CN109135623A - A kind of mould proof glue and preparation method thereof - Google Patents
A kind of mould proof glue and preparation method thereof Download PDFInfo
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- CN109135623A CN109135623A CN201710501057.3A CN201710501057A CN109135623A CN 109135623 A CN109135623 A CN 109135623A CN 201710501057 A CN201710501057 A CN 201710501057A CN 109135623 A CN109135623 A CN 109135623A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J129/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
- C09J129/02—Homopolymers or copolymers of unsaturated alcohols
- C09J129/04—Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/22—Halogen free composition
Abstract
The present invention provides a kind of mould proof glue and preparation method thereof, the following steps are included: graphene, triscyclopentadienyl samarium are added in polyvinyl alcohol and phosphonous acid diethylester, 90 DEG C are stirred 1 hour, and 1- acetic acid mercapto ester group methyl is added, and 130 DEG C are stirred 1 hour, bisphenol A epoxide resin is added, then silica solution, laruyl alcohol sodium sulfovinate is added in stirring 2 hours, 110 DEG C are stirred 1 hour, then methyl trialkoxysilane is added, stirring obtained mould proof glue after 15 minutes.It is V1 grades fire-retardant；Using 600 adhesive tape of 3M, it is 5B that drawing coating, which tests adhesive force,；Escherichia coli sterilizing rate is greater than 99.8%.
Description
Technical field
The invention belongs to glue technical fields, and in particular to a kind of mould proof glue and preparation method thereof.
Background technique
The microorganism of erosion material has bacterium, mould, saccharomycete and algae, for resin system, endangers biggish micro-
Biology is mainly bacterium and mould, and the substance that can be used as antibacterial mildew inhibitor has very much, is broadly divided into organic antibacterial agent, inorganic resists
4 major class of microbial inoculum, natural antibacterial agent and polymer antibacterial agent.Inorganic antiseptic is killing using metal ions such as silver, zinc, copper, titaniums
One kind antibacterial agent prepared by bacterium or bacteriostasis, heat-resist, broad-spectrum antiseptic, validity period is long, toxicity is low, does not generate drug resistance
Property；But easy to change, preparation is difficult, weaker to mould restraint.There are commonly halide, organotin, different thiophenes for organic antibacterial agent
Azoles, pyridine metal salt, imidazolone, aldehyde compound, quaternary ammonium salt etc., sterilization speed is fast, easy to process, and colour stability is good, prevents
Mould effect is good；But poor heat resistance, and be easy to generate biology drug resistance.Natural antibacterial agent mainly has chitosan class, and heat resistance is poor,
Using being restricted.Polymer antibacterial agent is the macromolecule with certain anti-microbial property for simulating the synthesis of natural polymer antibacterial agent
Material is prepared more difficult.
It is sizing that presently commercially available solid glue stick, which mostly uses greatly PVA and PVP, and production cost is low and has the property of solid glue stick
Can, cementability, embossability, is coated with the preferable market competitiveness at moisture retention.But it is tested by QB/T2857-2007, present city
The solid glue stick sold or generally existing colloid large viscosity, painting property etc., smear that performance is poor, moisture retention is poor, free formaldehyde content is exceeded
The defects of, let alone mould proof index.
Summary of the invention
The present invention provides a kind of mould proof glue and preparation method thereof.
To achieve the above object of the invention, the present invention adopts the following technical scheme: a kind of preparation method of mould proof glue, including
Following steps:
Graphene, triscyclopentadienyl samarium are added in polyvinyl alcohol and phosphonous acid diethylester, 100 DEG C are stirred 1 hour, and 1- acetic acid mercapto is added
Ester group methyl, 120 DEG C are stirred 1 hour, and bisphenol A epoxide resin is added, and stir 2 hours, silica solution, laruyl alcohol sulfuric acid is then added
Ester sodium, 110 DEG C are stirred 1 hour, and methyl trialkoxysilane is then added, and stirring obtained mould proof glue after 15 minutes.
In the present invention, graphene, triscyclopentadienyl samarium, polyvinyl alcohol, phosphonous acid diethylester, 1- acetic acid mercapto ester group methyl, bisphenol-A ring
Oxygen resin, silica solution, laruyl alcohol sodium sulfovinate, methyl trialkoxysilane mass ratio be 10: (0.5~2): 100: 8: 10:
60: 30: 20: (6~12).
