CN109047977B - Environment-friendly flue gas treatment device for PCB soldering tin - Google Patents
Environment-friendly flue gas treatment device for PCB soldering tin Download PDFInfo
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- CN109047977B CN109047977B CN201810807289.6A CN201810807289A CN109047977B CN 109047977 B CN109047977 B CN 109047977B CN 201810807289 A CN201810807289 A CN 201810807289A CN 109047977 B CN109047977 B CN 109047977B
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- soldering tin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
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Abstract
The invention discloses an environment-friendly flue gas treatment device for PCB soldering tin, which comprises a device body, wherein the device body is provided with a support frame, the inner side of the support frame is provided with a containing cavity, a soldering tin chamber is arranged above the support frame, a soldering tin furnace is arranged in the containing cavity, a PCB mounting plate is arranged in the soldering tin chamber, the top of the inner side of the soldering tin chamber is provided with a smoke guide hood, an activated carbon adsorption cavity is arranged in the smoke guide hood, and the device body is provided with a flue gas treatment chamber. The device ensures the stability of the installation of the PCB through the movable installation structure, avoids soldering tin liquid caused by misoperation from splashing on hands, improves the safety performance, effectively treats harmful ingredients in smoke through adsorption and dust removal treatment on the smoke, improves the working environment to a great extent, and has the advantages that the device body adsorbs and removes dust to the smoke through a closed structure, so that workers are prevented from sucking harmful smoke for a long time, the working environment is ensured, the health of the workers is prevented from being damaged, and the environmental protection is good.
Description
Technical Field
The invention relates to the field of environmental protection, in particular to an environment-friendly flue gas treatment device for PCB soldering tin.
Background
PCB circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components. Its development has been over 100 years old; the design of the method is mainly layout design; the circuit board has the main advantages of greatly reducing errors of wiring and assembly, and improving the automation level and the production labor rate.
The circuit board can be divided into a single-sided board, a double-sided board, a four-layer board, a six-layer board and other multi-layer circuit boards according to the number of the layers of the circuit board.
Since printed circuit boards are not typical end products, they are somewhat confusing in the definition of names such as: the motherboard for a personal computer is called a motherboard and cannot be directly called a circuit board, and although the circuit board exists in the motherboard, the motherboard is different from the motherboard, so that the two aspects cannot be said to be the same when evaluating the industry. For another example: because of the integrated circuit components mounted on the circuit board, the news media is called an IC board, but it is not substantially identical to a printed circuit board. By printed circuit board we generally say bare board-i.e. a circuit board without upper components.
The electric elements on the PCB need to be fixed above the PCB in a soldering tin mode, the existing soldering tin modes are of two types, firstly, the soldering tin wires are welded on pins of the electric elements on the circuit board by using electric soldering irons, but the mode is not applicable to mass production, and the other mode is used for immersing all the pins on the bottom surface of the PCB into soldering tin liquid, so that the soldering tin is realized in the mode, and the mode has wider application range. However, this soldering method has several disadvantages:
1. the PCB board is held to the hand during soldering tin and immerse it in the soldering tin liquid, and this kind of mode appears holding unstably easily, and the PCB board drops in the soldering tin liquid, causes scrapping phenomenon.
2. The careless operation of soldering tin easily causes the soldering tin liquid to splash on hands or bodies, and scalds appear.
3. The most serious problem is that the existing soldering tin mode is not environment-friendly, because the soldering tin operation chamber is directly exposed in the operation environment, the smoke of the soldering tin is easily inhaled by human bodies, and the phenomena of respiratory tract infection or heavy metal poisoning occur, so the operation environment is very poor.
In view of the above disadvantages, improvements are needed.
