CN109108494A - A kind of tile laser cutting machine and its cutting method - Google Patents
A kind of tile laser cutting machine and its cutting method Download PDFInfo
- Publication number
- CN109108494A CN109108494A CN201811217624.3A CN201811217624A CN109108494A CN 109108494 A CN109108494 A CN 109108494A CN 201811217624 A CN201811217624 A CN 201811217624A CN 109108494 A CN109108494 A CN 109108494A
- Authority
- CN
- China
- Prior art keywords
- litter
- main control
- cutting
- laser
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003698 laser cutting Methods 0.000 title claims abstract description 22
- 238000000034 method Methods 0.000 title claims description 9
- 239000000919 ceramic Substances 0.000 claims abstract description 21
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 18
- TVEXGJYMHHTVKP-UHFFFAOYSA-N 6-oxabicyclo[3.2.1]oct-3-en-7-one Chemical compound C1C2C(=O)OC1C=CC2 TVEXGJYMHHTVKP-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011449 brick Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a kind of tile laser cutting machines, including main control unit, touch display screen, camera module, the first litter, the second litter, bracket, pedestal and laser emitting module；Wherein, pedestal is located at the underface of main control unit, and camera module is arranged on main control unit, and touch display screen is connected with main control unit；Described bracket one end is connect with main control unit, another end is connect with pedestal, and the second slide bar is fixed on bracket, and is placed perpendicular to bracket；First litter is connected with the second litter, and perpendicular to the second litter, the first litter can be moved along the second litter；The lower section of the first litter is arranged in the laser module, and can move along the first litter；When carrying out ceramic tile cutting, the main control unit control laser emitting module is cut according to the cutting drawing of touch display screen.Using laser irradiation ceramic tile, cut quality is high, and cutting is not necessarily to human contact's ceramic tile, substantially increases the safety of operation.
Description
Technical field
The present invention relates to laser cutting machine technical field more particularly to a kind of tile laser cutting machine and its cutting methods.
Background technique
In house decoration, precision and safety to ceramic tile cutting require very stringent, the porcelain of a high-precision, safety
The instrument of brick cutting plays great effect in fitment process.
Now using it is relatively broad be portable cutters, the cutting machine is easy to use, lighter weight.But due to knife
Piece is too big, and cutting accuracy is not easy to control, and especially when special position needs to cut irregular figure, cutting accuracy is even more big
It gives a discount, and blade is there is security risk,
Summary of the invention
Goal of the invention: in order to solve the problems, such as existing ceramic tile cutter, the present invention provide a precision height, it is easy to operate,
The tile laser cutting machine of safety.
Technical solution: a kind of tile laser cutting machine, including main control unit, touch display screen, camera module, the first cunning
Pole, the second litter, bracket, pedestal and laser emitting module；Wherein, pedestal is located at the underface of main control unit, for carrying
Ceramic tile；Camera module is arranged on main control unit, for shooting tile image；Touch display screen is connected with main control unit,
For showing the image of camera module and editing the cutting drawing of ceramic tile；Described bracket one end is connect with main control unit, another
End is connect with pedestal, and the second slide bar is fixed on bracket, and is placed perpendicular to bracket；First litter is connected with the second litter
It connects, and perpendicular to the second litter, the first litter can be moved along the second litter；The lower section of the first litter is arranged in the laser module,
And it can be moved along the first litter；
When carrying out ceramic tile cutting, the main control unit controls laser emitting module according to the cutting drawing of touch display screen
It is cut.
Further, the main control unit includes main control chip and power switch.
Further, third motor, the 4th motor are respectively equipped with inside the both ends of second litter and for driving
Third motor drive module, the 4th motor drive module for driving the 4th motor of third motor；Third motor and the 4th
It is connected between motor by crawler belt, groove is equipped on crawler belt, one end of the first litter is embedded in the groove；Second litter it is interior
Portion is additionally provided with second signal line, and second signal line connects main control unit and third motor drive module, the 4th motor drive module.
