CN109121314B - A kind of printing preparation method and device of printed circuit - Google Patents
A kind of printing preparation method and device of printed circuit Download PDFInfo
- Publication number
- CN109121314B CN109121314B CN201811109532.3A CN201811109532A CN109121314B CN 109121314 B CN109121314 B CN 109121314B CN 201811109532 A CN201811109532 A CN 201811109532A CN 109121314 B CN109121314 B CN 109121314B
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- Prior art keywords
- melting
- polar plot
- low
- point metal
- plot source
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/003—Apparatus, e.g. furnaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/115—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces by spraying molten metal, i.e. spray sintering, spray casting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
Abstract
The invention discloses a kind of printing preparation method of printed circuit and device, method includes: acquisition vector graphics file；Identify the first polar plot source for including in the vector graphics file；Judge with the presence or absence of overlapping between first polar plot source, and first polar plot source of overlapping is merged, obtains at least one second polar plot source；Print track is generated according to the second polar plot source described at least one；The low-melting-point metal of molten state is printed in the printing substrate in the temperature environment not less than the fusing point of the low-melting-point metal according to the print track, forms printed circuit.The present invention is by reintegrating polar plot source before generating print track, to eliminate the region being wherein overlapped, it is ensured that be formed by low-melting-point metal liquid metal entirety uniformity in figure, prevent the appearance of spillover.
Description
Technical field
The invention belongs to electronic circuit increases material manufacturing technology field more particularly to a kind of printing preparation methods of printed circuit
And device.
Background technique
New material of the liquid metal as increases material manufacturing technology, since it is far below conventionally manufactured metals such as copper, aluminium, silver
The fusing point of material, so that the complexity of making apparatus, energy consumption, safety and environmentally friendly auxiliary facility are greatly simplified, it is electronics
Quickly manufacture provides the foundation at the scene of circuit.
Vehicle equipment of the liquid metal printer as liquid metal increases material manufacturing technology, user can use and beat accordingly
Printing apparatus carries out scene quickly manufacture to the vector map file of design.At present in liquid metal printer printing effect it is still further preferred that
Liquid metal write-through printer draws liquid metal circuit in printing substrate similar to the mode of lettering pen.
However, when carrying out Circuit Drawing in software, due to the design habit of user and the arrow of segment vector map file
Amount supports limitation, inevitable that overlapping, this overlapping not only will increase additional in print procedure for the polar plot of design
Consumptive material and time-consuming can also be excessive due to the amount liquid metal of regional area for normal temperature liquid metal printing, cause liquid
The problem of metal overflows, influences the quality of printed circuit entirety.
Summary of the invention
In view of this, it is an object of the invention to propose a kind of printing preparation method of printed circuit, it is existing to solve
Local liquid metal caused by the overlapping of polar plot source excessively generates in technology, liquid metal overflow problem.
In some illustrative embodiments, the printing preparation method of the printed circuit, comprising: obtain vector graphics text
Part；Identify the first polar plot source for including in the vector graphics file；Judge to whether there is between first polar plot source
Overlapping, and first polar plot source of overlapping is merged, obtain at least one second polar plot source；According at least one
Second polar plot source generates print track；The low-melting-point metal of molten state is printed on according to the print track and is not less than
In printing substrate in the temperature environment of the fusing point of the low-melting-point metal, printed circuit is formed.
In some optionally embodiments, the fusing point of the low-melting-point metal is not higher than 300 DEG C.
In some optionally embodiments, the fusing point of the low-melting-point metal is not higher than 200 DEG C.
In some optionally embodiments, the fusing point of the low-melting-point metal is not higher than 100 DEG C.
In some optionally embodiments, the fusing point of the low-melting-point metal is not higher than 50 DEG C.
In some optionally embodiments, the fusing point of the low-melting-point metal is between 10 DEG C -20 DEG C.
In some optionally embodiments, the temperature of the temperature environment is at least higher by the fusing point 5 of the low-melting-point metal
℃。
In some optionally embodiments, the temperature of the temperature environment is between 25 DEG C -35 DEG C.
In some optionally embodiments, the low-melting-point metal is using gallium simple substance, the gallium-indium alloy of eutectic and low total
It is one or more of in molten gallium-indium-tin alloy.
