CN109127853A - High-density packages SOT class lead frame punching mold and its application method - Google Patents
High-density packages SOT class lead frame punching mold and its application method Download PDFInfo
- Publication number
- CN109127853A CN109127853A CN201810941756.4A CN201810941756A CN109127853A CN 109127853 A CN109127853 A CN 109127853A CN 201810941756 A CN201810941756 A CN 201810941756A CN 109127853 A CN109127853 A CN 109127853A
- Authority
- CN
- China
- Prior art keywords
- punching mold
- lead frame
- punching
- feeding
- pinch roller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D28/00—Shaping by press-cutting; Perforating
- B21D28/02—Punching blanks or articles with or without obtaining scrap; Notching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D28/00—Shaping by press-cutting; Perforating
- B21D28/02—Punching blanks or articles with or without obtaining scrap; Notching
- B21D28/14—Dies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D43/00—Feeding, positioning or storing devices combined with, or arranged in, or specially adapted for use in connection with, apparatus for working or processing sheet metal, metal tubes or metal profiles; Associations therewith of cutting devices
- B21D43/02—Advancing work in relation to the stroke of the die or tool
- B21D43/04—Advancing work in relation to the stroke of the die or tool by means in mechanical engagement with the work
- B21D43/08—Advancing work in relation to the stroke of the die or tool by means in mechanical engagement with the work by rollers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D45/00—Ejecting or stripping-off devices arranged in machines or tools dealt with in this subclass
- B21D45/02—Ejecting devices
- B21D45/04—Ejecting devices interrelated with motion of tool
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F1/00—Bending wire other than coiling; Straightening wire
Abstract
The invention discloses high-density packages SOT class lead frame punching mold and its application methods, it includes punching mold ontology (1), positioned at the intrinsic feeding cover board (2) of punching mold, feeding track (3) positioned at punching mold ontology both ends and the roller feeding mechanism (4) positioned at punching mold ontology both ends, it is divided into punching work step (5) along lead frame direction of advance in punching mold ontology, pin forming work step (6) and shaped article blanking port (7), roller feeding mechanism includes the front wheel feeding mechanism before punching mold ontology and the rear roller feeding mechanism after punching mold ontology, punching mold ontology includes upper die and lower die, the gap of feeding cover board and lower die is 0.1-0.2mm.The beneficial effects of the invention are as follows no pusher dog molds and high speed transfer mode to realize that high density SOT encapsulating lead is moved in mold by the step pitch of setting.
Description
Technical field
The present invention relates to IC punching field shaping techniques more particularly to high-density packages SOT class lead frame to rush
Cut molding die and its application method.
Background technique
With the continuous advancement of semiconductor technology, the packaging density of SOT class product lead frame is higher and higher, encapsulates simultaneously
Factory is also higher and higher to the capacity requirements of SOT class product punching formation equipment.Traditional SOT lead frame punching formation equipment
For action sequence due to wanting matched mold molding simultaneously, pusher dog movement, pusher dog lift action, punching speed highest only has 110
Beat/min, and domestic major encapsulation producer is typically necessary the capacity requirements of SOT class lead frame punching formation equipment now
180 beats/min.In existing punching molding process, the arrangement of general procedure is usually such that rush cast gate, rushes air discharge duct
Process → rib cutting punching modeling process → molding procedure → separation process rushes cast gate, rushes four air discharge duct, rib cutting punching modeling and molding processes
Usually completed on punching mold, and separation process is generally completed by separation mold, and separation process needs to occupy volume
Outer time, traditional at this time sent on by idler wheel to mold retaining screw position enter punching by pusher dog group lead frame frame hole again
Feeding style in molding die does not have been carried out high speed transfer demand.
Chinese invention patent publication number CN103084504B is disclosed to be sent for the idler wheel of IC punching formation equipment
Expect mechanism, it includes pedestal (15) and the transmission rail (6) for being used to transmit lead frame on pedestal, the close transmission
The pedestal of track one end is equipped with lead frame flattening mechanism (5), and roller compression mechanism and driving idler wheel are equipped in transmission rail
The driving mechanism of hold-down mechanism.Integrated circuit can be quickly and easily sent into the gear of punching mold by the roller feeding mechanism
Position is followed closely, is entered in punching mold if still dialling lead frame frame hole by pusher dog, punching molding efficiency is still not
It can be improved.
