CN109148412A - Substrate, manufacturing method and LED illumination mould group with insulated vias - Google Patents
Substrate, manufacturing method and LED illumination mould group with insulated vias Download PDFInfo
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- CN109148412A CN109148412A CN201810949887.7A CN201810949887A CN109148412A CN 109148412 A CN109148412 A CN 109148412A CN 201810949887 A CN201810949887 A CN 201810949887A CN 109148412 A CN109148412 A CN 109148412A
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- 239000000758 substrate Substances 0.000 title claims abstract description 51
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 238000005286 illumination Methods 0.000 title claims abstract description 19
- 229910052751 metal Inorganic materials 0.000 claims abstract description 41
- 239000002184 metal Substances 0.000 claims abstract description 41
- 238000009413 insulation Methods 0.000 claims abstract description 32
- 238000005070 sampling Methods 0.000 claims abstract description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000011889 copper foil Substances 0.000 claims abstract description 16
- 238000003825 pressing Methods 0.000 claims abstract description 9
- 239000003990 capacitor Substances 0.000 claims description 70
- 238000000034 method Methods 0.000 claims description 17
- 230000005611 electricity Effects 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 230000001681 protective effect Effects 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 6
- 238000003754 machining Methods 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 3
- 238000000608 laser ablation Methods 0.000 claims description 3
- 150000002739 metals Chemical class 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 210000000080 chela (arthropods) Anatomy 0.000 claims 1
- 238000001914 filtration Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000005553 drilling Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005491 wire drawing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/30—Driver circuits
- H05B45/345—Current stabilisation; Maintaining constant current
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/50—Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
- Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Ceramic Engineering (AREA)
- Circuit Arrangement For Electric Light Sources In General (AREA)
Abstract
The invention discloses a kind of substrate with insulated vias, manufacturing method and LED illumination mould groups, wherein the substrate with insulated vias includes: metal plate, insulation board, copper foil circuit, through-hole, insulating part, and the board structure is simple；The manufacturing method of the substrate with insulated vias using the substrate manufacture insulated vias pressed, has versatility first, and without the through-hole for different product pressing particular designs, manufacturing method is simple, yields is high, saving is low；The LED illumination mould group uses the constant current driver circuit for LED with filter module, rectifier bridge, primary clamping protection module, current output module, primary feedback control module, time delay module, current sampling module and buffer module to drive LED simultaneously; circuit structure is simple; effective protection LED element extends the service life of LED element.
Description
Technical field
The present invention relates to pcb board technical field of heat dissipation more particularly to a kind of substrate with insulated vias, manufacturing method and
LED illumination mould group.
Background technique
As electronics and industrial products are to miniaturization and centralization development, LED substrate it is high-power miniaturized also increasingly by
Favor, and minimize to the route on the thermally conductive of substrate, heat dissipation and substrate, the required precision of pad is higher.In order to solve it is thermally conductive,
Heat dissipation problem usually selects thermally conductive, good heat dissipation effect baseplate material to replace glass fibers plate substrate, increase in this way material at
This；It on the other hand is also common solution in substantially drilling heat dissipation, traditional glass-fiber-plate is due to insulation characterisitic itself, directly
Drilling, but since metal plate belongs to the good conductor of electricity, it just needs substrate through-hole doing insulation position when making insulated vias
Reason.Currently, the drilling of substrate is that first metal plate drills, insulating materials is then filled out in drilling, then by metal plate and other
The pressing of plate stack, then the holes drilled through again on the substrate of pressing, presses needs after fill insulant in this way in hole again and scrapes
Glue, roasting glue, wire drawing and pressing easily cause the problems such as stomata, blistering, so that product is unqualified.
Light source of the LED as electric lighting on substrate, when work, need constant current, it is therefore desirable to special driving electricity
Road avoids the electric current for flowing through LED when voltage, temperature change from becoming currently, LED drive circuit is all made of constant current drive mode
The case where change causes LED to damage, still, existing constant current driver circuit for LED is most of, and structure is complicated, and lacks overvoltage protection
Circuit, if the voltage of output influences the using effect and use of LED display panel beyond desired specification, easily damage LED
Service life.