Disclosure of Invention
The invention aims to provide an environment-friendly flue gas treatment device for PCB soldering tin, which aims to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme:
an environment-friendly flue gas treatment device for PCB soldering tin comprises a device body, wherein the device body is provided with a support frame, the inner side of the support frame is provided with a containing cavity, the containing cavity is fixedly connected with the support frame through the action of screws, a soldering tin chamber is arranged above the support frame and is fixedly connected with the support frame, the inside of the soldering tin chamber is mutually communicated with the inside of the containing cavity, a soldering tin furnace is arranged in the containing cavity, a PCB mounting plate is arranged in the soldering tin chamber, the left end of the PCB mounting plate is provided with a sealing plate, the sealing plate is fixedly connected with the PCB mounting plate through the action of a connecting rod, the top of the inner side of the soldering tin chamber is provided with a smoke guide hood, the smoke guide hood is fixedly connected with the inner wall of the soldering tin chamber, the inside of the smoke guide hood is provided with an activated carbon adsorption cavity, and the activated carbon adsorption cavity is fixedly connected with the smoke guide hood through the, the device body sets up the flue gas treatment chamber, the effect that communicating pipe was passed through to the inside of leading petticoat pipe and flue gas treatment chamber communicates each other, the right side bottom of flue gas treatment chamber sets up the pipe of discharging fume, discharge fume the inside of pipe and flue gas treatment chamber and communicate each other, the output of discharging fume the pipe is higher than the topmost of flue gas treatment chamber, the device body sets up the reservoir chamber, effect fixed connection through the screw between reservoir chamber and the support frame, be equipped with the filter core between reservoir chamber and the flue gas treatment chamber, the inside of flue gas treatment chamber and reservoir chamber communicates each other, set up the aqueduct on the inner wall of flue gas treatment chamber, pass through the fix with screw between the inner wall of aqueduct and flue gas treatment chamber, set up the water valve on the terminal surface of aqueduct, the water valve passes through the fix with screw on the aqueduct.
As a further scheme of the invention: the bottom of the soldering tin furnace is provided with a movable support, and the movable support is fixed on the movable support through the action of a screw.
As a further scheme of the invention: the left end of movable support sets up the guide bar, sliding connection between guide bar and the movable support, welded connection between guide bar and the inner wall that holds the chamber, the right-hand member of movable support sets up the threaded rod, be connected through the lead screw formula between threaded rod and the movable support, the threaded rod with hold the chamber or rotate through the effect of bearing between the support frame and be connected, the top of threaded rod sets up shakes the wheel, shake and pass through welded mode fixed connection between wheel and the threaded rod.
As a further scheme of the invention: the right-hand member of PCB board mounting panel sets up the locating pin, fixed connection between the inner wall of locating pin and soldering tin room, the position that corresponds the locating pin on the PCB board mounting panel sets up the slot, mutually support between slot and the locating pin.
As a further scheme of the invention: the PCB mounting plate is provided with a mounting hole, and the mounting hole is formed in the edge of the PCB mounting plate.
As a further scheme of the invention: set up fixing hole on the closing plate, fixing hole communicates the both sides terminal surface of closing plate, the medial surface of closing plate is equipped with the sealing washer, paste through the effect of glue between sealing washer and the closing plate and be connected, the position that corresponds the closing plate on the lateral wall of soldering tin room sets up the installing zone, the intermediate position of installing zone sets up the opening, the PCB board mounting panel passes the opening and installs the inside at the soldering tin room.
As a further scheme of the invention: the mounting area is provided with a fixing column, the fixing column is fixedly connected with the mounting area in a welding mode, and the fixing column corresponds to the fixing through hole in position.
As a further scheme of the invention: the end part of the communicating pipe arranged in the smoke processing chamber is provided with a diffusion cover, the diffusion cover is arranged downwards, and the diffusion cover is communicated with the inside of the communicating pipe.
As a still further scheme of the invention: the water storage chamber is internally provided with a water pump, and the water guide pipe is communicated with the output end of the water pump through the action of a connecting water pipe.
Compared with the prior art, the invention has the beneficial effects that:
1. the installation stability of the PCB is guaranteed through the movable installation structure, and the PCB is prevented from falling due to the fact that the existing handheld mode is unstable in taking.
2. The mode of using the removal solder pot when soldering tin is handled has guaranteed that the PCB board is fixed motionless, has avoided handheld PCB board like this, stops soldering tin liquid that misoperation caused through this kind of mode and spatters in one's hands, has improved the security performance.
3. Through adsorbing the flue gas and removing dust and handle, effectively handle harmful components in the flue gas, to a great extent has improved operational environment, and the device body adsorbs the dust removal to the flue gas through closed structure, avoids doing the long-time harmful flue gas that inhales of staff, has ensured operational environment, avoids haring staff's health, and the feature of environmental protection is good.
Drawings
FIG. 1 is a schematic structural view of an environment-friendly flue gas treatment device for PCB soldering.
