CN109075677B - Winding inspection method and winding inspection device - Google Patents

Abstract

A winding inspection method for a stator (10) in which a winding coil (1) is formed on a chip (20), comprising: a second acquisition step (step ST8) of acquiring an image of the chip (20) after winding; a second extraction step (step ST9) of extracting contour data of a wound coil (1) wound on a chip (20) from an image; and a second determination step (step ST12) for determining whether the wound coil (1) is acceptable or not, based on the contour data of the wound coil (1).

Description

Winding inspection method and winding inspection device

Technical Field

The present invention relates to a winding inspection method and a winding inspection apparatus for inspecting a state of a winding in a so-called concentrated winding fixture in which a plurality of chips supplied to a rotating electrical machine are arranged in a ring shape.

Background

In a stator manufacturing process of a rotating electrical machine, coils need to be arranged and wound at equal intervals in each layer in a winding process, and visual inspection and voltage resistance inspection of the coils after winding are performed to inspect whether or not the windings are defective or abnormal. However, the visual inspection has problems such as "poor inspection time capability", "poor inspection result, and the like.

In order to solve this problem, a conventional winding inspection method and a conventional winding inspection apparatus disclose a technique for detecting a winding point by processing an image of a winding state and quantifying winding abnormalities such as jumping and jumping at the winding point in a method of winding an electric wire, a cable, and the like around a drum (for example, see patent document 1).

Further, there is disclosed a winding device in which a coil outer shape inspection device is provided separately from the winding device immediately after the winding process, the size of the winding outer shape of the winding coil wound around the stator core is determined, and whether or not the winding coil is acceptable is determined (for example, see patent document 2).

Patent document 1: japanese patent No. 3275276 (paragraphs 0007 to 0016, FIGS. 1 to 11)

Patent document 2: japanese patent No. 4670789 (paragraphs 0015 to 0049, FIGS. 1 to 11)

Disclosure of Invention

In the conventional winding inspection method and winding inspection apparatus,

as a method of winding a stator constituting a rotating electrical machine, there are a distributed winding method of forming a coil in advance and inserting the coil into a slot called a slot of the stator, and a concentrated winding method of directly winding each chip. The concentrated winding method can significantly reduce the circumference of the coil compared to the distributed winding method, and therefore, a thick electric wire can be wound at a high density to reduce the winding resistance, and the motor efficiency is higher than that of the rotary electric machine of the distributed winding method.

Therefore, many rotary electric machines such as motors of compressors for air conditioners and refrigerators and inverter motors capable of changing the number of revolutions are of the concentrated winding type. In particular, a concentrated winding system is a mainstream of an electric motor having a capacity of several tens to several kw. In the concentrated winding method, the rotation speed for winding is performed at a high speed of not less than thousand rpm in order to improve productivity. The portion of the stator where each core piece is wound is a rectangular cross section, and the coil shape as viewed from the winding axis is also a rectangular shape, which is a so-called irregular bobbin.

In view of this background, in the case of applying patent document 1, since the irregular-shaped spool rotates, the position of the wound wire moves in 2 directions for every rotation, and the rotational speed of the winding wire is high, and therefore, the camera is driven to follow the position of the wound wire, that is, the measurement point, and the image of the winding state is processed to detect the winding point, which has a problem that it is difficult to quantify and detect winding abnormalities such as jumping and jumping at the winding point.

In order to solve this problem, patent document 2 proposes a method of inspecting the outer shape of the coil after the winding is performed. However, the method of measuring the gap between adjacent coils arranged in a circular shape can be performed only after the step of winding all the chips of the fixture, aligning the chips, fitting the chips to the outer periphery of the fixture by means of a hollow case or the like, and locking the fixture. Thus, when a failure is detected at this stage, it is difficult to remove the failed coil from the chip. The fixture itself, where the faulty coil is present, has to be discarded.

Thus, the fraction defective as a product after the final process can be reduced, but there is a problem that the productivity is not improved.

The present invention has been made to solve the above-described problems, and an object thereof is to provide a winding inspection method and a winding inspection apparatus capable of determining that a winding of a chip is defective before forming the winding as a fixture.

The invention provides a winding inspection method for forming a winding coil on a fixing member of a chip,

the winding inspection method includes:

a second acquisition step of acquiring an image of the chip after the winding;

a second extraction step of extracting contour data of the wire-wound coil wound around the chip from the image; and

and a second determination step of determining whether or not the winding coil is acceptable based on the profile data of the winding coil.

In addition, the winding inspection method of the present invention is a winding inspection method of a fixture in which a plurality of chips on which a winding coil is formed are annularly arranged,

the winding inspection method includes:

a second acquisition step of acquiring a post-image that is an image of the chip after the wire winding;

a second extraction step of extracting contour data of the wire-wound coil of the chip from the image;

a comparison step of comparing profile data of the wound coils of the chips adjacent to each other in the ring shape; and

and an adjacent determination step of determining whether or not the winding coil of the adjacent chip is acceptable based on a result of the comparison step.

In addition, the winding inspection device of the invention is a winding inspection device for winding a winding and forming a winding coil on a fixing piece of a chip,

the winding inspection device comprises:

an acquisition unit that acquires an image of a chip captured by an imaging unit that captures the chip;

a second extraction unit that extracts contour data of the wound coil from an image of the chip; and

and a second determination unit that determines whether or not the wound coil is acceptable.

In addition, the winding inspection device of the invention is a winding inspection device of a fixing piece which is annularly provided with a plurality of chips of a winding coil,

the winding inspection device comprises:

an acquisition unit that acquires an image of a chip captured by an imaging unit that captures the chip;

a second extraction unit that extracts contour data of the wound coil from an image of the chip;

a comparison unit that compares profile data of the wound coils of the chips that are adjacent to each other in the ring shape; and

and an adjacent determination unit that determines whether or not the winding coils of the adjacent chips are acceptable based on a comparison result of the comparison unit.

ADVANTAGEOUS EFFECTS OF INVENTION

According to the winding inspection method and the winding inspection apparatus of the present invention,

the diagnosis of the occurrence of the winding failure of the chip can be performed, and the winding failure of the winding coil can be judged before the winding is formed as the fixing piece.

Drawings

Fig. 1 is a perspective view showing the structure of a fixture for performing a winding inspection method according to embodiment 1 of the present invention.

Figure 2 is a top view of the fixture shown in figure 1.

Fig. 3 is a perspective view showing the structure of a chip of the fixing member shown in fig. 1.

Fig. 4 is a perspective view showing a structure of the chip shown in fig. 3 before the wire coil is provided.

Fig. 5 is an exploded perspective view showing the structure of the chip shown in fig. 4.

