CN109049376B - Semiconductor wafer cutting device and working method thereof - Google Patents
Semiconductor wafer cutting device and working method thereof Download PDFInfo
- Publication number
- CN109049376B CN109049376B CN201811101578.0A CN201811101578A CN109049376B CN 109049376 B CN109049376 B CN 109049376B CN 201811101578 A CN201811101578 A CN 201811101578A CN 109049376 B CN109049376 B CN 109049376B
- Authority
- CN
- China
- Prior art keywords
- positioning rods
- rod
- positioning
- tray
- sliding rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
Abstract
A semiconductor wafer dicing apparatus and a method of operating the same. Relates to the technical field of semiconductor manufacturing, in particular to a wafer cutting device and a working method thereof. The semiconductor wafer cutting device is simple in structure, reliable in scribing and capable of reducing the risk of back collapse and the working method of the semiconductor wafer cutting device are provided. The cutting device comprises an upright frame, a supporting component, a cutting component and a positioning component, wherein the upright frame is n-shaped and is provided with a transverse plate and a pair of upright plates which are arranged in parallel; the supporting component is arranged in the vertical frame and is positioned below the transverse plate, and comprises a base, wherein a tray for placing wafers is arranged on the base, and the tray is rotatably and movably connected to the base; the winding mechanism comprises a motor and a winding shaft, the motor is arranged at the transverse end of the supporting frame, the winding shaft is driven by the motor, and the top ends of the positioning rods are connected with the winding shaft through pull ropes respectively. The invention is convenient to process and reliable in operation.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a wafer cutting device and a working method thereof.
Background
In semiconductor manufacturing applications, wafer dicing is essential, and the dicing quality of a semiconductor wafer directly determines whether a semiconductor is acceptable. In the processing of small signal products, after the front process and the middle test are finished, the dies are required to be separated before being sent to package, and the dicing process is required to be formulated for different products due to the epitaxial wafer and the back metal process; the smaller the die, the greater the stress, and the stress of the chip needs to be relieved during dicing, thereby reducing the risk of backfin.
In the prior art, cutting is usually carried out by rotating once as shown in fig. 8-9, the cutting interval is the width of the crystal grain, thus the abnormal rate can reach 50-60%, the quality of the product is reduced, and the cost is high.
Disclosure of Invention
Aiming at the problems, the invention provides the semiconductor wafer cutting device with simple structure, reliable scribing and reduced back collapse risk and the working method thereof.
The technical scheme of the invention is as follows: comprises a vertical frame, a supporting component, a cutting component and a positioning component,
the vertical frame is n-shaped and is provided with a transverse plate and a pair of vertical plates which are arranged in parallel;
the supporting component is arranged in the vertical frame and is positioned below the transverse plate, and comprises a base, wherein a tray for placing wafers is arranged on the base, and the tray is rotatably and movably connected to the base;
the cutting assembly comprises a hydraulic cylinder, a sliding rod and a cutting head, wherein the hydraulic cylinder is arranged on a transverse plate, a sliding groove is formed in the transverse plate, the sliding rod is in a cross shape and is provided with a vertical rod and a transverse rod, the vertical rod is positioned in the sliding groove, the transverse rod is positioned on the transverse plate, the cutting head is connected with the vertical rod through a supporting rod, and the cutting head is positioned between the transverse plate and a wafer;
the positioning assembly comprises a supporting frame, a plurality of positioning rods and a winding mechanism, wherein the supporting frame is n-shaped and is provided with a transverse end and a pair of vertical ends, the supporting frame is arranged on a transverse plate, the sliding rods are positioned below the transverse end of the supporting frame, the transverse end of the supporting frame is provided with a plurality of through holes, the positioning rods are arranged in the through holes in a one-to-one correspondence manner, the positioning rods are in an inverted T shape, and the interval between every two adjacent positioning rods is the width of a crystal grain;
the winding mechanism comprises a motor and a winding shaft, the motor is arranged at the transverse end of the supporting frame, the winding shaft is driven by the motor, and the top ends of the positioning rods are connected with the winding shaft through pull ropes respectively.
The base is provided with a containing groove, a rotating motor which is vertically arranged is arranged in the containing groove, and a driving shaft of the rotating motor is connected with the tray.
The cross section of the tray is U-shaped.
The height of the wafer is higher than that of the accommodating groove in the middle of the tray.
