CN109130169B - MEMS printing head package - Google Patents
MEMS printing head package Download PDFInfo
- Publication number
- CN109130169B CN109130169B CN201811023412.1A CN201811023412A CN109130169B CN 109130169 B CN109130169 B CN 109130169B CN 201811023412 A CN201811023412 A CN 201811023412A CN 109130169 B CN109130169 B CN 109130169B
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- CN
- China
- Prior art keywords
- ink supply
- micro
- driving unit
- circuit board
- printed circuit
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/112—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/205—Means for applying layers
- B29C64/209—Heads; Nozzles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
Abstract
The invention relates to an MEMS printing head package, aiming at solving the technical problems that the driving effect of a micro-driving unit is difficult to evaluate and ink drops at a nozzle are difficult to erase and observe because a printing head chip is completely wrapped in the traditional printing head package, the printing head package comprises a nozzle plate, a vibrating plate, an ink supply transition layer and a printed circuit board which are sequentially arranged from bottom to top; the lower surface of the nozzle plate is completely exposed; the printed circuit board is suspended above the vibrating plate by virtue of the ink supply transition layer, and openings are arranged at the corresponding positions of the printed circuit board, the ink supply pipe hole and the micro-driving unit, so that the external ink supply pipe can penetrate through the printed circuit board to be connected with the ink supply pipe hole, and the micro-driving unit is exposed. The printing head package is more convenient for the vibration test of the laser vibration meter in the vibration process of the micro-driving unit, and is convenient for hanging, brushing and wiping the ink hanging and residual ink around the nozzle in the ink drop jetting process of the printing head.
Description
Technical Field
The present invention relates to printhead packages, and more particularly to MEMS printhead packages.
Background
The 3D printing technology is also called additive manufacturing technology, rapid prototyping manufacturing technology, and manufactures solid parts by CAD design data and using a method of material layer-by-layer accumulation. Compared with the traditional manufacturing method, the method can quickly and accurately manufacture parts with any complex shapes on one piece of equipment. The 3D printing technology can be divided into technologies such as photocuring molding, selective laser sintering, selective laser melting, electron beam melting, and three-dimensional jet printing according to the principle.
The printing head principle is basically consistent whether facing to the ink jet printing head for two-dimensional printing or facing to the ink jet printing head for 3D printing application, and the printing head is divided into a thermal driving type ink jet printing head and a piezoelectric type ink jet printing head.
A micro-nano manufacturing technology (MEMS) is generally used to manufacture a print head chip of an inkjet print head, and the print head chip is precisely packaged and then installed in a three-dimensional inkjet printer. Print head chips for two-dimensional printing can only provide a small driving force, driving lower viscosity ink-jet materials. The ink-jet printing head facing the 3D printing needs a large driving force, a micro-driving unit driven by patterned bulk piezoelectric is adopted, and the micro-driving unit is packaged on a vibrating plate prepared through micro-nano processing, so that a printing head chip is formed. In the preparation process of the printing head, the driving performance of the packaged printing head chip needs to be evaluated in real time in the two-dimensional printing and the three-dimensional printing, so that the structure and the packaging process of the printing head are optimized.
In the current ink-jet printing head chip packaging process, no matter to two-dimensional ink-jet printing or three-dimensional ink-jet printing, the printing head packaging adopts the structural style that the shell wraps the printing head chip completely, the performance of the vibration plate, the nozzle plate and the micro-driving unit can only be evaluated indirectly by detecting the parameters of the ejected ink drops through an ink drop observation system, the packaging structure can not be directly compared with the early-stage simulation result in the early-stage process of printing head research and development, and the quick evaluation and the improvement on the performance of the printing head chip are more inconvenient.
In addition, in the conventional inkjet printhead package, after the inkjet printhead chip and the micro-driving unit are bonded by epoxy resin glue, ejected ink drops are left on the nozzle plate or ink is hung on the nozzle, which affects parameters such as ink drop ejection speed, volume and linearity, thereby causing printing quality to be reduced, so that the lower surface of the nozzle plate needs to be wiped by a wiping blade, which requires that the lower surface of the nozzle plate is exposed outside smoothly, but the conventional inkjet printhead package is covered by the head cover below the printhead frame around the lower surface of the nozzle plate, and is difficult to completely wipe off residual ink.
