CN109049889A - A kind of NEW TYPE OF COMPOSITE polymer floor - Google Patents

A kind of NEW TYPE OF COMPOSITE polymer floor Download PDF

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Publication number
CN109049889A
CN109049889A CN201810709817.4A CN201810709817A CN109049889A CN 109049889 A CN109049889 A CN 109049889A CN 201810709817 A CN201810709817 A CN 201810709817A CN 109049889 A CN109049889 A CN 109049889A
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Prior art keywords
parts
building body
pours
pour
new type
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Granted
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CN201810709817.4A
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Chinese (zh)
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CN109049889B (en
Inventor
刘仕宽
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Xingren County Detail New Energy Saving Building Materials Co Ltd
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Xingren County Detail New Energy Saving Building Materials Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/18—Layered products comprising a layer of metal comprising iron or steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/02—Layer formed of wires, e.g. mesh
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
    • B32B3/12—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by a layer of regularly- arranged cells, e.g. a honeycomb structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/02—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising animal or vegetable substances, e.g. cork, bamboo, starch
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/10—Homopolymers or copolymers of propene
    • C09J123/12—Polypropene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J127/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers
    • C09J127/02—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J127/04—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
    • C09J127/06—Homopolymers or copolymers of vinyl chloride
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/546—Flexural strength; Flexion stiffness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/554—Wear resistance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/558—Impact strength, toughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/73—Hydrophobic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2419/00—Buildings or parts thereof
    • B32B2419/04—Tiles for floors or walls
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/2224—Magnesium hydroxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
    • C08K2003/3009—Sulfides

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical And Physical Treatments For Wood And The Like (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention discloses a kind of NEW TYPE OF COMPOSITE polymer floors, including pouring building body, several steel wires, bamboo board and watertight sealing, described pour pours the vertically arranged steel wire of several layers in building body, be bamboo board pouring building body top and bottom, described to pour building body and the equal packaged water sealant of bamboo board surrounding.Its manufacturing step is main are as follows: the configuration of 1 glue；The configuration of 2 mixtures；Electronic-grade glass silk or electron level basalt fibre silk are added in glue after heating melting mixture is added to be melt into and pour liquid by 3；4 molten liquids, which pour to be formed, pours building body；It 5 bamboo boards and pours building body and is pressed into composite wood；7 composite woods spray watertight sealing.Advantage is that each aspect of the present invention mechanical performance is better than traditional PC plate, and fire protecting performance is preferable, low thermal expansion.

