CN109129635A - Backlight cutter device and backlight cutting method - Google Patents
Backlight cutter device and backlight cutting method Download PDFInfo
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- CN109129635A CN109129635A CN201710513066.4A CN201710513066A CN109129635A CN 109129635 A CN109129635 A CN 109129635A CN 201710513066 A CN201710513066 A CN 201710513066A CN 109129635 A CN109129635 A CN 109129635A
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- backlight
- cutter
- sawtooth
- cutter device
- cutting
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- 239000011248 coating agent Substances 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 12
- 239000000428 dust Substances 0.000 claims description 10
- 238000000605 extraction Methods 0.000 claims description 9
- 239000000843 powder Substances 0.000 abstract description 22
- 230000008901 benefit Effects 0.000 abstract description 6
- 238000006073 displacement reaction Methods 0.000 description 19
- 238000003682 fluorination reaction Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
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- 239000004568 cement Substances 0.000 description 4
- 238000000227 grinding Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 3
- 230000009123 feedback regulation Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910000997 High-speed steel Inorganic materials 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
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- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
- B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
- B26D1/157—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a movable axis
- B26D1/18—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a movable axis mounted on a movable carriage
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/0006—Cutting members therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/18—Means for removing cut-out material or waste
- B26D7/1845—Means for removing cut-out material or waste by non mechanical means
- B26D7/1863—Means for removing cut-out material or waste by non mechanical means by suction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/0006—Cutting members therefor
- B26D2001/006—Cutting members therefor the cutting blade having a special shape, e.g. a special outline, serrations
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- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The present invention provides a kind of backlight cutter device, for cutting backlight, backlight cutter device includes carrying platform and cutter device, carrying platform is for carrying backlight, cutter device includes driving mechanism and cutter, cutter is connected with driving mechanism, driving mechanism driving cutter rotation simultaneously can form relative motion with backlight to be cut to cut to backlight, cutter is that circular saw blade includes cutter body and sawtooth, cutter includes a median plane, sawtooth extends from the surrounding of cutter body toward the direction far from cutter body, sawtooth is further away from cutter body, the thickness of sawtooth is smaller, cutter body thickness is less than the spacing of backlight adjacent chips.Backlight cutter device provided by the invention has calorific value in cutting process low, the advantages of suitable for cutting backlight made of this kind of fluorescent powder without high temperature resistant property.
Description
[technical field]
The present invention relates to backlight source domain, in particular to a kind of backlight cutter device and a kind of backlight cutting side
Method.
[background technique]
Some backlights can use some fluorescent powders with non-refractory physical property in the fabrication process, such as some
The fluorescence coating of backlight can have hygroscopicity and intolerant to height during manufacture using fluorination matter fluorescent powder, fluorination matter fluorescent powder
The characteristic of temperature, and be fluorinated matter fluorescent powder and be easy to decompose with water when the temperature rises to react.Traditional cutting mode is to backlight
Source can generate big calorimetric during cutting, and not be suitable for cutting backlight made of this kind of fluorescent powder without high temperature resistant property
Source.
[summary of the invention]
It is made by overcoming above-mentioned traditional cutting mode not to be suitable for cutting this kind of fluorescent powder without high temperature resistant property
Backlight the problem of, the present invention provides a kind of backlight cutter device and a kind of backlight cutting methods.
The technical solution for solving technical problem is to provide a kind of backlight cutter device, for cutting backlight, the back
Light source includes substrate, multiple spaced LED chips for being formed on substrate and is covered in glimmering on multiple LED chips
LED chip is packaged in substrate and fluorescence coating by photosphere, the fluorescence coating, the backlight cutter device include carrying platform and
Cutter device, for the carrying platform for carrying the backlight, the cutter device includes driving mechanism and cutter, cutter and
The driving mechanism connection, driving mechanism drive cutter rotation and can form relative motion with backlight to be cut to backlight
Source is cut, and the cutter is circular saw blade comprising cutter body and sawtooth, cutter include a median plane, sawtooth
Extend from the surrounding of cutter body toward the direction far from cutter body, the sawtooth is got over further away from cutter body, the thickness of sawtooth
Small, the cutter body thickness is less than the spacing of the backlight adjacent chips.
