CN109148152A - A kind of frequency microwave multilayer ceramic capacitor micro-strip mounting structure and installation method - Google Patents
A kind of frequency microwave multilayer ceramic capacitor micro-strip mounting structure and installation method Download PDFInfo
- Publication number
- CN109148152A CN109148152A CN201811062442.3A CN201811062442A CN109148152A CN 109148152 A CN109148152 A CN 109148152A CN 201811062442 A CN201811062442 A CN 201811062442A CN 109148152 A CN109148152 A CN 109148152A
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- China
- Prior art keywords
- ceramic capacitor
- multilayer ceramic
- frequency microwave
- micro
- microwave multilayer
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
Abstract
A kind of frequency microwave multilayer ceramic capacitor micro-strip mounting structure and installation method, implementation through the invention, micro-strip is connected by soldering paste in the two sides of the bottom of frequency microwave multilayer ceramic capacitor, and inwardly protruded soldering paste protruding portion is set in the two sides of frequency microwave multilayer ceramic capacitor, the performance of frequency microwave multilayer ceramic capacitor can be greatly enhanced, furthermore, during installation, by carrying out the techniques such as copper facing cleaning to micro-strip, greatly enhance the conduction property of micro-strip, silver-plated process is carried out after the completion of welding simultaneously, also the performance of frequency microwave multilayer ceramic capacitor is substantially increased, the frequency microwave multilayer ceramic capacitor for being mounted with microstrip structure is set to be easily installed and use, the wiring board not of uniform size suitable for spot pitch.
Description
Technical field
The invention belongs to microwave device technical fields, and in particular to a kind of frequency microwave multilayer ceramic capacitor micro-strip peace
Assembling structure and installation method.
Background technique
Microstrip type frequency microwave multilayer sheet type porcelain Jie's multilayer ceramic capacitor has high q-factor, high RF power, low equivalent series
Resistance, low equivalent series inductance, high reliability, nonpolarity, moisture resistance is good, frequency characteristic is good, loss is low, high reliablity, capacitor
The characteristics of stability is good, excellent combination property is measured, is widely used in mobile communication base station, repeater, radiated television are set
The fields such as standby, radio station, radar, high-speed railway signal responder unit, computer, space flight, aviation, electronics, weapons.When use exists
Frequency microwave or when with super band, generally requires the product of more low ESR, to guarantee in the lower energy of high frequency condition
Amount loss.
Summary of the invention
In order to solve the above technical problems, the present invention provides a kind of frequency microwave multilayer ceramic capacitor micro-strip mounting structures
And installation method.
The present invention is achieved by the following technical programs.
A kind of frequency microwave multilayer ceramic capacitor micro-strip mounting structure provided by the invention, including micro-strip, soldering paste and
Frequency microwave multilayer ceramic capacitor, wherein micro-strip is two, is respectively arranged at the two sides of frequency microwave multilayer ceramic capacitor
Bottom, the two sides of frequency microwave multilayer ceramic capacitor 3 are equipped with soldering paste, each micro-strip passes through soldering paste and frequency microwave multilayer porcelain
Dielectric container 3 connects.
Further, the soldering paste of 3 two sides of the frequency microwave multilayer ceramic capacitor setting is situated between along frequency microwave multilayer porcelain
The inwardly protruding formation soldering paste protruding portion in the both sides of the edge of capacitor 3.
Further, the soldering paste is high temperature soldering paste.
Further, the soldering paste protruding portion is symmetric in the two sides of frequency microwave multilayer ceramic capacitor.
Further, the surface of the micro-strip is coated with copper.
Further, the micro-strip copper coating with a thickness of 0.2mm.
Such as the installation method of above-mentioned frequency microwave multilayer ceramic capacitor micro-strip mounting structure, comprising the following steps:
Step 1 carries out copper facing to micro-strip；
Step 2 is arranged soldering paste in the two sides of frequency microwave multilayer ceramic capacitor 3, and is welded；
Step 3, cleaning scaling powder；
Step 4 is processed by shot blasting the micro-strip and frequency microwave multilayer ceramic capacitor that weld together；
Step 5 carry out after plating pretreatment to frequency microwave multilayer ceramic capacitor silver-plated；
Step 6 is processed by shot blasting to by silver-plated frequency microwave multilayer ceramic capacitor.
Further, it in step 1, also needs to be cleaned by ultrasonic micro-strip after carrying out copper plating treatment to micro-strip.