Fig. 6 is a plan view showing a structure of a core portion to which the chip shown in fig. 1 is bonded.

Fig. 7 is a cross-sectional view showing a cross-section taken along line T-T shown in fig. 6.

Fig. 8 is a perspective view showing a state in which the core portions to which the chips shown in fig. 4 are connected are arranged linearly.

Fig. 9 is a perspective view showing a state in which the core chip shown in fig. 8 is wound.

Fig. 10 is a diagram showing a configuration of a winding device including a winding inspection device that performs the winding inspection method according to embodiment 1 of the present invention.

Fig. 11 is a diagram for explaining a non-defective product of the arrangement of the coils in the chip.

Fig. 12 is a diagram for explaining a non-defective product of the arrangement of the coils in the chip.

Fig. 13 is a diagram for explaining defective pieces of the alignment of coils in the chip.

Fig. 14 is a diagram for explaining defective pieces of the alignment of coils in the chip.

Fig. 15 is an explanatory diagram for explaining a process of the winding inspection method in embodiment 1 of the present invention.

Fig. 16 is an explanatory diagram for explaining a process of the winding inspection method in embodiment 1 of the present invention.

Fig. 17 is an explanatory diagram for explaining a process of the winding inspection method in embodiment 1 of the present invention.

Fig. 18 is an explanatory diagram for explaining an analysis result of the winding inspection method in embodiment 1 of the present invention.

Fig. 19 is a flowchart showing a winding inspection method according to embodiment 1 of the present invention.

Fig. 20 is a flowchart of a winding inspection method according to embodiment 1 of the present invention.

Fig. 21 is an explanatory diagram for explaining a turn extracting step in the winding inspection method according to embodiment 2 of the present invention.

Fig. 22 is a flowchart for explaining a winding inspection method according to embodiment 2 of the present invention.

Fig. 23 is an explanatory diagram for explaining interference between adjacent chips in the winding inspection method according to embodiment 3 of the present invention.

Fig. 24 is a flowchart for explaining a winding inspection method according to embodiment 3 of the present invention.

Fig. 25 is a diagram showing an analysis result of coil contour data obtained in embodiment 3 of the present invention.

Fig. 26 is a diagram showing the result of analyzing the coil contour data obtained in embodiment 3 of the present invention.

Fig. 27 is a graph showing a comparison result obtained by comparing the analysis results of fig. 25 and 26.

Fig. 28 is a diagram for explaining a winding inspection apparatus according to embodiment 4 of the present invention.

Detailed Description

Embodiment 1.

Embodiments of the present invention will be described below. First, the structure of the fixture 10 and the chip to be inspected for the winding will be described with reference to fig. 1 to 9.

Fig. 1 is a perspective view showing the structure of a fixture using a chip for performing a wire inspection method according to embodiment 1 of the present invention.

Figure 2 is a top view of the fixture shown in figure 1.

Fig. 3 is a perspective view showing the structure of a chip of the fixing member shown in fig. 1.

Fig. 4 is a perspective view showing a structure of the chip shown in fig. 3 before the wire coil is provided.

Fig. 5 is an exploded perspective view showing the structure of the chip shown in fig. 4.

Fig. 6 is a plan view showing a structure of a core portion to which the chip shown in fig. 1 is bonded.

Fig. 7 is a cross-sectional view showing a cross-section taken along line T-T shown in fig. 6.

Fig. 8 is a perspective view showing a state in which the core portion to which the chip shown in fig. 4 is connected is linearly arranged.

Fig. 9 is a perspective view showing a state in which the core chip shown in fig. 8 is wound.

In the figure, the stator 10 is composed of a wound coil (hereinafter, simply referred to as a coil) 1, a core 2, and an insulating portion 3. The core 2 is formed by annularly connecting 9 chips 20 around which the coil 1 is wound. In embodiment 1, an example of the core portion 2 in which 9 chips 20 are connected is shown. However, the present invention is not limited to this, and the stator 10 may be configured by an arbitrary number of chips 20 required for the characteristics of the rotating electric machine.

In embodiment 1, the shape of the chip 20 and the shape of the coil 1 are measured from the images of the chip 20 before and after winding, and the winding failure is inspected. Thus, the structure of the chip 20 before and after the winding will be described in a mixed manner. In embodiment 1, as shown in fig. 8, the chip 20 before winding is referred to as a front chip 201. As shown in fig. 9, the chip 20 on which the winding is performed is divided into rear chips 202. However, when it is not necessary to distinguish between the front and the rear of the winding, only the chip 20 may be shown.

The core piece 20 is a laminated core formed by laminating electromagnetic steel sheets 4 as magnetic plates in the axial direction Z. The front chip 201 is formed by inserting a first insulating portion 301 and a second insulating portion 302 as the insulating portions 3 in both the upper and lower directions of the laminated axial direction Z. The insulating portion 3 electrically insulates the core 2 and the coil 1. The shape of the insulating portion 3 for connecting the terminal wire of the coil 1 and the shape for locking the terminal wire for winding around the front chip 201 are not illustrated.

The chip 20 is not limited to the case of being formed separately as shown in fig. 3. For example, as shown in fig. 6 and 7, the core portion 2 in which the chips 20 are connected to each other via the connection portion 5 may be used.

In embodiment 1, the shape is measured using the image of the chip 20. Thus, the names of the respective portions of the chip 20 are defined in advance using fig. 6. The core piece 20 includes a yoke portion 7 extending in the circumferential direction X and a tooth portion 6 protruding from the yoke portion 7 inward in the radial direction Y. The wire is provided to the tooth 6 via the insulating portion 3. As described above, the yoke 7 is formed outside the tooth 6 in the radial direction Y. Here, the inner side of the tooth portion 6 in the radial direction Y is defined as a counter yoke portion 8, and is defined separately from the yoke portion 7.

The yoke portion 7 is provided with coupling portions 5 at both ends in the circumferential direction X. The coupling portion 5 is composed of a convex portion 51 and a concave portion 52. The convex portion 51 and the concave portion 52 are formed at the circumferential X end of the yoke portion 7 of the chip 20. The stacked electromagnetic steel sheets 4 are overlapped with each other at the end of the yoke portion 7 of the adjacent core piece 20 in the circumferential direction X. The adjacent chips 20 are fixed by caulking the convex portions 51 and the concave portions 52 at the overlapping portions. This structure forms a connection portion 5 that connects adjacent chips 20 so as to be bendable. The coupling portion 5 is not limited to this configuration, and may have another configuration as long as it couples the adjacent chips 20 to each other so as to be bendable.

