CN109103161A - A kind of water cooling IGBT combination assembly device - Google Patents
A kind of water cooling IGBT combination assembly device Download PDFInfo
- Publication number
- CN109103161A CN109103161A CN201811124766.5A CN201811124766A CN109103161A CN 109103161 A CN109103161 A CN 109103161A CN 201811124766 A CN201811124766 A CN 201811124766A CN 109103161 A CN109103161 A CN 109103161A
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- Prior art keywords
- cooling
- water
- cooling tube
- tube
- pipe connections
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/112—Mixed assemblies
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to a kind of water cooling IGBT to combine assembly device, including two water tubular unions and multiple cooling tubes, and two water tubular unions are respectively mutually isostructural water inlet pipe connections and water outlet pipe connections；Water tubular union includes integrally formed water pipe joint and cooling pipe jointing part, offers multiple connecting holes on cooling pipe jointing part；The both ends of each cooling tube are inserted into water inlet pipe connections cooling tube interconnecting piece respectively and are discharged in the two in correspondence with each other connecting hole of pipe connections cooling tube interconnecting piece, and the end of cooling tube and connecting hole are tightly connected；The gap for clamping MOS single tube is formed between two neighboring cooling tube, cuff there are multiple limited blocks for two MOS single tubes of space between adjacent on each cooling tube.Water cooling IGBT combination assembly device provided by the invention, design is scientific and reasonable, compact-sized, small in size, occupies little space, power density is high, and at low cost, by water-cooling, good heat dissipation effect has a wide range of application.
Description
Technical field
The invention belongs to technical field of electronic components, and in particular to a kind of water cooling IGBT combination assembly device.
Background technique
In the control of current power electronics, new-energy automobile control field, the core devices of energy transformation and transmission are insulation
Grid bipolar junction transistor, i.e. IGBT (Insulated Gate Bipolar Transistor).Insulated gate bipolar transistor,
The compound full-control type voltage driven type power half being made of BJT (double pole triode) and MOS (insulating gate type field effect tube)
Conductor device has feature of both high input impedance and low conduction voltage drop concurrently.IGBT is in actual application, often with 3
Integral multiple IGBT be used in combination, combination assembling structure as shown in Figure 1, this kind combine assembling structure there are it is following not
Foot place: structure is not compact, and volume is larger, and occupied space is big, huge on the influence of the compactedness of topology layout, so as to cause product
Power density it is low, influence the competitiveness of product, while also having limited to the application range of product, and this kind combine assembling structure
Heat dissipation effect is bad, and heat accumulation affects product service life.In new-energy automobile field, which leads to electricity
Machine controller structural volume is big, weight is big, to be unfavorable for the lightweight of new-energy automobile and the waste of electricity.
Summary of the invention
For above-mentioned problems of the prior art, it can avoid above-mentioned skill occur the purpose of the present invention is to provide one kind
The water cooling IGBT combination assembly device of art defect.
In order to achieve the above-mentioned object of the invention, technical solution provided by the invention is as follows:
A kind of water cooling IGBT combination assembly device, including two water tubular unions and multiple cooling tubes, two water pipe connections
Part is respectively mutually isostructural water inlet pipe connections and water outlet pipe connections；Water tubular union includes integrally formed water pipe connection
Head and cooling pipe jointing part, cool down and offer multiple connecting holes on pipe jointing part；Water inlet is inserted at the both ends of each cooling tube respectively
In the two in correspondence with each other connecting hole of the cooling pipe jointing part of pipe connections and water outlet pipe connections cooling tube interconnecting piece, and it is cooling
The end of pipe and connecting hole are tightly connected；The gap for clamping MOS single tube, Mei Geleng are formed between two neighboring cooling tube
But managing upper cuff has multiple limited blocks for two MOS single tubes of space between adjacent.
Further, the lumenal cross-section two sides of cooling tube are wavy line shape.
Further, the card slot for blocking MOS single tube is offered on limited block.
Further, through-hole is offered on limited block, cooling tube is inserted into through-hole.
Further, six MOSs of the gap inner clip between adjacent two cooling tube there are six MOS single tube, in same gap
Single tube is spaced apart by five limited blocks.
Further, the inner cavity of cooling tube is separated into three parts by two parting beads formed in inner tube wall.
Water cooling IGBT combination assembly device provided by the invention, design is scientific and reasonable, compact-sized, small in size, occupies empty
Between it is small, power density is high, and at low cost, by water-cooling, good heat dissipation effect has a wide range of application, and can meet reality well
The needs of application.
Detailed description of the invention
Fig. 1 is the IGBT combination assembly apparatus structure schematic diagram of the prior art；
Fig. 2 is schematic perspective view of the invention；
Fig. 3 is the structural schematic diagram at another visual angle of the invention；
Fig. 4 is the three-dimensional figure structure schematic representation of water tubular union；
Fig. 5 is the schematic cross-sectional view of water tubular union；
Fig. 6 is the structural schematic diagram at another visual angle of water tubular union；
Fig. 7 is the structural schematic diagram at the another visual angle of water tubular union；
Fig. 8 is the three-dimensional figure structure schematic representation of limited block；
Fig. 9 is the structural schematic diagram at another visual angle of limited block；
Figure 10 is the structural schematic diagram at the another visual angle of limited block；
Figure 11 is the perspective view of cooling tube；
Figure 12 is the structural schematic diagram at another visual angle of cooling tube；
Figure 13 is the cross-sectional view of cooling tube；
Figure 14 is the schematic diagram of driving plate；
In figure, 1- water inlet pipe connections, 2- cooling tube, 3- limited block, 4-MOS single tube, 5- driving plate, the connection of 6- water pipe
Head, the cooling pipe jointing part of 7-, 8- connecting hole, 9- welding hole, 10- lumenal cross-section, 11- are discharged pipe connections, 12- parting bead, 13-
Through-hole.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawing and specific implementation
The present invention will be further described for example.It should be appreciated that described herein, specific examples are only used to explain the present invention, and does not have to
It is of the invention in limiting.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Under every other embodiment obtained, shall fall within the protection scope of the present invention.
As shown in Fig. 2-Figure 13, a kind of water cooling IGBT combination assembly device, including two water tubular unions, four cooling tubes
2 and multiple limited blocks 3, two water tubular unions are respectively mutually isostructural water inlet pipe connections 1 and be discharged pipe connections 11.
Water tubular union includes integrally formed water pipe joint 6 and cooling pipe jointing part 7, is opened on cooling pipe jointing part 7
If there are four connecting holes 8；Cuff has multiple limited blocks 3 on each cooling tube 2, and through-hole 13, cooling tube 2 are offered on limited block 3
It is inserted into through-hole 13；The both ends of each cooling tube 2 are inserted into the cooling pipe jointing part 7 of water inlet pipe connections 1 respectively and are connected with outlet pipe
In the two in correspondence with each other connecting hole 8 of the cooling pipe jointing part 7 of part 11, and the end of cooling tube 2 and connecting hole 8 are tightly connected；
Multiple MOS single tubes 4 are clipped in the gap between two neighboring cooling tube 2, and the two neighboring MOS being located in same gap is mono-
Pipe 4 is separated by a limited block 3, and the card slot for blocking MOS single tube 4 is offered on limited block 3, and limited block 3 utilizes itself
Card slot block, compress MOS single tube 4；The water pipe joint 6 of water tubular union is for connecting water pipe.The inner cavity of cooling tube 2 is transversal
10 two sides of face are wavy line shape, are conducive to radiate.In the present embodiment, in the gap between each adjacent two cooling tube 2
There are six MOS single tube 4, six MOS single tubes 4 in same gap are spaced apart folder by five limited blocks 3.
Multiple welding holes 9 (as shown in figure 14) are offered in driving plate 5, after multiple MOS single tubes 4 are clipped, by each MOS
In the welding hole 9 of the corresponding insertion driving plate 5 of the pin of single tube 4, welding is completed, driving plate 5 is by modulating of sending of control panel
Driving MOS single tube 4 reliablely and stablely works after driving signal amplifies.What the inner cavity of cooling tube 2 was formed in inner tube wall
Two parting beads 12 are separated into three parts, and water flow improves water flow and absorb heat by being divided into three strands when the inner cavity of cooling tube 2
Ability, good heat dissipation effect.The number of cooling tube 2 can be set according to actual needs, the number of the connecting hole 8 on water tubular union
Mesh is identical as the number of cooling tube 2.
When in use, cold water is inputted into water inlet pipe connections 1 by water pipe, water flows through after each cooling tube 2 through outlet pipe
Connector 11 flows away from outlet pipe, takes away the heat that each MOS single tube 4 generates, reaches preferable cooling effect, it is mono- to extend each MOS
The service life of pipe 4.
Water cooling IGBT combination assembly device provided by the invention, design is scientific and reasonable, compact-sized, small in size, occupies empty
Between it is small, power density is high, and at low cost, by water-cooling, good heat dissipation effect has a wide range of application, and can meet reality well
The needs of application.
Embodiments of the present invention above described embodiment only expresses, the description thereof is more specific and detailed, but can not
Therefore limitations on the scope of the patent of the present invention are interpreted as.It should be pointed out that for those of ordinary skill in the art,
Without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection model of the invention
It encloses.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (6)
1. a kind of water cooling IGBT combination assembly device, which is characterized in that including two water tubular unions and multiple cooling tubes, two
Water tubular union is respectively mutually isostructural water inlet pipe connections and water outlet pipe connections；Water tubular union includes integrally formed
Water pipe joint and cooling pipe jointing part, cool down and offer multiple connecting holes on pipe jointing part；Distinguish at the both ends of each cooling tube
Insertion water inlet pipe connections cooling tube interconnecting piece and the two in correspondence with each other connecting hole for being discharged pipe connections cooling tube interconnecting piece
In, and the end of cooling tube and connecting hole are tightly connected；The seam for clamping MOS single tube is formed between two neighboring cooling tube
Gap, cuff has multiple limited blocks for two MOS single tubes of space between adjacent on each cooling tube.
2. water cooling IGBT according to claim 1 assembles device, which is characterized in that the lumenal cross-section two sides of cooling tube
For wavy line shape.
3. water cooling IGBT according to claim 1 assembles device, which is characterized in that offer on limited block for blocking
The card slot of MOS single tube.
4. water cooling IGBT according to claim 1 assembles device, which is characterized in that through-hole is offered on limited block, it is cooling
Pipe is inserted into through-hole.
5. water cooling IGBT according to claim 1 assembles device, which is characterized in that in the gap between adjacent two cooling tube
There are six MOS single tube, six MOS single tubes in same gap are spaced apart folder by five limited blocks.
6. water cooling IGBT according to claim 1 assembles device, which is characterized in that the inner cavity of cooling tube is by inner tube wall
Two parting beads formed are separated into three parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811124766.5A CN109103161A (en) | 2018-09-26 | 2018-09-26 | A kind of water cooling IGBT combination assembly device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811124766.5A CN109103161A (en) | 2018-09-26 | 2018-09-26 | A kind of water cooling IGBT combination assembly device |
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| Publication Number | Publication Date |
|---|---|
| CN109103161A true CN109103161A (en) | 2018-12-28 |
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ID=64867847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811124766.5A Pending CN109103161A (en) | 2018-09-26 | 2018-09-26 | A kind of water cooling IGBT combination assembly device |
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| CN (1) | CN109103161A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111755399A (en) * | 2019-03-28 | 2020-10-09 | 比亚迪半导体有限公司 | Heat dissipation module of power module, load controller and vehicle |
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| CN101769695A (en) * | 2010-02-05 | 2010-07-07 | 江苏金圣铜业科技有限公司 | Special cooling pipe and making method thereof |
| CN106384729A (en) * | 2016-10-18 | 2017-02-08 | 池州脉纬散热器有限责任公司 | Heat radiating pipe with uniform heat radiation |
| CN207265411U (en) * | 2017-09-13 | 2018-04-20 | 大族激光科技产业集团股份有限公司 | The water cooling plant and semi-conductor laser equipment of semiconductor laser power supply |
| CN207573809U (en) * | 2017-11-07 | 2018-07-03 | 上海大郡动力控制技术有限公司 | Two-sided water-cooling structure applied to IGBT power components |
| CN207690956U (en) * | 2017-12-13 | 2018-08-03 | 深圳市华新达五金制品有限公司 | A kind of charging shell of new energy car battery |
| CN208904009U (en) * | 2018-09-26 | 2019-05-24 | 江苏罗思韦尔电气有限公司 | A kind of water cooling IGBT combination assembly device |
-
2018
- 2018-09-26 CN CN201811124766.5A patent/CN109103161A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050030717A1 (en) * | 2003-08-06 | 2005-02-10 | Denso Corporation | Cooler for cooling electric part |
| CN1700454A (en) * | 2004-05-18 | 2005-11-23 | 株式会社电装 | Power stack |
| US20050259402A1 (en) * | 2004-05-18 | 2005-11-24 | Denso Corporation | Power stack |
| CN101769695A (en) * | 2010-02-05 | 2010-07-07 | 江苏金圣铜业科技有限公司 | Special cooling pipe and making method thereof |
| CN106384729A (en) * | 2016-10-18 | 2017-02-08 | 池州脉纬散热器有限责任公司 | Heat radiating pipe with uniform heat radiation |
| CN207265411U (en) * | 2017-09-13 | 2018-04-20 | 大族激光科技产业集团股份有限公司 | The water cooling plant and semi-conductor laser equipment of semiconductor laser power supply |
| CN207573809U (en) * | 2017-11-07 | 2018-07-03 | 上海大郡动力控制技术有限公司 | Two-sided water-cooling structure applied to IGBT power components |
| CN207690956U (en) * | 2017-12-13 | 2018-08-03 | 深圳市华新达五金制品有限公司 | A kind of charging shell of new energy car battery |
| CN208904009U (en) * | 2018-09-26 | 2019-05-24 | 江苏罗思韦尔电气有限公司 | A kind of water cooling IGBT combination assembly device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111755399A (en) * | 2019-03-28 | 2020-10-09 | 比亚迪半导体有限公司 | Heat dissipation module of power module, load controller and vehicle |
| CN111755399B (en) * | 2019-03-28 | 2022-06-21 | 比亚迪半导体股份有限公司 | Heat dissipation module of power module, load controller and vehicle |
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