Summary of the invention
The present invention is based on problem above, a kind of substrate with insulated vias, manufacturing method and LED illumination mould group are provided and used
Complicated to solve existing through-hole board structure, manufacturing process, yields is low, the problem of LED drive circuit complexity thereon.
In a first aspect, the invention discloses a kind of substrates with insulated vias, comprising: metal plate, insulation board, copper foil line
Road, through-hole, insulating part；The insulation board is provided with the first contact surface and the second contact surface, first contact surface and described the
Two contact surfaces are oppositely arranged, and the metal plate is abutted with first contact surface, the copper foil circuit and second contact surface
It abuts, the hole wall of the through-hole is made of the insulation board, copper foil circuit and insulating part, and the insulating part and the metal plate can
Dismantling connection.
Second aspect, the invention also discloses a kind of manufacture of substrates with insulated vias, comprising the following steps:
Metal plate, insulation board and the copper foil circuit that S1, offer have pre-processed, by pressing metal plate, insulation board and copper
The fitting of tinsel cord road produces metal substrate；
S2, protective film is set on the metal plate, and blind hole is formed by bore process on the metal plate, it is described
Blind via bottom is at a distance from the insulation board in 0mm~0.1mm；
S3, the part metals plate remnants between the blind via bottom and insulation board are removed completely by machining process,
Expose the insulation board；
Protective film on S4, the removal metal plate, and the filling liquid insulating resin in the blind hole, wait certain
Time makes the liquid dielectric resin solidification；
Through-hole is formed by bore process on S5, the insulating resin after hardening and obtains tool described in first aspect
There is the substrate of insulated vias, wherein the cross section of the through-hole is identical as the geometric center of the cross section of the blind hole, and described
Through-hole is located in the blind hole.
Preferably, the machining process includes: laser ablation process, etching process.
The third aspect, the invention also discloses a kind of LED illumination mould groups, comprising: substrate and setting are on the substrate
Constant current driver circuit for LED, wherein the substrate is the substrate described in first aspect with insulated vias.
Preferably, the constant current driver circuit for LED includes: filter module, rectifier bridge, primary clamping protection module, electric current
Output module, primary feedback control module, time delay module, current sampling module and buffer module；The filter module will be described
The electric current of rectifier bridge input inputs the primary clamping protection module, the primary clamping protection module root after being filtered
According to the signal output constant current current signal of the received primary feedback control module to the current output module；The primary
Feedback control module compares output according to the electric current of current output module feedback and the electric current of current sampling module acquisition
Current signal is to the primary clamping protection module, and the current sampling module is by the electric current of the cache module of acquisition through prolonging
When the module input primary clamping protection module.
Preferably, the filter module includes: the first inductance, first resistor, first capacitor and the second capacitor；Described first
The first end of resistance is connect with the rectifier bridge input terminal, the second end of the first resistor and the primary clamp protection circuits
Connection；The first resistor and first inductance in parallel；The first of the first end of the first capacitor and the first resistor
End electrical connection, the second end ground connection of the first capacitor；The first end of second capacitor and the second end of the first resistor
Electrical connection, the second end ground connection of second capacitor.
Preferably, the primary clamping protection module includes second resistance, 3rd resistor, third capacitor, the 4th resistance, the
Five resistance and first diode；The first end of the second resistance is electrically connected with the second end of the first resistor, and described second
The second end of resistance is connect with the first end of the 3rd resistor, the 3rd resistor second end and the primary feedback control mould
Block connection；The first end of the third capacitor is connect with the first end of the second resistance, the second end of the third capacitor with
The first end of 5th resistance connects, and the 4th resistance is in parallel with the third capacitor, the first end of the 4th resistance
It is connect with the current output module, the second end of the 4th capacitor is connect with the first end of the 5th resistance；Described
The second end of five resistance is electrically connected with the cathode of the first diode, anode and the buffer module of the first diode
And the current output module connection.