In order to form the core 2 in fig. 1, only 2 chips 20 located at both ends of the connected chips 20 in fig. 9 may be bonded to each other. In the process of winding, as shown in fig. 9, the chip 20 adjacent to the chip 20 on which the winding is performed is bent.

Next, the structure of the winding device 14 will be described with reference to fig. 10. Fig. 10 is a diagram showing the structure of the winding device 14 in embodiment 1 of the present invention. In the figure, the winding device 14 has a reel 11 that stores the magnetic wire 9 for forming the coil 1, a tensioner 12, a turret 13, a winding inspection device 140, and a winding control section 15. The winding inspection device 140 includes a camera 141 and an image processing unit 142.

Fig. 10 shows a state where the front chip 201 is fixed to a position where the winding is performed by the winding device 14. The winding control unit 15 controls the reel 11, the tensioner 12, and the turret 13. The wiring for these portions is not shown. The turret 13 rotates in the direction of arrow R around the front chip 201. Then, the front core 201 forms the coil 1 by winding the teeth 6 through the insulating portion 3. The coil 1 is formed by high-density winding.

Thus, the rotating frame 13 winds the magnet wires 9 while intermittently or continuously moving the distance corresponding to the wire diameter of the magnet wires 9 in the direction of the arrow Q, which is the yoke 7 and the counter yoke 8, every one rotation in the direction of the arrow R. The camera 141 is used to photograph the positions and shapes of the chip 20 and the coil 1. The camera 141 is fixed to a position where the entire chip 20 provided at a normal position in the field of view is projected.

In fig. 10, the position of the camera 141 may not be exactly perpendicular, as long as the yoke 7, the counter yoke 8, and the teeth 6 of the core 20 on which the winding is performed are reflected. In addition, the position of the camera 141 may be a case where images are taken from both the first insulating portion 301 and the second insulating portion 302 in fig. 3, or a case where images are taken from either direction. The brightness of the image quality of the camera 141 may be adjusted with sufficient illuminance for image processing. Thus, in embodiment 1, the type of illumination and the necessity of illumination are not limited, and therefore, the description thereof is omitted.

The image processing unit 142 processes the image of the camera 141. The wiring between the image processing unit 142 and the winding control unit 15 represents, for example, that the winding control unit 15 controls the timing of starting winding by driving the turret 13, and the image processing unit 142 can collect information such as the timing and use the information for inspection. Thus, wiring between the image processing unit 142 and the winding control unit 15 is not necessarily required.

Next, examples of non-defective products of the alignment of the coils 1 and defective products of the alignment of the defective coils 16 in the chip 20 will be described with reference to fig. 11 to 14. Fig. 11 is a plan view showing the structure of the rear chip 202 in order to explain the non-defective product of the arrangement of the coils 1 in embodiment 1 of the present invention. Fig. 12 is a side view showing the structure of the non-defective rear chip 202 shown in fig. 11. Fig. 13 is a plan view showing the structure of the rear chip 202 in order to describe a defective product of defective coil 16 alignment for comparison with a defective product of coil 1 alignment in embodiment 1 of the present invention. Fig. 14 is a side view showing the structure of the rear chip 202 of the defective product shown in fig. 13.

In fig. 11, 1 turn of the coil 1 wound around the tooth portion 6 of the rear core piece 202 is defined as one turn. The degree of adhesion between adjacent turns of the coil 1 is defined as the alignment. As a result, the alignment is excellent, and the adhesion degree is represented by the adhesion without gaps between the turns of the coil 1 as shown in fig. 11 and 12.

In contrast, the defective is a portion where turns of the defective coil 16 are not bonded or overlapped with each other and a plurality of gaps or overlapping portions occur between the turns as shown in fig. 13 and 14. Fig. 13 and 14 show an example of a defective coil 16 having a defective alignment. Although the example of the defective coil in the winding arrangement is described as an example of the defective coil 16 which is frequently generated in the inspection target in embodiment 1, the defective coil is divided into a plurality of branches.

The defective coil 16 formed as described above is in a state of poor alignment, which is called as so-called winding disorder. As described above, if the winding disorder occurs, the defective coil 16 expands. When the defective coils 16 are arranged in a ring shape as shown in fig. 1, the adjacent coils 1 interfere with each other, and the coils 1 are deformed by compression.

As a result, the insulation coating of the magnet wire 9 constituting the coil 1 is damaged, and the correlation with the short circuit is high, and thus the coil becomes defective. As shown in fig. 14, in the defective coil 16 in a state in which winding disorder occurs, the short-circuit portion 17 may be in a state in which the partial turns are separated from the insulating portion 3 and come into contact with the core portion 2. Note that the short-circuited portion 17 formed in the counter yoke portion 8 shown in fig. 14 is not limited to this position, and a defective coil 16 may come into contact with the yoke portion 7 to cause a similar defect.

Next, a winding inspection method in the winding inspection apparatus 140 according to embodiment 1 will be described with reference to fig. 15 to 20. In embodiment 1, the alignment of the windings is quantified by image processing, and thus the inspection of the winding failure is performed. Here, the position of the chip 20 before winding, which has a high correlation with winding irregularity, is inspected, and the possibility of occurrence of winding failure such as winding irregularity is determined. In addition, the contour of the coil 1 after winding is inspected, and the winding failure is inspected.

Fig. 15 to 17 are explanatory views for explaining respective steps of the wire inspecting method. Fig. 15(a) is an explanatory diagram for explaining a part of the front chip 201 when the model of the fixture 10 on which the winding is performed by the winding device 14 is determined based on the shape of the front chip 201 that reflects the field of view 21 of the camera 141. Fig. 15(B) is an explanatory diagram illustrating a fixed point for determining a model of the fixture 10 for winding from a portion of the front chip 201, which is obtained as shown in fig. 15 (a).

Fig. 16 is an explanatory diagram for explaining a preliminary extraction step (or first extraction step) which is a step of extracting an edge of a shape which is an outline of the chip 20 in embodiment 1 of the present invention. Fig. 16(a) is an explanatory diagram for explaining a portion of the extracted contour when the inspection is performed based on the contour data of the front chip 201 that maps the field of view of the camera 141. Fig. 16(B) is an explanatory diagram for explaining the fixed points for calculating the position of the front chip 201 from the contour data of the front chip 201, obtained as shown in fig. 16 (a).

Fig. 17 is an explanatory diagram for explaining a post-extraction step (or a second extraction step) which is a step of extracting an edge of a shape which is an outline of the coil 1 in embodiment 1 of the present invention. Fig. 17(a) is an explanatory diagram for explaining an extracted portion when extracting contour data of the coil 1 of the rear chip 202 which reflects the field of view of the camera 141. Fig. 17(B) is an explanatory diagram for explaining a portion obtained as shown in fig. 17(a) for calculating the arrangement of the coils 1 from the contour data of the coils 1 and quantifying the arrangement.