Further, first motor, the second motor are respectively equipped with inside the both ends of first litter and for driving
The first motor drive module of first motor, the second motor drive module for driving the second motor；First motor and second
It is connected between motor by crawler belt；Groove is equipped on crawler belt, the laser module is embedded in the groove, the inside of the first litter
It is additionally provided with the first signal wire, the first signal wire connects main control unit and first motor drive module, the second motor drive module.
Further, first signal wire and the second signal line are separately connected the main control chip of main control unit
GPIO mouthfuls.
Further, the length of first litter and the second litter is identical.
The present invention gives a kind of cutting method of tile laser cutting machine, the specific steps are as follows:
(1) it turns on the power switch；
(2) ceramic tile is placed on pedestal；
(3) camera module shoots tile image, and image is transferred to the main control chip of main control unit in real time；
(4) main control chip handles picture, and shows in touch display screen；Meanwhile cutting is edited in touch display screen
Figure, draws cutting line or needs the size of borehole；
(5) the cutting drawing signal of editor is passed to main control chip by touch display screen, and main control chip controls laser module edge
The cutting track of cutting drawing shown in touch display screen carry out laser cutting or borehole operation；
(6) cutting track of laser module is passed to main control chip by camera module, main control chip by cutting track with
Cutting drawing shown in touch display screen compares, if cutting track is offset, main control chip control in time laser module into
Row is corrected, to prevent the course deviation of cutting.
Further, in steps of 5, the main control chip controls the first litter and moves along the second litter, and control swashs
Optical module is moved along the first litter.
Further, in steps of 5, the laser of laser module is high power density laser beam.
The utility model has the advantages that the present invention utilizes laser irradiation ceramic tile, because laser facula is small, energy density is high, cutting speed is fast,
So cut quality is high, cutting is not necessarily to human contact's ceramic tile, substantially increases the safety of operation.It is easily processed at the same time
Mature product.
Detailed description of the invention
Fig. 1 is a kind of to cut hole digging machine structure chart based on the ceramic tile of camera and laser；
Fig. 2 is a kind of to cut hole digging machine circuit connection block diagram based on the ceramic tile of camera and laser.
Specific embodiment
The present invention is further explained in the light of specific embodiments.
As shown in Figure 1, tile laser cutting machine of the invention include main control unit, touch display screen, camera module 4,
First litter 5, the second litter 6, bracket 7, pedestal 8 and laser emitting module 9.Wherein, main control unit includes 2 He of main control chip
Power switch 3；Wherein, pedestal is located at the underface of main control unit, and for carrying ceramic tile, the size of pedestal is 80cm*80cm；It takes the photograph
Picture head module 4 is arranged on main control unit, shoots tile image, and image is transferred to main control unit, main control unit in real time
Processing result image is transferred to touch display screen 1 to show.Touch display screen is connected with main control unit, takes the photograph for showing
As head module image and edit the cutting drawing of ceramic tile；7 one end of bracket is linked with main control unit, another end is linked with pedestal 8,
Second slide bar 6 is fixed on bracket 7, and the second slide bar 6 is placed perpendicular to bracket 7, irremovable apart from pedestal 45cm to 46cm.
First litter 5 is connected with the second litter 6, and perpendicular to the second litter 6, the first litter can be moved along the second litter；
Third motor and the 4th motor are respectively equipped with inside the both ends of second litter 6 and for driving third electric
The third motor drive module of machine and the 4th motor drive module for driving the 4th motor.Lead between third and fourth motor
Crawler belt connection is crossed, groove is equipped on crawler belt, one end of the first litter is embedded in the groove, and the inside of the second litter 6 is additionally provided with
Second signal line and third, the 4th motor drive module power supply line, second signal line connect the main control chip and the of main control unit
Three, the 4th motor drive module, preferably second signal line connect main control chip GPIO mouthfuls；Main control chip signal passes through control the
Three, the 4th motor drive module respectively drives third, the 4th motor, to reach driving crawler belt to drive the first litter to slide.
Third, the 4th electrode drive modular power source line external power supply.