Disclosure of Invention
The invention provides an MEMS printing head package, aiming at solving the technical problems that the driving effect of a micro-driving unit is difficult to evaluate and ink drops at a nozzle are difficult to erase and observe because a printing head chip is completely wrapped in the existing printing head package.
The technical solution of the invention is as follows:
a MEMS printing head package comprises a printing head chip and a printed circuit board, wherein the printing head chip comprises a vibrating plate, a nozzle plate and a micro-driving unit; it is characterized in that: the ink supply transition layer is also included;
the nozzle plate, the vibrating plate, the ink supply transition layer and the printed circuit board are sequentially arranged from bottom to top;
the nozzle plate is provided with a plurality of nozzles, and the lower surface of the nozzle plate is completely exposed;
the vibrating plate is provided with a flow channel structure, an upper end inlet of the flow channel structure is used for feeding ink, and a lower end outlet of the flow channel structure is communicated with a plurality of nozzles of the nozzle plate;
the micro-driving unit is arranged on the vibrating plate and is used for driving the ink in the flow channel structure to be ejected out through the nozzle;
the ink supply transition layer is arranged on the vibrating plate and positioned beside the micro-driving unit, and is provided with an ink supply pipe mounting hole communicated with an inlet at the upper end of the flow channel structure;
the printed circuit board is suspended above the vibrating plate by virtue of the ink supply transition layer and is provided with a switching interface of the micro-driving unit, and the switching interface is used for introducing a driving signal of the micro-driving unit;
the printed circuit board is provided with openings at the positions corresponding to the ink supply pipe mounting holes and the micro-driving unit, so that the external ink supply pipe can penetrate through the printed circuit board to be connected with the ink supply pipe mounting holes, and the micro-driving unit is exposed.
Further, in order to facilitate connection with the ink observation test system, the printed circuit board is also provided with a mounting hole.
Further, in order to better perform circulating ink supply, the ink supply transition layer comprises two ink supply blocks, the two ink supply blocks are respectively arranged on two sides of the micro-driving unit, and the two ink supply blocks are respectively provided with an ink supply pipe hole.
Further, in order to facilitate connection between the ink supply hose and the ink supply pipe hole, the ink supply pipe hole is in a circular truncated cone shape with a large upper part and a small lower part.
Furthermore, the ink supply block is of a convex structure with a small upper part and a big lower part, and the upper part and the lower part form a positioning step; the upper end of the ink supply block is embedded into the printed circuit board, and the printed circuit board is positioned through the positioning step.
Further, the ink supply transition layer and the vibration plate are bonded by an adhesive.
Further, the micro driving unit and the vibration plate are bonded by an adhesive.
Further, the adhesive is an epoxy glue.
Further, in order to improve a large driving force, the micro-driving unit is a patterned bulk piezoelectric driver.
Compared with the prior art, the invention has the beneficial effects that:
1. the MEMS printing head packaging structure is used for packaging the MEMS printing head for 3D printing, and the lower surfaces of the micro-driving unit and the nozzle plate are exposed through the integral structure design.
Compare in traditional totally enclosed beat printer head packaging structure, the little drive unit exposes the little drive unit vibration in-process of being more convenient for, and the laser vibrometer is favorable to carrying out quick evaluation to the performance of beating printer head chip to its test of vibration.
In addition, the lower surface of the nozzle plate is completely exposed, so that hanging and brushing wiping can be conveniently carried out on hanging ink and residual ink around the nozzle in the ink drop jetting process of the printing head; and can guarantee the ink droplet observation in-process, CCD can be accurate snatch the ink droplet and locate the image at the nozzle to reach and spray each item parameter, the convenience is to the further optimization of printer head chip structure.