In some optionally embodiments, the printing preparation method is applied to liquid metal write-through printer.
It is another object of the present invention to the printing preparation facilities for proposing a kind of printed circuit, to solve in the prior art
?.
In some illustrative embodiments, the printing preparation facilities of the printed circuit, comprising: cache module, for obtaining
Take vector graphics file；Parsing module, the first polar plot source for including in the vector graphics file for identification；Merge mould
Block for judging with the presence or absence of overlapping between first polar plot source, and first polar plot source of overlapping is melted
It closes, obtains at least one second polar plot source；Track generation module, for being generated according to the second polar plot source described at least one
Print track；Print module is low not less than described for being printed on the low-melting-point metal of molten state according to the print track
In printing substrate in the temperature environment of the fusing point of melting point metals, printed circuit is formed.
Compared with prior art, the present invention has the advantage that
The present invention is by reintegrating polar plot source before generating print track, to eliminate the region being wherein overlapped, really
Guarantor is formed by the whole uniformity of low-melting-point metal in figure (liquid metal), prevents the appearance of spillover.
Detailed description of the invention
Fig. 1 is that schematic diagram is overlapped as caused by the line of centres in circuit design software in the prior art；
Fig. 2 is to be illustrated in the prior art by basis vector figure source lapping into caused overlapping in conventional vector graphic file
Figure；
Fig. 3 is the flow chart of printing preparation method in the embodiment of the present invention；
Fig. 4 is liquid metal single line lapping schematic diagram in the embodiment of the present invention；
Fig. 5 is liquid metal single line lapping schematic diagram in the embodiment of the present invention；
Fig. 6 is the liquid metal single line lapping effect diagram in the embodiment of the present invention；
Fig. 7 is the structural block diagram of the printing preparation facilities in the embodiment of the present invention.
Specific embodiment
The following description and drawings fully show specific embodiments of the present invention, to enable those skilled in the art to
Practice them.Other embodiments may include structure, logic, it is electrical, process and other change.Embodiment
Only represent possible variation.Unless explicitly requested, otherwise individual components and functionality is optional, and the sequence operated can be with
Variation.The part of some embodiments and feature can be included in or replace part and the feature of other embodiments.This hair
The range of bright embodiment includes equivalent obtained by the entire scope of claims and all of claims
Object.Herein, these embodiments of the invention can individually or generally be indicated that this is only with term " invention "
For convenience, and if in fact disclosing the invention more than one, the range for being not meant to automatically limit the application is to appoint
What single invention or inventive concept.
Currently, the electric circuit diagram design software of drawing manufacturer publication has a lot of, such as traditional Altium Designer
The Visio of (Protel 99), Pads, Cadence Orcad and Microsoft can meet the Cartography designing of circuit diagram, can lead
Provide the file of vector graphics attribute.The etch process that this document may be directly applied to traditional PCB plate is made, or
It is that printing preparation is carried out in traditional printing technique.
Usually contained several routes, pad isovector figure source in vector graphics file, when design due to software from
Wiring and/or the habit of user are moved, overlapping, such as Fig. 1 can be had by being substantially all between polar plot source；On the other hand, different type
Vector graphics file define different basic vector figure sources, each basic vector figure source is independent completion, for
For undefined or complicated polar plot source, lapping can be carried out by several basic vector figures source and be formed, this will also result in overlapping
Phenomenon, as Gerber file does not support that round rectangle polar plot, Altium Designer software can be vertical with 4 circles and 2
Rectangle indicates that the polar plot, Ultiboard can be indicated with 4 peripheral conducting wires and central rectangular.Such as Fig. 2.
Prepared by traditional PCB plate for etch process, manufacture is cut out since it belongs to, is by the blank in identification circuit figure
Then place carries out etching, the photoetching of designated position to copper facing, form printing pcb board, above-mentioned overlapping will not be to the copper plate electric of formation
Road impacts.
And for the liquid metal write-through printer for belonging to increasing material manufacturing, overlapping region will cause the two of printer
Secondary or more printing, thus the situation for causing the printing amount of overlapping part excessive, if this thing is melting using under room temperature
The low-melting-point metal of state, since liquid metal still maintains its fluid state in printing substrate, gold is excessively easily caused in part
Belong to the spilling of route.
