CN109161379A - The processing method of abrasive - Google Patents

The processing method of abrasive Download PDF

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Publication number
CN109161379A
CN109161379A CN201810918228.7A CN201810918228A CN109161379A CN 109161379 A CN109161379 A CN 109161379A CN 201810918228 A CN201810918228 A CN 201810918228A CN 109161379 A CN109161379 A CN 109161379A
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abrasive
partial size
sedimentation
processed
processing method
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CN201810918228.7A
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CN109161379B (en
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蒋安国
邓江
钟钦
杨建坤
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Hunan Chuang Yao Photoelectric Technology Co Ltd
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Hunan Chuang Yao Photoelectric Technology Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • C09K3/1409Abrasive particles per se

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

This application involves a kind of processing methods of abrasive, including following sorting step: abrasive to be processed and water being mixed, stoste is obtained;Flocculant and stoste are mixed, standing sedimentation obtains suspension, on collection liquid surface in the sedimentation time to the suspension between sedimentation face, is dehydrated to obtain treated abrasive, the distance between liquid surface to sedimentation face is no more than the 4/5 of suspension total height.The processing method of above-mentioned abrasive, it is 1220g:(9.5~10 by the mass volume ratio of control abrasive and water) L, add flocculant, after standing sedimentation, the abrasive of required target grain size can be obtained to the suspension between sedimentation face for collection liquid surface within the specific sedimentation time, abrasive size distribution is more uniform, and this method only uses water and a small amount of flocculant, and cost is relatively low.