FIG. 2 is a schematic view of the structure of the bottom surface of a PCB mounting plate in the environment-friendly flue gas treatment device for PCB soldering.
FIG. 3 is a schematic view of the structure of the sealing plate in the direction A in the environment-friendly flue gas treatment device for PCB soldering.
FIG. 4 is a schematic view of a soldering chamber in a B-direction of an environment-friendly flue gas treatment device for PCB soldering.
In the figure: 1-supporting frame, 2-containing cavity, 3-soldering furnace, 4-movable support, 5-guide rod, 6-threaded rod, 7-rocking wheel, 8-soldering chamber, 9-PCB mounting plate, 10-sealing plate, 11-positioning pin, 12-smoke guide hood, 13-activated carbon adsorption cavity, 15-communicating pipe, 16-diffusion hood, 17-smoke treatment chamber, 18-smoke exhaust pipe, 19-water storage chamber, 20-filter core, 21-water guide pipe, 22-water valve, 23-water pump, 24-connecting water pipe, 25-mounting hole, 26-fixing through hole, 27-sealing ring, 28-through hole, 29-mounting area and 30-fixing column.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
Referring to fig. 1-4, an environment-friendly flue gas treatment device for PCB soldering tin comprises a device body, the device body is provided with a support frame 1, the inner side of the support frame 1 is provided with a containing cavity 2, the containing cavity 2 is fixedly connected with the support frame 1 through the action of screws, a soldering tin chamber 8 is arranged above the support frame 1, the soldering tin chamber 8 is fixedly connected with the support frame 1, the inside of the soldering tin chamber 8 is communicated with the inside of the containing cavity 2, a soldering tin furnace 3 is arranged in the containing cavity 2, the bottom of the soldering tin furnace 3 is provided with a movable support 4, the movable support 4 is fixed on the movable support 4 through the action of screws, the left end of the movable support 4 is provided with a guide rod 5, the guide rod 5 is in sliding connection with the movable support 4, the guide rod 5 is in welding connection with the inner wall of the containing cavity 2, the right end of the movable support 4 is provided with a threaded rod 6, the threaded rod 6 is connected with the movable support 4 in a screw rod type, the threaded rod 6 is rotatably connected with the accommodating cavity 2 or the support frame 1 through the action of a bearing, the top of the threaded rod 6 is provided with a rocking wheel 7, the rocking wheel 7 is fixedly connected with the threaded rod 6 in a welding mode, the interior of the soldering tin chamber 8 is provided with a PCB mounting plate 9, the left end of the PCB mounting plate 9 is provided with a sealing plate 10, the sealing plate 10 is fixedly connected with the PCB mounting plate 9 through the action of a connecting rod, the right end of the PCB mounting plate 9 is provided with a positioning pin 11, the positioning pin 11 is fixedly connected with the inner wall of the soldering tin chamber 8, a slot is arranged on the PCB mounting plate 9 corresponding to the position of the positioning pin 11, the slot is matched with the positioning pin 11, the PCB mounting plate 9 is provided with a mounting hole 25, and the mounting hole 25 is arranged at the edge of, the sealing plate 10 is provided with a fixing through hole 26, the fixing through hole 26 is communicated with the end faces of two sides of the sealing plate 10, the inner side face of the sealing plate 10 is provided with a sealing ring 27, the sealing ring 27 is pasted and connected with the sealing plate 10 under the action of glue, the side wall of the soldering tin chamber 8 is provided with a mounting area 29 corresponding to the position of the sealing plate 10, the middle position of the mounting area 29 is provided with a through hole 28, the PCB mounting plate 9 passes through the through hole 28 and is mounted inside the soldering tin chamber 8, the mounting area 29 is provided with a fixing column 30, the fixing column 30 is fixedly connected with the mounting area 29 in a welding mode, the fixing column 30 corresponds to the fixing through hole 26 in position, the top of the inner side of the soldering tin chamber 8 is provided with a smoke guide hood 12, the smoke guide hood 12 is fixedly connected with the inner wall of the soldering tin chamber 8, the device comprises an activated carbon adsorption cavity 13, a smoke guide hood 12, a diffusion hood 16, a smoke treatment chamber 17, a smoke guide hood 12, a