Preferably, the buffer module includes: first switch tube, the 6th resistance, the 7th resistance and the 9th capacitor；Described
The first end of one switching tube is electrically connected with the anode of the first diode, the second end of the first switch tube and the electric current
Sampling module connection, the first of the first end and the 7th resistance of the third end of the first switch tube and the 6th resistance
End connection；The second end of 6th resistance connect with the primary feedback control module, the second end of the 7th resistance and
The current sampling module and time delay module connection；9th capacitor is in parallel with the first switch tube.
Preferably, the time delay module includes: the 8th resistance and the 4th capacitor；The first end of 8th resistance with it is described
The second end of 7th resistance and current sampling module connection, the of the second end of the 8th resistance and the 4th capacitor
One end and the primary feedback control module connection；The first end of 4th capacitor and the primary feedback control module connect
It connects, the second end ground connection of the 4th capacitor.
Preferably, the current sampling module includes the 9th resistance and the tenth resistance；The first end of 9th resistance with
The second end of the first switch tube and the connection of the first end of the 8th resistance, the second end ground connection of the 9th resistance；Institute
The tenth resistance and the 9th resistor coupled in parallel are stated, the first end of the tenth resistance and the first end of the 8th resistance are electrically connected
It connects, the second end ground connection of the tenth resistance.
In conclusion the substrate with insulated vias of the invention, manufacturing method and LED illumination mould group, wherein have exhausted
The substrate of edge through-hole includes: metal plate, insulation board, copper foil circuit, through-hole, insulating part, and the board structure is simple, using metal
Plate is at low cost；The manufacturing method of the substrate with insulated vias is first using the substrate manufacture insulated vias pressed, tool
There is versatility, without the through-hole for different product pressing particular designs, simultaneously, it is thus also avoided that press again after fill insulant
Frictioning, roasting glue, wire-drawing process required for closing, manufacturing method is simple, yields is high, saving is low；The LED illumination mould group simultaneously
Using with filter module, rectifier bridge, primary clamping protection module, current output module, primary feedback control module, delay mould
The constant current driver circuit for LED of block, current sampling module and buffer module drives LED, and circuit structure is simple, effective protection LED member
Part extends the service life of LED element.
Detailed description of the invention
Fig. 1 is the schematic diagram of substrate structure with insulated vias of the invention.
Fig. 2 is the manufacture of substrates flow chart with insulated vias of the invention
Fig. 3 is the schematic diagram of constant current driver circuit for LED of the invention.
Specific embodiment
In the following, being described further in conjunction with attached drawing and specific embodiment to the present invention, it should be noted that not
Under the premise of conflicting, new implementation can be formed between various embodiments described below or between each technical characteristic in any combination
Example.
Referring to Fig. 1, the invention discloses a kind of substrates with insulated vias, comprising: metal plate 11, insulation board 12,
Copper foil circuit 13, through-hole 14, insulating part 15；The insulation board 12 is provided with the first contact surface 121 and the second contact surface 122, institute
It states the first contact surface 121 to be oppositely arranged with second contact surface 122, the metal plate 11 is supported with first contact surface 121
It connects, the copper foil circuit 13 is abutted with second contact surface 122, and the hole wall of the through-hole 14 is by the insulation board 12, copper foil
Route 13 and insulating part 15 form, and the insulating part 15 is detachably connected with the metal plate 11.Wherein, the metal plate 11 can
To be that aluminium sheet, copper sheet are also possible to metal alloy plate, the specific material of the metal plate 11 is it is not limited here.
Referring to Fig. 2, the invention also discloses a kind of manufacturing method of substrate with insulated vias, including following step
It is rapid:
Metal plate, insulation board and the copper foil circuit that S1, offer have pre-processed, by pressing metal plate, insulation board and copper
The fitting of tinsel cord road produces metal substrate；
S2, protective film is set on the metal plate, and blind hole is formed by bore process on the metal plate, it is described
Blind via bottom is at a distance from the insulation board in 0mm~0.1mm；
When the blind via bottom is 0mm at a distance from the insulation board, progress step S3 can not had to and be directly entered step
Rapid S4；And it then has to when the blind via bottom is greater than when 0mm is less than or equal to 0.1mm at a distance from the insulation board by step
S3 carries out the remaining removal of metal plate.
S3, the part metals plate remnants between the blind via bottom and insulation board are removed completely by machining process,
Expose the insulation board；
Protective film on S4, the removal metal plate, and the filling liquid insulating resin in the blind hole, wait certain
Time makes the liquid dielectric resin solidification；
On S5, the insulating resin after hardening by bore process formed through-hole obtain it is above-described have it is exhausted
The substrate of edge through-hole, wherein the cross section of the through-hole is identical as the geometric center of the cross section of the blind hole, and the through-hole
In the blind hole.
Preferably, the machining process includes: laser ablation process, etching process.
The invention also discloses a kind of LED illumination mould groups, comprising: substrate and setting with insulated vias have described
Constant current driver circuit for LED on the substrate of insulated vias, wherein the substrate with insulated vias is any of the above embodiment
The substrate with insulated vias.
Referring to Fig. 3, the constant current driver circuit for LED includes: filter module 10, rectifier bridge 20, primary clamping protection mould
Block 30, current output module 40, primary feedback control module 50, time delay module 60, current sampling module 70 and buffer module 80；
The filter module 10 inputs the primary clamping protection module after being filtered the electric current that the rectifier bridge 20 inputs
30, the signal output constant current electric current letter of the primary clamping protection module 30 primary feedback control module 50 based on the received
Number to the current output module 40；The electric current that the primary feedback control module 50 feed back according to current output module 40 with
The electric current that the current sampling module 70 acquires compares output current signal to the primary clamping protection module 30, the electric current
The electric current of the cache module of acquisition is inputted the primary clamping protection module 30 through time delay module 60 by sampling module 70.Institute
Constant current driver circuit for LED is stated to simplify circuit structure only with a primary feedback control module 50 while still having good
Constant-current characteristics.
Preferably, the filter module 10 includes: the first inductance L1, first resistor R1, first capacitor C1 and the second capacitor
C2；The first inductance L1, the first resistor R1, the first capacitor C1 and the second capacitor C2 form π type filtered electrical
Road；The first end of the first resistor R1 is connect with 20 input terminal of rectifier bridge, the second end of the first resistor R1 and institute
State primary clamp protection circuits connection；The first resistor R1 is in parallel with the first inductance L1；The of the first capacitor C1
One end is electrically connected with the first end of the first resistor R1, the second end ground connection of the first capacitor C1；The second capacitor C2
First end be electrically connected with the second end of the first resistor R1, the second end of the second capacitor C2 ground connection.
Preferably, the primary clamping protection module 30 includes second resistance R2,3rd resistor R3, third capacitor C3, the
Four resistance R4, the 5th resistance R5 and first diode D1；The of the first end of the second resistance R2 and the first resistor R1
The electrical connection of two ends, the second end of the second resistance R2 are connect with the first end of the 3rd resistor R3, the 3rd resistor R3
Second end is connect with the primary feedback control module 50；The of the first end of the third capacitor C3 and the second resistance R2
One end connection, the second end of the third capacitor C3 connect with the first end of the 5th resistance R5, the 4th resistance R4 and
The third capacitor C3 is in parallel, and the first end of the 4th resistance R4 is connect with the current output module 40, the 4th electricity
The second end for holding C4 is connect with the first end of the 5th resistance R5；The second end of the 5th resistance R5 and the one or two pole
The cathode of pipe D1 is electrically connected, and anode and the buffer module 80 and the current output module 40 of the first diode D1 connects
It connects.The primary clamp protection circuits absorb leakage inductance peak voltage protective switch pipe, and the 5th resistance R5 can reduce temperature rise, improve
Inhibit high frequency ringing and inhibits the ability of system electromagnetic interference.Wherein, the resistance value of the 5th resistance R5 is less than 100 Ω.