Fig. 18 is a diagram showing the result of analyzing the profile data of the coil 1 obtained in fig. 17.

Fig. 19 and 20 are flowcharts showing a winding inspection method according to embodiment 1 of the present invention.

Next, the processing steps of the winding inspection method according to embodiment 1 will be described with reference to fig. 19 and 20. First, as shown in fig. 15, the front chip 201 is provided at a position where the winding device 14 winds the winding wire, and the camera 141 starts shooting the moving image from just before the winding wire starts winding, and the moving image up to the end of winding is shot (step ST1 of fig. 19). The moving Picture is an aggregate of still pictures, because it has a general moving Picture file format, such as avi (audio Video interleave) and mpeg (moving Picture Experts group).

Next, a specific still image for determining a model, for example, as shown in fig. 15, that is, a front image, which is an image of the front chip 201 before winding, is acquired from the moving image file (step ST2 in fig. 19). The still image can be obtained, for example, from the timing at which the winding control unit 15 drives the turret 13 to start winding as shown in fig. 10. Then, the image processing unit 142 uses this information to synchronize the timing of starting the shooting of the moving image. Thus, the extraction of the still images can be easily determined according to the order of the still images constituting the moving image. The step of acquiring an image can be similarly performed in the following steps.

Next, the 2-valued processing of the acquired front image of the front chip 201 is performed (step ST3 in fig. 19). Since the 2-valued processing can be generally performed by a known processing method, the description thereof is omitted. However, processing conditions for 2-valued processing are required in consideration of the brightness of the acquired image and the color of the subject. For example, when the insulating portion 3 is white, the chip 20 is silver having metallic luster, and the magnet wire 9 forming the coil 1 is a copper wire having glossy brown, the process of changing to 2 values is performed by the threshold values of the RGB values.

The 2-valued processing can also be performed in accordance with a filtering process for noise of an image. The 2-valued processing need not be performed over the entire area of the acquired image. In the following steps, too, the description is omitted as appropriate since only the range used in the acquired image is required.

Next, the type of the mount 10 is determined based on the size of the front chip 201 that is occupied in the field of view 21 of the camera 141 (step ST4 in fig. 19). It is not limited to the winding device 14 winding a single kind of the fixing member 10. The winding device 14 is assumed to wind the stator 10 of a plurality of types (types) of rotating electrical machines in general.

The steps up to the determination step of step ST4 will be described with reference to fig. 15. First, as shown in fig. 15(a), the position of the front chip 201 with respect to the field of view 21 captured by the camera 141 changes depending on the type of the fixture 10. However, the position of the front chip 201 of the fixing member 10 for each category is substantially the same position. The analysis window 19 shown in fig. 15(a) is set to have a size for arraying the chips 20 of the various types of fixtures 10 to be wound by the winding device 14.

The 2-corner points (X1, Y1) and (X2, Y2) of the analysis window 19 are fixed points for analysis and are coordinates with respect to the field of view 21 of the camera 141. That is, the chip 20 is fixed at a position where the winding device 14 can wind the wire, and at the time of winding, the coordinates of the chip 20 entering the analysis window 19 are set on both the left side surface 181 and the right side surface 182 of any type of the fixture 10.

Next, in fig. 15B, reference points (X3, Y3) and (X4, Y4) for determining the type of the anchor 10 are acquired from the contour data of the left side surface 181 and the right side surface 182 in the analysis window 19. Then, the distance between the 2 points is calculated, and the type of the fixture 10 is determined. In the determination step, if the set analysis window 19 is largely deviated from the position of the front chip 201, it is determined that analysis is impossible. Therefore, in the determination step, if the analysis cannot be performed, it can be determined that there is a problem in the placement of the front chip 201 on the winding device 14.

Next, the contour data of the front chip 201 is extracted (step ST5 of fig. 19). Next, the contour data of the front chip 201 is quantified (step ST6 in fig. 19). Next, the quantified profile data of the front chip 201 is compared with a threshold value to determine whether or not the front chip 201 is properly mounted on the winding device 14 (step ST7 in fig. 19).

The steps of step ST7, i.e., the steps up to the previous determination step (or first determination step) will be described with reference to fig. 16. First, as shown in fig. 16 a, 2 points (X5, Y5) and (X6, Y6) of the opposite corners of the analysis window 22 are set in advance for each type of the fixture 10 determined by the determination step (step ST4) described above. Then, the outline of the front chip 201, that is, the outline data of the left side surface 181 in the analysis window 22 and the yoke side surface 23 of the insulating part 3 is extracted using the analysis window 22 corresponding to the type of the fixture 10 determined in the determination step.

In fig. 16B, the intersection (X7, Y7) of the 2 straight lines and the angle θ 1 of the 2 straight lines are obtained from the contour data of the left side surface 181 and the yoke side surface 23 in the analysis window 22, and the position and the posture (inclination) of the chip 20 at the time of winding are calculated and quantified. Then, the contour data of the front chip 201 is analyzed, and when the intersection (X7, Y7) and the angle θ 1 do not exist in the threshold for determination, that is, the coordinates of the original position, it is determined that the front chip 201 is not correctly installed in the winding device 14 before the winding is performed, and there is a possibility that a winding failure such as a winding disorder occurs.

Further, by this determination, if it is determined that the cause of the positional deviation of the chip 20 is caused by a problem in the mechanism of the winding device 14 that engages the chip 20, the mechanism can be adjusted and repaired to suppress the occurrence of a failure as soon as possible.

The following steps are performed for the chips 20 that have been determined to be wire-wrappable through the above-described steps. Then, the inspection after the winding of the chip 20 is performed. First, from the moving image captured continuously, the shape of the coil 1 after the completion of the winding can be extracted in the same manner as in step ST2 described above, and a rear image which is an image of the rear chip 202 after the winding can be acquired (step ST8 in fig. 20). Next, from the rear image of the rear chip 202, 2-valued processing is performed to extract the contour data of the coil 1 (step ST9 in fig. 20). This step is similar to the step ST3 described above.

Next, the contour data of the rear chip 202 is extracted (step ST10 of fig. 20). Next, the contour data of the coil 1 of the rear chip 202 is quantified (step ST11 in fig. 20). Next, the quantified contour data of the coil 1 of the rear chip 202 is compared with a threshold value to determine whether the coil 1 of the rear chip 202 is acceptable (step ST12 in fig. 20).

