CN112538618A (en) * | 2019-09-20 | 2021-03-23 | 江苏菲沃泰纳米科技股份有限公司 | Moving electrode device, movable support device and application |
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| US20210193441A1 (en) * | 2019-12-18 | 2021-06-24 | Jiangsu Favored Nanotechnology Co., Ltd. | Coating Apparatus and Coating Method |
| WO2021120540A1 (en) * | 2019-12-18 | 2021-06-24 | 江苏菲沃泰纳米科技有限公司 | Coating device and coating method thereof |
| CN113412342A (en) * | 2019-12-18 | 2021-09-17 | 江苏菲沃泰纳米科技股份有限公司 | Film coating equipment and film coating method thereof |
| CN113454265A (en) * | 2019-12-18 | 2021-09-28 | 江苏菲沃泰纳米科技股份有限公司 | Film coating equipment and film coating method thereof |
| CN113454265B (en) * | 2019-12-18 | 2022-09-27 | 江苏菲沃泰纳米科技股份有限公司 | Film coating equipment and film coating method thereof |
| CN113412342B (en) * | 2019-12-18 | 2023-04-28 | 江苏菲沃泰纳米科技股份有限公司 | Coating equipment and coating method thereof |
| US11898248B2 (en) | 2019-12-18 | 2024-02-13 | Jiangsu Favored Nanotechnology Co., Ltd. | Coating apparatus and coating method |
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