CN109150219B - Card holder, preparation method thereof and electronic equipment - Google Patents
Card holder, preparation method thereof and electronic equipment Download PDFInfo
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- CN109150219B CN109150219B CN201810777031.6A CN201810777031A CN109150219B CN 109150219 B CN109150219 B CN 109150219B CN 201810777031 A CN201810777031 A CN 201810777031A CN 109150219 B CN109150219 B CN 109150219B
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- card
- card holder
- support
- plastic layer
- framework
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/3816—Mechanical arrangements for accommodating identification devices, e.g. cards or chips; with connectors for programming identification devices
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
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- Signal Processing (AREA)
- Computer Networks & Wireless Communication (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The embodiment of the application provides a card support, a preparation method thereof and electronic equipment, wherein the card support comprises: the clamp support frame is made of metal materials and provided with a clamping groove, and the plastic layer is wrapped outside the clamp support frame. By forming the metal card support framework and then wrapping the plastic layer outside the card support framework, the cost can be obviously reduced, the generation process is simplified, and the manufacturing difficulty is reduced. The electronic equipment using the card support reduces the production cost and improves the work efficiency.
Description
Technical Field
The application relates to the technical field of electronic equipment, in particular to a card holder, a preparation method of the card holder and the electronic equipment.
Background
The card holder is a carrier for loading a Subscriber Identity Module (SIM), and is applied to electronic equipment.
Disclosure of Invention
The application aims to provide a card support, a preparation method thereof and electronic equipment so as to reduce the manufacturing difficulty and cost of the card support.
In a first aspect, an embodiment of the present application provides a card holder, including: the clamp support frame is made of metal materials and provided with a clamping groove, and the plastic layer is wrapped outside the clamp support frame.
In a second aspect, an embodiment of the present application provides a method for manufacturing the above card holder, including:
forming a card support framework by using a metal material; and forming a plastic layer on the card support framework by utilizing in-mold injection molding.
In a third aspect, an embodiment of the present application provides an electronic device, which includes a housing and the above card holder, where the card holder is installed in the housing.
Compared with the prior art, the card support, the preparation method of the card support and the electronic equipment have the advantages that the metal card support framework is formed, the plastic layer is wrapped outside the card support framework, the cost can be obviously reduced, the generation process is simplified, and the manufacturing difficulty is reduced.
These and other aspects of the present application will be more readily apparent from the following description of the embodiments.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a card holder provided in a first embodiment of the present application;
FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1;
FIG. 3 is a schematic structural view of a mold provided in accordance with a first embodiment of the present application;
fig. 4 is a schematic structural diagram of an electronic device according to a second embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
With the rapid development of electronic devices (e.g., mobile terminals), a card holder is widely used in electronic devices such as mobile terminals as a carrier for a Subscriber Identity Module (SIM), a memory card, and other storage media, and the card holder needs to be provided with a card slot and adapted to a narrow space in the electronic device, and is mostly of a special-shaped structure, and has a complex structure, and cannot be directly formed by stamping or the like. Therefore, the existing card holder is mostly prepared by adopting a powder metallurgy technology, the manufacturing mode has high cost, the complicated working procedures required by the powder metallurgy technology are complex, defective products are easy to generate in the production process, and the manufacturing cost is high. Meanwhile, the inventor proposes the card holder, the manufacturing method thereof and the electronic device in the embodiment of the application. Embodiments of the present application will be described in detail below with reference to the accompanying drawings.
First embodiment
Referring to fig. 1 and 2, the present embodiment provides a card holder 100, the card holder 100 includes a card holder frame 101, a plastic layer 140 and a pressing portion 150, the plastic layer 140 is wrapped outside the card holder frame 101, and the pressing portion 150 is used for pressing and controlling the card holder 100 during assembly.
Wherein, the card support framework 101 is made of metal materials, such as: metals such as Cu, Al, Ag, Fe, Au, Ni, Cr, etc., or various alloys thereof. Card holder chassis 101 has a card slot 160, card slot 160 for carrying a card body (e.g., a SIM card), it being understood that card slot 160 may be used for carrying, for example, a standard SIM card, a Micro SIM card, or a Nano SIM card, as well as various types of memory cards, and correspondingly, card slot 160 may be sized according to the corresponding SIM card.
In this embodiment, the card-holding frame 101 includes a first supporting member 110, a second supporting member 120, and a third supporting member 130, the first supporting member 110 and the second supporting member 120 are both long solid members, and the length extending directions of the first supporting member 110 and the second supporting member 120 are parallel to each other. The first support 110 and the second support 120 are spaced apart from each other, and the third support 130 is connected between the first support 110 and the second support 120 and is located in a plane formed by the first support 110 and the second support 120. The third support 130 forms a card slot 160 with the first support 110 and the second support 120.