Description

A kind of NEW TYPE OF COMPOSITE polymer floor
Technical field
The present invention relates to macromolecule building materials technology field, in particular to a kind of NEW TYPE OF COMPOSITE polymer floor.
Background technique
With the development of Polymer Technology, high molecular material is gradually available for building materials or other related fields, and conduct The plastics of high molecular synthetic material are abundant with its principle, manufacture is easy, low in cost, specific strength is big, and the spies such as acid-proof alkaline Point is increasingly becoming one of building materials market new material.And existing many floors are all pure bamboo boards, expend trees material It does not say, stiffness and strength are all lower, and its hardness is low, therefore easy to wear, and heat resistance is poor, are easy to produce thermal expansion.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of good mechanical property, that intensity is high, peel strength is big is novel multiple Close polymer floor and its manufacturing method.
The technical solution of the present invention is as follows:
A kind of NEW TYPE OF COMPOSITE polymer floor, including building body, several steel wires, bamboo board and watertight sealing are poured, it is described to pour The vertically arranged steel wire of several layers is poured in building body, is bamboo board pouring building body top and bottom, it is described to pour building body and bamboo board The equal packaged water sealant of surrounding.
Further, pour building body to be grouped as by the group of following parts by weight: 50-60 parts of epoxy resin or phenolic resin are hidden 1-2 parts of type electron level cyanamide, 0.05-0.085 parts of methylimidazole, 20-40 parts of dimethylformamide, 65-80 parts of plastic substrate, 10-20 parts of electronic-grade glass silk or electron level basalt fibre silk, magnesium hydroxide or 5-20 parts of aluminium hydroxide, curing 2-4 parts of molybdenum, 2-5 parts of coupling agent.
Further, it pours building body to be grouped as by the group of following parts by weight: 56 parts of phenolic resin, resting form electron level cyanamide 1.5 parts, 0.07 part of methylimidazole, 30 parts of dimethylformamide, 70 parts of plastic substrate, 15 parts of electron level basalt fibre silk, 10 parts of magnesium hydroxide, 3 parts of molybdenum disulfide, 4 parts of coupling agent.
Further, plastic substrate is polyvinyl chloride, polypropylene or polyamide.
The present invention also provides a kind of methods for manufacturing above-mentioned NEW TYPE OF COMPOSITE polymer floor, comprise the following steps that:
(1) epoxy resin or phenolic resin are mixed with resting form electron level cyanamide, methylimidazole, dimethylformamide Glue is made；
(2) plastic substrate, magnesium hydroxide or aluminium hydroxide, molybdenum disulfide, coupling agent are mixed evenly and mixing is made Expect spare；
(3) electronic-grade glass silk or electron level basalt fibre silk are added in glue and are heated to 185-230 DEG C, Mixture is added after molten state to be formed to continue that temperature 10-15min formation melting is kept to pour liquid；
(4) several layers steel wire is set up at vertical direction interval in a template, and melting is poured liquid and pours into template and protects The temperature for holding template, which is allowed to cool after 160-180 DEG C, 5-10min to 50-70 DEG C of formation, pours building body；
(5) two pieces of bamboo boards to match with template size are taken, one side handles to coat acrylic acid gluing behind hair training face Agent；
(6) bamboo board is sent into superposed type press after the processed one side of step 5 is affixed on pours building body upper and lower surface respectively, It is suppressed between 100-150 DEG C, keeps the temperature 50-80min after compacting between 150-160 DEG C and form composite wood；
(7) upper watertight sealing is sprayed in its four side after composite wood is cooling.
Further, building body is poured described in step 6 being all made of acrylic resin retanning agent, its surface is handled.
The invention has the beneficial effects that:
The present invention pours the stiffened wire lath that several layers are spaced apart in vertical direction in pouring building body, and is making Pouring melting in journey still keeps the temperature of template at 160-180 DEG C after liquid pours into template, just allow its nature after 5-10min It cools down, this process can allow stiffened wire lath adequately to incorporate and pour in building body, can also remove melting and pour possibility inside liquid The bubble of generation increases stiffened wire lath and pours the bonding strength of building body, and inside cooling after-pouring body between steel wire Tensile stress can be generated under the action of shrinkage effect so that the present invention have very strong bonding strength and toughness, anti-pressure ability and Warping resistance ability is all greatly improved.
It is fused in glue using mixture, it is then remelted at liquid is poured, due to plastic substrate and epoxy resin or phenolic aldehyde Resin is macromolecular compound, and the gap of molecular level is larger, and talcum powder, wollastonite etc. is added, along with resting form electricity Sub- grade cyanamide, the particle physical aspect of these types of substance commonly reach dispersion under sub-nanometer state and are mounted to original in ultra-fine situation Between the macromolecular chain of material, the synergistic effect for playing physical characteristic is realized, enhance caking property in molecular level, to increase compound The wear-resisting property of plate.
Glue uses epoxy resin or phenolic resin and resting form electron level cyanamide, methylimidazole, dimethyl formyl Then amine mixing electronic-grade glass silk or electron level basalt fibre silk is added in glue again and is heated to 185-230 DEG C, mixture melting is then added, electronic-grade glass silk or electron level basalt fibre silk can increase its intensity And wear-resisting property, glue can then be such that the adhesion strength between this composite material increases, thus increase its intensity and wear resistance, Thermal expansion coefficient is small, and performance is stablized.
It pours building body and is all made of acrylic resin retanning agent and its surface is handled, be black skin by one surface treatment of bamboo board It is affixed on feeding superposed type press after pouring building body upper and lower surface again afterwards, is suppressed between 100-150 DEG C, in 150-160 after compacting 50-80min is kept the temperature between DEG C and forms composite wood, and bamboo board can be enhanced in this way and pour the peel strength of building body, composite wood is cooling Waterproof performance of the invention can also be increased by spraying upper watertight sealing in its four side afterwards.
Detailed description of the invention
Fig. 1 is schematic structural view of the invention；
Fig. 2 is the Section A-A structural schematic diagram in Fig. 1.