In the present invention, graphene, triscyclopentadienyl samarium, polyvinyl alcohol, phosphonous acid diethylester, 1- acetic acid mercapto ester group methyl, bisphenol-A ring
Oxygen resin, silica solution, laruyl alcohol sodium sulfovinate, methyl trialkoxysilane mass ratio be 10: (1~1.5): 100: 8: 10:
60: 30: 20: (8~10).
In the present invention, graphene, triscyclopentadienyl samarium, polyvinyl alcohol, phosphonous acid diethylester, 1- acetic acid mercapto ester group methyl, bisphenol-A ring
Oxygen resin, silica solution, laruyl alcohol sodium sulfovinate, methyl trialkoxysilane mass ratio be 10: 1.2: 100: 8: 10: 60: 30:
20∶9。
In the present invention, the molecular weight of the bisphenol A epoxide resin is 25000~32000.
In the present invention, the molecular weight of the bisphenol A epoxide resin is 28000~30000.
In the present invention, the partial size of the silica solution is 80~150 nanometers.
In the present invention, the partial size of the silica solution is 100~120 nanometers.
In the present invention, the solid content of the silica solution is 40~45%.
The present invention devises several small molecule compounds other than high performance resin, in conjunction with polymerization technology, poly-
During closing Polymerization induced phase separation, system will form two-arch tunnel structure, and can occur under certain condition opposite
The phenomenon that turning, i.e., forming thermoplastic unit as a small amount of component reaction becomes the auxiliary continuous phase of system.Since reversion phase structure is
Netted continuous phase is constituted by a small amount of thermoplastic unit and is formed, and the mechanical property of system is often based on main continuous phase,
A small amount of thermoplastic unit is controlled by parameter designing, this structure is conducive to increasing substantially for system performance.
The present invention obtains compounded mix with graphene modified RE samarium for the first time, manufactures glue material then in conjunction with resin matrix, leads to
The chemical activity for crossing samarium makes the powder of different properties form uniform network structure with small organic molecule and polymer, is conducive to
Each constituent element makes entire material system be in the most steady state of thermodynamics, so friction in the interaction and mutually wetting of interface
The heat fading of coefficient is small, particularly, without adding modified metal in resin system in powder, avoids polymerizeing resin matrix
Influence；So that properties of product of the invention are high and stablize.
The indices of glue practical application influence each other very big, and it is extremely difficult that many index will reach requirement simultaneously, than
Such as say that glue density itself is the smaller the better, but density is small, intensity is lower with regard to impacted.The kind of glue material, proportion,
Method in dispersing uniformity and process in granularity size, process etc. has influence to technical indicator, solution
Certainly the key of problem is to solve while meeting the scheme of all technical requirement, passes through formula and technique both sides
In conjunction with just can achieve technical effect.
With the implementation of the disabling anti-preparation method of harmful substance (RoHS), an ep-type material not instead of demand becomes
It is generally uniform at a kind of requirement of fundamental property although the regulation of country variant is not quite similar.In existing environmental protection
In type halogen-free material formula composition, it is typically chosen phosphide and makees flame retardant substitution halogen compounds, but use the heat-resisting material of phosphorus system
When material, the inorganic particle that need to usually arrange in pairs or groups just has method by UL-94 test specification, and the inorganic particle arranged in pairs or groups is usually hydroxide
Object, more commonly used hydroxide are silica and aluminium hydroxide respectively, and there are distinct disadvantages when for glue, in addition to shadow
It rings outside electrical property, wear-resisting, heat resistance but will be influenced；The present invention by the cooperation between organic matter, such as Si element with it is compound
Metallic element synergistic effect, limits the usage ratio of several compounds, the Halogen for realizing glue is heat-resisting, reaches V1 grades.
Specific embodiment
Embodiment one
A kind of preparation method of mould proof glue, comprising the following steps:
Graphene, triscyclopentadienyl samarium are added in polyvinyl alcohol and phosphonous acid diethylester, 90 DEG C are stirred 1 hour, and 1- acetic acid mercapto is added
Ester group methyl, 130 DEG C are stirred 1 hour, and bisphenol A epoxide resin is added, and stir 2 hours, silica solution, laruyl alcohol sulfuric acid is then added
Ester sodium, 110 DEG C are stirred 1 hour, and methyl trialkoxysilane is then added, and stirring obtained mould proof glue after 15 minutes.