Preferably, the cutter body includes parallel first surface and second surface, first surface and second surface
The plane of symmetry is the median plane of cutter, and the sawtooth includes first direction sawtooth and second direction sawtooth, first direction sawtooth and the
Two direction sawtooth deviate to two sides respectively from median plane, and the distance of first direction sawtooth and second direction sawtooth tooth tip is greater than first
The distance on surface and second surface.
Preferably, the backlight cutter device further comprises dust-extraction unit, and the dust-extraction unit includes exhaust fan, pipe
Road and suction nozzle, suction nozzle are connected through piping with exhaust fan, and exhaust fan forms suction at suction nozzle to remove cutting backlight source procedure
The dust of middle generation.
Preferably, the backlight cutter device further comprises feedback control system, the feedback control system setting
In on cutter device with to cutter device running precision carry out feedback regulation.
Preferably, the space width of adjacent sawtooth is 0.5-2mm, a height of 0.5-1.5mm of the tooth of the sawtooth.
Preferably, the revolving speed of the cutter is 2000-6000r/min.
Another technical solution for solving technical problem is to provide a kind of backlight cutting method, the backlight cutting side
Method the following steps are included:
Backlight is located on bogey；
Start cutter device, driving mechanism drives circular saw blade rotation；And
Circular saw blade contact backlight is simultaneously relatively moved on predetermined cuts route with backlight, will and blade contact
Backlight part dig.
Preferably, the circular saw blade contacts backlight, and relatively moves on predetermined cuts route with backlight
Backlight part with blade contact, which is dug, can specifically include following two mode: backlight is fixed, round sawtooth
Blade, which is rotated and run, runs to circular saw blade backlight progress slicing or circular saw blade rotation, backlight
Place, circular saw blade carry out slicing to backlight.
Preferably, the backlight cutting method further includes steps of during cutting backlight, removes
The dust generated in cutting process.
Preferably, the backlight cutting method further includes steps of during cutting backlight, to institute
The running precision for stating cutter device carries out feedback control adjusting.
Backlight cutter device provided by the invention has the advantages that
1, the backlight cutter device provided includes carrying platform and cutter device, and the carrying platform is described for carrying
Backlight, the cutter device include driving mechanism and cutter, and cutter is connected with the driving mechanism, and driving mechanism drives cutter
It rotates and relative motion can be formed with backlight to be cut to cut to backlight, the cutter is circular saw blade
Including cutter body and sawtooth, cutter includes a median plane, the past direction far from cutter body of the surrounding of sawtooth from cutter body
Extend, for the sawtooth further away from cutter body, the thickness of sawtooth is smaller, and it is adjacent that the cutter body thickness is less than the backlight
The spacing of chip.With the design method, due to being cut using circular saw blade, process of the circular saw blade in cutting
It is middle using plane by the way of, relative to traditional in such a way that circular knives are ground, the cutting mode will not because of it is long when
Between largely friction generate more heat, calorific value is low, thus the backlight cutter device is suitable for cutting and this kind of does not have
The advantages of backlight made of the fluorescent powder of high temperature resistant property.
2, the cutter provided includes cutter body and sawtooth, and cutter body includes parallel first surface and second surface,
The plane of symmetry of first surface and second surface is the median plane of cutter, and the sawtooth includes first direction sawtooth and second direction saw
Tooth, first direction sawtooth and second direction sawtooth deviate to two sides respectively from median plane, first direction sawtooth and second direction saw
The distance of tooth tooth tip is greater than the distance of first surface and second surface.The first table in cutting process can be prevented with the design method
Face and second surface touch backlight, maximize and reduce rubbing surface, are effectively reduced the heat generated due to friction.
3, the backlight cutter device provided further comprises dust-extraction unit, and the dust-extraction unit includes exhaust fan, pipeline
And suction nozzle, suction nozzle are connected through piping with exhaust fan, during exhaust fan forms suction at suction nozzle to remove cutting backlight
The dust of generation.Prevent pollution of the dust generated in cutting process to surrounding air.
4, the backlight cutter device provided further comprises feedback control system, and the feedback control system, which is set to, cuts
It cuts and feedback regulation is carried out with the running precision to cutter device on device.By being provided with feedback control system, the displacement machine
The kinematic error of structure can control in ± 3 μ ms, and the yields of product is significantly increased.