First motor and the second motor are respectively equipped with inside the both ends of first litter 5 and for driving the first electricity
The first motor drive module of machine and the second motor drive module for driving the second motor.Lead between first and second motors
Crawler belt connection is crossed, groove is equipped on crawler belt, laser module 9 is embedded in the groove, and the inside of the first litter 5 is additionally provided with the first letter
Number line and the first and second motor drive module power supply lines, the first signal wire connect the main control chip and first and the of main control unit
Two motor drive modules, preferably the first signal wire connect main control chip GPIO mouthfuls；Main control chip signal passes through control first, second
Motor drive module drives first motor and the second motor, to reach driving crawler belt to drive laser module 9 to be slided.The
One, the second motor drive module power supply line external power supply.Meanwhile main control chip is swashed by GPIO mouthfuls to laser module transmission transmitting
Light instruction.It can be seen that laser module can be throughout any one place of pedestal.
As shown in Fig. 2, providing the direction of modules information exchange of the present invention, i.e. camera, litter and mode of laser in figure
Block and main control chip individual event are transmitted, by main control chip control camera, 2 litter and laser module, touch display screen and master control
Chip transmitted in both directions.
A kind of job order step that ceramic tile cutter is cut are as follows:
Step 1: turning on the power switch；
Step 2: ceramic tile is placed on pedestal；
Step 3: camera module 4 shoots tile image, and image is transferred to the main control chip 2 of main control unit in real time；
Step 4: main control chip 2 handles picture, and shows in touch display screen 1, and it is soft that main control chip 2 provides a mapping
Part is simultaneously shown in touch display screen, can edit cutting drawing on the touchscreen, is drawn cutting line or is needed the size of borehole；
Step 5: the cutting drawing signal of editor is passed to main control chip by touch display screen, and main control chip controls the first litter
5 are moved forward and backward along the second litter 6, and control laser module is moved left and right along the first litter 5, so that laser module is along touching
The cutting track for touching the cutting drawing of display screen carries out laser cutting or borehole operation；The light beam that laser module issues is high power
Density laser beam.
Step 6: the cutting track of laser module is passed to main control chip by camera module 4, and main control chip will cut rail
Mark is compared with the cutting drawing in touch display screen, if cutting track is offset, main control chip controls laser module in time
It is corrected, to prevent the course deviation of cutting.
Claims (10)
1. a kind of tile laser cutting machine, it is characterised in that: slided including main control unit, touch display screen, camera module, first
Pole, the second litter, bracket, pedestal and laser emitting module；Wherein, pedestal is located at the underface of main control unit, for carrying
Ceramic tile；Camera module is arranged on main control unit, for shooting tile image；Touch display screen is connected with main control unit,
For showing the image of camera module and editing the cutting drawing of ceramic tile；Described bracket one end is connect with main control unit, another
End is connect with pedestal, and the second slide bar is fixed on bracket, and is placed perpendicular to bracket；First litter is connected with the second litter
It connects, and perpendicular to the second litter, the first litter can be moved along the second litter；The lower section of the first litter is arranged in the laser module,
And it can be moved along the first litter；
When carrying out ceramic tile cutting, the main control unit control laser emitting module is carried out according to the cutting drawing of touch display screen
Cutting.
2. a kind of tile laser cutting machine according to claim 1, it is characterised in that: the main control unit includes master control
Chip and power switch.
3. a kind of tile laser cutting machine according to claim 1, it is characterised in that: in the both ends of second litter
Portion be respectively equipped with third motor, the 4th motor and for driving the third motor drive module of third motor, for driving the
4th motor drive module of four motors；It is connected between third motor and the 4th motor by crawler belt, groove is equipped on crawler belt,
One end of first litter is embedded in the groove；The inside of second litter is additionally provided with second signal line, and second signal line connects master control
Unit and third motor drive module, the 4th motor drive module.
4. a kind of tile laser cutting machine according to claim 1, it is characterised in that: in the both ends of first litter
Portion be respectively equipped with first motor, the second motor and for driving the first motor drive module of first motor, for driving the
Second motor drive module of two motors；It is connected between first motor and the second motor by crawler belt；Groove is equipped on crawler belt,
The laser module is embedded in the groove, and the inside of the first litter is additionally provided with the first signal wire, and the first signal wire connects master control list
Member and first motor drive module, the second motor drive module.
5. a kind of tile laser cutting machine according to claim 3 or 4, it is characterised in that: first signal wire and
The second signal line is separately connected GPIO mouthfuls of main control chip of main control unit.
6. a kind of tile laser cutting machine described in -4 according to claim 1, it is characterised in that: first litter and second
The length of litter is identical.
7. a kind of tile laser cutting machine described in -4 according to claim 1, it is characterised in that: second slide bar is the bottom of apart from
Seat 45cm is between 46cm.
8. a kind of cutting method of tile laser cutting machine described in claim 1-7, it is characterised in that: specific step is as follows:
(1) it turns on the power switch；
(2) ceramic tile is placed on pedestal；
(3) camera module shoots tile image, and image is transferred to the main control chip of main control unit in real time；
(4) main control chip handles picture, and shows in touch display screen；Meanwhile cutting drawing is edited in touch display screen, it draws
Cutting line or need the size of borehole out；
(5) the cutting drawing signal of editor is passed to main control chip by touch display screen, and main control chip controls laser module along touching
The cutting track for touching cutting drawing shown in display screen carries out laser cutting or borehole operation；
(6) cutting track of laser module is passed to main control chip by camera module, and main control chip is by cutting track and touches
Cutting drawing shown in display screen compares, if cutting track is offset, main control chip controls laser module in time and entangled
Just, to prevent the course deviation of cutting.
9. a kind of cutting method of tile laser cutting machine according to claim 8, it is characterised in that: in steps of 5, institute
The main control chip stated controls the first litter and moves along the second litter, and control laser module is moved along the first litter.
10. a kind of cutting method of tile laser cutting machine according to claim 8, it is characterised in that: in steps of 5,
The laser of laser module is high power density laser beam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811217624.3A CN109108494A (en) | 2018-10-18 | 2018-10-18 | A kind of tile laser cutting machine and its cutting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811217624.3A CN109108494A (en) | 2018-10-18 | 2018-10-18 | A kind of tile laser cutting machine and its cutting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109108494A true CN109108494A (en) | 2019-01-01 |
Family
ID=64854162
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811217624.3A Pending CN109108494A (en) | 2018-10-18 | 2018-10-18 | A kind of tile laser cutting machine and its cutting method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109108494A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112809170A (en) * | 2019-10-29 | 2021-05-18 | 大族激光科技产业集团股份有限公司 | Silicon wafer cutting device and method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20130036586A (en) * | 2011-10-04 | 2013-04-12 | (주)제이콥스 | Laser cutting device |
| CN206122898U (en) * | 2016-09-18 | 2017-04-26 | 广西博辰自动化设备有限公司 | Automatic single -end laser cutting machine makes a video recording |
| CN206230577U (en) * | 2016-11-06 | 2017-06-09 | 杨海涛 | Portable numerical control multiaxis ground material process equipment |
| CN108145327A (en) * | 2017-12-22 | 2018-06-12 | 玉林市玉州区万通华信科技服务部 | A kind of tile laser cutting machine stent |
| CN209190035U (en) * | 2018-10-18 | 2019-08-02 | 南京信息工程大学 | A kind of tile laser cutting machine |
-
2018
- 2018-10-18 CN CN201811217624.3A patent/CN109108494A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20130036586A (en) * | 2011-10-04 | 2013-04-12 | (주)제이콥스 | Laser cutting device |
| CN206122898U (en) * | 2016-09-18 | 2017-04-26 | 广西博辰自动化设备有限公司 | Automatic single -end laser cutting machine makes a video recording |
| CN206230577U (en) * | 2016-11-06 | 2017-06-09 | 杨海涛 | Portable numerical control multiaxis ground material process equipment |
| CN108145327A (en) * | 2017-12-22 | 2018-06-12 | 玉林市玉州区万通华信科技服务部 | A kind of tile laser cutting machine stent |
| CN209190035U (en) * | 2018-10-18 | 2019-08-02 | 南京信息工程大学 | A kind of tile laser cutting machine |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112809170A (en) * | 2019-10-29 | 2021-05-18 | 大族激光科技产业集团股份有限公司 | Silicon wafer cutting device and method |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190101 |