In some embodiments, there may be one and only one third supporting member 130, and in this case, the third supporting member 130 may be connected to the end of the first connecting member and the end of the second connecting member to form a locking groove 160. In some embodiments, there may be only one third supporting member 130, and in this case, the third supporting member 130 is connected to the end of the first connecting member and the end of the second connecting member, and two locking grooves 160 are formed on two opposite sides of a plane defined by the first supporting member 110, the second supporting member 120, and the third supporting member 130.
In some embodiments, the card-holding frame 101 may include a plurality of third supporting members 130, and each of the plurality of third supporting members 130 is connected between the first supporting member 110 and the second supporting member 120. In this embodiment, referring to fig. 1, the number of the third supporting members 130 is four and all are strip-shaped structures, and the four third supporting members 130 are disposed in parallel and at intervals in the same plane and are all connected between the first supporting member 110 and the second supporting member 120. The four third supporting members 130, the first supporting member 110 and the second supporting member 120 form a first locking groove 161, a second locking groove 162 and a third locking groove 163, and the first locking groove 161, the second locking groove 162 and the third locking groove 163 are sequentially distributed along the length extending direction of the first supporting member 110.
Referring to fig. 1, the first support 110 includes a first injection molding section 111, a second injection molding section 112 and a third injection molding section 113, the first injection molding section 111, the second injection molding section 112 and the third injection molding section 113 are sequentially connected, the second support 120 includes a fourth injection molding section 121, a fifth injection molding section 122 and a sixth injection molding section 123, and the fourth injection molding section 121, the fifth injection molding section 122 and the sixth injection molding section 123 are sequentially connected. A first clamping groove 161 is formed between the first injection molding section 111 and the fourth injection molding section 121, a second clamping groove 162 is formed between the second injection molding section 112 and the fifth injection molding section 122, and a third clamping groove 163 is formed between the third injection molding section 113 and the sixth injection molding section 123. In some embodiments, the first injection section 111, the second injection section 112, and the third injection section 113 may be connected in sections or integrally formed, and the same fourth injection section 121, the fifth injection section 122, and the sixth injection section 123 may also be connected in sections or integrally formed.
The first card slot 161, the second card slot 162 and the third card slot 163 are respectively arranged to adapt to the current electronic device 200 with multiple SIM cards, and meanwhile, the first card slot 161, the second card slot 162 and the third card slot 163 can be respectively and correspondingly arranged to be a standard SIM card, a Micro SIM card or a Nano SIM card, so that the electronic device 200 can adapt to different use requirements of users.
Referring to fig. 2, the plastic layer 140 is wrapped outside the card-supporting framework 101, and the plastic layer 140 may be made of any one or at least two of polypropylene, polyethylene, ABS, and polyurethane, wherein some additives, such as antioxidants, lubricants, cross-linking agents, plasticizers, etc., may also be added. The plastic layer 140 can be bonded outside the card-supporting frame 101 by means of in-mold injection molding. In other embodiments, the plastic layer may be made of other plastics and rubbers. For example: PVDF, nitrile rubber, fluororubber, and the like.
Referring to fig. 1 and 2, the pressing portion 150 is exposed on the surface of the electronic device when the card holder 100 is in use, and is used for controlling the card holder 100 to extend into or slide out of a card holder slot of the electronic device and sealing the card holder slot. In some embodiments, the pressing portion 150 may be directly integrally formed with the card-holding frame 101, or connected to the card-holding frame 101.
In this embodiment, the pressing portion 150 is integrally formed with the plastic layer 140, and the pressing portion 150 is made of the same material as the plastic layer 140 and is integrally formed outside the card-supporting frame 101 by an in-mold injection molding method. The first support 110 and the second support 120 are both connected to the pressing portion 150 through the plastic layer 140. The pressing portion 150 is elongated and disposed parallel to the third supporting member 130, the length of the pressing portion 150 is greater than the distance between the first supporting member 110 and the second supporting member 120, and the length of the pressing portion 150 is greater than the length of the third supporting member 130. One end of the pressing portion 150 facing the first connecting member 110 extends beyond the first supporting member 110, and one end of the pressing portion 150 facing the second connecting member 120 extends beyond the second supporting member 120, both ends of which extend out of the first supporting member 110 and the second supporting member 120 for a certain distance. In other embodiments, the pressing portion 150 may be a separate component, and may be coupled to the plastic layer 140 by clamping, screwing, or the like.