Graphene, triscyclopentadienyl samarium, polyvinyl alcohol, phosphonous acid diethylester, 1- acetic acid mercapto ester group methyl, bisphenol A epoxide resin, silicon
Colloidal sol, laruyl alcohol sodium sulfovinate, methyl trialkoxysilane mass ratio be 10: 2: 100: 8: 10: 60: 30: 20: 6；
The molecular weight of bisphenol A epoxide resin is 25000~32000；The partial size of silica solution is 150 nanometers；The solid content of silica solution
It is 40%.
V1 grades；Using 600 adhesive tape of 3M, it is 5B that drawing coating, which tests adhesive force,；Escherichia coli sterilizing rate is greater than 98.9%.
Embodiment two
A kind of preparation method of mould proof glue, comprising the following steps:
Graphene, triscyclopentadienyl samarium are added in polyvinyl alcohol and phosphonous acid diethylester, 90 DEG C are stirred 1 hour, and 1- acetic acid mercapto is added
Ester group methyl, 130 DEG C are stirred 1 hour, and bisphenol A epoxide resin is added, and stir 2 hours, silica solution, laruyl alcohol sulfuric acid is then added
Ester sodium, 110 DEG C are stirred 1 hour, and methyl trialkoxysilane is then added, and stirring obtained mould proof glue after 15 minutes.
Graphene, triscyclopentadienyl samarium, polyvinyl alcohol, phosphonous acid diethylester, 1- acetic acid mercapto ester group methyl, bisphenol A epoxide resin, silicon
Colloidal sol, laruyl alcohol sodium sulfovinate, methyl trialkoxysilane mass ratio be 10: 0.5: 100: 8: 10: 60: 30: 20: 6；
The molecular weight of bisphenol A epoxide resin is 25000~32000；The partial size of silica solution is 80 nanometers；The solid content of silica solution is
40%。
V1 grades；Using 600 adhesive tape of 3M, it is 5B that drawing coating, which tests adhesive force,；Escherichia coli sterilizing rate is greater than 98.9%.
Embodiment three
A kind of preparation method of mould proof glue, comprising the following steps:
Graphene, triscyclopentadienyl samarium are added in polyvinyl alcohol and phosphonous acid diethylester, 90 DEG C are stirred 1 hour, and 1- acetic acid mercapto is added
Ester group methyl, 130 DEG C are stirred 1 hour, and bisphenol A epoxide resin is added, and stir 2 hours, silica solution, laruyl alcohol sulfuric acid is then added
Ester sodium, 110 DEG C are stirred 1 hour, and methyl trialkoxysilane is then added, and stirring obtained mould proof glue after 15 minutes.
Graphene, triscyclopentadienyl samarium, polyvinyl alcohol, phosphonous acid diethylester, 1- acetic acid mercapto ester group methyl, bisphenol A epoxide resin, silicon
Colloidal sol, laruyl alcohol sodium sulfovinate, methyl trialkoxysilane mass ratio be 10: 0.5: 100: 8: 10: 60: 30: 20: 12；
The molecular weight of bisphenol A epoxide resin is 25000~32000；The partial size of silica solution is 150 nanometers；The solid content of silica solution
It is 45%.
V1 grades；Using 600 adhesive tape of 3M, it is 5B that drawing coating, which tests adhesive force,；Escherichia coli sterilizing rate is greater than 98.9%.
Example IV
A kind of preparation method of mould proof glue, comprising the following steps:
Graphene, triscyclopentadienyl samarium are added in polyvinyl alcohol and phosphonous acid diethylester, 90 DEG C are stirred 1 hour, and 1- acetic acid mercapto is added
Ester group methyl, 130 DEG C are stirred 1 hour, and bisphenol A epoxide resin is added, and stir 2 hours, silica solution, laruyl alcohol sulfuric acid is then added
Ester sodium, 110 DEG C are stirred 1 hour, and methyl trialkoxysilane is then added, and stirring obtained mould proof glue after 15 minutes.