The flow chart of the printing preparation method of the printed circuit in the embodiment of the present invention is shown referring now to Fig. 3, Fig. 3,
As shown in the flow chart, the invention discloses a kind of printing preparation methods of printed circuit, comprising:
Step S11. obtains vector graphics file；
Step S12. identifies the first polar plot source for including in the vector graphics file；
Step S13. judges with the presence or absence of overlapping between first polar plot source, and by first polar plot of overlapping
Source is merged, at least one second polar plot source is obtained；
Step S14. generates print track according to the second polar plot source described at least one；
The low-melting-point metal of molten state is printed on not less than the low melting point gold by step S15. according to the print track
In printing substrate in the temperature environment of the fusing point of category, printed circuit is formed.
Polar plot source attribute in the embodiment includes: its figure, specific coordinate and specific length attribute, wherein the
One polar plot source refers to the original vector figure source that parsing vector graphics file obtains, and the second polar plot source refers to the first polar plot source
The obtained polar plot source after fusion, may include fusion polar plot source in the polar plot source, and originally non-overlapping first
Polar plot source.
The present invention is by reintegrating polar plot source before generating print track, to eliminate the region being wherein overlapped, really
Guarantor is formed by the whole uniformity of low-melting-point metal in figure (liquid metal), prevents the appearance of spillover.
In some embodiments, the overlapping in step S13 between process decision chart source, is analyzed using coordinate information, from
And determine to obtain between 2 and 2 or more polar plot sources with the presence or absence of overlapping relation, polar plot source is carried out in step S13
The mode of fusion can plan again new polar plot source identifying along side, by way of digital snapshot or calculating cover graphics.
In some embodiments, the mode that print track is generated in step S14 can be used track in the prior art and generate
Algorithm, such as cissing filling, individual event filling.
Such as Fig. 4 and Fig. 5, in some embodiments, the spacing in step S14 between two adjacent liquid metal lines is less than
Single line width, obtaining adjacent liquid metal line (1010,1020) can mutually merge, avoid due to liquid metal surface tension compared with
Big problem generates diminishing line, hollow phenomenon.
Referring to Fig. 6
Offset step in Fig. 6 a between liquid metal line using single line width as print head designs, i.e. liquid metal list
Lapping range between line is 0, and ideally it should just be connected, but in practice due to the surface tension of liquid metal
Effect, leads to the state being separated from each other between liquid metal single line.
It is less than the design of single line width, but single line lapping range between liquid metal single line in Fig. 6 b using offset step
Smaller, laps are not enough to overcome respective single wire surface tension (stress point), so that still there may be due to surface tension
The phenomenon that breaking.
It is less than the design of single line width, but single line lapping range between liquid metal single line in Fig. 6 c using offset step
Larger, the surface area that the line group of two single lines reconstruct is contacted with printing substrate is not enough to fetter the liquid metal in the region, i.e.,
The gravity of liquid metal is greater than the liquid metal surface tension in the region, so as to cause the liquid metal in the region indefinite
To overflow problem.
It is less than the design of single line width between liquid metal single line in Fig. 6 d using offset step, single line lapping range was both
It is not too small, only greatly, to guarantee being stabilized for liquid metal line.
Further, when the lapping range between liquid metal single line is not less than the 20% of single line width, can obviously change
The problem of shown in kind Fig. 6 b.When lapping range between liquid metal single line is no more than the 80% of single line width, it can keep away
Exempt from problem shown in Fig. 6 c.When region i.e. in lapping range between the 20%-80% of single line width, can effectively it change
Defect problem caused by kind print liquid metallic circuit, reaches the printing effect of Fig. 6 d.
In some preferred embodiments, when lapping range is set as the 45%-60% of single line width, can greatly it be promoted
The reliability and stability of print liquid metallic circuit make the fused stable structure of liquid metal, are not susceptible to deform and overflow
It goes wrong.