2. The MEMS printing head packaging structure is used for packaging an MEMS printing head for 3D printing, and the printed circuit board is suspended above the ink supply transition layer through the structural design and layout of the ink supply transition layer and the printed circuit board, so that the structure can avoid the problem that the vibration performance of the micro-driving unit is influenced due to the direct contact between the printed circuit board and the micro-driving unit; on the other hand, because vibration board and nozzle plate generally adopt silicon material, toughness is less and fragile, consequently, in the ink droplet observation process, the printer head encapsulation accessible printed circuit board sets up the fixed orifices and is connected with the test system that observes the china ink to play the mechanical protection effect to the printer head chip.
3. The MEMS printing head package can be used for both 2D printing and 3D printing.
Drawings
FIG. 1 is an exploded view of a MEMS printhead package according to one embodiment of the present invention;
FIG. 2 is a structural assembly diagram of a MEMS printhead package according to one embodiment of the present invention;
FIG. 3 is a top view of FIG. 2;
FIG. 4 is a bottom view of FIG. 2;
FIG. 5 is a top view of the vibrating plate with the micro drive unit of FIG. 2;
fig. 6 is a structural view of the ink supply transition layer in fig. 2.
Wherein the reference numerals are: 1-nozzle plate, 11-nozzle, 2-vibration plate, 21-upper inlet, 3-ink supply transition layer, 31-ink supply block, 32-ink supply pipe hole, 33-positioning step, 4-printed circuit board, 41-switching interface, 42-opening, 43-mounting hole, 44-electric connecting line, 5-micro-driving unit and 6-ink supply pipe.
Detailed Description
The MEMS printhead of the present invention is packaged as a core component in a three-dimensional inkjet printing technology, and the present invention will be described in detail with reference to the accompanying drawings.
As shown in fig. 1-6, the MEMS print head package for 3D printing according to the present invention includes a print head chip, an ink supply transition layer 3 and a printed circuit board 4, wherein the print head chip includes a vibrating plate 2, a nozzle plate 1 and a micro-driving unit 5. The nozzle plate 1, the vibrating plate 2, the ink supply transition layer 3 and the printed circuit board 4 are arranged in sequence from bottom to top. Wherein the nozzle plate 1 has a plurality of nozzles 11 and the lower surface is completely exposed; the vibrating plate 2 has a flow channel structure, the upper end of the flow channel structure is provided with two micro ink supply ports, and the lower end outlet is communicated with a plurality of nozzles 11 of the nozzle plate 1; a micro driving unit 5 is provided on the vibration plate 2 for driving the ink in the flow path structure to be ejected through the nozzle 11; the ink supply transition layer 3 is arranged on the vibrating plate 2 and positioned at the side of the micro-driving unit 5, and is provided with an ink supply pipe hole 32 communicated with the inlet 21 at the upper end of the flow passage structure; the printed circuit board 4 is suspended above the vibrating plate 2 by virtue of the ink supply transition layer 3, and is provided with a switching interface 41 of the micro-driving unit 5, wherein the switching interface 41 is used for introducing a driving signal of the micro-driving unit 5; openings 42 are provided at the corresponding locations of the printed circuit board 4 and the ink supply tube aperture 32 and the micro-drive unit 5 so that the external ink supply tube 6 can pass through the printed circuit board 4 to connect with the ink supply tube aperture 32 and expose the micro-drive unit 5.
In the present embodiment, the ink supply transition layer 3 includes two ink supply blocks 31, the two ink supply blocks 31 are respectively disposed on two sides of the micro driving unit 5, and the two ink supply blocks 31 are each provided with an ink supply pipe hole 32. In use, the ink supply tube 6 is inserted into the ink supply tube hole 32, and ink enters from the ink supply tube 6 therein, enters the flow channel structure through an upper end inlet 21 on the vibration plate 2, and is ejected through the nozzle 11 under the driving of the micro-driving unit 5; the other ink supply tube 6 is communicated with the flow passage structure through the other upper end inlet 21 on the vibration plate 2, and plays a role of exhausting air in the ink supply process.