Description

The processing method of abrasive
Technical field
The present invention relates to grinding and polishing technical fields, more particularly to a kind of processing method of abrasive.
Background technique
Optical grinding is a kind of currently popular precision machinery cooked mode, is mainly used for processing in the precision equipments such as punch die Key part, be suitble to high hardness material molding grinding.The progress of optical grinding is carried out mainly by means of abrasive.With The development of Ultraprecision Machining, it is also higher and higher to the quality requirement of abrasive.Although also there is the grinding of better quality at present Material, but it is expensive be difficult to large-scale use, and there is the scarce of particle size distribution difference in cheap abrasive mostly Point, it is difficult to meet the high technical requirements closely processed.
Therefore, find it is a kind of low cost, even particle size distribution abrasive become the focus of people's research.
Summary of the invention
Based on this, it is necessary to provide a kind of processing method of abrasive, abrasive size distribution after treatment by using the treatment method Uniformly and cost is relatively low.
A kind of processing method of abrasive, comprising the following steps:
Abrasive to be processed is provided, in terms of mass percentage, the abrasive to be processed is containing within 15% Silicon carbide abrasive of the partial size at 28 μm or more;Or to be ground containing the partial size within 12% in 10 μm or more of silicon carbide Material;It or is the corundum abrasive containing the partial size within 12% at 5 μm or more;
The abrasive and water are mixed, obtain stoste, the mass volume ratio of the abrasive and water is 1220g:(9.5 ~10) L;
Flocculant and the stoste are mixed, standing sedimentation obtains suspension, and collection liquid surface extremely settles within the sedimentation time The suspension between face, is dehydrated to obtain treated abrasive, and the distance between described liquid surface to sedimentation face is no more than institute State suspension total height 4/5;
When silicon carbide abrasive of the partial size at 28 μm or more within the abrasive to be processed is containing 15%, institute Stating the sedimentation time is 4~5 minutes;
When silicon carbide abrasive of the partial size at 10 μm or more within the abrasive to be processed is containing 12%, institute Stating the sedimentation time is 18~20 minutes;
It is described when corundum abrasive of the partial size at 5 μm or more within the abrasive to be processed is containing 12% Sedimentation time is 72~80 minutes.
Partial size within being in one of the embodiments, containing 15% when the abrasive to be processed is at 28 μm or more Silicon carbide abrasive or for containing the partial size within 12%, in 10 μm or more of silicon carbide abrasive, the flocculant is water Glass.
The waterglass and the mass volume ratio of the stoste are 0.5g:1L in one of the embodiments,.
Partial size within being in one of the embodiments, containing 12% when the abrasive to be processed is at 5 μm or more Corundum abrasive when, the flocculant be concentrated hydrochloric acid.
The volume of the concentrated hydrochloric acid and the stoste is 2.6mL:1L in one of the embodiments,.
In one of the embodiments, the processing method of above-mentioned abrasive further include using microscopic analysis to dehydration after Abrasive the step of testing.
Described the step of being tested using microscopic analysis to dewatered abrasive in one of the embodiments, Include:
The dewatered abrasive of 18g~20g is uniformly laid on the sampling paper of 40mm × 40mm;
The sampling paper for being equipped with abrasive is divided into the grid of 10mm × 10mm, equal quality is taken out from each grid Abrasive, until the total amount of abrasive is 5g~7g;
Powder belt is laid to after the abrasive of taking-up is mixed;
The powder belt is uniformly divided into 7~8 parts along its length, the abrasive of even number section is taken out, by remaining abrasive Mixing repeats the step of being laid to powder belt and taking out even number section abrasive, until the total amount of remaining abrasive is 0.5g ~1.0g, obtains sample survey;
Glycerol is added dropwise on object carrier, sample survey described in picking is mixed with the glycerol, obtained containing the sweet of abrasive Oil;
Slide is covered on the glycerol containing abrasive, and is slowly moved, and makes the glycerol containing abrasive described Uniform glycerin layer is formed between object carrier and the slide;
It is tested using partial size of the microscope to the abrasive in the glycerin layer, if disqualified upon inspection, repeatedly institute Sorting step is stated, until examining qualification.
The length of the powder belt is 7cm~8cm, width 1cm in one of the embodiments,.
When the use microscope is tested in one of the embodiments, microscopical object lens amplify 40 times, eyepiece 7 times of amplification.
The processing method of above-mentioned abrasive is 1220g:(9.5~10 by the mass volume ratio of control abrasive and water) L, adds flocculant, and after standing sedimentation, according to the difference of abrasive, collection liquid surface is to settling face within the specific sedimentation time Between suspension the abrasive of required target grain size can be obtained, abrasive size distribution is more uniform, and this method is only used To water and a small amount of flocculant, cost is relatively low.
Specific embodiment
To facilitate the understanding of the present invention, below will to invention is more fully described, and give it is of the invention compared with Good embodiment.But the invention can be realized in many different forms, however it is not limited to embodiment described herein.Phase Instead, purpose of providing these embodiments is makes the disclosure of the present invention more thorough and comprehensive.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term as used herein "and/or" includes one or more phases Any and all combinations of the listed item of pass.
The processing method of the abrasive of one embodiment, including following sorting step S110~S130:
S110, abrasive to be processed is provided.
Wherein, above-mentioned abrasive to be processed is the silicon carbide abrasive containing the partial size within 15% at 28 μm or more (wherein also the partial size containing 55% or more is 20 μm~28 μm of silicon carbide, the carbon that 80% or more partial size is 14 μm~28 μm The silicon carbide that the partial size of SiClx and 10% or more is 5 μm~14 μm), it is denoted as W28, i.e., commercially available W28 silicon carbide abrasive.
Alternatively, above-mentioned abrasive to be processed is the silicon carbide abrasive containing the partial size within 12% at 10 μm or more (wherein also the partial size containing 50% or more is 7 μm~10 μm of silicon carbide, the carbonization that 80% or more partial size is 5 μm~10 μm The silicon carbide that the partial size of silicon and 10% or more is 2.5 μm~5 μm), it is denoted as W10, i.e., commercially available W10 silicon carbide abrasive.
Alternatively, above-mentioned abrasive to be processed be containing the partial size within 12% 5 μm or more corundum abrasive (wherein Also the partial size containing 50% or more be 3 μm~5 μm of corundum, the corundum that 80% or more partial size is 2.5 μm~5 μm and 13% with On partial size be 1.5 μm~2.5 μm of corundum), be denoted as W5, i.e., commercially available W5 corundum abrasive.
S120, above-mentioned abrasive to be processed and water are mixed, obtains stoste.
Wherein, the mass volume ratio of abrasive and water is 1220g:(9.5~10) L.
S130, flocculant and above-mentioned stoste are mixed, standing sedimentation obtains suspension, the collection liquid surface within the sedimentation time Suspension between to sedimentation face is dehydrated to obtain treated abrasive, and wherein the distance between liquid surface to sedimentation face is no more than The 4/5 of suspension total height.
It is appreciated that the liquid level that sedimentation face i.e. target grain size particle can arrive within the sedimentation time, is more than target at this time The particle of partial size has all been deposited to sedimentation face position below, and is then dispersed with from liquid surface to the suspension between sedimentation face The particle of target grain size, therefore, as long as institute can be obtained on collection liquid surface in the sedimentation time to the suspension between sedimentation face Need the particle of target grain size.Applicant has found that it is always high that the distance in liquid surface to sedimentation face is no more than suspension by many experiments When spending 4/5, treatment effeciency highest.
Specifically, silicon carbide abrasive of the partial size within being containing 15% when abrasive to be processed at 28 μm or more When, the sedimentation time is 4~5 minutes.I.e. through 4~5 minutes, silicon carbide abrasive of the partial size within 28 μm is distributed in liquid table mostly Between face and sedimentation face, the distance between liquid surface and sedimentation face are no more than suspension total height 4/5 at this time, and partial size is greater than 28 μm silicon carbide be already deposited to sedimentation face position below, the suspension between collection liquid surface and sedimentation face at this time, just Partial size can be greater than to 28 μm of silicon carbide to remove, to obtain silicon carbide abrasive of the partial size within 28 μm.
When silicon carbide abrasive of the partial size at 10 μm or more within abrasive to be processed is containing 12%, when sedimentation Between be 18~20 minutes.I.e. through 18~20 minutes, silicon carbide abrasive of the partial size within 10 μm is largely all also distributed in liquid In suspension between surface and sedimentation face, at this time liquid surface and at the distance between river surface be no more than suspension total height 4/ 5, and partial size has already been deposited to sedimentation face position below greater than 10 μm of silicon carbide, at this time collection liquid surface and sedimentation face it Between suspension, can by partial size greater than 10 μm silicon carbide remove, thus obtain partial size within 10 μm silicon carbide grinding Material.
When corundum abrasive of the partial size at 5 μm or more within abrasive to be processed is containing 12%, the sedimentation time It is 72~80 minutes.I.e. through 72~80 minutes, corundum abrasive of the partial size within 5 μm be largely all also distributed in liquid surface and In suspension between sedimentation face, the distance between liquid surface and sedimentation face are no more than the 4/5 of suspension total height, and grain at this time Corundum of the diameter greater than 5 μm has already been deposited to sedimentation face position below, at this time collection liquid surface to the suspension between sedimentation face Partial size can be greater than 5 μm of corundum and removed, to obtain corundum abrasive of the partial size within 5 μm by liquid.
It should be noted that when abrasive to be processed is to grind containing the partial size within 15% in 28 μm or more of silicon carbide Abrasive material or for containing the partial size within 12% 10 μm or more silicon carbide abrasive constantly, flocculant is waterglass, and water glass Glass and the mass volume ratio of stoste are 0.5g:1L, i.e. need that 0.5g waterglass is added in every liter of stoste.When abrasive to be processed is Containing the partial size within 12% in 5 μm or more of corundum abrasive, flocculant is concentrated hydrochloric acid, and the volume of concentrated hydrochloric acid and stoste For 2.6mL:1L, i.e. need that 2.6mL concentrated hydrochloric acid is added in every liter of stoste.
In order to examine whether the abrasive after sorting meets needs, the processing method of above-mentioned abrasive further includes examining as follows Step S140~S200:
S140, the dewatered abrasive of 18g~20g is uniformly laid on the sampling paper of 40mm × 40mm.
S150, the grid that the sampling paper for being equipped with abrasive is divided into 10mm × 10mm take out same from each grid The abrasive of quality, until the total amount of abrasive is 5g~7g.
S160, powder belt is laid to after mixing the abrasive of taking-up.
Wherein, the length of powder belt is 7cm~8cm, width 1cm.
S170, above-mentioned powder belt is uniformly divided into 7~8 parts along its length, the abrasive of even number section is taken out, residue is ground Abrasive material mixing repeats the step of being laid to powder belt and taking out even number section abrasive, until the total amount of remaining abrasive is 0.5g~1.0g obtains sample survey.
Dewatered abrasive not only can obtain target under the premise of only weighing primary through above-mentioned steps S140~S170 The abrasive of quality avoids that impurity may be introduced during repeatedly weighing, and influences inspection result, and it is equal to can get size distribution Even abrasive further increases the accuracy of inspection.
S180, glycerol is added dropwise on object carrier, the above-mentioned sample survey of picking is mixed with glycerol, obtained containing the sweet of abrasive Oil.
S190, slide is covered on the above-mentioned glycerol containing abrasive, and slowly moved, make the glycerol containing abrasive described Uniform glycerin layer is formed between object carrier and the slide.
S200, it is tested using microscope, if disqualified upon inspection, repeats above-mentioned sorting step, until examining qualification.
Wherein, when being tested using microscope, micro objective amplifies 40 times, and eyepiece amplifies 7 times.
It is appreciated that the abrasive outside target grain size is greatly general under the premise of repeatedly carrying out above-mentioned sorting step Rate is removed, and checking procedure can be omitted at this time.
The treatment and precaution simple possible of above-mentioned abrasive, abrasive even particle size distribution that treated, using treated Abrasive is ground, and is detected under 40 times of microscope, lapped face no marking, is substantially increased production efficiency and is reduced Production cost.
The following are specific embodiments.
Embodiment 1
The silicon carbide abrasive of the commercially available W28 of 1220g and 9.5 liters of water are mixed, stoste is obtained.By every liter of stoste 0.5g water Waterglass is added into stoste for the ratio of glass, and standing sedimentation collects the suspension of 4/5 height of top when reaching 4 minutes, takes off Water.
It is tested using microscope, inspection result is shown in Table 2.
Embodiment 2
The silicon carbide abrasive of the commercially available W10 of 1220g and 10 liters of water are mixed, stoste is obtained.By every liter of stoste 0.5g water Waterglass is added into stoste for the ratio of glass, and standing sedimentation collects the suspension of 4/5 height of top when reaching 18 minutes, takes off Water.
It is tested using microscope, inspection result is shown in Table 2.
Embodiment 3
The corundum abrasive of the commercially available W5 of 1220g and 9.5 liters of water are mixed, stoste is obtained.By the ratio of every liter of stoste 2.5mL Concentrated hydrochloric acid is added into stoste for example, and standing sedimentation collects the suspension of 4/5 height of top when reaching 72 minutes, dehydration will be dehydrated Abrasive afterwards is mixed with 9.5 liters of water again, is added concentrated hydrochloric acid into stoste in the ratio of every liter of stoste 2.5mL, standing sedimentation, The suspension of 4/5 height of top, dehydration are collected when reaching 72 minutes.
It is tested using microscope, inspection result is shown in Table 2.
Table 2
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.

Claims (9)

1. a kind of processing method of abrasive, which is characterized in that including following sorting step:
Abrasive to be processed is provided, in terms of mass percentage, the abrasive to be processed is containing the grain within 15% Silicon carbide abrasive of the diameter at 28 μm or more;It or is the silicon carbide abrasive containing the partial size within 12% at 10 μm or more;Or For the corundum abrasive containing the partial size within 12% at 5 μm or more;
The abrasive and water are mixed, obtain stoste, the mass volume ratio of the abrasive and water is 1220g:(9.5~10) L;
Flocculant and the stoste are mixed, standing sedimentation obtains suspension, within the sedimentation time collection liquid surface to sedimentation face it Between the suspension, be dehydrated to obtain treated abrasive, the distance in the liquid surface to sedimentation face is no more than the suspension The 4/5 of total height;
It is described heavy when silicon carbide abrasive of the partial size at 28 μm or more within the abrasive to be processed is containing 15% Dropping the time is 4~5 minutes;
It is described heavy when silicon carbide abrasive of the partial size at 10 μm or more within the abrasive to be processed is containing 12% Dropping the time is 18~20 minutes;
When corundum abrasive of the partial size at 5 μm or more within the abrasive to be processed is containing 12%, the sedimentation Time is 72~80 minutes.
2. the processing method of abrasive according to claim 1, which is characterized in that when the abrasive to be processed be containing There are the silicon carbide abrasive of partial size within 15% at 28 μm or more or carbon for the partial size within containing 12% at 10 μm or more When SiClx abrasive, the flocculant is waterglass.
3. the processing method of abrasive according to claim 2, which is characterized in that the matter of the waterglass and the stoste Amount volume ratio is 0.5g:1L.
4. the processing method of abrasive according to claim 1, which is characterized in that when the abrasive to be processed be containing There is the partial size within 12% in 5 μm or more of corundum abrasive, the flocculant is concentrated hydrochloric acid.
5. the processing method of abrasive according to claim 4, which is characterized in that the body of the concentrated hydrochloric acid and the stoste Product is 2.6mL:1L.
6. the processing method of described in any item abrasives according to claim 1~5, which is characterized in that further include using micro- The step of mirror analytic approach tests to dewatered abrasive.
7. the processing method of abrasive according to claim 6, which is characterized in that described to use microscopic analysis to de- The step of abrasive after water is tested include:
The dewatered abrasive of 18g~20g is uniformly laid on the sampling paper of 40mm × 40mm;
The sampling paper for being equipped with abrasive is divided into the grid of 10mm × 10mm, the grinding of equal quality is taken out from each grid Material, until the total amount of abrasive is 5g~7g;
Powder belt is laid to after the abrasive of taking-up is mixed;
The powder belt is uniformly divided into 7~8 parts along its length, the abrasive of even number section is taken out, remaining abrasive is mixed, The step of repeating to be laid to powder belt and taking out even number section abrasive, until the total amount of remaining abrasive be 0.5g~ 1.0g obtains sample survey;
Glycerol is added dropwise on object carrier, sample survey described in picking is mixed with the glycerol, obtains the glycerol containing abrasive;
Slide is covered on the glycerol containing abrasive, and is slowly moved, and makes the glycerol containing abrasive in the loading Uniform glycerin layer is formed between glass and the slide;
It is tested using microscope, if disqualified upon inspection, repeats the sorting step, until examining qualification.
8. the preparation method of abrasive according to claim 7, which is characterized in that the length of the powder belt be 7cm~ 8cm, width 1cm.
9. the preparation method of abrasive according to claim 7, which is characterized in that described to be tested using microscope When, microscopical object lens amplify 40 times, and eyepiece amplifies 7 times.
CN201810918228.7A 2018-08-13 2018-08-13 Method for treating abrasive Active CN109161379B (en)

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Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1951574A (en) * 2005-10-21 2007-04-25 夏玉策 Method for preparing fine powder of silicon carbide
CN101628728A (en) * 2009-01-17 2010-01-20 汉寿金诚研磨材有限公司 White alundum hyperfine abrasive micropowder preparation method
CN102241959A (en) * 2011-05-09 2011-11-16 无锡晨旸科技有限公司 Production method for mixed grinding material
CN103387233A (en) * 2013-08-16 2013-11-13 王淑贤 Chemical sedimentation tank and extraction process for silicon carbide nano-powder material and silicon dioxide nano-powder material
CN104556165A (en) * 2014-11-25 2015-04-29 湖南金诚新材料科技有限公司 Production method of white alundum micropowder for precise resin grinding wheels
CN105255368A (en) * 2015-10-09 2016-01-20 同济大学 Method for screening micron and submicron polishing solution for ultra-precision polishing
CN105645968A (en) * 2016-03-03 2016-06-08 南京工业大学 Preparation method of ultramicro silicon carbide powder high-performance slurry
CN107159443A (en) * 2017-06-28 2017-09-15 烟台华锐微粉有限公司 A kind of quiet levigation method of powder
CN107983526A (en) * 2017-12-04 2018-05-04 中国恩菲工程技术有限公司 The classification treatment process of silicon carbide micro-powder
CN108373904A (en) * 2018-01-08 2018-08-07 上海大学 The preparation method and applications of soft crisp wafer grinding polishing abrasive material

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1951574A (en) * 2005-10-21 2007-04-25 夏玉策 Method for preparing fine powder of silicon carbide
CN101628728A (en) * 2009-01-17 2010-01-20 汉寿金诚研磨材有限公司 White alundum hyperfine abrasive micropowder preparation method
CN102241959A (en) * 2011-05-09 2011-11-16 无锡晨旸科技有限公司 Production method for mixed grinding material
CN103387233A (en) * 2013-08-16 2013-11-13 王淑贤 Chemical sedimentation tank and extraction process for silicon carbide nano-powder material and silicon dioxide nano-powder material
CN104556165A (en) * 2014-11-25 2015-04-29 湖南金诚新材料科技有限公司 Production method of white alundum micropowder for precise resin grinding wheels
CN105255368A (en) * 2015-10-09 2016-01-20 同济大学 Method for screening micron and submicron polishing solution for ultra-precision polishing
CN105645968A (en) * 2016-03-03 2016-06-08 南京工业大学 Preparation method of ultramicro silicon carbide powder high-performance slurry
CN107159443A (en) * 2017-06-28 2017-09-15 烟台华锐微粉有限公司 A kind of quiet levigation method of powder
CN107983526A (en) * 2017-12-04 2018-05-04 中国恩菲工程技术有限公司 The classification treatment process of silicon carbide micro-powder
CN108373904A (en) * 2018-01-08 2018-08-07 上海大学 The preparation method and applications of soft crisp wafer grinding polishing abrasive material

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
孙斯衡: "刚玉磨料生产知识问答(连载)", 《金刚石与磨料磨具工程》 *

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