Backlight cutting method provided by the invention has the advantages that
Due to being cut using circular saw blade, circular saw blade during cutting using digging by the way of,
Relative to traditional in such a way that circular knives are ground, which will not generate because of a large amount of friction for a long time
More heat, calorific value is low, thus the backlight cutter device has to be suitable for cut and this kind of do not have high temperature resistant property
Made of fluorescent powder the advantages of backlight.
[Detailed description of the invention]
Fig. 1 is the schematic perspective view of the light source assembly of first embodiment of the invention.
Fig. 2 is I-I schematic cross-section in Fig. 1.
Fig. 3 is the stereochemical structure perspective view of the explosion of the backlight of the backlight manufacturing method of second embodiment of the invention.
Fig. 4 is the schematic block diagram of the backlight manufacturing method of second embodiment of the invention.
Fig. 5 is the schematic perspective view of the backlight cutter device of third embodiment of the invention comprising support platform
And cutter device.
Fig. 6 is the schematic perspective view of cutter device shown in Fig. 5 comprising mobile mechanism and cutting mechanism.
Fig. 7 is the schematic perspective view of cutter device shown in Fig. 5.
Fig. 8 is the schematic diagram of the cutting backlight of cutting mechanism shown in Fig. 5.
Fig. 9 is the structural schematic diagram of cutter shown in Fig. 8.
Figure 10 is I-I schematic cross-section in Fig. 9.
Figure 11 is the serrated portion schematic perspective view of cutter shown in Fig. 9.
Figure 12 is a kind of deformation design schematic diagram of cutter shown in Fig. 9.
Figure 13 is a kind of deformation design mode cutter serrated portion schematic perspective view of cutter shown in Fig. 9.
Figure 14 is a kind of structural schematic diagram of deformation design mode of cutter device shown in Fig. 5.
Figure 15 is the schematic block diagram of feedback control system.
Figure 16 is the schematic block diagram of the backlight cutting method of fourth embodiment of the invention.
[specific embodiment]
In order to make the purpose of the present invention, technical solution and advantage are more clearly understood, with reference to the accompanying drawings and embodiments, right
The present invention is further described.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and do not have to
It is of the invention in limiting.
Please refer to Fig. 1 and Fig. 2, it includes substrate 11, fluorescence coating that the first embodiment of the present invention, which provides a kind of light source assembly 10,
12 and multiple LED chips 13.Substrate 11 includes two opposite surfaces, and multiple LED chips 13 are arranged according to certain rule
The one of surface of substrate 11, fluorescence coating 12 are covered in the surface that substrate 11 is provided with LED chip 13, and LED chip 13 is packaged in
In fluorescence coating 12.Specifically, the fluorescence coating 12, which can be covered on substrate 11 by prefabricated fluorescent film, is provided with LED chip 13
Hot pressing attaching is formed on a surface behind surface.The shape of the light source assembly 10 is flat shape.
In some other embodiment, the shape of the LED chip 13 is rectangle, length 0.8-1.5mm, width
For 0.1-0.5mm.LED chip 13 is specifically arranged in array on the substrate 11, defines row of the LED chip 13 in X axis direction
Cloth is column, and arrangement in the Y-axis direction is row, and the spacing L between adjacent two column LED chip 13 is 0.2-0.8mm, adjacent two
Spacing W between row LED chip 13 is 2.1-3.6mm.The thickness D of the light source assembly 10 is 0.4-2mm.
In some embodiments, the fluorescent film is made of the fluorescent powder without high-temperature stability.For example, this implementation
In example, the fluorescent film is (1~4): (0.5~2) by mass ratio: the red light fluorescent powder of (0.5~2), green light fluorescent powder and
Yellow fluorescent powder is uniformly mixed.The red light fluorescent powder is fluorination matter fluorescent powder, and fluoride herein refers to that 4 valence manganese excite
Fluosilicate, molecular formula AxMFy: (wherein A is the one such of the metals such as Li, Na, K, Ca, Sr, Ba to Mn4+, and M is
The one of which of the metals such as Si, Al, Y, Sc), fluorination matter fluorescent powder has the characteristic of hygroscopicity and non-refractory, and fluoride is glimmering
Light powder is easy to decompose with water to react when the temperature rises.