A working method of a semiconductor wafer cutting device comprises the following steps:
s1, placing a wafer in a tray;
s2, setting a reference I, namely, contacting a first positioning rod through a sliding rod, wherein the distance between adjacent positioning rods is 2 times of the grain width, and driving the positioning rods to sequentially realize positioning of the sliding rod through a rope winding in a winding mechanism;
the hydraulic cylinder drives a cutting head on the slide bar to cut;
s3, the tray drives the wafer to rotate 90 degrees anticlockwise, and the positioning rods are reset;
s4, setting a reference I, namely, contacting a first positioning rod through a sliding rod, wherein the distance between adjacent positioning rods is 2 times of the grain width, and driving the positioning rods to sequentially realize positioning of the sliding rod through a winding rope in a winding mechanism;
the hydraulic cylinder drives a cutting head on the slide bar to cut;
s5, the tray drives the wafer to rotate 90 degrees anticlockwise, and the positioning rods are reset;
s6, setting a second reference, namely contacting a second positioning rod through a sliding rod, wherein the distance between adjacent positioning rods is 2 times of the grain width, and driving the positioning rods to sequentially realize positioning of the sliding rods through a rope winding in a winding mechanism;
the hydraulic cylinder drives a cutting head on the slide bar to cut;
s7, the tray drives the wafer to rotate 90 degrees anticlockwise, and the positioning rods are reset;
s8, setting a second reference, namely contacting a second positioning rod through a sliding rod, wherein the distance between adjacent positioning rods is 2 times of the grain width, and driving the positioning rods to sequentially realize positioning of the sliding rod through a rope winding in a winding mechanism;
the hydraulic cylinder drives a cutting head on the slide bar to cut;
s9, cutting is completed.
In operation, the wafer is placed on the tray of the supporting component, and the wafer can be cut in different directions conveniently through the rotation action of the tray; when the cutting assembly acts, the hydraulic cylinder pushes the slide rod, and the cutting head on the slide rod cuts the wafer; when the slide bar slides, the slide bar is positioned by a positioning rod in the positioning assembly;
the motor drives the stay ropes on the winding shafts to sequentially pull the positioning rods at different positions, so that the sliding rods can gradually advance, and reliable cutting action is performed.
The invention is convenient to process and reliable in operation.
Drawings
Figure 1 is a schematic view of the structure of the present invention,
figure 2 is a schematic view of the structure of the positioning rod and the bracket,
figure 3 is a schematic diagram II of the structure of the positioning rod and the bracket,
figure 4 is a schematic view of the cutting of the present invention-one,
figure 5 is a second schematic view of the cutting of the present invention,
figure 6 is a schematic view of a cut of the present invention in three,
figure 7 is a schematic drawing of a cut of the present invention,
figure 8 is a prior art cutting schematic diagram-one,
FIG. 9 is a prior art cut schematic diagram II;
in the figure, 1 is a vertical frame, 11 is a transverse plate, 110 is a sliding groove, 12 is a vertical plate,
21 is a susceptor, 22 is a tray, 23 is a rotary motor, 24 is a wafer,
31 is a hydraulic cylinder, 32 is a slide bar, 321 is a vertical bar, 322 is a cross bar, 33 is a cutting head, 34 is a support bar,
41 is a bracket, 411 is a transverse end, 4110 is a through hole, 412 is a vertical end, 42 is a positioning rod, 43 is a motor, 44 is a winding shaft, 45 is a pull rope,
a is the grain width, b is the double step width;
the arrows inside the wafer in the figure represent the dicing direction, and the arrows outside the wafer represent the rotation direction.