The steps up to the post-determination step of step ST12 will be described with reference to fig. 17. First, fig. 17 a shows the rear chip 202 which is projected in the field of view 21, and the analysis left window 241 and the analysis right window 242 for extracting the contour data of the coil 1 for each type of the fixture 10 determined by the determination step (step ST4) described above. Here, the analysis left window 241 has (X8, Y8), (X9, Y9). In addition, the analysis right window 242 has (X10, Y10), (X11, Y11). The contour data of the coil 1 is extracted using the 2-valued data in the analysis left window 241 and the analysis right window 242, respectively.

Specifically, the scanning start point for extracting the contour data of the coil 1 starts from, for example, a point (X9, Y9) at the upper right corner of the analysis left window 241 in fig. 17 a. Then, the same value that continues continuously in the X direction as the 2-valued drawing data is counted, and when an arbitrary number of the same value continues to be counted, a point that is the contour of the coil 1 is defined, and the contour data of the coil 1 is extracted.

Next, as shown in fig. 17(B), boundary lines 25 between adjacent chips 20 and center lines 28 of the chips 20 are defined with respect to the chips 20 in order to quantify the position of the left contour 261 which is a part of the extracted contour data. First, the center line 28 is calculated using, for example, 2 ridge lines of the yoke-side surface 23 and the counter-yoke-side surface 27 in the 2 planes of the insulating portion 3. Then, a boundary 25 between adjacent chips 20 when the chips 20 are arranged in a ring shape is calculated. The boundary line 25 and the center line 28 can be calculated by referring to a preset center line 28 at the time of designing the fixture 10 and an angle θ 2 at which the center line 28 intersects the boundary line 25.

Further, the center line 28 and the boundary line 25 may be calculated and set based on the contour data of the chip 20 detected in the previous step, without using data set in advance at the time of designing the fixture 10. In this case, the current information of the chip 20 to the winding device 14 can be used, and thus detection with higher accuracy can be performed.

Then, a boundary line 25 is obtained which passes through a point P on the ridge line of the yoke-side surface 23 and a point K on the ridge line of the counter-yoke-side surface 27. Also, the position of the left contour 261 relative to the chip 20 is quantified.

First, K and P points are specified in order to analyze the positional relationship with respect to the boundary line 25 calculated from the center line 28. Next, quantification of the left contour 261 is performed with reference to the boundary line 25 from the point P to the point K. Note that, although only the left contour 261 using the analysis left window 241 is described here, the same applies to the right contour 262 using the analysis right window 242, and therefore, the description thereof is appropriately omitted.

FIG. 18 is a view showing analysis results obtained in a subsequent quantification step (or a second quantification step) which is the step ST 11. In fig. 18, the XA axis corresponds to the boundary 25 in fig. 17 (B). In addition, a point P of an end point on the yoke 7 side of the left contour 261 is defined as an origin (0, 0) of coordinates. The difference plot 29 of the boundary line 25 and the left contour 261 shows the boundary line 25 as zero of YA coordinates and the distance up to the left contour 261 as the distance L.

Accordingly, the YA coordinate of the difference plot 29 of the boundary line 25 and the left contour 261 in fig. 18 becomes a negative value, and the coil 1 protrudes toward the adjacent chip 20 and interferes therewith. The points P and K, which are the ends of the left contour 261, are near the boundary between the insulating portion 3 and the core portion 2. Accordingly, at the point P and the point K, the YA coordinate becomes a negative value, and as shown in fig. 14, the core 2 and the coil 1 come into contact with each other, and a short-circuit failure occurs.

As described above, the condition that the YA coordinate in fig. 18 is negative is set as the threshold value on the basis of the distance L of the left contour 261 with respect to the boundary line 25, and the interference between the adjacent chips 20 and the coil 1, the short-circuit failure due to the contact between the wound chip 20 and the core 2, and the like are determined as the failures.

In embodiment 1, an example is shown in which the determination is performed in each of the determination step, the pre-determination step, and the post-determination step, and the determination is not performed in the determination step and the pre-determination step, and the determination in each of the determination step, the pre-determination step, and the post-determination step is performed in the post-determination step in a combined manner, whereby the determination of the winding failure can be performed.

In this case, in the determination in each of the determination step, the pre-determination step, the post-determination step, and the like, a case in which the threshold value is significantly exceeded is determined as a failure. Then, final comprehensive judgment is performed. Thus, if it is determined that the threshold value is significantly exceeded for each determination, it is possible to appropriately cope with this case. This can suppress waste of production time until the occurrence of a subsequent failure.

In embodiment 1, a winding inspection method including a chip discrimination step before winding and a pre-determination step is described. However, depending on the purpose of the winding inspection and the required inspection accuracy, a winding inspection method may be adopted which has only a post-determination step of determining whether or not the coil of the chip after winding is acceptable. This can simplify the inspection method. In accordance with the purpose of the winding inspection, the inspection accuracy can be improved and the inspection can be made more efficient by appropriately adding a determination step, a pre-determination step, and the like.

According to the winding inspection method and the winding inspection apparatus of embodiment 1 performed as described above, it is possible to determine that the winding is defective from the profile data of the coil of the rear chip after the winding. Thus, the chips after winding can be arranged in a ring shape and can be detected as defective before the chips are fixed by welding or the like to form the core. Thus, when a failure of the coil is detected, the failed chip can be removed at that time, the coil can be rewound, or the coil can be corrected. This can improve productivity. Therefore, energy is saved and the yield is improved.

In addition, by using the profile data of the chip before winding in the determination of winding failure, it is possible to determine whether the chip is acceptable or not with higher accuracy.

Further, the possibility of occurrence of winding failure can be determined based on the profile data of the front chip just before winding. Thus, the accuracy of the winding inspection is improved, the winding failure can be detected in advance, and the failure can be prevented from flowing out to the subsequent process.

In addition, in the determination step, when the chip that is largely separated from the analysis window cannot be analyzed, the chip can be determined as a winding failure. Thus, the accuracy of the winding inspection is improved, the winding failure can be detected in advance, and the failure can be prevented from flowing out to the subsequent process.

Further, since the type of the fixture is determined in the determination step, the winding inspection apparatus does not need to obtain information from another external device regarding the type of the fixture, and thus can perform winding inspection without limitation on the type of signal and the amount of data.

In embodiment 1, an example in which a determination step of determining the type of the fixture is provided is shown, but the present invention is not limited to this, and the winding inspection apparatus may obtain information on the type of the fixture in advance from the winding control unit. In this case, a step of discriminating the type of the chip is not necessary.

In addition, although embodiment 1 described above shows an example in which processing is performed using 2-dimensional video, the present invention is not limited to this, and processing can be performed using 3-dimensional video, and determination can be made in the same manner as in embodiment 1.

Embodiment 2.

Embodiment 2 relates to a winding inspection method for detecting the position of the first turn portion 30 of the front chip 201 and determining the occurrence of winding disorder. Specifically, the winding inspection method according to embodiment 2 is configured such that the winding inspection method according to embodiment 1 described above is added with a turn extracting step of the first turn portion, a turn quantifying step of the first turn portion, and a turn determining step of the first turn portion.

Fig. 21 is an explanatory diagram for explaining a turn extracting step in the winding inspection method according to embodiment 2 of the present invention.

Fig. 22 is a flowchart for explaining a winding inspection method according to embodiment 2 of the present invention.

In the drawings, the same components as those in embodiment 1 are denoted by the same reference numerals, and description thereof is omitted. The first turn portion 30 is a turn of the front chip 201 around which the magnetic wire 9 is wound for the first time. Further, a pin 31 is provided at one end of the magnetic wire 9.

Next, the processing steps of the winding inspection method according to embodiment 2 will be described with reference to fig. 22. First, the steps up to step ST7 are performed through the same steps as those in embodiment 1. Next, the first turn portion 30 in which the magnetic wire 9 is wound around the front chip 201 is extracted (step ST13 in fig. 22). Next, the extracted first loop portion 30 is quantified (step ST14 in fig. 22). Next, the quantified first turn portion 30 is compared with a threshold value to determine the failure of the first turn portion 30 (step ST15 in fig. 22). Next, from step ST8, the same steps as those in embodiment 1 are performed to perform a winding inspection.

Here, the steps up to the turn determination step of step ST15 will be described with reference to fig. 21. Fig. 21(a) is an explanatory diagram illustrating a portion where the turn contour data of the magnetic wire 9, that is, the first turn portion 30 is extracted when the possibility of occurrence of winding irregularity in the subsequent winding is determined based on the shape of the magnetic wire 9 of the first turn portion 30 wound around the front chip 201 reflected in the visual field 21 of the camera 141. Fig. 21(B) is an explanatory diagram for explaining the fixed point for calculating the position of the first turn portion 30 of the coil 1 with respect to the front chip 201 based on the obtained turn contour data.

First, the position of the first turn 30 in fig. 21 a, specifically, the distance between the intersection (X14, Y14) of the yoke side surface 23 and the right side surface 182 in fig. 21B and the bent portion tip (X15, Y15) of the first turn 30 is measured, and the contour data is extracted. In fig. 21(a), the first turn portion 30 is originally wound in contact with both side surfaces of the yoke side surface 23 and the right side surface 182 of the insulating portion 3, and therefore, one end of the magnetic wire 9 is wound around the pin 31 and locked. Then, the magnet wires 9 are sequentially wound with an appropriate tension applied thereto.

If the winding is performed without the first turn portion 30 abutting on both the yoke side surface 23 and the right side surface 182, the second turn and its subsequent turns jump up to the first turn portion 30 and are deformed in an aligned manner, which may become a starting point of winding disorder.

For example, when neither of the first turn portions 30 abuts against the yoke side surface 23 and the both side surfaces of the right side surface 182, it is suspected that the first turn portion 30 is completely loosened and broken. When the first loop portion 30 abuts only the yoke-side surface 23, the first loop portion 30 is suspected of being loose or the front chip 201 is suspected of having a tilt in the X direction of fig. 21. When the first loop portion 30 abuts only the right side surface 182, the first loop portion 30 is suspected of being loose or the front chip 201 is suspected of having a tilt in the Y direction of fig. 21. In short, this phenomenon is detected before winding, and thus, winding irregularities can be suppressed thereafter.

Thus, whether or not the first turn portion 30 abuts on both the yoke side surface 23 and the right side surface 182 of the insulating portion 3 is checked. Therefore, 2 points (X12, Y12) and (X13, Y13) of the opposite corners of the turn analysis window 32 corresponding to the category of the mount 10 determined by step ST4 are determined as shown in fig. 21 (a).

Next, the contour data of the first turn portion 30 within the turn analysis window 32 is extracted. The yoke-side surface 23 of the insulating portion 3 and the right-side surface 182 of the chip 20 are extracted from the outline data of the chip 20 extracted in the preliminary extraction step of step ST 5. Next, relative coordinates { (X15-X14), (Y15-Y14) } between 2 points, which are the intersections (X14, Y14) of the right side surface 182 and the yoke side surface 23 and the Y direction vertices (X15, Y15) of the contour data of the first turn unit 30 in fig. 21B, were quantified.

Next, as the threshold value, for example, if it is (X15-X14) > (wire diameter of magnetic wire 9 ÷ 2), it is determined that the first turn portion does not abut against the right side surface 182. If it is (Y15-Y14) > (the wire diameter of the magnet wires 9), it is determined that the first turn portion 30 does not abut on the yoke side surface 23.

In embodiment 2, the previous determination step and the turn determination step are performed in different steps, but the present invention is not limited to this, and the determination of whether or not the chip before forming the winding is acceptable may be performed by determining whether or not the chip is installed in the winding device based on the outline data of the chip and determining whether or not the first turn portion is acceptable based on the outline data of the first turn portion and the outline data of the chip.

In embodiment 2, the winding inspection method in the case where the first turn portion 30 is positioned on the right side surface 182 of the front core piece 201 has been described, but the first turn portion 30 may be positioned on the left side surface 181 in the design of the rotating electric machine. In this case, the same operation as the right side surface 182 described above can be performed.

According to the winding inspection method and the winding inspection apparatus of embodiment 2 configured as described above, it is needless to say that the same effects as those of embodiment 1 described above are obtained, and the possibility of occurrence of a defective winding can be determined based on the profile data for the first turn portion of the chip. The precision of the winding inspection is improved, the unqualified winding can be detected in advance, and the unqualified winding can be prevented from flowing out to the subsequent process. This can further improve productivity, save energy, and further improve yield.

Embodiment 3.

In each of the above embodiments, the case where the inspection of 1 chip 20 is performed is described, but in embodiment 3, it is needless to say that the inspection of 1 chip 20 is performed, and the wire winding inspection is performed for the interference between the adjacent chips 20 when the chips 20 are arranged in a ring shape. In the winding inspection method according to embodiment 3, a comparison step and an adjacent judgment step are added to the respective processing steps of the winding inspection method according to embodiment 1.

Fig. 23 is an explanatory diagram for explaining interference between adjacent chips 20 in the winding inspection method according to embodiment 3 of the present invention.

Fig. 24 is a flowchart for explaining a winding inspection method according to embodiment 3 of the present invention.

Fig. 25 and 26 are diagrams showing analysis results of the contour data of the coil 1 obtained in embodiment 3 of the present invention.