The ink supply block 31 of the embodiment of the present invention has a convex structure with a small upper part and a large lower part, and the upper part and the lower part form a positioning step 33. The printed circuit board 4 is suspended above the vibrating plate 2 and is fixed by the positioning step 33 of the ink supply transition layer 3.
The corresponding position of the printed circuit board 4 and the micro-driving unit 5 is provided with an opening 42, so that the micro-driving unit 5 is exposed, and the test is convenient. The interface 41 on the printed circuit board 4 is connected to the micro-drive unit 5 via an electrical connection 44.
The shape of the ink supply pipe hole 32 in this embodiment is a circular truncated cone with a large top and a small bottom, and the ink supply pipe hole 32 in this shape has a glue guiding function on the sealing glue, so as to ensure that the curing shape of the sealing glue at the ink supply pipe 6 is regular, ensure strong sealing performance at the ink supply port and beautify the appearance of the ink supply port. In use, the ink supply tube 6 is inserted into the ink supply tube hole 32 and sealed by adhesive around the tapered periphery.
The ink supply transition layer 3 in the present embodiment is bonded to the vibration plate 2 by an adhesive. The micro-driving unit 5 and the vibration plate 2 are also bonded by an adhesive.
The adhesive in the embodiment is mixed glue of polyimide and epoxy resin, and bubbles in the mixed glue are removed through defoaming machine equipment after the mixed glue is uniformly mixed.
The micro-driving unit 5 in this embodiment is a patterned bulk piezoelectric driver, has a larger driving force than the conventional printing head thin film type piezoelectric ceramic, and is used for driving high-viscosity ink in 3D printing. The micro-driving unit is adhered to the upper surface of the vibrating plate 2 through a uniform adhesive, and a piezoelectric driving adhesion positioning mark is marked on the upper surface of the vibrating plate 2, so that the micro-driving unit 5 can accurately correspond to the flow channel structure.
Claims (9)
1. The MEMS printing head package comprises a printing head chip and a printed circuit board (4), wherein the printing head chip comprises a vibrating plate (2), a nozzle plate (1) and a micro-driving unit (5);
the method is characterized in that: the ink supply transition layer (3) is also included;
the nozzle plate (1), the vibrating plate (2), the ink supply transition layer (3) and the printed circuit board (4) are sequentially arranged from bottom to top;
the nozzle plate (1) has a plurality of nozzles (11) and the lower surface is completely exposed;
the vibrating plate (2) is provided with a flow channel structure, an upper end inlet (21) of the flow channel structure is used for feeding ink, and a lower end outlet of the flow channel structure is communicated with a plurality of nozzles (11) of the nozzle plate (1);
the micro-driving unit (5) is arranged on the vibrating plate (2) and is used for driving ink in the flow channel structure to be ejected through the nozzle (11);
the ink supply transition layer (3) is arranged on the vibrating plate (2) and is positioned at the side of the micro-driving unit (5), and is provided with an ink supply pipe hole (32) communicated with an inlet (21) at the upper end of the flow channel structure;
the printed circuit board (4) is suspended above the vibrating plate (2) by virtue of the ink supply transition layer (3), and is provided with a switching interface (41) of the micro-driving unit (5), wherein the switching interface (41) is used for introducing a driving signal of the micro-driving unit (5);
openings (42) are formed in the positions, corresponding to the ink supply pipe hole (32) and the micro-driving unit (5), of the printed circuit board (4), so that the external ink supply pipe (6) can penetrate through the printed circuit board (4) to be connected with the ink supply pipe hole (32), and the micro-driving unit (5) is exposed.
2. The MEMS printhead package of claim 1, wherein:
the printed circuit board (4) is also provided with a mounting hole (43).
3. The MEMS printhead package of claim 1 or 2, wherein:
the ink supply transition layer (3) comprises two ink supply blocks (31), the two ink supply blocks (31) are respectively arranged on two sides of the micro-driving unit (5), and the two ink supply blocks (31) are respectively provided with an ink supply pipe hole (32).