Detailed Description
The invention is shown in fig. 1-7, and comprises a vertical frame 1, a supporting component, a cutting component and a positioning component,
the vertical frame 1 is n-shaped and is provided with a transverse plate 11 and a pair of vertical plates 12 which are arranged in parallel;
the supporting component is arranged in the vertical frame and positioned below the transverse plate, and comprises a base 21, a tray 22 for placing a wafer 24 is arranged on the base, and the tray is rotatably and movably connected to the base;
the cutting assembly comprises a hydraulic cylinder 31, a sliding rod 32 and a cutting head 33, wherein the hydraulic cylinder 31 is arranged on a transverse plate 11, a sliding groove 110 is formed in the transverse plate, the sliding rod is in a cross shape and is provided with a vertical rod 321 and a transverse rod 322, the vertical rod is positioned in the sliding groove, the transverse rod is positioned on the transverse plate, the cutting head 33 is connected with the vertical rod through a supporting rod 34, and the cutting head is positioned between the transverse plate and a wafer; the sliding rod is in a cross shape, so that the sliding rod is convenient to position, and is reliably and slidably connected in the sliding groove;
the positioning assembly comprises a support 41, a plurality of positioning rods 42 and a winding mechanism, wherein the support is n-shaped and is provided with a transverse end 411 and a pair of vertical ends 412, the support is arranged on a transverse plate, the sliding rod is positioned below the transverse end of the support, the transverse end of the support is provided with a plurality of through holes 4110, the positioning rods are arranged in the through holes in a one-to-one correspondence manner, and the positioning rods are in an inverted T shape and are arranged in an inverted T shape, so that the positioning rods can be reliably positioned in the through holes; the positioning rod contacts the sliding rod on one hand to position the sliding rod; on the other hand, the positioning rod is lifted so as to facilitate the movement of the sliding rod; the spacing between adjacent positioning rods is the grain width;
the winding mechanism comprises a motor 43 and a winding shaft 44, the motor is arranged at the transverse end of the support frame, the motor drives the winding shaft, and the top ends of the positioning rods are connected with the winding shaft through pull ropes 45 respectively.
In operation, the wafer is placed on the tray of the supporting component, and the wafer can be cut in different directions conveniently through the rotation action of the tray; when the cutting assembly acts, the hydraulic cylinder pushes the slide rod, and the cutting head on the slide rod cuts the wafer; when the slide bar slides, the slide bar is positioned by a positioning rod in the positioning assembly;
the motor drives the stay ropes on the winding shafts to sequentially pull the positioning rods at different positions, so that the sliding rods can gradually advance, and reliable cutting action is performed.
The base is provided with a containing groove, a rotating motor 23 which is vertically arranged is arranged in the containing groove, and a driving shaft of the rotating motor is connected with the tray.
The wafer is driven to rotate through the rotation action of the rotating motor, and the subsequent cutting action is facilitated.
The cross section of the tray 22 is U-shaped. Therefore, the wafer is reliably arranged in the tray, and the positioning is reliable.
The height of the wafer is higher than that of the accommodating groove in the middle of the tray. The wafer placement and the advance are convenient, and the operation is reliable.
A working method of a semiconductor wafer cutting device comprises the following steps:
s1, placing a wafer in a tray;
s2, setting a reference I, namely, enabling the sliding rods to contact the first positioning rods, enabling the distance between the adjacent positioning rods to be 2 times of the grain width a (in this way, taking down the positioning rods in the middle of the adjacent positioning rods to form a double step width b), and enabling the positioning rods to be driven by ropes in the winding mechanism to sequentially realize positioning of the sliding rods;
the hydraulic cylinder drives a cutting head on the slide bar to cut;
s3, the tray drives the wafer to rotate 90 degrees anticlockwise, and the positioning rods are reset;
s4, setting a reference I, namely, contacting a first positioning rod through a sliding rod, wherein the distance between adjacent positioning rods is 2 times of the grain width (in this way, the positioning rod in the middle of the adjacent positioning rods is taken down), and driving the positioning rods to sequentially realize the positioning of the sliding rod through a rope winding in a winding mechanism;
the hydraulic cylinder drives a cutting head on the slide bar to cut;
s5, the tray drives the wafer to rotate 90 degrees anticlockwise, and the positioning rods are reset;
s6, setting a second reference, namely contacting a second positioning rod through a sliding rod, wherein the distance between adjacent positioning rods is 2 times of the grain width (in this way, the positioning rod in the middle of the adjacent positioning rods is taken down), and driving the positioning rods to sequentially position the sliding rod through a rope winding in a winding mechanism;
the hydraulic cylinder drives a cutting head on the slide bar to cut;
s7, the tray drives the wafer to rotate 90 degrees anticlockwise, and the positioning rods are reset;
s8, setting a second reference, namely contacting a second positioning rod through a sliding rod, wherein the distance between adjacent positioning rods is 2 times of the grain width (in this way, the positioning rod in the middle of the adjacent positioning rods is taken down), and driving the positioning rods to sequentially position the sliding rod through a rope winding in a winding mechanism;
the hydraulic cylinder drives a cutting head on the slide bar to cut;
s9, cutting is completed.
