CN109068483A - A kind of wiring board being directly integrated IC - Google Patents
A kind of wiring board being directly integrated IC Download PDFInfo
- Publication number
- CN109068483A CN109068483A CN201811100935.1A CN201811100935A CN109068483A CN 109068483 A CN109068483 A CN 109068483A CN 201811100935 A CN201811100935 A CN 201811100935A CN 109068483 A CN109068483 A CN 109068483A
- Authority
- CN
- China
- Prior art keywords
- copper foil
- layer
- wiring board
- directly integrated
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Abstract
The invention discloses a kind of wiring boards for being directly integrated IC, it include: potting resin lid, metal lead wire, chip, solder mask, circuit board substrate, the circuit board substrate includes copper foil layer, adhesive layer, basal layer, the adhesive layer is located above basal layer, copper foil layer is located at adhesive layer two sides, solder mask is equipped on each copper foil layer, substrate copper foil is equipped between copper foil layer, chip is equipped on substrate copper foil, the two sides of the chip are separately connected one end of metal lead wire, the other end of the metal lead wire is connected with copper foil layer, the potting resin lid covers on the copper foil layer of two sides to protect chip and metal lead wire.The application realizes the production for being done directly IC in the circuit board, saves IC frame, optimizes IC processing technology, while having banned wiring board actual load technique, realizes binding directly for IC and wiring board.
Description
Technical field
The present invention relates to a kind of wiring board, specifically a kind of wiring board for being directly integrated IC.
Background technique
In recent years, electronics auxiliary material generally appears in every field, and with the update of the development speed in every year generation.
Printed circuit board as electronics auxiliary material important component is also in continuous perfect, update.With mentioning for people's living standard
Height, in terms of substance therewith there has also been requiring to a certain degree, especially in terms of electronics auxiliary material, be not only particular about it is practical and attractive, auxiliary
The requirement of the volume of material, integrated level, function etc. is also higher and higher.As industry continues to develop, printed wiring board application neck
Domain is continuously increased, and demand is increasing, and the requirement to printed wiring board is also varied, is needed to better meet market
It asks, meets high integration, multi-functional requirement, then need to carry out the integrated of IC, IC market competition motivates, and between enterprise
Differentiation is increasingly fuzzy, and product is gradually convergent, and this requires us constantly to optimize, and constantly weeds out the old and bring forth the new.
Summary of the invention
In view of the above-mentioned problems existing in the prior art, this application provides a kind of wiring boards for being directly integrated IC, realize
It is done directly the production of IC on wiring board, saves IC frame, optimizes IC processing technology, while having banned wiring board actual load work
Skill realizes binding directly for IC and wiring board.
To achieve the above object, a kind of technical solution of the application are as follows: wiring board for being directly integrated IC, comprising: encapsulation tree
Rouge lid, metal lead wire, chip, solder mask, circuit board substrate, the circuit board substrate include copper foil layer, adhesive layer, basal layer,
The adhesive layer is located above basal layer, and copper foil layer is located at adhesive layer two sides, solder mask is equipped on each copper foil layer, in copper
It is equipped with substrate copper foil between layers of foil, chip is equipped on substrate copper foil, the two sides of the chip are separately connected one end of metal lead wire,
The other end of the metal lead wire is connected with copper foil layer, and the potting resin lid covers on the copper foil layer of two sides to protect chip
With metal lead wire.
Further, silver-plated or tin plating in copper foil layer surface gold-plating.
Further, IC pin is etched on the copper foil layer of two sides.
Further, the application further includes stiffening plate, positioned at basal layer in the following, the width of the stiffening plate is less than substrate
Layer, greater than the width of potting resin lid.
Further, the solder mask is polyimide film (PI) or solder mask.
Further, the adhesive layer is epoxide-resin glue or acrylate glue.
Further, the basal layer is polyimide film.
Further, the stiffening plate is polyimides (PI) plate or glass mat FR4 or steel disc.
The present invention due to using the technology described above, can obtain following technical effect:
1., wiring board combined with Integrated circuit IC, optimized production process.
2., reduce IC making material, reduce IC cost of manufacture.
3., ban the process of wiring board actual load IC.
4., Integrated circuit IC be directly integrated on wiring board, evaded the bad risk of subsequent actual load, it is qualified to improve product
Rate.
5., Integrated circuit IC be directly integrated on wiring board, increase the reliability of IC, IC made to be present in the position of wiring board
It sets, height, peel strength are further promoted.
Detailed description of the invention
Fig. 1 is a kind of wiring board side view for being directly integrated IC；
Number explanation in figure: 1, substrate copper foil；2, chip；3, potting resin lid；4, metal lead wire；5, solder mask；6, copper
Layers of foil；7, adhesive layer；8, basal layer；9, stiffening plate.
Specific embodiment
The present invention is described in further detail in the following with reference to the drawings and specific embodiments: doing as example to the application
Further description explanation.
As shown in Figure 1, the present embodiment provides a kind of wiring board for being directly integrated IC, including a kind of route for being directly integrated IC
Plate, comprising: potting resin lid, metal lead wire, chip, solder mask, circuit board substrate, the circuit board substrate include copper foil layer,
Adhesive layer, basal layer, the adhesive layer are located above basal layer, and copper foil layer is located at adhesive layer two sides, on each copper foil layer
Equipped with solder mask, it is equipped with substrate copper foil between copper foil layer, chip is equipped on substrate copper foil, the two sides of the chip are separately connected
The other end of one end of metal lead wire, the metal lead wire is connected with copper foil layer, and the potting resin lid covers the copper foil in two sides
To protect chip and metal lead wire on layer.