Fig. 3 and Fig. 4 are please referred to, the second embodiment of the present invention provides a kind of backlight manufacturing method S10, for manufacturing back
Light source M, the backlight manufacturing method S10 include the following steps:
Step S101 provides substrate A；
Multiple LED chip B are fixed on the substrate A by step S102 according to certain arrangement rule；
One prefabricated fluorescent film C is covered in the surface for being fixed with the substrate A of LED chip B by step S103；
Step S104, fluorescent film C described in hot pressing, makes the fluorescent film C soften to form fluorescence coating, multiple LED chip B
It is packaged within the fluorescence coating, forms the backlight M.
In above-mentioned steps S102, it is described by multiple LED chip B according to certain arrangement rule be fixed on the substrate A it
On specifically can be LED chip 13 and be specifically arranged in array on the substrate 11.
In above-mentioned steps S103, the ingredient of the fluorescent film C is consistent with the ingredient of fluorescent film in first embodiment, herein
It does not repeat them here.
The backlight M as described in second embodiment of light source assembly 10 described in first embodiment is cut according to predetermined shape
It cuts to be formed.It is appreciated that the backlight M is not limited to be cut into the light source assembly 10 of flat shape in first embodiment,
Other shapes, such as bar shape can also be cut into, depending on needing with specific reference to design.By previously mentioned it is found that forming fluorescence
The fluorescent film C of layer contains fluorination matter fluorescent powder, and fluorination matter fluorescent powder has the characteristic of hygroscopicity and non-refractory, and fluoride
Fluorescent powder is easy to decompose with water to react when the temperature rises, thus can not be with traditional using circular shear blade and cooperation plus water
Or the mode of liquid nitrogen cooling is cut.
Referring to Fig. 5, the third embodiment of the present invention provides a kind of backlight cutter device 20, implement for cutting second
Backlight M described in example is to form light source assembly 10 described in first embodiment.The backlight cutter device 20 includes carrying
Platform 21 and cutter device 22, for carrying the backlight M, backlight M is fixed on carrying platform 21, cuts carrying platform 21
Device 22 is cut for cutting on scheduled cutting line road to the backlight M being fixed on carrying platform 21.
Fig. 6 and Fig. 7 are please referred to, the cutter device 22 includes displacement mechanism 221 and cutting mechanism 222.The displacement machine
Structure includes the first displacement component 2211, second displacement component 2212 and third displacement component 2213, specifically, described first
Displacement component 2211, second displacement component 2212 and third displacement component 2213 can be ball wire bar pair.First set of displacements
Part 2211 includes the first screw rod 2211a and the first sliding block 2211b being slidably matched, and second displacement component 2212 includes that sliding is matched
The the second screw rod 2212a and the second sliding block 2212b closed, third displacement component 2213 include the third screw rod 2213a being slidably matched
With third sliding block 2213b.First screw rod 2211a and the second screw rod 2212a are arranged in parallel, the both ends difference of third screw rod 2213a
Connected with the first sliding block 2211b and the second sliding block 2212b, it is preferred that third screw rod 2213a and the first screw rod 2211a and
Second screw rod 2212a is vertical.The cutting mechanism 222 is connected with third sliding block 2213b, the first sliding block 2211b, the second sliding block
2212b and third sliding block 2213b cooperation sliding drives cutting mechanism 222 to be displaced in X-axis and Y direction.In other implementations
In example, the cutting mechanism 222 and third sliding block 2213b can be set to be slidably matched, and cutting mechanism 222 can be relative to the
Three sliding block 2213b are moved in the enterprising line position of Z axis.
It is appreciated that first displacement component 2211, second displacement component 2212 and third displacement component 2213 are not
It is limited as ball wire bar pair, is also possible to the displacement mechanism of linear motor driving.