Low-melting-point metal simple substance of the fusing point not higher than 300 DEG C or conjunction can be used in low-melting-point metal in the embodiment of the present invention
Gold, wherein the melting temperature of low-melting-point metal may be selected 12 ± 2 DEG C, 17 ± 2 DEG C, 29 ± 2 DEG C, 65 ± 2 DEG C, 80 ± DEG C, 98 ±
2℃,120±2℃,180±2℃,220±2℃,232±2℃,260±2℃,288±2℃,298±2℃.Such as mercury, gallium,
Indium, tin simple substance, gallium-indium alloy, gallium-indium-tin alloy, gallium tin alloy, gallium kirsite, gallium indium kirsite, gallium red brass, gallium indium tin
Kirsite, gallium tin cadmium alloy, gallium Zn-Cd alloy, bismuth indium alloy, bismuth tin alloy, bismuth indium stannum alloy, bismuth indium kirsite, bismuth tin zinc close
One of gold, bismuth indium red brass, leypewter, gun-metal, tin pltine, Tin Silver Copper Alloy, bismuth terne metal or
It is several.Wherein, the fusing point of above-mentioned alloy can carry out the proportion selection of corresponding fusing point according to the ratio in its alloy phase diagram.Such as gallium
Indium alloy, according to its alloy phase diagram, as the content of gallium is constantly reduced from 100%-0%, the content of indium is continuous from 0%-100%
During raised, alloy melting point is gradually reduced since 29 DEG C, until reaching the eutectic point of gallium-indium alloy, gallium indium is closed at this time
The fusing point of gold is minimum (15 DEG C or so), the gallium of the ratio 79.6 of gallium-indium alloy, 21.4 indium, hereafter, the fusing point of gallium-indium alloy by
It walks close to the fusing point of indium, may ultimately reach 158 DEG C or so.
Further, in order to reduce the equipment requirement and energy consumption of liquid metal printer, fusing point is can be selected in low-melting-point metal
Not higher than 200 DEG C, or even it is no greater than 100 DEG C of low-melting-point metal simple substance or alloy.Wherein, the melting temperature of low-melting-point metal
May be selected 12 ± 2 DEG C, 17 ± 2 DEG C, 25 ± 2 DEG C, 29 ± 2 DEG C, 45 ± 2 DEG C, 50 ± 2 DEG C, 65 ± 2 DEG C, 72 ± 2 DEG C, 80 ± DEG C,
98±2℃.The metal simple-substance or alloy for meeting the fusing point can be selected according to its phasor.
Further, the fusing point of the low-melting-point metal is not higher than 50 DEG C.Preferably, the low-melting-point metal can meet
Fusing point selects in metal simple-substance/alloy between 10 DEG C -20 DEG C.Further, the low-melting-point metal is using gallium simple substance, low
It is one or more of in the gallium-indium alloy of congruent melting and the gallium-indium-tin alloy of eutectic, the metalloid under the conditions of room temperature (room temperature) still
In molten state, there is good mobility.
In some embodiments, the temperature of the temperature environment is at least higher by 5 DEG C of fusing point of the low-melting-point metal.Guarantee
Low-melting-point metal still maintains the state of its melting in printing substrate.Preferably, the temperature of the temperature environment is at 25 DEG C -35
Between DEG C.
Printing preparation method in the embodiment of the present invention is mainly used in liquid metal write-through printer, by printing
The mode for describing filling in substrate forms printed circuit.
It is another object of the present invention to the printing preparation facilities for proposing a kind of printed circuit, to solve in the prior art
?.
Such as Fig. 7, the invention also discloses a kind of printing preparation facilities 100 of printed circuit, comprising: obtains vector graphics text
The cache module 101 of part；Identify the parsing module 102 in the first polar plot source for including in the vector graphics file；Judge institute
It states with the presence or absence of overlapping between the first polar plot source, and first polar plot source of overlapping is merged, obtain at least one
The Fusion Module 103 in a second polar plot source；The track for generating print track according to the second polar plot source described at least one is raw
At module 104；The low-melting-point metal of molten state is printed on melting not less than the low-melting-point metal according to the print track
In printing substrate in the temperature environment of point, the print module 05 of printed circuit is formed.
Printing preparation facilities 100 in the embodiment suitable for the above method for low melting point metal material, fusing point, with
And the restriction of environment temperature.