The metal lead wire is gold thread, and the copper foil layer surface gold-plating is silver-plated or tin plating, is etched on each copper foil layer
IC pin, the IC pin are connected with metal lead wire.Flexible circuit board needs overleaf to attach stiffening plate to protect when being integrated IC
Demonstrate,prove the flatness in the face IC.
A kind of production process of above-mentioned wiring board for being directly integrated IC is: by IC pin and IC base substrate direct-on-line road
It is made on the copper foil layer of plate by etch process, after wiring board is made into finished product, then chip is adhered to wiring board with conductive silver paste
On on the base substrate copper foil that etches, then the IC etched on chip and wiring board is managed with gold thread by ultrasonic bonding
Payment to a porter road is welded, and is finally protected chip with potting resin lid.
The preferable specific embodiment of the above, only the invention, but the protection scope of the invention is not
It is confined to this, anyone skilled in the art is in the technical scope that the invention discloses, according to the present invention
The technical solution of creation and its inventive concept are subject to equivalent substitution or change, should all cover the invention protection scope it
It is interior.
Claims (8)
1. a kind of wiring board for being directly integrated IC characterized by comprising potting resin lid, metal lead wire, chip, solder mask,
Circuit board substrate, the circuit board substrate include copper foil layer, adhesive layer, basal layer, and the adhesive layer is located above basal layer, copper
Layers of foil is located at adhesive layer two sides, and solder mask is equipped on each copper foil layer, substrate copper foil is equipped between copper foil layer, in substrate
Copper foil is equipped with chip, and the two sides of the chip are separately connected one end of metal lead wire, the other end and copper foil of the metal lead wire
Layer is connected, and the potting resin lid covers on the copper foil layer of two sides to protect chip and metal lead wire.
2. a kind of wiring board for being directly integrated IC according to claim 1, which is characterized in that in copper foil layer surface gold-plating or plating
It is silver-colored or tin plating.
3. a kind of wiring board for being directly integrated IC according to claim 2, which is characterized in that be etched on the copper foil layer of two sides
IC pin.
4. a kind of wiring board for being directly integrated IC according to claim 1, which is characterized in that the application further includes stiffening plate,
Positioned at basal layer in the following, the width of the stiffening plate is less than basal layer, greater than the width of potting resin lid.
5. a kind of wiring board for being directly integrated IC according to claim 1, which is characterized in that the solder mask is polyimides
Film or solder mask.
6. a kind of wiring board for being directly integrated IC according to claim 1, which is characterized in that the adhesive layer is epoxy resin
Glue or acrylate glue.
7. a kind of wiring board for being directly integrated IC according to claim 1, which is characterized in that the basal layer is polyimides
Film.
8. a kind of wiring board for being directly integrated IC according to claim 1, which is characterized in that the stiffening plate is polyimides
Plate or glass mat or steel disc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811100935.1A CN109068483A (en) | 2018-09-20 | 2018-09-20 | A kind of wiring board being directly integrated IC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811100935.1A CN109068483A (en) | 2018-09-20 | 2018-09-20 | A kind of wiring board being directly integrated IC |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109068483A true CN109068483A (en) | 2018-12-21 |
Family
ID=64762208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811100935.1A Pending CN109068483A (en) | 2018-09-20 | 2018-09-20 | A kind of wiring board being directly integrated IC |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109068483A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110519936A (en) * | 2019-08-01 | 2019-11-29 | 中国电子科技集团公司第二十九研究所 | A kind of the high-precision ultrathin welding resistance film layer and its process for making on ltcc substrate surface |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1691329A (en) * | 2004-04-30 | 2005-11-02 | 金士顿科技公司 | Multi-level packaging for memory module |
| US20090224385A1 (en) * | 2008-03-05 | 2009-09-10 | Advanced Optoelectronic Technology Inc. | Package structure of integrated circuit device and manufacturing method thereof |
| CN106098919A (en) * | 2016-08-10 | 2016-11-09 | 广州硅能照明有限公司 | High-thermal-conductivity and high-insulation LED light engine packaging structure and preparation method |
| CN209448990U (en) * | 2018-09-20 | 2019-09-27 | 大连吉星电子股份有限公司 | A kind of wiring board being directly integrated IC |
-
2018
- 2018-09-20 CN CN201811100935.1A patent/CN109068483A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1691329A (en) * | 2004-04-30 | 2005-11-02 | 金士顿科技公司 | Multi-level packaging for memory module |
| US20090224385A1 (en) * | 2008-03-05 | 2009-09-10 | Advanced Optoelectronic Technology Inc. | Package structure of integrated circuit device and manufacturing method thereof |
| CN106098919A (en) * | 2016-08-10 | 2016-11-09 | 广州硅能照明有限公司 | High-thermal-conductivity and high-insulation LED light engine packaging structure and preparation method |
| CN209448990U (en) * | 2018-09-20 | 2019-09-27 | 大连吉星电子股份有限公司 | A kind of wiring board being directly integrated IC |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110519936A (en) * | 2019-08-01 | 2019-11-29 | 中国电子科技集团公司第二十九研究所 | A kind of the high-precision ultrathin welding resistance film layer and its process for making on ltcc substrate surface |
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