In some embodiments, a metal skeleton may be disposed in the pressing portion 150 to improve the rigidity of the pressing portion 150. At this time, the metal frame may be integrally formed with the card holder frame 101 or may be combined by welding, clamping, or the like.
It is understood that the pressing portion 150 is not necessary for the card holder 100, and in some embodiments, the pressing portion 150 may not be provided, the card slot 160 is formed directly through the card holder frame 101, and the plastic layer 140 is wrapped outside the card holder frame 101. In use, the slot cap of the card bracket 210 may be separately provided on the electronic device 200 to enclose the card bracket 210.
In order to improve the appearance decoration function of the pressing part 150, the card holder 100 can better match with the appearance of the electronic device 200 after being applied to the electronic device 200. In this embodiment, the surface of the pressing portion 150 is provided with the decoration layer 170, wherein the surface of the pressing portion 150 refers to a surface of the pressing portion 150 facing away from the first connecting member and the second connecting member, that is, a surface exposed after being mounted on the electronic device 200. It is understood that in other embodiments, the decorative layer 170 may be disposed on the entire pressing portion 150.
The decorative layer 170 is preferably a decorative layer 170 having a metallic luster, for example, a metallic luster having one or more mixed colors of champagne gold, red, black, white, purple, silver, and the like. The decoration layer 170 may be formed on the surface of the pressing part 150 by vacuum evaporation, sputtering, or plating.
The present embodiment further provides a manufacturing method of the card holder 100, which includes the following steps:
step 1, forming a card support framework 101 by using a metal material.
In some embodiments, the card-holder framework 101 may be formed by powder metallurgy or the like. I.e. by sintering of metal powders. The powder metallurgy process can be specifically divided into the following steps: (1) preparing metal powder, (2) pressing and forming, (3) sintering, and (4) post-processing. The metal material here may be a metal such as Cu, Al, Ag, Fe, Au, Ni, Cr, or an alloy thereof in various forms.
In this example, the card-holding frame 101 was prepared in the following manner.
According to the preset shape configuration of the card holder 100, sheet-shaped sheet metal parts are punched to form a card holder framework 101. The clamping and supporting framework 101 formed by stamping the sheet metal part has the advantages of simple production process and low cost. The molded card cage 101 has a substantially sheet-like structure.
And 2, forming a plastic layer 140 on the card support framework 101 by utilizing in-mold injection molding.
Specifically, the In-mold decoration (IMD) method is a technique of putting the molded card holder frame 101 into an injection mold, injecting a gum on the surface of the card holder frame 101, and integrally curing and molding a resin and a sheet.
In some embodiments, this may be done in particular as follows:
the card support framework 101 is placed in the mold 300, and molten plastic is injected into 3 glue injection points in the length direction of the card support framework 101 at the same time to form the plastic layer 140. The longitudinal direction of the card-holding frame 101 herein refers to the longitudinal extension direction of the first support member 110 and the second support member 120. By arranging more glue injection points, the flowing time of the molten plastic is reduced when the molten plastic enters the mold 300, the instability caused by the change of parameters such as temperature and the like in the flowing process of the molten plastic can be obviously reduced, and the uniformity of the molded plastic layer 140 is improved.
In this embodiment, molten plastic is injected simultaneously into 6 glue injection points along the length direction of the card-holding frame 101 to form the plastic layer 140. Wherein, the 6 glue injection points are symmetrically located at the portions of the mold 300 corresponding to the first support member 110 and the second support member 120, so as to further improve the uniformity of the injection molded plastic layer 140. Specifically, the 6 glue injection points are respectively and correspondingly located in the vicinity of the first clamping groove 161, the second clamping groove 162 and the third clamping groove 163.
In this embodiment, fig. 3 shows a structure of a mold 300 in this embodiment, referring to fig. 3, 6 glue injection ports are formed in the mold 300, the 6 glue injection ports are divided into a first group of glue injection ports 310, a second group of glue injection ports 320 and a third group of glue injection ports 330, and two glue injection ports of each group of glue injection ports are symmetrically arranged on two sides of the mold 300. The card support framework 101 is placed in the mold 300, and the positions of the first injection molding section 111 and the fourth injection molding section 121 correspond to the positions of the first group of glue injection openings 310. The positions of the second injection molding section 112 and the fifth injection molding section 122 correspond to the position of the second group of glue injection ports 320. The positions of the third injection molding section 113 and the sixth injection molding section 123 correspond to the position of the third group of glue injection openings 330. In some embodiments, the first group of injection openings 310 may be aligned with a middle position of the first injection section 111 and the fourth injection section 121. Likewise, the second group of injection openings 320 can be aligned with the middle position of the second injection section 112 and the fifth injection section 122. The third set of injection openings 330 may be aligned with the middle positions of the third injection section 113 and the sixth injection section 123.
During injection molding, the 6 glue injection ports simultaneously inject molten plastics, and the same injection pressure and injection flow are kept, so that the uniformity of the injection molding plastic layers 140 at each position is ensured. The plastic layer 140 and the pressing portion 150 are obtained by pressure maintaining molding after injection.
The in-mold injection molding technology has the following technical advantages:
1. product stability: so that the plastic layer 140 and the pressing portion 150 can produce consistent and standardized correct color register.
2. Product durability: the plastic layer 140 and the pressing portion 150 can have better surface wear resistance and chemical resistance.
3. 3D complex shape design: the application of the excellent extensibility of the film can successfully meet the complex outward-opening design requirements of the required card holder 100.
4. Diversified styles: can create special patterns of metal plating or natural materials according to the requirements of customers.
5. The process is simplified: by means of one-step injection molding, the molding and decoration can be simultaneously achieved, the cost and the working hours can be effectively reduced, and stable production can be provided.
6. The cost and the working hours are reduced: in the IMD process, only one set of mold 300 is needed, unlike other old replacing processes which need to open a plurality of sets of jigs, the manpower and the working hours of one-time operation procedures can be eliminated, and the system cost and the inventory cost are reduced.
In this embodiment, since the pressing portion 150 and the plastic layer 140 are integrally formed in the process of forming the plastic layer 140, the number of manufacturing processes is further reduced, and the manufacturing cost is reduced.
Step 3, after the plastic layer 140 and the pressing portion 150 are formed, the surface of the pressing portion 150 is covered with the decoration layer 170, and the decoration layer 170 may be formed on the surface of the pressing portion 150 by, for example, vacuum deposition, sputtering, or plating.
In this embodiment, the decoration layer 170 is formed by spraying, and the main component of the decoration layer 170 is nickel-chromium alloy. Specifically, the surface of the pressing portion 150 is first degreased and cleaned, and the cleaning liquid may be, for example, alcohol or acetone. Then, the decoration layer 170 is formed by performing a spraying process using an Al electrode, and in some embodiments, before the spraying process using the electrode, the surface of the pressing part 150 is primer-coated, i.e., the depressions on the surface of the pressing part 150 are filled, so that the sprayed decoration layer 170 has a uniform thickness and a more remarkable metallic gloss.
In some embodiments, the decorative layer 170 may not be provided, and the plastic color of the pressing portion 150 is directly reserved and used for exposure. In some embodiments, the decorative layer 170 may be provided with a surface treatment to remove various defects such as impurities and cracks on the surface of the card holder 100.
The card holder 100 provided in this embodiment can be applied to various electronic devices, such as various mobile terminals, e.g., mobile phones, tablet computers, smart watches, and the like. And because the design of the three-card slot 160 is adopted, the multi-card multi-standby function can be realized, and various types of SIM cards can be loaded.
Second embodiment
In the present embodiment, an electronic device 200 is provided, the electronic device 200 is a mobile phone, referring to fig. 4, the electronic device 200 includes a housing 210, a card slot 210 is disposed on a side frame of the housing 210, the card holder 100 is installed in the card slot 210 of the housing 210, the pressing portion 150 encloses the card slot 210 and forms an approximately integral structure with the housing 210, and a color of the decoration layer 170 is consistent with a color of the housing 210. In some use states, the card holder 100 can slide out of the card holder slot 210, the housing 210 is provided with a lock hole 212, when the card holder 100 needs to be pulled out, a spring bolt in the lock hole 212 is pressed by a thimble, the card holder 100 can automatically slide out of the card holder slot 210, when the card holder 100 needs to be installed, the card holder 100 is directly pushed into the card holder slot 210, and the pressing part 150 is pressed.
In the electronic device 200 of the present embodiment, the metal luster of the outer surface of the pressing portion 150 is maintained by using the card holder 100, so that the manufacturing cost is greatly reduced.
It is understood that, in some embodiments, the pressing portion 150 may not be provided on the card holder 100, and a card holder groove cap matched with the card holder groove 210 may be provided directly on the housing 210 to seal the card holder groove 210.
Specifically, the electronic apparatus 10 may be a mobile phone or a smart phone (e.g., an iPhone (TM) based phone), a Portable game device (e.g., Nintendo DS (TM), PlayStation Portable (TM), game Advance (TM), iPhone (TM)), a laptop computer, a PDA, a Portable internet appliance, a music player and a data storage device, other handheld devices and a head-mounted device (HMD) such as a watch, a headset, a pendant, a headset, etc., and the electronic apparatus 10 may also be other wearable devices (e.g., a head-mounted device (HMD) such as electronic glasses, electronic clothes, an electronic bracelet, an electronic necklace, an electronic tattoo, an electronic device, or a smart watch).