Fig. 27 is a graph showing a comparison result obtained by comparing the analysis results of fig. 25 and 26.

First, a structure of the fixture 10 particularly effective in the winding inspection method according to embodiment 3 of the present invention will be described. For example, as shown in fig. 23, when there is a portion 33 of the coil 1 that exceeds the boundary line 25. This is the case where the shape of the coil 1, that is, the arrangement of turns of the adjacent chips 20 is intentionally changed alternately.

In the case of the configuration of the fixture 10 described above, in the winding inspection method according to embodiment 1 described above, it is determined that the extracted contour of the coil 1 exceeds the boundary line 25. Then, it is determined that the coil 1 of the adjacent chip 20 protrudes to be in contact with the coil 1. Thus, as described in embodiment 1, it is determined to be a failure. However, for example, in electromagnetic design, which is a characteristic of a rotating electric machine, it is sometimes preferable that the arrangement of turns as described above be intentionally and alternately arranged. In this case, embodiment 3 is effective.

In addition, when the same coil 1 is wound in the same shape with the same turn arrangement, the coil may not be completely arranged. In this case, as a result, even if a portion exceeding the boundary line 25 is generated, the determination is made in consideration of the relative positional relationship between the coil 1 and the adjacent chip 20 to the extent that the coil 1 protrudes toward the chip 20 side, and the determination as to whether or not the coil 1 is acceptable is made. In this case, embodiment 3 is effective.

Next, the processing steps of the winding inspection method according to embodiment 3 will be described with reference to fig. 24. First, the steps up to step ST11 are performed through the same steps as in the above embodiments. Next, the outline data of the coils 1 of the chips 20 adjacent to each other in the ring shape, which are quantified in step ST11, are compared (step ST16 in fig. 24). Next, it is determined whether or not the coil 1 of the adjacent chip 20 is acceptable based on the result of comparison at step ST16 (step ST17 in fig. 24).

Here, the adjacency determination step in step ST17 will be described with reference to fig. 25 to 27. Fig. 25 is a differential plot 29 of the coils 1 of adjacent one of the chips 20. Fig. 26 is a differential plot 29 of the coil 1 of another adjacent chip 20. Fig. 25 and 26 show the results of analyzing the contour data of the coil 1, which are processed in the same manner as fig. 18 shown in embodiment 1. Then, the difference plots 29 shown in fig. 25 and 26 are summed up to obtain a comparison value 34 of the distance LA set to half as shown in fig. 27.

That is, if the YB coordinate is a negative value with the comparison value 34 of fig. 27 being the threshold value, it can be determined as a failure if the adjacent coils 1 are in contact. Thus, if the determination is made only by the difference plot 29 of fig. 26, the coil is determined to be defective, but since the determination is made by the comparison value 34 of fig. 27, the adjacent coils 1 are not in contact and are determined to be defective.

Further, although embodiment 3 shows an example in which the adjacent chips 20 are compared with each other to determine whether or not the coil 1 is acceptable, the present invention is not limited to this, and similarly to the above embodiments, the adjacent chips 20 in embodiment 3 may be compared with each other to determine whether or not the coil 1 is acceptable after the step ST12 in which the chips 20 alone are subjected to the step of determining whether or not the coil 1 is acceptable in advance. In this case, in step ST12, the chips 20 adjacent to each other are not compared with each other, and the failure of the chip 20 is determined in advance from the object of determination, so that the determination is made more efficient.

According to the winding inspection method and the winding inspection apparatus of embodiment 3 configured as described above,

it is needless to say that the same effects as those of the above embodiments are achieved, and the coils of adjacent chips are compared to determine that the winding is defective. The accuracy of the winding inspection can be improved, the productivity can be further improved, the energy can be saved, and the yield can be further improved.

Embodiment 4.

Embodiment 4 relates to a winding inspection apparatus 140 for implementing the winding inspection method described in each of the above embodiments. In embodiment 4, the description is made with reference to the fixture 10 described in each of the above embodiments. Fig. 28 is a diagram showing the configuration of a winding inspection apparatus 140 according to embodiment 4 of the present invention. In the figure, the winding inspection apparatus 140 includes a camera 141 and an image processing unit 142.

The image processing unit 142 includes an introduction unit 35, an acquisition unit 36, a 2-valued processing unit 37, a determination unit 38, a front extraction unit 39, a front quantization unit 40, a turn extraction unit 41, a turn quantization unit 42, a front determination unit 43, a rear extraction unit 44, a rear quantization unit 45, a rear determination unit 46, a comparison unit 47, an integrated determination unit 48 serving as a turn determination unit and an adjacent determination unit, and a control unit 49.

The control unit 49 controls the camera 141 and the image processing unit 142.

The control unit 49 performs signal processing between a display device, a keyboard, a mouse, and the like, which are not shown.

The image processing unit 142 is composed of a CPU, a memory, a magnetic disk, an input/output unit, and peripheral equipment units, and can process each processing step of the winding inspection method by software.

The control unit 49 may be used as a part of the winding device 14. In this case, the winding control unit 15 and the control unit 49 are completely synchronized, and the inspector can perform automatic production and automatic inspection of the winding without operating the winding device 14 based on the determination result.

The introduction unit 35 uses the camera 141 to capture a moving image immediately behind (just before) the position where the front chip 201 is wound, until the winding is completed.

The moving image file obtained by the acquisition unit 36 acquires images required for the front chip 201 and the rear chip 202.

The 2-valued processing unit 37 performs a 2-valued process in consideration of the brightness of the acquired images of the front chip 201 and the rear chip 202 and the colors of the insulating portion, the core portion, and the coil, which are the imaging targets.

The determination unit 38 determines the model based on the size and position of the front chip 201 in the field of view 21 of the camera 141.

The front extraction unit 39 extracts contour data of the front chip 201 including the edge of the core shape, that is, the insulation unit 3, for inspecting the front chip 201.

The front-end quantification unit 40 quantifies the position and inclination of the front chip 201 based on the profile data of the front chip 201.

The turn extracting unit 41 extracts contour data of the first turn portion 30 in order to inspect the position of the first turn portion 30 wound around the front chip 201.

In the turn quantifying unit 42, quantification of the position of the first turn portion 30 of the front chip 201 is performed based on the profile data of the first turn portion 30.

The pre-determination unit 43 diagnoses the results of the determination unit 38, the pre-quantification unit 40, and the turn-quantification unit 42, which are checked and determined using the image of the pre-chip 201, and determines the possibility of the occurrence of a winding failure in the stage before the winding is performed.

The post-extraction unit 44 extracts contour data of the coil 1 in order to check the arrangement of the coils 1 of the post-chip 202.