Summary of the invention
The technical problem to be solved by the present invention is to the punching molds of existing high density SOT class product lead frame only
Rib cutting and molding procedure can be completed, separation process needs to be completed with other separation equipment, and which consumes additional working hours, together
When punching mold using retaining screw and pusher dog cooperation tow lead frame enter the feeding style efficiency in punching mold
Lower, the time that integrally punching molding needs is far from satisfying production requirement, provides a kind of high-density packages SOT class thus and draws
Wire frame punching mold and its application method.
The technical scheme is that high-density packages SOT class lead frame punching mold, it includes punching molding
Die ontology is sent positioned at the feeding track at punching mold ontology both ends and the idler wheel positioned at punching mold ontology both ends
Expect mechanism, in the punching mold ontology along lead frame direction of advance be divided into punching work step, pin forming work step and at
Type product blanking port, the roller feeding mechanism include front wheel feeding mechanism before the punching mold ontology and are located at
Rear roller feeding mechanism after punching mold ontology.
Roller feeding mechanism described in above scheme includes the pinch roller for being movably connected in feeding track top outer, activity company
Connect the idler wheel being driven by motor on the inside of feeding track and the reflective sensor on the inside of feeding track, the pinch roller and rolling
Wheel, which is located on same vertical plane, to be spaced apart, and the pinch roller is connect with lever, and the lever is connect by pillar with pinch roller cylinder,
It is fitted with pressure spring on the pillar, lever band when pinch roller cylinder driving pressure spring compression after reflective sensor detects lead frame
Dynamic pressure wheel is bonded with idler wheel downwards.
The improvement of above scheme is that the pinch roller and roller surface are carved with anti-skid design.
The rated speed 9000-12000r/min of motor described in above scheme.
The application method of high-density packages SOT class lead frame punching mold, it is the following steps are included: (1), feeding
Enter position: lead frame enters after feeding track detected by the reflective sensor of front wheel feeding mechanism, pinch roller cylinder driving pressure
Wheel, which is moved down, is matched for clamping tightly lead frame with idler wheel, and the rotation of motor driven idler wheel drives lead frame to enter in punching mold,
Chip is separated with lead frame by punching work step, by pin forming work step by chip pin bending and molding, through overmolding
Chip is fallen into storage box when product blanking port；(2), feeding goes out position: remaining waste material is passed by the reflection of rear roller feeding mechanism
Sensor detects that pinch roller cylinder driving pinch roller, which is moved down, is matched for clamping tightly lead frame with idler wheel, and the rotation of motor driven idler wheel, which drives, draws
Wire frame pulls out outside punching mold.
The beneficial effects of the invention are as follows no pusher dog molds and high speed transfer mode to realize high density SOT encapsulating lead
Moved in mold by the step pitch of setting realize chip cut dissipate separation and molding procedure and by product after molding by
Blanking port is taken in storage box.Rib cutting is rushed modeling process → molding procedure → separation process and is integrated in a die cutting die by the present invention
In ontology, while cooperating and being realized quick feeding by the motor-driven roller feeding mechanism of high speed high torque and quickly formed
Chip simplifies the action sequence of equipment, so the punching speed of equipment is greatly increased to 200 beats/min.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the invention；
Fig. 2 is the internal view of punching mold in Fig. 1；
Fig. 3 is the cooperation schematic diagram of feeding cover board and lower die in Fig. 1；
Fig. 4 is roller feeding mechanism and feeding track cooperation schematic diagram in Fig. 1；
In figure, 1, punching mold ontology, 2, feeding cover board, 3, feeding track, 4, roller feeding mechanism, 5, punching work step,
6, pin forming work step, 7, shaped article blanking port, 8, pinch roller, 9, idler wheel, 10, reflective sensor, 11, pinch roller cylinder, 12, draw
Wire frame, 13, lower die.
Specific embodiment
With reference to the accompanying drawing, technical scheme in the embodiment of the invention is clearly and completely described.Obviously, it is retouched
The embodiment stated is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, originally
Field those of ordinary skill every other embodiment without making creative work, belongs to protection model of the invention
It encloses.