The beneficial effects of the present invention are: implementation through the invention, in the bottom of frequency microwave multilayer ceramic capacitor
Two sides connect micro-strip by soldering paste, and inwardly protruded soldering paste is arranged in the two sides of frequency microwave multilayer ceramic capacitor and protrudes
Portion can greatly enhance the performance of frequency microwave multilayer ceramic capacitor, in addition, during installation, by carrying out copper facing to micro-strip
The techniques such as cleaning, greatly enhance the conduction property of micro-strip, while carrying out silver-plated process after the completion of welding, also greatly improve
The performance of frequency microwave multilayer ceramic capacitor makes the frequency microwave multilayer ceramic capacitor for being mounted with microstrip structure convenient for peace
Dress and use, the wiring board not of uniform size suitable for spot pitch.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the invention；
In figure: 1- micro-strip；2- soldering paste；21- soldering paste protruding portion；3- frequency microwave multilayer ceramic capacitor.
Specific embodiment
Be described further below technical solution of the present invention, but claimed range be not limited to it is described.
As shown in Figure 1, a kind of frequency microwave multilayer ceramic capacitor micro-strip mounting structure provided by the invention, including micro-strip
1, soldering paste 2 and frequency microwave multilayer ceramic capacitor 3, wherein micro-strip 1 is two, is respectively arranged at frequency microwave multilayer porcelain
The two sides of two side bottoms of dielectric container 3, frequency microwave multilayer ceramic capacitor 3 are equipped with soldering paste 2, each micro-strip 1 passes through weldering
Cream 2 is connect with frequency microwave multilayer ceramic capacitor 3.
Further, the soldering paste 2 of 3 two sides of the frequency microwave multilayer ceramic capacitor setting is situated between along frequency microwave multilayer porcelain
The inwardly protruding formation soldering paste protruding portion 21 in the both sides of the edge of capacitor 3.
Further, the soldering paste 2 is high temperature soldering paste.
Further, the soldering paste protruding portion 21 is symmetric in the two sides of frequency microwave multilayer ceramic capacitor 3.
Further, the surface of the micro-strip 1 is coated with copper.
Further, 1 copper coating of micro-strip with a thickness of 0.2mm.
Such as the installation method of above-mentioned frequency microwave multilayer ceramic capacitor micro-strip mounting structure, comprising the following steps:
Step 1 carries out copper facing to micro-strip 1；
Step 2 is arranged soldering paste 2 in the two sides of frequency microwave multilayer ceramic capacitor 3, and is welded；
Step 3, cleaning scaling powder；
Step 4 is processed by shot blasting the micro-strip 1 and frequency microwave multilayer ceramic capacitor 3 that weld together；
Step 5 carry out after plating pretreatment to frequency microwave multilayer ceramic capacitor 3 silver-plated；
Step 6 is processed by shot blasting to by silver-plated frequency microwave multilayer ceramic capacitor 3.
Further, it in step 1, also needs to be cleaned by ultrasonic micro-strip 1 after carrying out copper plating treatment to micro-strip 1.
When carrying out step 2, welding is carried out according to technological parameter described in following table.
| Time (second) | 0 | 20 | 40 | 60 | 80 | 120 | 140 | 160 | 180 | 200 | 220 | 240 |
| Temperature (DEG C) | 0 | 50 | 100 | 180 | 280 | 300 | 320 | 280 | 220 | 180 | 120 | 60 |
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
The change or replacement expected without creative work, should be covered by the protection scope of the present invention.Therefore, of the invention
Protection scope should be determined by the scope of protection defined in the claims.
Claims (8)
1. a kind of frequency microwave multilayer ceramic capacitor micro-strip mounting structure, it is characterised in that: including micro-strip (1), soldering paste (2) with
And frequency microwave multilayer ceramic capacitor (3), wherein micro-strip (1) is two, is respectively arranged at frequency microwave multilayer Leaded Ceramic Disc Capacitor
The two sides of two side bottoms of device (3), frequency microwave multilayer ceramic capacitor (3) are equipped with soldering paste (2), each micro-strip (1) passes through
Soldering paste (2) is connect with frequency microwave multilayer ceramic capacitor (3).
2. a kind of frequency microwave multilayer ceramic capacitor micro-strip mounting structure as described in claim 1, it is characterised in that: described
Two sides of the soldering paste (2) of frequency microwave multilayer ceramic capacitor (3) two sides setting along frequency microwave multilayer ceramic capacitor (3)
The inwardly protruding formation soldering paste protruding portion (21) of edge.