According to the invention, by adopting a double-step cutting mode, the stress is fully released, the cutting speed is improved, the back collapse risk is reduced, the abnormal rate of the product can be controlled below 5%, and the cost is reduced.
Claims (5)
1. A semiconductor wafer cutting device is characterized by comprising a stand, a supporting component, a cutting component and a positioning component,
the vertical frame is n-shaped and is provided with a transverse plate and a pair of vertical plates which are arranged in parallel;
the supporting component is arranged in the vertical frame and is positioned below the transverse plate, and comprises a base, wherein a tray for placing wafers is arranged on the base, and the tray is rotatably and movably connected to the base;
the cutting assembly comprises a hydraulic cylinder, a sliding rod and a cutting head, wherein the hydraulic cylinder is arranged on a transverse plate, a sliding groove is formed in the transverse plate, the sliding rod is in a cross shape and is provided with a vertical rod and a transverse rod, the vertical rod is positioned in the sliding groove, the transverse rod is positioned on the transverse plate, the cutting head is connected with the vertical rod through a supporting rod, and the cutting head is positioned between the transverse plate and a wafer;
the positioning assembly comprises a supporting frame, a plurality of positioning rods and a winding mechanism, wherein the supporting frame is n-shaped and is provided with a transverse end and a pair of vertical ends, the supporting frame is arranged on a transverse plate, the sliding rods are positioned below the transverse end of the supporting frame, the transverse end of the supporting frame is provided with a plurality of through holes, the positioning rods are arranged in the through holes in a one-to-one correspondence manner, the positioning rods are in an inverted T shape, and the interval between every two adjacent positioning rods is the width of a crystal grain;
the winding mechanism comprises a motor and a winding shaft, the motor is arranged at the transverse end of the supporting frame, the winding shaft is driven by the motor, and the top ends of the positioning rods are connected with the winding shaft through pull ropes respectively.
2. The semiconductor wafer dicing apparatus according to claim 1, wherein the susceptor is provided with a receiving groove, a vertically arranged rotary motor is provided in the receiving groove, and a driving shaft of the rotary motor is connected to the tray.
3. The semiconductor wafer dicing apparatus of claim 1, wherein the tray has a U-shaped cross section.
4. A semiconductor wafer dicing apparatus according to claim 3, wherein the wafer has a height higher than that of the tray middle accommodating groove.
5. A method of operating the semiconductor wafer dicing apparatus of claim 1, comprising the steps of:
s1, placing a wafer in a tray;
s2, setting a reference I, namely, contacting a first positioning rod through a sliding rod, taking down the positioning rods in the middle of adjacent positioning rods, wherein the distance between the adjacent positioning rods is 2 times of the width of crystal grains, and driving the positioning rods to sequentially position the sliding rod through a winding rope in a winding mechanism;
the hydraulic cylinder drives a cutting head on the slide bar to cut;
s3, the tray drives the wafer to rotate 90 degrees anticlockwise, and the positioning rods are reset;
s4, setting a reference I, namely, contacting a first positioning rod through a sliding rod, taking down the positioning rods in the middle of adjacent positioning rods, wherein the distance between the adjacent positioning rods is 2 times of the width of crystal grains, and driving the positioning rods to sequentially position the sliding rod through a winding rope in a winding mechanism;
the hydraulic cylinder drives a cutting head on the slide bar to cut;
s5, the tray drives the wafer to rotate 90 degrees anticlockwise, and the positioning rods are reset;
s6, setting a second reference, namely, contacting a second positioning rod through a sliding rod, taking down the positioning rods in the middle of the adjacent positioning rods, wherein the distance between the adjacent positioning rods is 2 times of the grain width, and driving the positioning rods to sequentially position the sliding rod through a winding rope in a winding mechanism;
the hydraulic cylinder drives a cutting head on the slide bar to cut;
s7, the tray drives the wafer to rotate 90 degrees anticlockwise, and the positioning rods are reset;