Preferably, the buffer module 80 includes: first switch tube Q1, the 6th resistance R6, the electricity of the 7th resistance R7 and the 9th
Hold C9；The first end of the first switch tube Q1 is connect with the anode of the first diode D1, the first switch tube Q1's
Second end is connect with the current sampling module 70, the third end of the first switch tube Q1 and the first of the 6th resistance R6
The connection of the first end of end and the 7th resistance R7；The second end of the 6th resistance R6 and the primary feedback control module 50
Connection, the second end of the 7th resistance R7 are connect with the current sampling module 70 and the time delay module 60；Described 9th
Capacitor C9 is in parallel with the first switch tube Q1, in the both ends the first switch tube Q1 the 9th capacitor C9 in parallel, can both delay
The shutdown of the first switch tube Q1 is rushed to reduce turn-off power loss, while resonance can also be formed with primary inductance and helped
The recovery of magnetic core of transformer.
Preferably, the time delay module 60 includes: the 8th resistance R8 and the 4th capacitor C4；The first of the 8th resistance R8
End is connect with the second end of the 7th resistance R7 and the current sampling module 70, the second end of the 8th resistance R8 and institute
The first end and the primary feedback control module 50 for stating the 4th capacitor C4 connect；The first end of the 4th capacitor C4 with it is described
Primary feedback control module 50 connects, the second end ground connection of the 4th capacitor C4.In the present embodiment, the 8th resistance R8
For weakening the first switch tube Q1 in switching process to the current spike of current sampling module 70.
Preferably, the current sampling module 70 includes the 9th resistance R9 and the tenth resistance R10；The 9th resistance R9's
First end is connect with the first end of the second end of the first switch tube Q1 and the 8th resistance R8, the 9th resistance R9's
Second end ground connection；The tenth resistance R10 is in parallel with the 9th resistance R9, the first end of the tenth resistance R10 with it is described
The first end of 8th resistance R8 is electrically connected, the second end ground connection of the tenth resistance R10.
Preferably, the primary feedback control module 50 includes processor U1, the 5th capacitor C5, the 6th capacitor C6, the 7th
Capacitor C7, eleventh resistor R11, twelfth resistor R12, thirteenth resistor R13, the 14th resistance R14, the second diode D2,
First transformer T2 and the tenth capacitor；The first pin OUT of the processor U1 is connect with the second end of the 6th resistance R6,
The second pin Isense of the processor U1 and the second end of the 8th resistance R8 and the first end of the 4th capacitor C4
Connection, the third pin GND pin ground connection of the processor U1, the 4th pin Vcc and the described 11st of the processor U1
The first end of resistance R11 connects, the first end of the 5th pin Vsense and the 5th capacitor C5 of the processor U1, described
The second end of thirteenth resistor R13 and the connection of the first end of the 14th resistance R14；The 6th pin of the processor U1
Vin is connect with the second end of the first end of the 6th capacitor C6 and the 3rd resistor R3；The 4th of the processor U1 draws
Foot Vcc pin is connect with the second end of the first end of the 7th capacitor C7 and the twelfth resistor R12；12nd electricity
The first end of resistance R12 is connect with the cathode of the second diode D2；The second end of the twelfth resistor R12 and the described 7th
The first end of capacitor C7 connects；The first end of the thirteenth resistor R13 and the anode and electric current of the second diode D2 are defeated
Module 40 connects out；The second end of the thirteenth resistor R13 is connect with the first end of the 14th resistance R14；Described
The first end of ten capacitors is connect with the current output module 40；The second end of the eleventh resistor R11, the 5th capacitor
The second end of C5, the second end of the 6th capacitor C6, the second end of the 7th capacitor C7, the second end of the tenth capacitor
And the second end electrical connection of the 14th resistance R14.The 5th pin Vsense of the processor U1 is auxiliary voltage induced,
By obtaining auxiliary polygonal voltage signal after the thirteenth resistor R13 and the 14th resistance R14 partial pressure: the processor U1's
5th pin Vsenseo detects voltage change, if there is error just by the first pin OUT adjustment described the of the processor U1
The duty ratio of one switching tube Q1 controls the energy transmission of the first transformer T2, with the constant of maintenance voltage.The processor
The second pin Isense of U1 is primary current induction, is periodically detected peak primary currents.By the 9th resistance R9 and institute
The voltage on the tenth resistance R10 is stated compared with chip interior reference voltage.Once there is error, the processor U1 will be adjusted
The duty ratio of the first switch tube Q1, with the constant of maintenance voltage.Wherein, the 9th resistance R9 and the tenth resistance
R10 is the precision resister of 1% error.
Preferably, the current output module 40 includes the second transformer T2, third diode D3, the 8th capacitor C8 and the
15 resistance R15；One end of the second transformer T2 is connect with the first end of the 4th resistance R4；Second transformer
The other end of T2 is connect with the anode of the third diode D3；The cathode and the 8th capacitor C8 of the third diode D3
First end connection, the second end of the 8th capacitor C8 connect with the second transformer T2；The 15th resistance R15 with
The 8th capacitor C8 is in parallel.
In conclusion the substrate with insulated vias of the invention, manufacturing method and LED illumination mould group, wherein the tool
The substrate for having insulated vias includes: metal plate 11, insulation board 12, copper foil circuit 13, through-hole 14, insulating part 15, the substrate knot
Structure is simple, at low cost using metal plate 11；The manufacturing method of the substrate with insulated vias is first using the base pressed
Plate makes insulated vias, has versatility, without the through-hole for different product pressing particular designs, simultaneously, it is thus also avoided that
Required frictioning, roasting glue, wire-drawing process are pressed after fill insulant again, manufacturing method is simple, yields is high, saving is low；
The LED illumination mould group, which is used, simultaneously exports mould with filter module 10, rectifier bridge 20, primary clamping protection module 30, electric current
Block 40, primary feedback control module 50, time delay module 60, current sampling module 70 and buffer module 80 LED constant current drive electricity
Road drives LED, and circuit structure is simple, and effective protection LED element extends the service life of LED element.
The above embodiment is only the preferred embodiment of the present invention, and the scope of protection of the present invention is not limited thereto,
The variation and replacement for any unsubstantiality that those skilled in the art is done on the basis of the present invention belong to institute of the present invention
Claimed range.
Claims (10)
1. a kind of substrate with insulated vias characterized by comprising metal plate, insulation board, copper foil circuit, through-hole, insulation
Part；The insulation board is provided with the first contact surface and the second contact surface, and first contact surface is opposite with second contact surface
Setting, the metal plate are abutted with first contact surface, and the copper foil circuit is abutted with second contact surface, the through-hole
Hole wall be made of the insulation board, copper foil circuit and insulating part, the insulating part is detachably connected with the metal plate.
2. a kind of manufacture of substrates with insulated vias, which comprises the following steps:
Metal plate, insulation board and the copper foil circuit that S1, offer have pre-processed, by pressing metal plate, insulation board and copper foil line
Road fitting produces metal substrate；
S2, protective film is set on the metal plate, and blind hole, the blind hole are formed by bore process on the metal plate
Bottom is at a distance from the insulation board in 0mm~0.1mm；
S3, the part metals plate remnants between the blind via bottom and insulation board are removed by machining process by clean, exposing
The insulation board；
Protective film on S4, the removal metal plate, and the filling liquid insulating resin in the blind hole, wait certain time
Make the liquid dielectric resin solidification；
Through-hole is formed by bore process on S5, the insulating resin after hardening to obtain described in claim 1 having
The substrate of insulated vias, wherein the cross section of the through-hole is identical as the geometric center of the cross section of the blind hole, and described logical
Hole is located in the blind hole.
3. the manufacture of substrates according to claim 2 with insulated vias, which is characterized in that the machining side
Method includes: laser ablation process, etching process.
4. a kind of LED illumination mould group characterized by comprising the LED constant current of substrate and setting on the substrate drives electricity
Road, wherein the substrate is the substrate described in claim 1 with insulated vias.
5. LED illumination mould group according to claim 4, which is characterized in that the constant current driver circuit for LED includes: filtering
Module, rectifier bridge, primary clamping protection module, current output module, primary feedback control module, time delay module, current sample
Module and buffer module；The filter module inputs the primary pincers after being filtered the electric current that the rectifier bridge inputs
Position protective module, the signal output constant current electricity of the primary clamping protection module primary feedback control module based on the received
Signal is flowed to the current output module；Electric current and institute of the primary feedback control module according to current output module feedback
The electric current for stating current sampling module acquisition compares output current signal to the primary clamping protection module, the current sample mould
The electric current of the cache module of acquisition is inputted the primary clamping protection module through time delay module by block.
6. LED illumination mould group according to claim 5, which is characterized in that the filter module includes: the first inductance,
One resistance, first capacitor and the second capacitor；The first end of the first resistor is connect with the rectifier bridge input terminal, and described first
The second end of resistance is connect with the primary clamp protection circuits；
The first resistor and first inductance in parallel；The first end of the first end of the first capacitor and the first resistor
Electrical connection, the second end ground connection of the first capacitor；The first end of second capacitor and the second end electricity of the first resistor
Connection, the second end ground connection of second capacitor.
7. LED illumination mould group according to claim 5 or 6, which is characterized in that the primary clamping protection module includes the
Two resistance, 3rd resistor, third capacitor, the 4th resistance, the 5th resistance and first diode；The first end of the second resistance with
The second end of the first resistor is electrically connected, and the second end of the second resistance is connect with the first end of the 3rd resistor, institute
3rd resistor second end is stated to connect with the primary feedback control module；The first end and the second resistance of the third capacitor
First end connection, the second end of the third capacitor connect with the first end of the 5th resistance, the 4th resistance and institute
It is in parallel to state third capacitor, the first end of the 4th resistance is connect with the current output module, and the second of the 4th capacitor
End is connect with the first end of the 5th resistance；The cathode of the second end and the first diode of 5th resistance is electrically connected
It connects, the anode of the first diode is connect with the buffer module and the current output module.
8. LED illumination mould group according to claim 7, which is characterized in that the buffer module include: first switch tube,
6th resistance, the 7th resistance and the 9th capacitor；The first end of the first switch tube and the anode of the first diode are electrically connected
Connect, the second end of the first switch tube is connect with the current sampling module, the third end of the first switch tube with it is described
The first end of 6th resistance and the connection of the first end of the 7th resistance；The second end of 6th resistance and the primary feedback
Control module connection, the second end of the 7th resistance are connect with the current sampling module and the time delay module；Described
Nine capacitors are in parallel with the first switch tube.
9. LED illumination mould group according to claim 8, which is characterized in that the time delay module includes: the 8th resistance and
Four capacitors；The first end of 8th resistance is connect with the second end of the 7th resistance and the current sampling module, described
The second end of 8th resistance is connect with the first end of the 4th capacitor and the primary feedback control module；4th capacitor
First end connect with the primary feedback control module, the second end of the 4th capacitor is grounded.