It should also be appreciated by one skilled in the art that various illustrative logical boxs, mould in conjunction with the embodiments herein description
Electronic hardware, computer software or combinations thereof may be implemented into block, circuit and algorithm steps.In order to clearly demonstrate hardware and
Interchangeability between software surrounds its function to various illustrative components, frame, module, circuit and step above and carries out
It is generally described.Hardware is implemented as this function and is also implemented as software, depends on specific application and to entire
The design constraint that system is applied.Those skilled in the art can be directed to each specific application, be realized in a manner of flexible
Described function, still, this realization decision should not be construed as a departure from the scope of protection of this disclosure.
Claims (10)
1. a kind of printing preparation method of printed circuit characterized by comprising
Obtain vector graphics file；
Identify the first polar plot source for including in the vector graphics file；
Judge with the presence or absence of overlapping between first polar plot source, and first polar plot source of overlapping merged,
Obtain at least one second polar plot source；
Print track is generated according to the second polar plot source described at least one；
The low-melting-point metal of molten state is printed on to the temperature of the fusing point not less than the low-melting-point metal according to the print track
It spends in the printing substrate in environment, forms printed circuit.
2. printing preparation method according to claim 1, which is characterized in that the fusing point of the low-melting-point metal is not higher than
300℃。
3. printing preparation method according to claim 1, which is characterized in that the fusing point of the low-melting-point metal is not higher than
100℃。
4. printing preparation method according to claim 1, which is characterized in that the fusing point of the low-melting-point metal is not higher than 50
℃。
5. printing preparation method according to claim 1, which is characterized in that the fusing point of the low-melting-point metal 10 DEG C-
Between 20 DEG C.
6. printing preparation method according to claim 1, which is characterized in that the temperature of the temperature environment is at least higher by institute
5 DEG C of fusing point for stating low-melting-point metal.
7. printing preparation method according to claim 1, which is characterized in that the temperature of the temperature environment is at 25 DEG C -35
Between DEG C.
8. printing preparation method according to claim 1, which is characterized in that the low-melting-point metal is using gallium simple substance, low
The gallium-indium alloy of congruent melting or the gallium-indium-tin alloy of eutectic.
9. printing preparation method according to claim 1, which is characterized in that be applied to liquid metal write-through printer.
10. a kind of printing preparation facilities of printed circuit characterized by comprising
Cache module, for obtaining vector graphics file；
Parsing module, the first polar plot source for including in the vector graphics file for identification；
Fusion Module, for judging with the presence or absence of overlapping between first polar plot source, and by first vector of overlapping
Figure source is merged, at least one second polar plot source is obtained；
Track generation module, for generating print track according to the second polar plot source described at least one；
Print module, for the low-melting-point metal of molten state to be printed on not less than the low melting point gold according to the print track
In printing substrate in the temperature environment of the fusing point of category, printed circuit is formed.
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| CN201811109532.3A CN109121314B (en) | 2018-09-21 | 2018-09-21 | A kind of printing preparation method and device of printed circuit |
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| CN201811109532.3A CN109121314B (en) | 2018-09-21 | 2018-09-21 | A kind of printing preparation method and device of printed circuit |
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| CN109121314B true CN109121314B (en) | 2019-10-11 |
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| CN113847999A (en) * | 2021-09-08 | 2021-12-28 | 绍兴智新机电科技有限公司 | Method for detecting temperature of built-in bearing of equipment and driving device with bearing |
| CN116811257B (en) * | 2023-08-03 | 2024-01-16 | 武汉必盈生物科技有限公司 | Single-line non-filling track printing method and system for surface model |
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| CN203992400U (en) * | 2014-08-05 | 2014-12-10 | 北京依米康科技发展有限公司 | A kind of low-melting-point metal 3D printing equipment |
| CN104636491A (en) * | 2015-02-28 | 2015-05-20 | 南京国图信息产业股份有限公司 | Batch generating system and batch generating method for making electronic maps |
| CN105855540B (en) * | 2016-04-12 | 2017-10-17 | 北京梦之墨科技有限公司 | A kind of liquid metal printing device |
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