4. The MEMS printhead package of claim 3, wherein:
the ink supply pipe hole (32) is in a circular truncated cone shape with a large upper part and a small lower part.
5. The MEMS printhead package of claim 4, wherein:
the ink supply block (31) is of a convex structure with a small upper part and a big lower part, and the upper part and the lower part form a positioning step (33);
the upper end of the ink supply block (31) is embedded into the printed circuit board (4), and the printed circuit board (4) is positioned through the positioning step (33).
6. The MEMS printhead package of claim 5, wherein:
the ink supply transition layer (3) is bonded with the vibration plate (2) through an adhesive.
7. The MEMS printhead package of claim 6, wherein:
the micro-driving unit (5) and the vibrating plate (2) are bonded through an adhesive.
8. The MEMS printhead package of claim 7, wherein:
the adhesive is epoxy resin glue.
9. The MEMS printhead package of claim 1, wherein:
the micro-driving unit (5) is a graphical bulk piezoelectric driver.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811023412.1A CN109130169B (en) | 2018-09-03 | 2018-09-03 | MEMS printing head package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811023412.1A CN109130169B (en) | 2018-09-03 | 2018-09-03 | MEMS printing head package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109130169A CN109130169A (en) | 2019-01-04 |
| CN109130169B true CN109130169B (en) | 2020-07-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811023412.1A Active CN109130169B (en) | 2018-09-03 | 2018-09-03 | MEMS printing head package |
Country Status (1)
| Country | Link |
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| CN (1) | CN109130169B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7467090B2 (en) * | 2019-12-05 | 2024-04-15 | キヤノン株式会社 | Liquid ejection head |
| CN111016432A (en) * | 2019-12-19 | 2020-04-17 | 西安增材制造国家研究院有限公司 | Piezoelectric type printing head and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1541839A (en) * | 2003-05-01 | 2004-11-03 | 三星电子株式会社 | Ink-jet printhead package |
| JP2010260311A (en) * | 2009-05-11 | 2010-11-18 | Toshiba Tec Corp | Inkjet head |
| CN104968500A (en) * | 2012-11-05 | 2015-10-07 | 斯特拉塔西斯公司 | System and method for direct inkjet printing of 3d objects |
| CN106715127A (en) * | 2014-09-19 | 2017-05-24 | 柯尼卡美能达株式会社 | Inkjet head, inkjet head module, and inkjet printer |
| CN206231060U (en) * | 2016-11-09 | 2017-06-09 | 天津尧艳科技发展有限公司 | A kind of ink jet head chip package structure |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7219979B2 (en) * | 2004-02-10 | 2007-05-22 | Lexmark International, Inc. | Inkjet printhead packaging tape for sealing nozzles |
| US9168745B2 (en) * | 2013-10-15 | 2015-10-27 | Illinois Tool Works LLC | Ink jet print head assembly having an angled carrier body and method |
| US20170182785A1 (en) * | 2015-12-23 | 2017-06-29 | Océ-Technologies B.V. | Inkjet printhead |
-
2018
- 2018-09-03 CN CN201811023412.1A patent/CN109130169B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1541839A (en) * | 2003-05-01 | 2004-11-03 | 三星电子株式会社 | Ink-jet printhead package |
| JP2010260311A (en) * | 2009-05-11 | 2010-11-18 | Toshiba Tec Corp | Inkjet head |
| CN104968500A (en) * | 2012-11-05 | 2015-10-07 | 斯特拉塔西斯公司 | System and method for direct inkjet printing of 3d objects |
| CN106715127A (en) * | 2014-09-19 | 2017-05-24 | 柯尼卡美能达株式会社 | Inkjet head, inkjet head module, and inkjet printer |
| CN206231060U (en) * | 2016-11-09 | 2017-06-09 | 天津尧艳科技发展有限公司 | A kind of ink jet head chip package structure |
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| CN109130169A (en) | 2019-01-04 |
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