3. a kind of frequency microwave multilayer ceramic capacitor micro-strip mounting structure as described in claim 1, it is characterised in that: described
Soldering paste (2) is high temperature soldering paste.
4. a kind of frequency microwave multilayer ceramic capacitor micro-strip mounting structure as claimed in claim 2, it is characterised in that: described
Soldering paste protruding portion (21) is symmetric in the two sides of frequency microwave multilayer ceramic capacitor (3).
5. a kind of frequency microwave multilayer ceramic capacitor micro-strip mounting structure as described in claim 1, it is characterised in that: described
The surface of micro-strip (1) is coated with copper.
6. a kind of frequency microwave multilayer ceramic capacitor micro-strip mounting structure as claimed in claim 5, it is characterised in that: described
Micro-strip (1) copper coating with a thickness of 0.2mm.
7. the installation method of frequency microwave multilayer ceramic capacitor micro-strip mounting structure as claimed in any one of claims 1 to 6,
Characterized by the following steps:
Step 1 carries out copper facing to micro-strip (1)；
Step 2 is arranged soldering paste (2) in the two sides of frequency microwave multilayer ceramic capacitor (3), and is welded；
Step 3, cleaning scaling powder；
Step 4 is processed by shot blasting the micro-strip (1) and frequency microwave multilayer ceramic capacitor (3) that weld together；
Step 5 carry out after plating pretreatment to frequency microwave multilayer ceramic capacitor (3) silver-plated；
Step 6 is processed by shot blasting to by silver-plated frequency microwave multilayer ceramic capacitor (3).
8. the installation method of frequency microwave multilayer ceramic capacitor micro-strip mounting structure as claimed in claim 7, feature exist
In: in step 1, also need to be cleaned by ultrasonic micro-strip (1) after carrying out copper plating treatment to micro-strip (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811062442.3A CN109148152A (en) | 2018-09-12 | 2018-09-12 | A kind of frequency microwave multilayer ceramic capacitor micro-strip mounting structure and installation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811062442.3A CN109148152A (en) | 2018-09-12 | 2018-09-12 | A kind of frequency microwave multilayer ceramic capacitor micro-strip mounting structure and installation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109148152A true CN109148152A (en) | 2019-01-04 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811062442.3A Pending CN109148152A (en) | 2018-09-12 | 2018-09-12 | A kind of frequency microwave multilayer ceramic capacitor micro-strip mounting structure and installation method |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002280254A (en) * | 2001-03-22 | 2002-09-27 | Tdk Corp | Surface mounting type stacked ceramic electronic component |
| CN1790567A (en) * | 2004-12-14 | 2006-06-21 | Tdk株式会社 | Chip-type electronic component |
| CN101477893A (en) * | 2009-01-23 | 2009-07-08 | 华为技术有限公司 | Ceramic capacitor and manufacturing process thereof |
| CN102064020A (en) * | 2010-10-28 | 2011-05-18 | 吴浩 | Making method of microwave high-frequency capacitor terminal electrode |
| JP2013165181A (en) * | 2012-02-10 | 2013-08-22 | Tdk Corp | Multi-layered electronic member |
| CN208848754U (en) * | 2018-09-12 | 2019-05-10 | 中国振华（集团）新云电子元器件有限责任公司 | A kind of frequency microwave multilayer ceramic capacitor micro-strip mounting structure |
-
2018
- 2018-09-12 CN CN201811062442.3A patent/CN109148152A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002280254A (en) * | 2001-03-22 | 2002-09-27 | Tdk Corp | Surface mounting type stacked ceramic electronic component |
| CN1790567A (en) * | 2004-12-14 | 2006-06-21 | Tdk株式会社 | Chip-type electronic component |
| CN101477893A (en) * | 2009-01-23 | 2009-07-08 | 华为技术有限公司 | Ceramic capacitor and manufacturing process thereof |
| CN102064020A (en) * | 2010-10-28 | 2011-05-18 | 吴浩 | Making method of microwave high-frequency capacitor terminal electrode |
| JP2013165181A (en) * | 2012-02-10 | 2013-08-22 | Tdk Corp | Multi-layered electronic member |
| CN208848754U (en) * | 2018-09-12 | 2019-05-10 | 中国振华（集团）新云电子元器件有限责任公司 | A kind of frequency microwave multilayer ceramic capacitor micro-strip mounting structure |
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