Fig. 8-9 is please referred to, the cutting mechanism 222 includes driving mechanism 2221 and cutter 2222, cutter 2222 and drive
Motivation structure 2221 connects, and driving mechanism 2221 is connected to the third sliding block 2213b, and driving mechanism 2221 drives cutter
Backlight M is cut in 2222 rotations.The cutter 2222 uses circular saw blade comprising cutter body 2223 and saw
Tooth 2224, cutter body 2223 are circle, and 2224 annular spread of sawtooth is in 2222 surrounding of cutter body.The rotation pair of cutter 2222
During backlight M is cut, the part that each sawtooth 2224 contacts sawtooth 2224 when touching backlight M is dug
Out, so that backlight M is cut into the light source assembly 10.The material of available circular saw blade have stainless steel, wolfram steel,
High-speed steel etc..
With the design method, due to being cut using circular saw blade, circular saw blade is during cutting
By the way of plane, relative to traditional in such a way that round flat blade cutter tool is ground, which will not be because of length
Time, which largely rubs, generates more heat, and calorific value is low, thus can not have to that water is added to be cooled down in cutting process, makes
It obtains the backlight cutter device 30 and is suitable for cutting using light source assembly 10 made of fluorination matter fluorescent powder.It was verified that passing through
Slicing is carried out using round saw tooth cutting tool, 80-100 DEG C of drop when the temperature of backlight M can be by traditional grinding when slicing
As low as 30-50 DEG C.
Further, the revolving speed of the circular saw blade is set as 2000-6000r/min, preferably 2000r/
Min, for traditional round flat blade cutter tool using 10000-13000r/min revolving speed, cutter 2222 is being cut
Being greatly reduced due to revolving speed in the process can be effectively reduced cutter 2222 during cutting closer to the mode of plane
The heat of generation.In contrast, traditional round flat blade cutter tool is cut in a manner of grinding due to being, even if cutter
Revolving speed is reduced to 2000-6000r/min, and cutter can also generate many heats during cutting backlight M.
Further, if setting traditional 10000-13000r/min, higher revolving speed for the revolving speed of cutter 2222
So that cutter 2222 is similar to the mode of grinding in cutting process, since knife can generate a large amount of heat in cutting process,
And it is further, higher revolving speed will lead to the fever of cutter, also be unfavorable for the control of calorific value.
Thus, by setting 2000-6000r/min for the revolving speed of cutter 2222, it can not only make cutter 2222
The cutting of backlight M is not only carried out in a manner of plane, and the friction of cutter 2222 and backlight M can also be reduced by the slow-speed of revolution
Amount, to preferably reduce calorific value of the cutter 2222 when cutting backlight M.It is appreciated that the revolving speed of cutter also not office
2000-6000r/min is limited, can also be lower, but to comprehensively consider the influence of cutting efficiency.
There are two types of the methods of operation when cutting backlight M for the backlight cutter device 20, one is carrying platform 21 is solid
Fixed motionless, backlight M is fixed on carrying platform 21, and cutter 2222 is driven by displacement mechanism 221 in X-axis, Y-axis and Z-direction
Backlight M is cut in upper displacement；The second is cutter 2222 is only displaced in Y-axis and Z axis, carrying platform 21 drives backlight
M is displaced in X-axis cuts it by the cutter 2222 rotated.It is appreciated that in such cases, carrying platform 21 itself can
To be designed as moving in X axis, Y direction, so as to drive the backlight M being carried on carrying platform 21 can also be opposite
Cutter 2222 is mobile.
Figure 10-11 is please referred to, the cutter body 2223 includes parallel first surface 2223a and second surface
2223b, the distance between first surface 2223a and second surface 2223b define the thickness H of cutter body 2223.By it is aforementioned can
Know, the spacing L between adjacent two column LED chip 13 is 0.2-0.8mm, and the thickness of cutter 222 should be less than adjacent two column LED core
Spacing L between piece 13.Specifically, the thickness H of cutter 222 is corresponding to can choose 0.1-0.7mm.Definition plane S is knife
The median plane S of tool 2222, then S pairs of median plane relative to cutter 2222 of the first surface 2223a and second surface 2223b
Claim,.Sawtooth 2224 extends from the surrounding of cutter body 2223 toward the direction far from cutter body 2223, further away from cutter body
2223, the thickness of sawtooth 2224 is gradually reduced from the thickness for being equal to cutter body 2223, finally, the tooth tip of 2224 end of sawtooth
At median plane S.The distance of the high E of tooth namely 2224 tooth root of sawtooth of the sawtooth 2224 to tooth tip is 0.5-1.5mm, into
One step, the space width F between the two neighboring sawtooth 2224 is 0.5-2mm.With the design method, it is ensured that sawtooth
Preferable slicing efficiency can also be obtained while 2224 intensity.It is appreciated that due to 2223 thinner thickness of cutter body, it is larger
The setting of the high E of tooth be easy to cause 2224 intensity of sawtooth inadequate, influence the service life of sawtooth 2224.It is also to be understood that relatively narrow
Or the design of wider space width F is unfavorable for slicing, relatively narrow space width is unfavorable for the cutting of backlight M, wider between cog
Cause slicing inefficient again when away from F.