smoke discharge pipe 18, a filter element 20, a smoke discharge pipe 18, a smoke treatment chamber 17, a water storage chamber 19, a smoke treatment chamber 17 and a support frame 1, wherein the activated carbon adsorption cavity 13 is fixedly connected with the smoke guide hood 12 through screws, the smoke guide hood 17 is communicated with the smoke treatment chamber 17 through the screws, the diffusion hood 16 is arranged at the inner end of the smoke treatment chamber 17 and is arranged downwards, the diffusion hood 16 is communicated with the inner part of the communication pipe 15, the smoke discharge pipe 18 is communicated with the inner part of the smoke treatment chamber 17, the output end of the smoke discharge pipe 18 is higher than the topmost end of the smoke treatment chamber 17, the device body is provided with the water storage chamber 19, the water storage chamber 19 is fixedly connected with the support frame 1 through the screws, the filter element 20 is, the water storage chamber 19 is internally provided with a water pump 23, the inner wall of the flue gas treatment chamber 17 is provided with a water guide pipe 21, the water guide pipe 21 and the inner wall of the flue gas treatment chamber 17 are fixed through screws, the end surface of the water guide pipe 21 is provided with a water valve 22, the water valve 22 is fixed on the water guide pipe 21 through screws, the water valve 22 is communicated with the inside of the water guide pipe 21, and the output ends of the water guide pipe 21 and the water pump 23 are communicated with each other through the action of a connecting water pipe 24.
The working principle of the invention is as follows:
the device body is divided into three steps when in use: the first step is PCB board mounting; the second step is soldering tin treatment; the third step is flue gas treatment, the first step is carried out separately from the other two parts, and the second step and the third step are carried out synchronously.
The first step is as follows: and (5) installing the PCB. When the PCB is installed, the PCB is installed on the lower end face of the PCB installation plate 9 under the action of the screw matched with the installation hole 25, an insulating gasket is added between the PCB and the PCB installation plate 9 during installation, then the PCB installation plate 9 is installed inside the soldering tin chamber 8, the right end of the PCB installation plate 9 is aligned to the position of the positioning pin 11 inside the soldering tin chamber 8 during installation of the PCB, the slot at the right end of the PCB installation plate 9 and the positioning pin 11 are mutually spliced, then the installation area 29 of the side wall of the soldering tin chamber 8 is installed with the sealing plate 10, the fixing column 30 is aligned to the fixing through hole 26 during installation and is inserted, and the PCB is installed at the moment.
The installation stability of the PCB is guaranteed through the movable installation structure, and the PCB is prevented from falling due to the fact that the existing handheld mode is unstable in taking.
The second step is that: and (6) soldering. The operation that soldering tin was handled is very simple, the mode of soldering tin has been changed in the time of soldering tin, the mode of current soldering tin is that the soldering tin stove is fixed motionless, with the contact of pin on the PCB board with the inside soldering tin liquid of soldering tin stove, then soldering tin, this place is gone on in reverse, it is motionless to be the PCB board, remove the soldering tin stove, and the soldering tin process is gone on inside soldering tin room 8, keep apart with the human body, wave rocking wheel 7 in the time of soldering tin, drive threaded rod 6 this moment and rotate, because movable support 4 is connected with threaded rod 6 is the lead screw formula, and under the guide effect of guide bar 5, make movable support 4 up move, carry out soldering tin when the contact of soldering tin liquid in the soldering tin stove with the pin on the PCB board, after the completion, reverse rotation rocking wheel 7, move down the soldering tin stove, the soldering tin process is accomplished.
The mode of using the removal solder pot when soldering tin is handled has guaranteed that the PCB board is fixed motionless, has avoided handheld PCB board like this, stops soldering tin liquid that misoperation caused through this kind of mode and spatters in one's hands, has improved the security performance.