As shown in Figs 1-4, high-density packages SOT class lead frame punching mold of the invention, it includes being punched into
Type die ontology 1 is located at the intrinsic feeding cover board 2 of punching mold, the feeding positioned at punching mold ontology both ends
Track 3 and roller feeding mechanism 4 positioned at punching mold ontology both ends, along lead frame in the punching mold ontology
12 direction of advance of frame is divided into punching work step 5, pin forming work step 6 and shaped article blanking port 7, the roller feeding mechanism
Front wheel feeding mechanism before punching mold ontology and the rear roller feeder after punching mold ontology
Structure, the punching mold ontology include upper die and lower die 13, and the gap of the feeding cover board and lower die is 0.1-0.2mm.
Punching mold ontology in the present invention is fallen compared to traditional punching mold compared to more shaped articles
Material mouth 7, the product after punching molding can be fallen directly into the storage box below shaped article blanking port, realize rib cutting
Punching modeling process, molding procedure, separation process are completed in a punching mold, save molding procedure and separation process it
Between waiting time.Punching mold ontology includes upper die and lower die, and upper and lower mould, which is equipped with, is used to complete to rush cast gate, punching exhaust
Slot, rib cutting punching modeling, molding procedure ground die assembly and stripper, slideway and feeding cover board.The gap of feeding cover board and lower die is protected
Card cuts the chip after dissipating, and that location deflection, offset and movement does not occur during dragged is smooth, if gap is less than 0.1mm meeting
Cause chip to move when advancing with lead frame to have some setbacks, causes chip with lead if gap is greater than 0.2mm
Transmitting offset, cannot can smoothly enter into shaped article blanking port when frame advances.
Embodiment 1: high-density packages SOT class lead frame punching mold, it include punching mold ontology 1,
Positioned at the intrinsic feeding cover board 2 of punching mold, positioned at the feeding track 3 at punching mold ontology both ends and positioned at punching
The roller feeding mechanism 4 at molding die ontology both ends is cut, is divided in the punching mold ontology along lead frame direction of advance
For punching work step 5, pin forming work step 6 and shaped article blanking port 7, the roller feeding mechanism includes being located to be punched into pattern
Front wheel feeding mechanism before having ontology and the rear roller feeding mechanism after punching mold ontology, the punching molding
Die ontology includes upper die and lower die, and the gap of the feeding cover board and lower die is 0.1mm；Roller feeding mechanism includes that activity connects
Connect the pinch roller 8 in feeding track top outer, the idler wheel 9 being driven by motor that is movably connected on the inside of feeding track and positioned at sending
Expect the reflective sensor 10 on the inside of track, the rated speed 9000r/min of motor, the pinch roller and idler wheel are located at same vertical plane
On be spaced apart, the pinch roller is connect with lever, and the lever is connect by pillar with pinch roller cylinder 11, is adapted on the pillar
Have pressure spring, after reflective sensor detects lead frame pinch roller cylinder driving pressure spring compression when lever drive pinch roller downwards with rolling
Wheel fitting.Roller compression disclosed in the working principle and Chinese invention patent publication number CN103084504B of the roller feeding mechanism
Mechanism is consistent.
Embodiment 2: the difference from embodiment 1 is that the gap of feeding cover board and lower die be 0.15mm, specified turn of motor
Fast 10000r/min.
Embodiment 3: the difference from embodiment 1 is that the gap of feeding cover board and lower die is 0.2mm, the rated speed of motor
12000r/min。
Embodiment 4: it is that pinch roller and roller surface are carved with anti-skid design with the difference of embodiment 1.Guarantee enough frictions
Power drives lead frame to advance.
Above-described embodiment can according to need any combination, as long as obtained scheme, which does not conflict, belongs to protection of the invention
In range.
The application method of high-density packages SOT class lead frame punching mold, it is the following steps are included: (1), feeding
Enter position: lead frame enters after feeding track detected by the reflective sensor of front wheel feeding mechanism, pinch roller cylinder driving pressure
Wheel, which is moved down, is matched for clamping tightly lead frame with idler wheel, and the rotation of motor driven idler wheel drives lead frame to enter in punching mold,
Chip is separated with lead frame by punching work step, by pin forming work step by chip pin bending and molding, through overmolding
Chip is fallen into storage box when product blanking port；(2), feeding goes out position: remaining waste material is passed by the reflection of rear roller feeding mechanism
Sensor detects that pinch roller cylinder driving pinch roller, which is moved down, is matched for clamping tightly lead frame with idler wheel, and the rotation of motor driven idler wheel, which drives, draws
Wire frame pulls out outside punching mold.