10. LED illumination mould group according to claim 9, which is characterized in that the current sampling module includes the 9th resistance
And the tenth resistance；The first end of the first end of 9th resistance and the second end of the first switch tube and the 8th resistance
Connection, the second end ground connection of the 9th resistance；Tenth resistance and the 9th resistor coupled in parallel, the of the tenth resistance
One end is electrically connected with the first end of the 8th resistance, the second end ground connection of the tenth resistance.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810949887.7A CN109148412B (en) | 2018-08-20 | 2018-08-20 | Substrate with insulating through hole, manufacturing method and LED (light emitting diode) lighting module |
| CN202210225731.0A CN114628355A (en) | 2018-08-20 | 2018-08-20 | Manufacturing method of LED lighting module and LED lighting module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810949887.7A CN109148412B (en) | 2018-08-20 | 2018-08-20 | Substrate with insulating through hole, manufacturing method and LED (light emitting diode) lighting module |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210225731.0A Division CN114628355A (en) | 2018-08-20 | 2018-08-20 | Manufacturing method of LED lighting module and LED lighting module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109148412A true CN109148412A (en) | 2019-01-04 |
| CN109148412B CN109148412B (en) | 2022-04-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210225731.0A Pending CN114628355A (en) | 2018-08-20 | 2018-08-20 | Manufacturing method of LED lighting module and LED lighting module |
| CN201810949887.7A Active CN109148412B (en) | 2018-08-20 | 2018-08-20 | Substrate with insulating through hole, manufacturing method and LED (light emitting diode) lighting module |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210225731.0A Pending CN114628355A (en) | 2018-08-20 | 2018-08-20 | Manufacturing method of LED lighting module and LED lighting module |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022126887A1 (en) * | 2020-12-18 | 2022-06-23 | 苏州和林微纳科技股份有限公司 | Method for assembling ultra-high frequency spring probe test assembly |
| US20220196707A1 (en) * | 2020-12-18 | 2022-06-23 | Suzhou Uigreen Micro&Nano Technology Co. Ltd. | Method for assembling ultrahigh-frequency spring probe test assembly |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0111599A1 (en) * | 1982-12-13 | 1984-06-27 | LOMERSON, Robert Bogardus | Method of processing through-holes |
| CN106132098A (en) * | 2016-06-30 | 2016-11-16 | 浙江罗奇泰克电子有限公司 | A kind of manufacture method of LED metal base circuit board |
| CN107487059A (en) * | 2017-09-25 | 2017-12-19 | 深圳市长奇节能环保科技有限公司 | Plug installation integrated power supply forms the aluminum-based copper-clad plate of LED integration |
| CN207354726U (en) * | 2017-10-26 | 2018-05-11 | 王定锋 | A kind of one-sided metallic base circuit board for being used to weld pin member |
-
2018
- 2018-08-20 CN CN202210225731.0A patent/CN114628355A/en active Pending
- 2018-08-20 CN CN201810949887.7A patent/CN109148412B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0111599A1 (en) * | 1982-12-13 | 1984-06-27 | LOMERSON, Robert Bogardus | Method of processing through-holes |
| CN106132098A (en) * | 2016-06-30 | 2016-11-16 | 浙江罗奇泰克电子有限公司 | A kind of manufacture method of LED metal base circuit board |
| CN107487059A (en) * | 2017-09-25 | 2017-12-19 | 深圳市长奇节能环保科技有限公司 | Plug installation integrated power supply forms the aluminum-based copper-clad plate of LED integration |
| CN207354726U (en) * | 2017-10-26 | 2018-05-11 | 王定锋 | A kind of one-sided metallic base circuit board for being used to weld pin member |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022126887A1 (en) * | 2020-12-18 | 2022-06-23 | 苏州和林微纳科技股份有限公司 | Method for assembling ultra-high frequency spring probe test assembly |
| US20220196707A1 (en) * | 2020-12-18 | 2022-06-23 | Suzhou Uigreen Micro&Nano Technology Co. Ltd. | Method for assembling ultrahigh-frequency spring probe test assembly |
| US11835567B2 (en) * | 2020-12-18 | 2023-12-05 | Suzhou Uigreen Micro&Nano Technology Co. Ltd. | Method for assembling ultrahigh-frequency spring probe test assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114628355A (en) | 2022-06-14 |
| CN109148412B (en) | 2022-04-12 |
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