When extension, the sawtooth 2224 can be extended along the diameter direction of cutter body 2223, can also be with
It is to extend along the direction to form an angle with 2223 diameter direction of cutter body.When sawtooth 2224 is along cutter body
2223 diameter directions extend when, the sawtooth 2224 can be the two sides on Plane of rotation and put the first edge on a knife or a pair of scissors, cutter 2222 rotate forward or
Person's reversion can carry out slicing to backlight M.When sawtooth 2224 be along with 2223 diameter direction of cutter body at one
When the direction at clamp angle extends, the sawtooth 2224 is that single side puts the first edge on a knife or a pair of scissors on Plane of rotation, and cutter 2222 can only be single direction
Rotation just can carry out slicing to backlight M, and specific direction of rotation is so that putting the first edge on a knife or a pair of scissors facing towards backlight M.
Figure 12-13 is please referred to, in some other embodiment, the sawtooth 2224 of the cutter 2222 includes first direction
Sawtooth 2224a and second direction sawtooth 2224b, first direction sawtooth 2224a and second direction sawtooth 2224b are from median plane S points
Do not deviate to the two sides median plane S.Preferably, the distance of first direction sawtooth 2224a and second direction sawtooth 2224b tooth tip is big
In the thickness H of cutter body 2223, and the distance of first direction sawtooth 2224a and second direction sawtooth 2224b tooth tip is less than phase
Spacing L between adjacent two column LED chips 13.Extending direction, the tooth of first direction sawtooth 2224a and second direction sawtooth 2224b
High and space width is consistent with sawtooth 2224 above-mentioned, and this will not be repeated here.
In cutting process, first direction sawtooth 2224a and second direction sawtooth 2224b are according to scheduled cutting route point
Not toward the two sides of plane where median plane S into contact with the part of backlight M dig, due to first direction sawtooth 2224a and
The distance of second direction sawtooth 2224b tooth tip is greater than the distance H of first surface 2223a and second surface 2223b, which can
To prevent first surface 2223a and second surface 2223b in cutting process from touching backlight M, maximizes and reduces rubbing surface,
It is effectively reduced the heat generated due to friction.
Figure 14 is please referred to, in some other embodiment, the backlight cutter device 20 further comprises dust-extraction unit,
The dust-extraction unit is for removing the dust that cutter device 20 is generated when cutting backlight M.The dust-extraction unit includes exhausting
Machine 231, pipeline 232 and suction nozzle 233, suction nozzle 233 are connected through piping 232 and exhaust fan 231, and exhaust fan 231 is at suction nozzle 233
Form suction.Specifically, in some embodiments, the pipeline 232 includes plastic cement section 232a and metal segments 232b, metal segments
One end of 232b is fixed on the third sliding block 2213b, and the other end and suction nozzle 233 connect suction nozzle 233 being fixed on cutter
The rear of direction of advance when 2222 cutting.Described one end plastic cement section 232a is connected to the metal segments 232b other end and exhaust fan 231
Connection, plastic cement section 232b of the exhaust fan 231 through piping, using the metal segments 232a of pipeline, the last shape at suction nozzle 233
At suction, suction nozzle 233 is purged to prevent cutting process the backlight M dust generated in cutting process in cutter device
Pollution of the dust of middle generation to surrounding air.The suction nozzle 233 can be set to one or more, when suction nozzle is multiple
When, gas adapter can be used that the pipeline of plastic cement section 232a is divided into more to gas piping and be connected to multiple suction nozzles 232.It can manage
Solution, the suction nozzle 233 are preferably that soft material is made, and avoid scrape damaging to the surface backlight M in moving process
Backlight M.