The motor of the high speed high torque of rated speed 9000-12000r/min drives idler wheel rotation by shaft coupling, utilizes
One step of step pitch that frictional force between the pressing force and idler wheel and lead frame of pinch roller sets lead frame according to the parameter of electric machine
Step be sent into mold in complete punching molding, cut scattered chip by the frame of lead frame be dragged to shaping step completion at
Type process, chip after molding are dragged to above molding blanking port in self weight income storage box by frame again.
Claims (5)
1. high-density packages SOT class lead frame punching mold, it includes punching mold ontology (1), is located at punching
The intrinsic feeding cover board (2) of molding die, positioned at the feeding track (3) at punching mold ontology both ends and positioned at being punched into
The roller feeding mechanism (4) at type die ontology both ends, it is characterized in that: advancing in the punching mold ontology along lead frame
It includes position that direction, which is divided into punching work step (5), pin forming work step (6) and shaped article blanking port (7), the roller feeding mechanism,
Front wheel feeding mechanism before punching mold ontology and the rear roller feeding mechanism after punching mold ontology,
The punching mold ontology includes upper die and lower die, and the gap of the feeding cover board and lower die is 0.1-0.2mm.
2. high-density packages SOT class lead frame punching mold as described in claim 1, it is characterized in that: the idler wheel
Feeding mechanism include the pinch roller (8) for being movably connected in feeding track top outer, be movably connected on the inside of feeding track by electricity
The idler wheel (9) and the reflective sensor (10) on the inside of feeding track of machine driving, the pinch roller and idler wheel are located at same vertical
It is spaced apart on face, the pinch roller is connect with lever, and the lever is connect by pillar with pinch roller cylinder (11), on the pillar
It is fitted with pressure spring, lever drives pinch roller downward when pinch roller cylinder driving pressure spring compression after reflective sensor detects lead frame
It is bonded with idler wheel.
3. high-density packages SOT class lead frame punching mold as claimed in claim 2, it is characterized in that: the pinch roller
Anti-skid design is carved with roller surface.
4. high-density packages SOT class lead frame punching mold as claimed in claim 2, it is characterized in that: the motor
Rated speed 9000-12000r/min.
5. the application method of high-density packages SOT class lead frame punching mold as claimed in claim 2, it is characterized in that
It is the following steps are included: (1), feeding enter position: lead frame enters feeding track by the reflective sensor of front wheel feeding mechanism
After detecting, pinch roller cylinder driving pinch roller, which is moved down, is matched for clamping tightly lead frame with idler wheel, and the rotation of motor driven idler wheel drives lead
Frame enters in punching mold, separates chip with lead frame by punching work step, by pin forming work step by core
Piece pin bending and molding is fallen into storage box by chip when shaped article blanking port；(2), feeding goes out position: remaining waste material quilt
The reflective sensor of rear roller feeding mechanism detects that pinch roller cylinder driving pinch roller, which is moved down, is matched for clamping tightly lead frame with idler wheel,
The rotation of motor driven idler wheel drives lead frame to pull out outside punching mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810941756.4A CN109127853A (en) | 2018-08-17 | 2018-08-17 | High-density packages SOT class lead frame punching mold and its application method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810941756.4A CN109127853A (en) | 2018-08-17 | 2018-08-17 | High-density packages SOT class lead frame punching mold and its application method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109127853A true CN109127853A (en) | 2019-01-04 |
Family
ID=64789850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810941756.4A Pending CN109127853A (en) | 2018-08-17 | 2018-08-17 | High-density packages SOT class lead frame punching mold and its application method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109127853A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110369608A (en) * | 2019-06-28 | 2019-10-25 | 无锡红光微电子股份有限公司 | The Trim Molding device of semiconductor devices |