Graphene, triscyclopentadienyl samarium, polyvinyl alcohol, phosphonous acid diethylester, 1- acetic acid mercapto ester group methyl, bisphenol A epoxide resin, silicon
Colloidal sol, laruyl alcohol sodium sulfovinate, methyl trialkoxysilane mass ratio be 10: (1~1.5): 100: 8: 10: 60: 30: 20:
(8~10)；
The molecular weight of bisphenol A epoxide resin is 25000~32000；The partial size of silica solution is 80~150 nanometers；Silica solution is consolidated
Content is 40~45%.
V1 grades；Using 600 adhesive tape of 3M, it is 5B that drawing coating, which tests adhesive force,；Escherichia coli sterilizing rate is greater than 99.2%.
Embodiment five
A kind of preparation method of mould proof glue, comprising the following steps:
Graphene, triscyclopentadienyl samarium are added in polyvinyl alcohol and phosphonous acid diethylester, 90 DEG C are stirred 1 hour, and 1- acetic acid mercapto is added
Ester group methyl, 130 DEG C are stirred 1 hour, and bisphenol A epoxide resin is added, and stir 2 hours, silica solution, laruyl alcohol sulfuric acid is then added
Ester sodium, 110 DEG C are stirred 1 hour, and methyl trialkoxysilane is then added, and stirring obtained mould proof glue after 15 minutes.
Graphene, triscyclopentadienyl samarium, polyvinyl alcohol, phosphonous acid diethylester, 1- acetic acid mercapto ester group methyl, bisphenol A epoxide resin, silicon
Colloidal sol, laruyl alcohol sodium sulfovinate, methyl trialkoxysilane mass ratio be 10: 1: 100: 8: 10: 60: 30: 20: 8；
The molecular weight of bisphenol A epoxide resin is 28000~30000；The partial size of the silica solution is 100 nanometers；Silica solution is consolidated
Content is 40%.
V1 grades；Using 600 adhesive tape of 3M, it is 5B that drawing coating, which tests adhesive force,；Escherichia coli sterilizing rate is greater than 99.2%.
Embodiment six
A kind of preparation method of mould proof glue, comprising the following steps:
Graphene, triscyclopentadienyl samarium are added in polyvinyl alcohol and phosphonous acid diethylester, 90 DEG C are stirred 1 hour, and 1- acetic acid mercapto is added
Ester group methyl, 130 DEG C are stirred 1 hour, and bisphenol A epoxide resin is added, and stir 2 hours, silica solution, laruyl alcohol sulfuric acid is then added
Ester sodium, 110 DEG C are stirred 1 hour, and methyl trialkoxysilane is then added, and stirring obtained mould proof glue after 15 minutes.
Graphene, triscyclopentadienyl samarium, polyvinyl alcohol, phosphonous acid diethylester, 1- acetic acid mercapto ester group methyl, bisphenol A epoxide resin, silicon
Colloidal sol, laruyl alcohol sodium sulfovinate, methyl trialkoxysilane mass ratio be 10: 1: 100: 8: 10: 60: 30: 20: 10；
The molecular weight of bisphenol A epoxide resin is 28000~30000；The partial size of the silica solution is 120 nanometers；Silica solution is consolidated
Content is 45%.
V1 grades；Using 600 adhesive tape of 3M, it is 5B that drawing coating, which tests adhesive force,；Escherichia coli sterilizing rate is greater than 99.2%.
Embodiment seven
A kind of preparation method of mould proof glue, comprising the following steps:
Graphene, triscyclopentadienyl samarium are added in polyvinyl alcohol and phosphonous acid diethylester, 90 DEG C are stirred 1 hour, and 1- acetic acid mercapto is added
Ester group methyl, 130 DEG C are stirred 1 hour, and bisphenol A epoxide resin is added, and stir 2 hours, silica solution, laruyl alcohol sulfuric acid is then added
Ester sodium, 110 DEG C are stirred 1 hour, and methyl trialkoxysilane is then added, and stirring obtained mould proof glue after 15 minutes.
Graphene, triscyclopentadienyl samarium, polyvinyl alcohol, phosphonous acid diethylester, 1- acetic acid mercapto ester group methyl, bisphenol A epoxide resin, silicon
Colloidal sol, laruyl alcohol sodium sulfovinate, methyl trialkoxysilane mass ratio be 10: 1.5: 100: 8: 10: 60: 30: 20: 9；
The molecular weight of bisphenol A epoxide resin is 28000~30000；The partial size of the silica solution is 120 nanometers；Silica solution is consolidated
Content is 43%.