Figure 15 is please referred to, in some other embodiment, the backlight cutter device 20 further comprises feedback control
System G10, the feedback control system G10 are set to the running precision that cutter device 22 is adjusted on the cutter device 22.
Spacing L known to aforementioned between adjacent two column LED chip 13 is 0.2-0.8mm, and spacing L is relatively narrow, what cutter device 22 was run
Error be easy to cause damage of the cutter 2222 in cutting process to LED chip 13.It can by being provided with feedback control system G10
To increase the running precision of cutter device 22, when cutting, is not allowed to easily cause the damage of LED chip 13, increases the yields of product.
Specifically, the feedback control system G10 includes comparator G11, controller G12, actuator G13 and detector
G14.Actuator G13 herein refers to driving the motor of aforementioned ball screw operation.The controller G12 respectively and compares
Device G11 and actuator G13 connection, detector G14 are used to detect the transportation load of cutter device 22, and the transportation load specifically may be used
Think the revolving speed of actuator G13 or the displacement of ball wire bar pair top shoe, the cutter device 22 that detector G14 will test
Transportation load passes to comparator G11, and comparator G11 will test the transportation load of the cutter device 22 of device G14 detection and backlight is cut
Cut the predetermined value being arranged inside device 20 to be compared, and comparison result passed into controller G12, controller G12 according to than
Compared with as a result, when there are when error, controller G12 controls the operating of actuator G13 so that error amount control is predetermined for comparison result
In the range of.The detector G14 can be the inclined code device of rotation or linear encoder or laser interferometer.It was verified that
By being provided with feedback control system G10, the kinematic error of the cutter device 22 be can control in ± 3 μ ms, substantially
Increase yields when product cutting.
Figure 16 is please referred to, the fourth embodiment of the present invention provides a kind of backlight cutting method S20, third is used to implement
Example described in backlight cutter device 20, the backlight cutting method S20 the following steps are included:
S201: backlight is fixed on the carrying platform；
S202: starting cutter device, the circular saw blade rotation on cutter device；
S203: circular saw blade contact backlight is simultaneously relatively moved on predetermined cuts route with backlight, will and knife
The backlight part of piece contact is dug.
In the step S203, the circular saw blade contacts backlight, and with backlight in predetermined cuts route
Backlight part with blade contact is dug following two mode that can specifically include by upper relative movement: backlight is fixed not
Dynamic, circular saw blade, which is rotated and run, runs to circle backlight progress slicing or circular saw blade rotation, backlight
At shape sawtooth blade, circular saw blade carries out slicing to backlight.
It in the step S203, further includes steps of during cutting backlight, removes cutting process
The dust of middle generation.
It in the step S203, further includes steps of during cutting backlight, the cutting is filled
The running precision set carries out feedback regulation.
With the design method, due to being to be cut using circular saw blade to backlight, in cutting process, circular saw
Teeth cutter blade is to be dug backlight along scheduled cutting route in a manner of plane, and the cutting mode is relative to existing using round
The rubbing surface of the mode that plain knife cuts backlight, circular saw blade and backlight shows, and is generated by friction
Heat reduces, cold scarce without adding water to carry out, so that the cutting mode is suitable for cutting and contains backlight made of fluorination matter fluorescent powder
Source.It was verified that carrying out slicing by using round saw tooth cutting tool, the temperature of backlight M can be by traditional grinding when slicing
When 80-100 DEG C be reduced to 30-50 DEG C.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in original of the invention
Made any modification within then, equivalent replacement and improvement etc. should all be comprising within protection scope of the present invention.
Claims (10)
1. a kind of backlight cutter device, for cutting backlight, the backlight includes substrate, it is formed in multiple on substrate
LED chip is packaged in base by spaced LED chip and the fluorescence coating being covered on multiple LED chips, the fluorescence coating
In plate and fluorescence coating, it is characterised in that: the backlight cutter device includes carrying platform and cutter device, the carrying platform
For carrying the backlight, the cutter device includes driving mechanism and cutter, and cutter is connected with the driving mechanism, driving
Mechanism driving cutter rotation simultaneously can form relative motion with backlight to be cut to cut to backlight, and the cutter is
Circular saw blade comprising cutter body and sawtooth, cutter include a median plane, and sawtooth is from the surrounding of cutter body far from
The direction of cutter body extends, and for the sawtooth further away from cutter body, the thickness of sawtooth is smaller, and the cutter body thickness is less than
The spacing of the backlight adjacent chips.
2. backlight cutter device as described in claim 1, it is characterised in that: the cutter body includes the first parallel table
Face and second surface, the plane of symmetry of first surface and second surface are the median plane of cutter, and the sawtooth includes first direction saw
Tooth and second direction sawtooth, first direction sawtooth and second direction sawtooth deviate to two sides respectively from median plane, first direction saw
The distance of tooth and second direction sawtooth tooth tip is greater than the distance of first surface and second surface.
3. backlight cutter device as described in claim 1, it is characterised in that: the backlight cutter device further comprises
Dust-extraction unit, the dust-extraction unit include exhaust fan, pipeline and suction nozzle, and suction nozzle is connected through piping with exhaust fan, and exhaust fan exists
Suction is formed at suction nozzle to remove the dust generated during cutting backlight.
4. backlight cutter device as described in claim 1, it is characterised in that: the backlight cutter device further comprises
Feedback control system, the feedback control system are set on cutter device and carry out feedback tune with the running precision to cutter device
Section.
5. backlight cutter device as described in claim 1, it is characterised in that: the space width of adjacent sawtooth is 0.5-
2mm, a height of 0.5-1.5mm of the tooth of the sawtooth.
6. backlight cutter device as described in any one in claim 1-5, it is characterised in that: the revolving speed of the cutter is
2000-6000r/min.
7. a kind of backlight cutting method uses backlight cutter device as claimed in claim 6, which is characterized in that institute
State backlight cutting method the following steps are included:
Backlight is located on bogey；
Start cutter device, driving mechanism drives circular saw blade rotation；And
Circular saw blade contact backlight simultaneously relatively moves on predetermined cuts route with backlight, by the back with blade contact
Light source part is dug.
8. backlight cutting method as claimed in claim 7, which is characterized in that the circular saw blade contacts backlight,
And relatively moved on predetermined cuts route with backlight the backlight part with blade contact is dug can specifically include with
Lower two ways: backlight is fixed, and circular saw blade, which is rotated and run, carries out slicing or round sawtooth to backlight
Blade rotation, backlight are run to circular saw blade, and circular saw blade carries out slicing to backlight.
9. backlight cutting method as claimed in claim 7, which is characterized in that further include steps of
During cutting backlight, the dust generated in cutting process is removed.
10. backlight cutting method as claimed in claim 7, which is characterized in that further include steps of
During cutting backlight, feedback control adjusting is carried out to the running precision of the cutter device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710513066.4A CN109129635A (en) | 2017-06-27 | 2017-06-27 | Backlight cutter device and backlight cutting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710513066.4A CN109129635A (en) | 2017-06-27 | 2017-06-27 | Backlight cutter device and backlight cutting method |
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| Publication Number | Publication Date |
|---|---|
| CN109129635A true CN109129635A (en) | 2019-01-04 |
Family
ID=64803299
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710513066.4A Withdrawn CN109129635A (en) | 2017-06-27 | 2017-06-27 | Backlight cutter device and backlight cutting method |
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| Country | Link |
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| CN (1) | CN109129635A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114905089A (en) * | 2022-07-19 | 2022-08-16 | 四川兆纪光电科技有限公司 | Backlight panel cutting device |
| CN116476287A (en) * | 2023-05-24 | 2023-07-25 | 苏州万润绝缘材料有限公司 | Production equipment of epoxy resin prepreg |
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| CN88101656A (en) * | 1987-04-01 | 1988-11-09 | 火石轮胎与橡胶公司 | A kind of apparatus and method that are used for transversely cutting strips of deformable material |
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| CN114905089A (en) * | 2022-07-19 | 2022-08-16 | 四川兆纪光电科技有限公司 | Backlight panel cutting device |
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| CN116476287B (en) * | 2023-05-24 | 2023-10-27 | 苏州万润绝缘材料有限公司 | Production equipment of epoxy resin prepreg |
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Application publication date: 20190104 |