| CN113814312A (en) * | 2021-11-25 | 2021-12-21 | 新恒汇电子股份有限公司 | High-precision rib cutting method for flexible lead frame |
| CN114194899A (en) * | 2021-12-09 | 2022-03-18 | 安徽耐科装备科技股份有限公司 | Die-cut pay-off guide rail mechanism and cut muscle system |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0615799A1 (en) * | 1993-02-24 | 1994-09-21 | Aida Engineering, Ltd. | Method and apparatus for processing material in a progressive die |
| CN203109095U (en) * | 2013-03-05 | 2013-08-07 | 铜陵三佳山田科技有限公司 | Roller feeding mechanism for integrated circuit punching forming device |
| CN204035367U (en) * | 2014-07-24 | 2014-12-24 | 常州常利来电子有限公司 | Material strip cuts simple frock |
| CN204486630U (en) * | 2015-03-26 | 2015-07-22 | 厦门市湖里星光金属制品工业有限公司 | A kind of punch press feeder |
| CN206614608U (en) * | 2017-03-10 | 2017-11-07 | 江苏钜芯集成电路技术股份有限公司 | A kind of multi-row-type Trim Molding tool |
| CN207547379U (en) * | 2017-08-11 | 2018-06-29 | 苏州赛硕拉不锈钢制品有限公司 | Stainless steel plate perforating press |
-
2018
- 2018-08-17 CN CN201810941756.4A patent/CN109127853A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0615799A1 (en) * | 1993-02-24 | 1994-09-21 | Aida Engineering, Ltd. | Method and apparatus for processing material in a progressive die |
| CN203109095U (en) * | 2013-03-05 | 2013-08-07 | 铜陵三佳山田科技有限公司 | Roller feeding mechanism for integrated circuit punching forming device |
| CN204035367U (en) * | 2014-07-24 | 2014-12-24 | 常州常利来电子有限公司 | Material strip cuts simple frock |
| CN204486630U (en) * | 2015-03-26 | 2015-07-22 | 厦门市湖里星光金属制品工业有限公司 | A kind of punch press feeder |
| CN206614608U (en) * | 2017-03-10 | 2017-11-07 | 江苏钜芯集成电路技术股份有限公司 | A kind of multi-row-type Trim Molding tool |
| CN207547379U (en) * | 2017-08-11 | 2018-06-29 | 苏州赛硕拉不锈钢制品有限公司 | Stainless steel plate perforating press |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110369608A (en) * | 2019-06-28 | 2019-10-25 | 无锡红光微电子股份有限公司 | The Trim Molding device of semiconductor devices |
| CN113814312A (en) * | 2021-11-25 | 2021-12-21 | 新恒汇电子股份有限公司 | High-precision rib cutting method for flexible lead frame |
| CN114194899A (en) * | 2021-12-09 | 2022-03-18 | 安徽耐科装备科技股份有限公司 | Die-cut pay-off guide rail mechanism and cut muscle system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109127853A (en) | High-density packages SOT class lead frame punching mold and its application method | |
| CN104742413B (en) | It is a kind of from moving magnet fitting machine | |
| CN205949709U (en) | Horizontal hunting formula dynamic sending machine in mould | |
| CN201350681Y (en) | Novel mould core-pulling mechanism of internal back-off pentroof | |
| CN109015896A (en) | A kind of lower folding for automatic packaging system removes flow passage device | |
| CN106335158B (en) | The automatic continuous injection molding system of 3C electronic chip packaging | |
| CN206765244U (en) | A kind of bottle cap of vacuum flask mould | |
| CN201791805U (en) | LED bracket bending machine | |
| CN209794450U (en) | Front mould back-off mechanism of loosing core | |
| CN208946362U (en) | A kind of lower folding for automatic packaging system removes flow passage device | |
| CN207914427U (en) | A kind of diel for bending floating core pulling | |
| CN202861240U (en) | Automatic material pulling device of mold | |
| CN206926204U (en) | A kind of lampshade mould | |
| CN204584018U (en) | A kind of device for automatically molding making brush hold assembly | |
| CN206382397U (en) | A kind of turn-cutting die | |
| CN201263037Y (en) | Device for forming glass-sealing diode conductor | |
| CN102921825A (en) | Automatic pulling device of mold | |
| CN211758257U (en) | A segmentation needle cutting mechanism for staple packing processing | |
| CN208643771U (en) | A kind of small U pipe flattens clamping blot lock | |
| CN202239160U (en) | Slicing device of lead frame | |
| CN102543664B (en) | Diode lead forming device | |
| CN201728696U (en) | Phenolic aldehyde gasket punching device | |
| CN204412916U (en) | One is applicable to take out tooth flange molding structure in high-speed stamping die | |
| CN209319931U (en) | A kind of perforating mold in dust catcher production process | |
| CN218856164U (en) | Single-hole hook pressing machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190104 |