V1 grades；Using 600 adhesive tape of 3M, it is 5B that drawing coating, which tests adhesive force,；Escherichia coli sterilizing rate is greater than 99.8%.
Embodiment eight
A kind of preparation method of mould proof glue, comprising the following steps:
Graphene, triscyclopentadienyl samarium are added in polyvinyl alcohol and phosphonous acid diethylester, 90 DEG C are stirred 1 hour, and 1- acetic acid mercapto is added
Ester group methyl, 130 DEG C are stirred 1 hour, and bisphenol A epoxide resin is added, and stir 2 hours, silica solution, laruyl alcohol sulfuric acid is then added
Ester sodium, 110 DEG C are stirred 1 hour, and methyl trialkoxysilane is then added, and stirring obtained mould proof glue after 15 minutes.
Graphene, triscyclopentadienyl samarium, polyvinyl alcohol, phosphonous acid diethylester, 1- acetic acid mercapto ester group methyl, bisphenol A epoxide resin, silicon
Colloidal sol, laruyl alcohol sodium sulfovinate, methyl trialkoxysilane mass ratio be 10: 1.2: 100: 8: 10: 60: 30: 20: 9；
The molecular weight of bisphenol A epoxide resin is 28000~30000；The partial size of silica solution is 120 nanometers, solid content 40%.
It is V1 grades fire-retardant；Using 600 adhesive tape of 3M, it is 5B that drawing coating, which tests adhesive force,；Escherichia coli sterilizing rate is greater than
99.8%。
Embodiment nine
A kind of preparation method of mould proof glue, comprising the following steps:
Graphene, triscyclopentadienyl samarium are added in polyvinyl alcohol and phosphonous acid diethylester, 90 DEG C are stirred 1 hour, and 1- acetic acid mercapto is added
Ester group methyl, 130 DEG C are stirred 1 hour, and bisphenol A epoxide resin is added, and stir 2 hours, silica solution, laruyl alcohol sulfuric acid is then added
Ester sodium, 110 DEG C are stirred 1 hour, and methyl trialkoxysilane is then added, and stirring obtained mould proof glue after 15 minutes.
Graphene, triscyclopentadienyl samarium, polyvinyl alcohol, phosphonous acid diethylester, 1- acetic acid mercapto ester group methyl, bisphenol A epoxide resin, silicon
Colloidal sol, laruyl alcohol sodium sulfovinate, methyl trialkoxysilane mass ratio be 10: 1.2: 100: 8: 10: 60: 30: 20: 9；
The molecular weight of bisphenol A epoxide resin is 28000~30000；The partial size of silica solution is 100 nanometers, solid content 45%.
It is V1 grades fire-retardant；Using 600 adhesive tape of 3M, it is 5B that drawing coating, which tests adhesive force,；Escherichia coli sterilizing rate is greater than
99.8%。
Embodiment ten
A kind of preparation method of mould proof glue, comprising the following steps:
Graphene, triscyclopentadienyl samarium are added in polyvinyl alcohol and phosphonous acid diethylester, 90 DEG C are stirred 1 hour, and 1- acetic acid mercapto is added
Ester group methyl, 130 DEG C are stirred 1 hour, and bisphenol A epoxide resin is added, and stir 2 hours, silica solution, laruyl alcohol sulfuric acid is then added
Ester sodium, 110 DEG C are stirred 1 hour, and methyl trialkoxysilane is then added, and stirring obtained mould proof glue after 15 minutes.
Graphene, triscyclopentadienyl samarium, polyvinyl alcohol, phosphonous acid diethylester, 1- acetic acid mercapto ester group methyl, bisphenol A epoxide resin, silicon
Colloidal sol, laruyl alcohol sodium sulfovinate, methyl trialkoxysilane mass ratio be 10: 1.2: 100: 8: 10: 60: 30: 20: 9；
The molecular weight of bisphenol A epoxide resin is 28000~30000；The partial size of silica solution is 110 nanometers, solid content 42%.
It is V1 grades fire-retardant；Using 600 adhesive tape of 3M, it is 5B that drawing coating, which tests adhesive force,；Escherichia coli sterilizing rate is greater than
99.8%。
Claims (10)
1. a kind of preparation method of mould proof glue, which comprises the following steps:
Graphene, triscyclopentadienyl samarium are added in polyvinyl alcohol and phosphonous acid diethylester, 90 DEG C are stirred 1 hour, and 1- acetic acid mercapto is added
Ester group methyl, 130 DEG C are stirred 1 hour, and bisphenol A epoxide resin is added, and stir 2 hours, silica solution, laruyl alcohol sulfuric acid is then added
Ester sodium, 110 DEG C are stirred 1 hour, and methyl trialkoxysilane is then added, and stirring obtained mould proof glue after 15 minutes.
2. the preparation method of mould proof glue according to claim 1, which is characterized in that graphene, triscyclopentadienyl samarium, polyvinyl alcohol,
Phosphonous acid diethylester, 1- acetic acid mercapto ester group methyl, bisphenol A epoxide resin, silica solution, laruyl alcohol sodium sulfovinate, three alcoxyl of methyl
The mass ratio of base silane is 10: (3~6): 100: 8: (3~6): 80: 10: 20: (3~6).
3. the preparation method of mould proof glue according to claim 2, which is characterized in that graphene, triscyclopentadienyl samarium, polyvinyl alcohol,
Phosphonous acid diethylester, 1- acetic acid mercapto ester group methyl, bisphenol A epoxide resin, silica solution, laruyl alcohol sodium sulfovinate, three alcoxyl of methyl
The mass ratio of base silane is 10: (4~5): 100: 8: (4~5): 80: 10: 20: (4~5).
4. the preparation method of mould proof glue according to claim 3, which is characterized in that graphene, triscyclopentadienyl samarium, polyvinyl alcohol,
Phosphonous acid diethylester, 1- acetic acid mercapto ester group methyl, bisphenol A epoxide resin, silica solution, laruyl alcohol sodium sulfovinate, three alcoxyl of methyl
The mass ratio of base silane is 10: 5: 100: 8: 5: 80: 10: 20: 5.
5. the preparation method of mould proof glue according to claim 1, which is characterized in that the molecular weight of the phosphonous acid diethylester
It is 4800~5500.
6. the preparation method of mould proof glue according to claim 1, which is characterized in that the molecular weight of the polyvinyl alcohol is
28000~30000.
7. the preparation method of mould proof glue according to claim 1, which is characterized in that the partial size of the laruyl alcohol sodium sulfovinate
It is 80~150 nanometers.
8. the preparation method of mould proof glue according to claim 7, which is characterized in that the partial size of the laruyl alcohol sodium sulfovinate
It is 100~120 nanometers.
9. the preparation method of mould proof glue according to claim 8, which is characterized in that the partial size of the laruyl alcohol sodium sulfovinate
It is 110 nanometers.
10. the mould proof glue of the preparation method preparation of mould proof glue according to claim 1.
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| CN1912041A (en) * | 2006-08-23 | 2007-02-14 | 河北北方绿野居住环境发展有限公司 | Environmental protection type adhesion agent for wood industry |
| CN103773281A (en) * | 2013-12-31 | 2014-05-07 | 广西吉顺能源科技有限公司 | Formaldehyde-free water-resistant adhesive for plywood and preparation method thereof |
| CN104017519A (en) * | 2014-06-17 | 2014-09-03 | 魏根成 | Binding agent for plywood and preparation method thereof |
| CN105086883A (en) * | 2015-09-29 | 2015-11-25 | 黄尤 | Environment-friendly polyvinyl alcohol adhesive for wood |
-
2017
- 2017-06-27 CN CN201710501057.3A patent/CN109135623A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1912041A (en) * | 2006-08-23 | 2007-02-14 | 河北北方绿野居住环境发展有限公司 | Environmental protection type adhesion agent for wood industry |
| CN103773281A (en) * | 2013-12-31 | 2014-05-07 | 广西吉顺能源科技有限公司 | Formaldehyde-free water-resistant adhesive for plywood and preparation method thereof |
| CN104017519A (en) * | 2014-06-17 | 2014-09-03 | 魏根成 | Binding agent for plywood and preparation method thereof |
| CN105086883A (en) * | 2015-09-29 | 2015-11-25 | 黄尤 | Environment-friendly polyvinyl alcohol adhesive for wood |
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