CN109152274A - A kind of composite stone ink sheet for circuit board of mobile phone - Google Patents
A kind of composite stone ink sheet for circuit board of mobile phone Download PDFInfo
- Publication number
- CN109152274A CN109152274A CN201711030073.5A CN201711030073A CN109152274A CN 109152274 A CN109152274 A CN 109152274A CN 201711030073 A CN201711030073 A CN 201711030073A CN 109152274 A CN109152274 A CN 109152274A
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- Prior art keywords
- heat
- parts
- graphite flake
- layer
- coat
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to mobile phones to manufacture production technical field, specifically, it is a kind of composite stone ink sheet for circuit board of mobile phone, including graphite flake layer, graphite flake layer upper surface is coated with upper coat, the lower surface of graphite flake is coated with lower coat, the upper surface of upper coat is coated with heat-insulated foamed resin layer, the lower surface of lower coat is coated with heat conduction silicone, heat conduction silicone can with to the seamless contact of thermal component, therefore it will can quickly export to the heat of thermal component to graphite flake layer, since graphite flake layer upper end is provided with heat-insulated foamed resin layer, it plays heat-insulated effect, the directionality that there is the conduction of heat, heat conducts on two-dimension graphite sheet, in addition the setting of heat-insulated foamed resin layer also functions to good buffer function, reduce the probability that graphite flake is damaged by other component compressing.
Description
Technical field
The present invention relates to mobile phones to manufacture production technical field, specifically, being a kind of composite stone for circuit board of mobile phone
Ink sheet.
Background technique
With modern microelectronic technology high speed development, electronic equipment (such as laptop, mobile phone, tablet computer) is increasingly
Become ultra-thin, light, this structure significantly improves electronic equipment internal power density, and generated heat is not easy in operation
It is discharged, is easy to accumulate rapidly and form high temperature.On the other hand, high temperature can reduce the performance of electronic equipment, reliability and use the longevity
Life.Therefore, Current electronic industry proposes increasingly higher demands for the heat sink material as heat control system core component, urgently
It needs a kind of high-efficiency heat conduction, light material to transfer heat away from rapidly, ensures that electronic equipment operates normally.
Graphite flake is a kind of completely new heat conduction and heat radiation material, has unique crystal grain orientation, uniformly lead in both directions
Heat, it is laminar structured to be well adapted for any surface, shielding heat source and the property that consumer electronics product is improved while component
Can, product Homogeneouslly-radiating while, which also provides in terms of thickness, to be thermally isolated.
Kapton is mostly used for flexible circuit board in the prior art, although having using polyimide film sintered acquisition stone
Black cooling fin to be covered on heat source, but is constrained to very different, the shadow of the product quality and performances of Kapton
Ring the performance for having arrived the two-sided pad pasting heat dissipation performance of heat dissipation, there are following technical problems: heat dissipation is uneven, hot-spot easily occurs,
The heat dissipation performance for improving product is unstable, reliability performance is poor, is unfavorable for product quality management control, influences the competitiveness of product.
Summary of the invention
The present invention discloses a kind of composite stone ink sheets for circuit board of mobile phone, and the graphite flake is in vertical direction and level side
To heating conduction is improved, hot-spot is avoided, while realizing the uniformity of heating conduction, improves the heat dissipation of product
Stability, reliability greatly reduce the cost of product.
A kind of specific technical solution of composite stone ink sheet for circuit board of mobile phone of present disclosure is as follows:
A kind of composite stone ink sheet for circuit board of mobile phone, including graphite flake layer, graphite flake layer upper surface are coated with upper coat,
The lower surface of graphite flake is coated with lower coat, and the upper surface of upper coat is coated with heat-insulated foamed resin layer, lower coat
Lower surface is coated with heat conduction silicone, and upper coat and lower coat are all sintered by graphite modified dose.
Further improvement of the present invention, the graphite modified dose of group by following parts by weight are grouped as: benzophenone tetracarboxylic dianhydride
25 parts, 20 parts of pyromellitic acid anhydride, 30 parts of diaminodiphenylmethane, 30 parts of dimethylformamide, N-Methyl pyrrolidone 8
Part, 2 parts of ethylene glycol, 2.5 parts of dimethyl silicone polymer, 4 parts of polyvinyl fluoride.
Further improvement of the present invention, heat-insulated foamed resin layer are foamed by Foamex glue.
Further improvement of the present invention, heat conduction silicone with a thickness of 50 ~ 200 microns, the thickness of heat-insulated foamed resin layer
It is 50 ~ 100 microns.
Further improvement of the present invention, heat conduction silicone with a thickness of 100 microns, heat-insulated foamed resin layer with a thickness of 80
Micron.
Further improvement of the present invention is additionally provided with Kapton, graphite flake between graphite flake layer and upper coat
Kapton is additionally provided between layer and lower coat.
Beneficial effects of the present invention: the bottom of the composite stone ink sheet for circuit board of mobile phone of present disclosure, which is provided with, leads
Hot layer of silica gel, heat conduction silicone therefore will can quickly be led with to the seamless contact of thermal component to the heat of thermal component
Heat-insulated effect is played, heat is made since graphite flake layer upper end is provided with heat-insulated foamed resin layer to graphite flake layer out
The directionality having is conducted, heat conducts on two-dimension graphite sheet, and in addition the setting of heat-insulated foamed resin layer also functions to well
Buffer function reduces the probability that graphite flake is damaged by other component compressing.