The subsequent quantification unit 45 quantifies the obtained profile data of the coil 1 of the rear chip 202 on the chip 20 basis. In addition, at this time, winding failures such as winding irregularities and short-circuit failures can be diagnosed.

The rear determination unit 46 performs the non-defective determination of the chip 20 by using the determination result of the image inspection of the front chip 201 and the determination result of the image inspection of the rear chip 202 of the determination unit 38, the front quantization unit 40, the turn quantization unit 42, and the like.

In the comparison unit 47, when the rear chips 202 are arranged in a ring shape, the interference between the coils 1 of the adjacent chips 20 is compared.

In the integrated judgment unit 48, the interference of the coils 1 of the adjacent chips 20 when the rear chips 202 are arranged in a ring shape is judged based on the results of the front judgment unit 43 and the rear judgment unit 46, and whether or not the integrated winding of the stator 10 is acceptable is judged.

The control unit 49 displays the results of the winding inspection, i.e., the results of the determination by the front determining unit 43, the rear determining unit 46, and the integrated determining unit 48 and the values thereof, and further information obtained by specifying the chips 20 given in the winding device 14, which are the chips 20 having completed winding, on a display device, and presents the information to a person involved in the inspection including an operator who operates the winding device 14.

In addition, when a possibility of failure is detected before winding, a warning signal is issued via an input/output device connected to the winding device 14, and the winding device 14 that has received the warning signal can be automatically stopped.

The winding inspection apparatus according to embodiment 4 configured as described above can implement the winding inspection method according to each of the above embodiments, and can obtain the same effects as those of each of the above embodiments. Further, the winding device can be appropriately handled according to the result of the winding inspection, or the result of the winding inspection can be provided to the operator.

Thus, the winding device and the operator can cope with the defective chip by detecting the defect of the winding before the chips are arranged in the ring shape. This can further improve productivity, save energy, and further improve yield.

In the present invention, the respective embodiments may be freely combined, or may be appropriately modified or omitted within the scope of the invention.

Claims (11)

1. A winding inspection method for forming a winding coil on a fixing member of a chip,

the winding inspection method includes:

a post-winding acquisition step of acquiring a post-winding image of the chip;

a post-winding extraction step of extracting contour data of the winding coil wound on the chip from the image acquired in the post-winding acquisition step; and

and a post-winding determination step of calculating a boundary line between adjacent chips when the chips are arranged in a ring shape, and determining whether or not the wound coil is acceptable based on a predetermined threshold value from a difference between the boundary line and an outline of the wound coil.

2. The winding inspection method according to claim 1, comprising:

a pre-winding acquisition step of acquiring an image of the chip before winding; and

a pre-winding acquisition step of extracting the outline data of the chip from the image acquired in the pre-winding acquisition step,

the pre-winding determination step determines the winding coil using the profile data of the chip.

3. The winding inspection method according to claim 2,

the winding inspection method for winding coils of the fixture in which a plurality of types of fixtures are formed by a winding device includes a determination step for determining the type of the fixture, and the post-winding determination step is performed in association with the type of the fixture determined by the determination step.

4. The winding inspection method according to claim 2 or 3,

in a winding inspection method of forming the wound coil by a winding device,

the method includes a pre-winding determination step of determining whether or not the chip is properly mounted on the winding device based on the profile data of the chip.

5. A winding inspection method for a fixture in which a plurality of chips on which a winding coil is formed are annularly arranged by winding each chip,

the winding inspection method includes:

a post-winding acquisition step of acquiring a post-winding image of the chip;

a post-winding extraction step of extracting contour data of the winding coil of the chip from the image;

a comparison step of comparing profile data of the wound coils of the chips adjacent to each other in the ring shape; and

and an adjacent determination step of determining whether or not the winding coils of the adjacent chips are acceptable based on a difference in outline between the winding coils of the chips that are adjacent in the ring shape.

6. The winding inspection method according to claim 5,

the method includes a post-winding determination step of determining whether or not the wound coil is acceptable based on profile data of the wound coil.

7. The winding inspection method according to any one of claims 1, 5, or 6, wherein:

a turn obtaining step of obtaining a turn image of a first turn portion of a winding of the chip;

a loop extraction step of extracting contour data of the first loop from the loop image; and

and a turn determination step of determining whether or not the first turn is acceptable based on the profile data of the first turn and the profile data of the chip.

8. A winding inspection device for winding a winding and forming a winding coil on a fixing member of a chip,

the winding inspection device comprises:

an acquisition unit that acquires an image of the chip captured by the imaging unit that captures the chip;

a post-winding extraction unit that extracts contour data of the winding coil from an image of a chip; and

and a post-winding determination unit that calculates a boundary line between the chips adjacent to each other when the chips are arranged in a ring shape, and determines whether or not the wound coil is acceptable based on a predetermined threshold value from a difference between the boundary line and an outline of the wound coil.

9. The winding inspection apparatus according to claim 8,

a winding inspection device for forming the winding coil by a winding device comprises:

a pre-winding extraction unit that extracts outline data of a chip from an image of the chip;

a determination unit that determines the type of the mount based on the outline data of the chip;

a pre-winding determination unit that determines whether or not the chip is properly mounted on the winding device based on the profile data of the chip;

a turn extraction unit that extracts contour data of a first turn of a chip from an image of the chip; and

a turn determination unit for determining whether or not the first turn is acceptable based on the profile data of the first turn and the profile data of the chip,

the post-winding determination unit performs determination in accordance with the type of the mount.

10. A winding inspection device for a fixture for winding each chip and annularly arranging a plurality of chips formed with winding coils,

the winding inspection device comprises:

an acquisition unit that acquires an image of the chip captured by the imaging unit that captures the chip;

a post-winding extraction unit that extracts contour data of the winding coil from an image of a chip;

a comparison unit that compares profile data of the wound coils of the chips that are adjacent to each other in the ring shape; and

and an adjacent determination unit that determines whether or not the wound coils of the adjacent chips are acceptable based on a difference in outline between the wound coils of the chips that are adjacent in the ring shape.

11. The winding inspection apparatus according to claim 10,

a winding inspection device for forming the winding coil by a winding device comprises:

a pre-winding extraction unit that extracts outline data of a chip from an image of the chip;

a determination unit that determines the type of the mount based on the outline data of the chip;

a pre-winding determination unit that determines whether or not the chip is properly mounted on the winding device based on the profile data of the chip;

a turn extraction unit that extracts contour data of a first turn of a chip from an image of the chip; and

a turn determination unit for determining whether or not the first turn is acceptable based on the profile data of the first turn and the profile data of the chip,

the adjacent determination unit performs determination in accordance with the type of the fixture.

Images