CN109055907A - A kind of magnetic control sputtering plating equipment - Google Patents
A kind of magnetic control sputtering plating equipment Download PDFInfo
- Publication number
- CN109055907A CN109055907A CN201810988891.4A CN201810988891A CN109055907A CN 109055907 A CN109055907 A CN 109055907A CN 201810988891 A CN201810988891 A CN 201810988891A CN 109055907 A CN109055907 A CN 109055907A
- Authority
- CN
- China
- Prior art keywords
- sliding block
- fixedly connected
- magnet
- turntable
- target
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004544 sputter deposition Methods 0.000 title claims abstract description 24
- 238000007747 plating Methods 0.000 title claims abstract description 13
- 238000003475 lamination Methods 0.000 claims description 31
- 239000012528 membrane Substances 0.000 claims description 26
- 239000002775 capsule Substances 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 11
- 238000001816 cooling Methods 0.000 description 6
- 210000004712 air sac Anatomy 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003032 molecular docking Methods 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 230000001739 rebound effect Effects 0.000 description 2
- 239000013077 target material Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810988891.4A CN109055907B (en) | 2018-08-28 | 2018-08-28 | Magnetron sputtering equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810988891.4A CN109055907B (en) | 2018-08-28 | 2018-08-28 | Magnetron sputtering equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109055907A true CN109055907A (en) | 2018-12-21 |
CN109055907B CN109055907B (en) | 2020-11-06 |
Family
ID=64756326
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810988891.4A Active CN109055907B (en) | 2018-08-28 | 2018-08-28 | Magnetron sputtering equipment |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109055907B (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101988188A (en) * | 2009-07-30 | 2011-03-23 | 鸿富锦精密工业(深圳)有限公司 | Magnetic control device for sputtering |
CN101994093A (en) * | 2009-08-14 | 2011-03-30 | 鸿富锦精密工业(深圳)有限公司 | Magnetron sputtering device |
CN102234777A (en) * | 2010-04-30 | 2011-11-09 | 亚洲太阳科技有限公司 | Magnetic control sputtering machine and sputtering method for manufacturing film solar battery |
CN102234776A (en) * | 2010-04-22 | 2011-11-09 | 鸿富锦精密工业(深圳)有限公司 | Magnetron sputtering apparatus |
-
2018
- 2018-08-28 CN CN201810988891.4A patent/CN109055907B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101988188A (en) * | 2009-07-30 | 2011-03-23 | 鸿富锦精密工业(深圳)有限公司 | Magnetic control device for sputtering |
CN101994093A (en) * | 2009-08-14 | 2011-03-30 | 鸿富锦精密工业(深圳)有限公司 | Magnetron sputtering device |
CN102234776A (en) * | 2010-04-22 | 2011-11-09 | 鸿富锦精密工业(深圳)有限公司 | Magnetron sputtering apparatus |
CN102234777A (en) * | 2010-04-30 | 2011-11-09 | 亚洲太阳科技有限公司 | Magnetic control sputtering machine and sputtering method for manufacturing film solar battery |
Also Published As
Publication number | Publication date |
---|---|
CN109055907B (en) | 2020-11-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20201014 Address after: 239236 No. 32 Gaoxin Road, Lai'an Chahe Economic Development Zone, Chuzhou City, Anhui Province Applicant after: ANHUI HAODING METAL PRODUCT LIMED Co. Address before: 310018 Hangzhou University of Electronic Science and Technology, No. 1158, No. 2 Main Street, Baiyang Street, Jingkai District, Hangzhou City, Zhejiang Province Applicant before: Yang Sheng |
|
TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A magnetron sputtering equipment Effective date of registration: 20230816 Granted publication date: 20201106 Pledgee: Lai An county Jinan financing Company limited by guarantee Pledgor: ANHUI HAODING METAL PRODUCT LIMED CO. Registration number: Y2023980052355 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right |