In figure: 1- pours building body, 2- steel wire, 3- bamboo board, 4- watertight sealing.
Specific embodiment
Specific embodiments of the present invention will be further explained with reference to the accompanying drawing.It should be noted that for The explanation of these embodiments is used to help understand the present invention, but and does not constitute a limitation of the invention.In addition, disclosed below The each embodiment of the present invention involved in technical characteristic can be combined with each other as long as they do not conflict with each other.
It is as shown in Figs. 1-2:
Embodiment 1:
Prepare the following material for pouring building body: epoxy resin or 50 parts of phenolic resin, 1 part of resting form electron level cyanamide, diformazan 0.085 part of base imidazoles, 40 parts of dimethylformamide, 65 parts of polyvinyl chloride, 10 parts of electronic-grade glass silk, magnesium hydroxide 20 Part, 4 parts of molybdenum disulfide, 2 parts of coupling agent.
Manufacturing process is as follows:
(1) epoxy resin and resting form electron level cyanamide, methylimidazole, dimethylformamide are mixed and made into glue；
(2) polyvinyl chloride, magnesium hydroxide, molybdenum disulfide, coupling agent be mixed evenly to that mixture is made is spare；
(3) electronic-grade glass silk is added in glue and be heated to 185 DEG C, be added after molten state to be formed mixture after Continuation of insurance holds temperature 10-15min formation melting and pours liquid；
(4) several layers steel wire is set up at vertical direction interval in a template, and melting is poured liquid and pours into template and protects The temperature for holding template, which is allowed to cool after 160 DEG C, 5-10min to 60 DEG C of formation, pours building body；
(5) two pieces of bamboo boards to match with template size are taken, one side handles to coat acrylic acid gluing behind hair training face Agent；
(6) it pours building body and is all made of acrylic resin retanning agent and its surface is handled, bamboo board is processed through step 5 One side be affixed on respectively pour building body upper and lower surface after be sent into superposed type press, suppressed at 120 DEG C, after compacting 155 DEG C it Between heat preservation 50-80min formed composite wood；
(7) upper watertight sealing is sprayed in its four side after composite wood is cooling.
Embodiment 2:
Prepare the following material for pouring building body: epoxy resin or 60 parts of phenolic resin, 2 parts of resting form electron level cyanamide, diformazan 0.05 part of base imidazoles, 20 parts of dimethylformamide, 80 parts of polypropylene, 20 parts of electron level basalt fibre silk, 5 parts of aluminium hydroxide, 2 parts of molybdenum disulfide, 5 parts of coupling agent.
Manufacturing process is as follows:
(1) epoxy resin and resting form electron level cyanamide, methylimidazole, dimethylformamide are mixed and made into glue；
(2) polypropylene, aluminium hydroxide, molybdenum disulfide, coupling agent be mixed evenly to that mixture is made is spare；
(3) electron level basalt fibre silk is added in glue and is heated to 200 DEG C, mixture is added after molten state to be formed Continue that temperature 10-15min formation melting is kept to pour liquid；
(4) several layers steel wire is set up at vertical direction interval in a template, and melting is poured liquid and pours into template and protects The temperature for holding template, which is allowed to cool after 170 DEG C, 5-10min to 50 DEG C of formation, pours building body；
(5) two pieces of bamboo boards to match with template size are taken, one side handles to coat acrylic acid gluing behind hair training face Agent；
(6) it pours building body and is all made of acrylic resin retanning agent and its surface is handled, bamboo board is processed through step 5 One side be affixed on respectively pour building body upper and lower surface after be sent into superposed type press, suppressed at 130 DEG C, after compacting 160 DEG C it Between heat preservation 50-80min formed composite wood；
(7) upper watertight sealing is sprayed in its four side after composite wood is cooling.
Embodiment 3:
Prepare the following material for pouring building body: 56 parts of phenolic resin, 1.5 parts of resting form electron level cyanamide, methylimidazole 0.07 part, 30 parts of dimethylformamide, 70 parts of polyamide, 15 parts of electron level basalt fibre silk, 10 parts of magnesium hydroxide, curing 3 parts of molybdenum, 4 parts of coupling agent.
Manufacturing process is as follows:
(1) phenolic resin and resting form electron level cyanamide, methylimidazole, dimethylformamide are mixed and made into glue；
(2) polyamide, magnesium hydroxide, molybdenum disulfide, coupling agent be mixed evenly to that mixture is made is spare；
(3) electron level basalt fibre silk is added in glue and is heated to 230 DEG C, mixture is added after molten state to be formed Continue that temperature 10-15min formation melting is kept to pour liquid；
(4) several layers steel wire is set up at vertical direction interval in a template, and melting is poured liquid and pours into template and protects The temperature for holding template, which is allowed to cool after 180 DEG C, 5-10min to 70 DEG C of formation, pours building body；
(5) two pieces of bamboo boards to match with template size are taken, one side handles to coat acrylic acid gluing behind hair training face Agent；
(6) bamboo board is sent into superposed type press after the processed one side of step 5 is affixed on pours building body upper and lower surface respectively, It is suppressed at 140 DEG C, keeps the temperature 50-80min after compacting between 150 DEG C and form composite wood；
(7) upper watertight sealing is sprayed in its four side after composite wood is cooling.
Technological parameter and its experimental data:
Table 1 (each embodiment superposed type press rolls combination process parameter)
Embodiment 1 Embodiment 2 Embodiment 3
Acrylic resin retanning agent surface treatment Processing Processing It is untreated
Acrylic acid adhesive spread 45 50 55
Press temperature DEG C 120 130 140
Rolling pressure kgf/cm2 8 6 7.5
Rolling speed rmp 600 650 700
Table 2 (dependence test experimental data (referring to GBT1767))
It can analyze and obtain from above-mentioned data, compared to PC plate traditional on the market, each aspect of the present invention mechanical performance Better than traditional PC plate, fire protecting performance is preferable, low thermal expansion.It is mechanical after being surface-treated using acrylic resin retanning agent Aspect of performance is relative to the untreated improvement that can be obtained slightly.
In conjunction with attached drawing, the embodiments of the present invention are described in detail above, but the present invention is not limited to described implementations Mode.For a person skilled in the art, in the case where not departing from the principle of the invention and spirit, to these embodiments A variety of change, modification, replacement and modification are carried out, are still fallen in protection scope of the present invention.