Detailed description of the invention
Fig. 1 is surface structure schematic diagram of the invention.
In figure, 1- graphite flake layer, the upper coat of 2-, coat under 3-, the heat-insulated foamed resin layer of 4-, 5- heat conduction silicone.
Specific embodiment
In order to deepen the understanding of the present invention, the present invention is done below in conjunction with drawings and examples and is further retouched in detail
It states, the embodiment is only for explaining the present invention, does not constitute and limits to protection scope of the present invention.
Embodiment: as shown in Figure 1, a kind of composite stone ink sheet for circuit board of mobile phone, including graphite flake layer 1, graphite flake
1 upper surface of layer is coated with upper coat 2, and the lower surface of graphite flake is coated with lower coat 3, and the upper surface of upper coat 2 coats
Have a heat-insulated foamed resin layer 4, the lower surface of lower coat 3 is coated with heat conduction silicone 5, upper coat 2 and lower coat 3 all by
Graphite modified dose is sintered, and the graphite modified dose of group by following parts by weight is grouped as: 25 parts of benzophenone tetracarboxylic dianhydride,
20 parts of pyromellitic dianhydride, 30 parts of diaminodiphenylmethane, 30 parts of dimethylformamide, 8 parts of N-Methyl pyrrolidone, ethylene glycol
2.0 parts, 2.5 parts of dimethyl silicone polymer, 4 parts of polyvinyl fluoride.
In the present embodiment, heat-insulated foamed resin layer 4 is foamed by Foamex glue, heat conduction silicone 5 with a thickness of
50 ~ 200 microns, heat-insulated foamed resin layer 4 with a thickness of 50 ~ 100 microns, it is preferable that heat conduction silicone 5 it is micro- with a thickness of 100
Rice, heat-insulated foamed resin layer 4 with a thickness of 80 microns.
In the present embodiment, Kapton, graphite flake are also provided between graphite flake layer 1 and upper coat 2
Kapton is also provided between layer 1 and lower coat 3.
Basic principles and main features and advantage of the invention have been shown and described above.The technical staff of the industry should
Understand, the present invention is not limited to the above embodiments, and the above embodiments and description only describe originals of the invention
Reason, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes and improvements
It all fall within the protetion scope of the claimed invention.The claimed scope of the invention is by appended claims and its equivalent circle
It is fixed.
Claims (6)
1. a kind of composite stone ink sheet for circuit board of mobile phone, it is characterised in that: including graphite flake layer, table on the graphite flake layer
Face is coated with upper coat, and the lower surface of the graphite flake is coated with lower coat, and the upper surface of the upper coat is coated with
The lower surface of heat-insulated foamed resin layer, the lower coat is coated with heat conduction silicone, the upper coat and the lower coating
Layer is all sintered by graphite modified dose.
2. the composite stone ink sheet according to claim 1 for circuit board of mobile phone, it is characterised in that: described graphite modified dose
It is grouped as by the group of following parts by weight: 25 parts of benzophenone tetracarboxylic dianhydride, 20 parts of pyromellitic acid anhydride, diaminodiphenylmethane
30 parts, 30 parts of dimethylformamide, 8 parts of N-Methyl pyrrolidone, 2 parts of ethylene glycol, 2.5 parts of dimethyl silicone polymer, poly- fluorine second
4 parts of alkene.
3. the composite stone ink sheet according to claim 2 for circuit board of mobile phone, it is characterised in that: the heat-insulated foaming tree
Rouge layer is foamed by Foamex glue.
4. the composite stone ink sheet according to claim 1-3 for circuit board of mobile phone, it is characterised in that: described to lead
Hot layer of silica gel with a thickness of 50 ~ 200 microns, the heat-insulated foamed resin layer with a thickness of 50 ~ 100 microns.
5. the composite stone ink sheet according to claim 4 for circuit board of mobile phone, it is characterised in that: the heat conduction silicone
With a thickness of 100 microns, the heat-insulated foamed resin layer with a thickness of 80 microns.
6. the composite stone ink sheet according to claim 5 for circuit board of mobile phone, it is characterised in that: the graphite flake layer with
It is additionally provided with Kapton between the upper coat, is additionally provided between the graphite flake layer and the lower coat poly-
Imide membrane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711030073.5A CN109152274A (en) | 2017-10-30 | 2017-10-30 | A kind of composite stone ink sheet for circuit board of mobile phone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711030073.5A CN109152274A (en) | 2017-10-30 | 2017-10-30 | A kind of composite stone ink sheet for circuit board of mobile phone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109152274A true CN109152274A (en) | 2019-01-04 |
Family
ID=64803780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711030073.5A Withdrawn CN109152274A (en) | 2017-10-30 | 2017-10-30 | A kind of composite stone ink sheet for circuit board of mobile phone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109152274A (en) |
-
2017
- 2017-10-30 CN CN201711030073.5A patent/CN109152274A/en not_active Withdrawn
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20190104 |
|
| WW01 | Invention patent application withdrawn after publication |