The electronic device 10 may also be any of a number of electronic devices including, but not limited to, cellular phones, smart phones, other wireless communication devices, personal digital assistants, audio players, other media players, music recorders, video recorders, cameras, other media recorders, radios, medical devices, vehicle transportation equipment, calculators, programmable remote controllers, pagers, laptop computers, desktop computers, printers, netbook computers, Personal Digital Assistants (PDAs), Portable Multimedia Players (PMPs), moving Picture experts group (MPEG-1 or MPEG-2) Audio layer 3(MP3) players, portable medical devices, and digital cameras, and combinations thereof.
In some cases, the electronic device 10 may perform a variety of functions (e.g., playing music, displaying video, storing pictures, and receiving and sending telephone calls). If desired, the electronic device 10 may be a portable device such as a cellular telephone, media player, other handheld device, wrist watch device, pendant device, earpiece device, or other compact portable device.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (9)
1. A card holder, comprising: card holds in the palm skeleton and plastic layer, the card holds in the palm the skeleton and is made by metal material, the card holds in the palm the skeleton and has the draw-in groove, the plastic layer cladding in the card holds in the palm the skeleton, the card holds in the palm the skeleton including first support piece and second support piece and a plurality of third support piece that are located length direction, first support piece with the relative interval of second support piece sets up, third support piece connect in first support piece with between the second support piece, and a plurality of third support piece intervals set up, the card holds in the palm and is obtained by following mode preparation:
forming the card support framework by using a metal material; and
the clamping support framework is arranged in the mold, at least 3 glue injection points in the length direction of the clamping support framework are simultaneously injected with molten plastics to form a plastic layer in a coating mode, and glue injection points are distributed between the adjacent third support pieces.
2. The card holder of claim 1, further comprising a pressing portion integrally formed with the plastic layer.
3. The card holder according to claim 2, wherein the first support member and the second support member are connected to the pressing portion through the plastic layer.
4. The manufacturing method of the card holder is characterized in that the card holder comprises a card holder framework and a plastic layer, the card holder framework is made of metal materials, the card holder framework is provided with a clamping groove, the plastic layer is coated on the card holder framework, the card holder framework comprises a first supporting piece, a second supporting piece and a plurality of third supporting pieces, the first supporting piece and the second supporting piece are arranged oppositely at intervals, the third supporting pieces are connected between the first supporting piece and the second supporting piece, and the plurality of third supporting pieces are arranged at intervals;
the method comprises the following steps:
forming the card support framework by using a metal material; and
the clamping support framework is arranged in the mold, at least 3 glue injection points in the length direction of the clamping support framework are simultaneously injected with molten plastics to form the plastic layer in a coating mode, and glue injection points are distributed between the adjacent third support pieces.
5. The method of manufacturing of claim 4, further comprising:
the pressing part is integrally formed in the process of forming the plastic layer.
6. The method of manufacturing of claim 5, further comprising:
the surface of the pressing part is covered with a decorative layer.
7. The method of manufacturing according to claim 4, wherein forming the card-holding skeleton from a metal material includes:
and stamping a sheet metal part to form the clamping support framework.
8. The manufacturing method according to claim 4, wherein the plastic layer is mainly composed of any one or at least two of polypropylene, polyethylene, ABS, and polyurethane.
9. An electronic device comprising a housing and the card holder of any one of claims 1-3, wherein the card holder is mounted to the housing.
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CN110111681A (en) * | 2019-04-08 | 2019-08-09 | 惠州市华星光电技术有限公司 | Backlight module preparation method and system |
CN113904141A (en) * | 2020-07-06 | 2022-01-07 | Oppo(重庆)智能科技有限公司 | Card holder and electronic equipment |
CN111981533B (en) * | 2020-07-22 | 2023-08-18 | 佛山市顺德区美的洗涤电器制造有限公司 | Water receiving box assembly and combined equipment with same and cooking bench |
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CN203734707U (en) * | 2013-12-27 | 2014-07-23 | 维沃移动通信有限公司 | Mobile phone SIM card holder structure |
CN104985051B (en) * | 2015-06-09 | 2017-04-12 | 苏州昀冢电子科技有限公司 | Machining method of mobile terminal card holder |
CN107517063A (en) * | 2017-10-09 | 2017-12-26 | 上海龙旗科技股份有限公司 | Kato |
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