Claims (6)

1. a kind of NEW TYPE OF COMPOSITE polymer floor, including pour building body (1), several steel wires (2), bamboo board (3) and watertight sealing (4), it is characterised in that: described pour pours the vertically arranged steel wire of several layers (2) in building body (1), pouring building body (1) top and bottom It is bamboo board (3), it is described to pour building body (1) and the equal packaged water sealant (4) of bamboo board (3) surrounding.
2. NEW TYPE OF COMPOSITE polymer floor according to claim 1, which is characterized in that the building body (1) of pouring is by following heavy The group of amount part is grouped as: epoxy resin or 50-60 parts of phenolic resin, 1-2 parts of resting form electron level cyanamide, methylimidazole 0.05-0.085 parts, 20-40 parts of dimethylformamide, 65-80 parts of plastic substrate, electronic-grade glass silk or electron level are profound 5-20 parts of 10-20 parts of military rock fiber filament, magnesium hydroxide or aluminium hydroxide, 2-4 parts of molybdenum disulfide, 2-5 parts of coupling agent.
3. NEW TYPE OF COMPOSITE polymer floor according to claim 2, which is characterized in that the building body (1) of pouring is by following heavy The group of amount part is grouped as: 56 parts of phenolic resin, 1.5 parts of resting form electron level cyanamide, 0.07 part of methylimidazole, dimethyl formyl 30 parts of amine, 70 parts of plastic substrate, 15 parts of electron level basalt fibre silk, 10 parts of magnesium hydroxide, 3 parts of molybdenum disulfide, coupling agent 4 Part.
4. NEW TYPE OF COMPOSITE polymer floor according to claim 2 or 3, it is characterised in that: the plastic substrate is polychlorostyrene Ethylene, polypropylene or polyamide.
5. a kind of method for manufacturing NEW TYPE OF COMPOSITE polymer floor as described in any one of claims 1-3, which is characterized in that packet Include following processing step:
(1) epoxy resin or phenolic resin are mixed with resting form electron level cyanamide, methylimidazole, dimethylformamide Glue；
(2) plastic substrate, magnesium hydroxide or aluminium hydroxide, molybdenum disulfide, coupling agent be mixed evenly to that mixture is made is standby With；
(3) electronic-grade glass silk or electron level basalt fibre silk are added in glue and are heated to 185-230 DEG C, to shape At mixture is added after molten state continue that temperature 10-15min formation melting is kept to pour liquid；
(4) several layers steel wire is set up at vertical direction interval in a template, and melting is poured liquid and pours into template and keeps mould The temperature of plate is allowed to cool to 50-70 DEG C of formation after 160-180 DEG C, 5-10min and pours building body；
(5) two pieces of bamboo boards to match with template size are taken, one side handles to coat acrylic acid adhesive behind hair training face；
(6) bamboo board is sent into superposed type press after the processed one side of step 5 is affixed on pours building body upper and lower surface respectively, It is suppressed between 100-150 DEG C, keeps the temperature 50-80min after compacting between 150-160 DEG C and form composite wood；
(7) upper watertight sealing is sprayed in its four side after composite wood is cooling.
6. the method for manufacture NEW TYPE OF COMPOSITE polymer floor according to claim 5, it is characterised in that: described in step 6 Building body of pouring be all made of acrylic resin retanning agent its surface handled.
CN201810709817.4A 2018-07-02 2018-07-02 Novel composite polymer floor Expired - Fee Related CN109049889B (en)

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CN112848531A (en) * 2021-03-09 2021-05-28 无锡双象光电材料有限公司 Novel high-strength polymethyl methacrylate composite board

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