s8, setting a second reference, namely, contacting a second positioning rod through a sliding rod, taking down the positioning rods in the middle of the adjacent positioning rods, wherein the distance between the adjacent positioning rods is 2 times of the grain width, and driving the positioning rods to sequentially position the sliding rod through a winding rope in a winding mechanism;
the hydraulic cylinder drives a cutting head on the slide bar to cut;
s9, cutting is completed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811101578.0A CN109049376B (en) | 2018-09-20 | 2018-09-20 | Semiconductor wafer cutting device and working method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811101578.0A CN109049376B (en) | 2018-09-20 | 2018-09-20 | Semiconductor wafer cutting device and working method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109049376A CN109049376A (en) | 2018-12-21 |
| CN109049376B true CN109049376B (en) | 2023-07-21 |
Family
ID=64763266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811101578.0A Active CN109049376B (en) | 2018-09-20 | 2018-09-20 | Semiconductor wafer cutting device and working method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109049376B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1770411A (en) * | 2004-11-05 | 2006-05-10 | 日月光半导体制造股份有限公司 | Method for making packaging structure by cutting wafer back |
| TW200741973A (en) * | 2005-08-26 | 2007-11-01 | Dynatex Internat | Method and apparatus for breaking semiconductor wafers |
| CN204621370U (en) * | 2015-02-12 | 2015-09-09 | 鞍山盛雄激光设备有限公司 | A kind of Semi-automatic wafer scribing cut-off machine of many |
| CN105345856A (en) * | 2015-11-04 | 2016-02-24 | 西安交通大学 | Slicing device capable of adjusting thickness |
| CN106425799A (en) * | 2016-08-29 | 2017-02-22 | 彭满意 | Stable industrial aluminum material cutting device |
| CN209566366U (en) * | 2018-09-20 | 2019-11-01 | 扬州扬杰电子科技股份有限公司 | Semiconductor crystal wafer cutter device |
-
2018
- 2018-09-20 CN CN201811101578.0A patent/CN109049376B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1770411A (en) * | 2004-11-05 | 2006-05-10 | 日月光半导体制造股份有限公司 | Method for making packaging structure by cutting wafer back |
| TW200741973A (en) * | 2005-08-26 | 2007-11-01 | Dynatex Internat | Method and apparatus for breaking semiconductor wafers |
| CN204621370U (en) * | 2015-02-12 | 2015-09-09 | 鞍山盛雄激光设备有限公司 | A kind of Semi-automatic wafer scribing cut-off machine of many |
| CN105345856A (en) * | 2015-11-04 | 2016-02-24 | 西安交通大学 | Slicing device capable of adjusting thickness |
| CN106425799A (en) * | 2016-08-29 | 2017-02-22 | 彭满意 | Stable industrial aluminum material cutting device |
| CN209566366U (en) * | 2018-09-20 | 2019-11-01 | 扬州扬杰电子科技股份有限公司 | Semiconductor crystal wafer cutter device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109049376A (en) | 2018-12-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| AU2020389903B2 (en) | Integrated feeding and cutting device for regular long strip-shaped materials | |
| CN109773993B (en) | Crystal bar cutting method using multi-section semiconductor crystal bar cutting machine | |
| CN109049376B (en) | Semiconductor wafer cutting device and working method thereof | |
| JP2020031620A (en) | Pineapple cutting device and method | |
| JP2013208073A (en) | Method and apparatus for piling up seedling container | |
| JP5792118B2 (en) | Vegetable centering and cutting equipment | |
| CN209566366U (en) | Semiconductor crystal wafer cutter device | |
| CN112701059A (en) | Wafer defect detector for semiconductor production | |
| JP5759361B2 (en) | Band saw machine and control method of band saw machine | |
| JP4972214B1 (en) | Vegetable centering and cutting equipment | |
| CN106787481B (en) | Miniature motor end cover lead wire kludge | |
| CN114160699B (en) | Manufacturing process for manufacturing tank body | |
| KR20110029787A (en) | Apparatus capable of cutting ingot | |
| CN107053504B (en) | Wire cutting equipment and wire cutting method | |
| CN206635221U (en) | Disconnected device is broken in a kind of glass-cutting | |
| CN206748777U (en) | Double-deck linear cutting equipment | |
| JP2002011536A (en) | Lead cutting mechanism and lead cutting device | |
| CN220592317U (en) | Tubular pile splitting and assembling mechanism | |
| CN219686177U (en) | Wire cutting equipment | |
| CN215661156U (en) | Block material cutting device and cutting equipment | |
| CN114734319B (en) | Semiconductor material processing system and method | |
| CN219466629U (en) | Monocrystalline silicon rod clamping mechanism | |
| CN219686168U (en) | Cutting device and wire cutting equipment | |
| CN211709747U (en) | Automatic feeding device for crystal silicon | |
| CN214956786U (en) | Novel automatic silicon chip splitting machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |