CN109108286A - A kind of lossless disengaging method of 3D printing micro-structure - Google Patents

A kind of lossless disengaging method of 3D printing micro-structure Download PDF

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Publication number
CN109108286A
CN109108286A CN201811257920.6A CN201811257920A CN109108286A CN 109108286 A CN109108286 A CN 109108286A CN 201811257920 A CN201811257920 A CN 201811257920A CN 109108286 A CN109108286 A CN 109108286A
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CN
China
Prior art keywords
printing
micro
lossless
substrate
disengaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811257920.6A
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Chinese (zh)
Inventor
魏发南
郑江宏
姚立纲
詹子恒
尹超
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Fuzhou University
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Fuzhou University
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Priority to CN201811257920.6A priority Critical patent/CN109108286A/en
Publication of CN109108286A publication Critical patent/CN109108286A/en
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/60—Treatment of workpieces or articles after build-up
    • B22F10/62—Treatment of workpieces or articles after build-up by chemical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/60—Treatment of workpieces or articles after build-up
    • B22F10/66—Treatment of workpieces or articles after build-up by mechanical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/18—Metallic material, boron or silicon on other inorganic substrates
    • C23C14/185—Metallic material, boron or silicon on other inorganic substrates by cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation
    • C23C14/30—Vacuum evaporation by wave energy or particle radiation by electron bombardment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/10—Formation of a green body
    • B22F10/12—Formation of a green body by photopolymerisation, e.g. stereolithography [SLA] or digital light processing [DLP]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/10—Formation of a green body
    • B22F10/18—Formation of a green body by mixing binder with metal in filament form, e.g. fused filament fabrication [FFF]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/20—Direct sintering or melting
    • B22F10/25—Direct deposition of metal particles, e.g. direct metal deposition [DMD] or laser engineered net shaping [LENS]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/20—Direct sintering or melting
    • B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/25—Process efficiency

Abstract

The present invention relates to a kind of lossless disengaging methods of 3D printing micro-structure.The active metal film of one layer of uniform thickness is deposited in substrate by modes such as electron beam deposition, sputterings, by including that extruding, photopolymerization, laser sintering metallic powder and electrochemical metal are deposited on interior a variety of 3D printing methods, the three-dimensional structure for designing shape or size is printed upon on film, finally the film in substrate is removed using dilute hydrochloric acid or dilute sulfuric acid, realizes the lossless disengaging of 3D printing micro-structure and substrate.The present invention efficiently solves the molding three-dimensional structure of 3D printing in 3D printing technique and is difficult to the problem of being nondestructively detached from from substrate, and has versatility in 3D printing field.

Description

A kind of lossless disengaging method of 3D printing micro-structure
Technical field
The invention belongs to 3D printing technique process fields, and in particular to a kind of lossless disengaging method of 3D printing micro-structure.
Background technique
With the development of micro-electromechanical system (MEMS) (Micro Electro Mechanical System), in order to meet function The requirement of can and assemble etc., many components require the complex three-dimensional micro-structure with inclined-plane, free form surface etc..3D is beaten Print technology provides strong tool for the processing of complex three-dimensional micro-structure.3D printing technique in terms of micro-structure processing have at This low, high-efficient significant advantage, and its machining accuracy is also up to micron level at present.Micro- knot is processed by 3D printing The strategy of structure is varied-and it include extruding, photopolymerization, laser sintering metallic powder, electrochemical metal ion deposition etc..But it is micro- After structure completion of processing, how lossless be detached from structure and substrate but has much challenge.For this challenge, the invention patent is mentioned A kind of lossless disengaging method of 3D printing micro-structure out.
Summary of the invention
The present invention is directed to prior art problem, provides a kind of lossless disengaging method of 3D printing micro-structure, can be effectively real The lossless disengaging of existing 3D printing micro-structure and substrate.
To achieve the above object, the technical solution adopted by the present invention is that:
A kind of lossless disengaging method of 3D printing micro-structure, the described method comprises the following steps:
(1) active metal uniform deposition is formed into one layer of active metal film in substrate surface；
(2) the 3D printing micro three-dimensional structure in the substrate that step (1) obtains, obtains 3D printing micro-structure and substrate composition；
(3) 3D printing micro-structure that step (2) obtains and substrate composition are placed in dilute hydrochloric acid or dilute sulfuric acid, to active gold It is complete to belong to film reaction, shakes substrate, 3D printing micro three-dimensional structure and the lossless disengaging of substrate, then is by centrifugal treating that 3D printing is micro- Three-dimensional structure is taken out, and cleaning obtains 3D printing micro-structure repeatedly.
Further, the substrate of step (1) includes that ito glass, FTO glass, silicon wafer and organic polymer etc. are any applicable In the substrate of 3D printing.
Further, the deposition method in step (1) is one in electron beam deposition, magnetron sputtering and chemical vapor deposition Kind.
Further, active metal film thickness is 10-40nm.
Further, active metal includes iron, tin, zinc and lead in step (1).
Further, the 3D printing fine structure material in step (2) be include organic polymer, light-hardening resin, metal The material suitable for 3D printing including powder etc..
Further, the 3D printing method in step (2) includes extruding, photopolymerization, laser sintering metallic powder and electrification Learn metal deposit.
The invention has the advantages that: the present invention using active metal film as the sacrificial layer in substrate, manufacturing cost is cheap, Conducive to large-scale application；The present invention using dilute hydrochloric acid or dilute sulfuric acid can lossless disengagings substrate and 3D printing micro-structure, the method It is easy to operate, it is high-efficient, convenient for promoting；Furthermore the present invention has good versatility, is suitable for various 3D printing methods and material Material.
Detailed description of the invention
Fig. 1 is that 3D printing micro-structure lossless disengaging schematic diagram from substrate is realized in the present invention.
Specific embodiment
In order to make content of the present invention easily facilitate understanding, the present invention will be further described for following instance, but It is not used to limit the scope of the present invention.
Embodiment 1
(1) pass through magnetron sputtering deposition method for ferrous metal uniform deposition in ito glass substrate surface, forming a layer thickness is 10nm Metallic film；
(2) using the micro- three-dimensional knot of laser sintering metallic powder method 3D printing metallic copper in the ito glass substrate that step (1) obtains Structure obtains 3D printing metallic copper micro-structure and ito glass substrate composition；
(3) 3D printing metallic copper micro-structure that step (2) obtains and ito glass substrate composition are placed in dilute hydrochloric acid, to Active metal film reaction is complete, gently shakes ito glass substrate, 3D printing metallic copper micro three-dimensional structure and the lossless disengaging of substrate, 3D printing metallic copper micro three-dimensional structure is taken out by centrifugal treating again, and cleaning obtains 3D printing metallic copper micro-structure repeatedly.
Embodiment 2
(1) pass through means of electron beam deposition for tin metal uniform deposition in silicon substrate surface, obtain the uniform gold of a layer thickness 20nm Belong to film；
(2) extrusion 3D printing ABS organic polymer micro three-dimensional structure is used in the silicon base of step (1), obtains D printing The composition of ABS organic polymer micro-structure and silicon base；
(3) the 3D printing ABS organic polymer micro-structure that step (2) obtains is placed in dilute hydrochloric acid together with the composition of silicon base In, to tin thin film fully reacting, silicon base, 3D printing abs polymer micro three-dimensional structure and the lossless disengaging of silicon base are gently shaken, 3D printing abs polymer micro three-dimensional structure is taken out by precipitating or centrifugal treating again, and is cleaned repeatedly, 3D printing is obtained ABS organic polymer micro-structure.
The foregoing is merely presently preferred embodiments of the present invention, all equivalent changes done according to scope of the present invention patent with Modification, is all covered by the present invention.

Claims (7)

1. a kind of lossless disengaging method of 3D printing micro-structure, it is characterised in that: the described method comprises the following steps:
(1) active metal uniform deposition is formed into one layer of active metal film in substrate surface；
(2) the 3D printing micro three-dimensional structure in the substrate that step (1) obtains, obtains 3D printing micro-structure and substrate composition；
(3) 3D printing micro-structure that step (2) obtains and substrate composition are placed in dilute hydrochloric acid or dilute sulfuric acid, to active gold It is complete to belong to film reaction, shakes substrate, 3D printing micro three-dimensional structure and the lossless disengaging of substrate, then is by centrifugal treating that 3D printing is micro- Three-dimensional structure is taken out, and cleaning obtains 3D printing micro-structure repeatedly.
2. a kind of lossless disengaging method of 3D printing micro-structure according to claim 1, it is characterised in that: step (1) Substrate includes ito glass, FTO glass, silicon wafer and organic polymer.
3. a kind of lossless disengaging method of 3D printing micro-structure according to claim 1, it is characterised in that: in step (1) Deposition method be one of electron beam deposition, magnetron sputtering and chemical vapor deposition.
4. a kind of lossless disengaging method of 3D printing micro-structure according to claim 1, it is characterised in that: active metal is thin Film thickness is 10-40nm.
5. a kind of lossless disengaging method of 3D printing micro-structure according to claim 1, it is characterised in that: in step (1) Active metal includes iron, tin, zinc and lead.
6. a kind of lossless disengaging method of 3D printing micro-structure according to claim 1, it is characterised in that: in step (2) The material of 3D printing structure include organic polymer, light-hardening resin and metal powder.
7. a kind of lossless disengaging method of 3D printing micro-structure according to claim 1, it is characterised in that: in step (2) 3D printing method include that extrudings, photopolymerization, laser sintering metallic powder and electrochemical metal deposit.
CN201811257920.6A 2018-10-26 2018-10-26 A kind of lossless disengaging method of 3D printing micro-structure Pending CN109108286A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110253018A (en) * 2019-06-30 2019-09-20 华中科技大学 A kind of manufacturing process and product of metal surface multistage microstructural

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Application publication date: 20190101