The third step: and (4) flue gas treatment. The problem that the most difficult to process during soldering tin is the smoke generated by soldering tin, firstly, the smoke has unpleasant smell, so that a person feels very sharp when breathing, meanwhile, the smoke of soldering tin is toxic, the smoke which inhales soldering tin for a long time is easy to cause respiratory tract infection and even heavy metal poisoning, therefore, the smoke processing device body guides the smoke into the smoke processing chamber 17 through the smoke guide hood 12 for processing, when the smoke enters the smoke guide hood 12, the smoke is subjected to primary adsorption processing through the action of the active carbon adsorption cavity 13, the pungent smell is discharged, then the smoke enters the smoke processing chamber 17 through the communicating pipe 15, the smoke processing chamber 17 keeps water to diffuse through the inlet of the smoke exhaust pipe 18 constantly, the smoke is prevented from directly overflowing, and then the smoke is sprayed through the diffusion hood 16 to enlarge the entering area when the smoke enters the smoke processing chamber 17, meanwhile, the water pump 23 works, water is pumped into the water guide pipe 21 through the water pump 23 and is sprayed out through the water guide pipe 21, dust removal treatment is carried out on the smoke in the smoke treatment chamber 17 during spraying, the discharged smoke is optimized, and finally the smoke is discharged into the air through the smoke discharge pipe 18.
Through adsorbing the flue gas and removing dust and handle, effectively handle harmful components in the flue gas, to a great extent has improved operational environment, and the device body adsorbs the dust removal to the flue gas through closed structure, avoids doing the long-time harmful flue gas that inhales of staff, has ensured operational environment, avoids haring staff's health, and the feature of environmental protection is good.
Although the preferred embodiments of the present patent have been described in detail, the present patent is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present patent within the knowledge of those skilled in the art.
Claims (8)
1. An environment-friendly flue gas treatment device for PCB soldering tin comprises a device body, wherein the device body is provided with a support frame (1), a containing cavity (2) is arranged on the inner side of the support frame (1), the containing cavity (2) is fixedly connected with the support frame (1) through screws, a soldering tin chamber (8) is arranged above the support frame (1), the soldering tin chamber (8) is fixedly connected with the support frame (1), the inside of the soldering tin chamber (8) is mutually communicated with the inside of the containing cavity (2), a soldering tin furnace (3) is arranged in the containing cavity (2), the environment-friendly flue gas treatment device is characterized in that a PCB mounting plate (9) is arranged in the soldering tin chamber (8), a sealing plate (10) is arranged at the left end of the PCB mounting plate (9), the sealing plate (10) is fixedly connected with the PCB mounting plate (9) through the connecting rods, a smoke guide hood (12) is arranged at the top of the inner side of the soldering tin chamber (8), the inner wall fixed connection of leading petticoat pipe (12) and soldering tin room (8), the inside of leading petticoat pipe (12) sets up active carbon adsorption chamber (13), effect fixed connection through the screw between active carbon adsorption chamber (13) and leading petticoat pipe (12), the device body sets up flue gas treatment chamber (17), the effect of communicating pipe (15) is passed through to the inside of leading petticoat pipe (12) and flue gas treatment chamber (17) communicates each other, the right side bottom of flue gas treatment chamber (17) sets up smoke exhaust pipe (18), smoke exhaust pipe (18) and the inside of flue gas treatment chamber (17) communicate each other, the output of smoke exhaust pipe (18) is higher than the top of flue gas treatment chamber (17), the device body sets up reservoir chamber (19), effect fixed connection through the screw between reservoir chamber (19) and support frame (1), be equipped with filter core (20) between reservoir chamber (19) and flue gas treatment chamber (17), flue gas treatment chamber (17) and the inside of reservoir chamber (19) communicate each other, set up aqueduct (21) on the inner wall of flue gas treatment chamber (17), pass through the fix with screw between the inner wall of aqueduct (21) and flue gas treatment chamber (17), set up water valve (22) on the terminal surface of aqueduct (21), water valve (22) pass through the fix with screw on aqueduct (21), and water valve (22) communicate each other with the inside of aqueduct (21).
2. The environment-friendly smoke treatment device for the PCB soldering tin according to claim 1, wherein a guide rod (5) is arranged at the left end of the movable support (4), the guide rod (5) is in sliding connection with the movable support (4), the guide rod (5) is in welding connection with the inner wall of the accommodating cavity (2), a threaded rod (6) is arranged at the right end of the movable support (4), the threaded rod (6) is connected with the movable support (4) through the threaded rod, the threaded rod (6) is in rotating connection with the accommodating cavity (2) or the support frame (1) through a bearing, a rocking wheel (7) is arranged at the top of the threaded rod (6), and the rocking wheel (7) is fixedly connected with the threaded rod (6) in a welding mode.
3. The environment-friendly flue gas treatment device for PCB soldering tin of claim 1, wherein the right end of the PCB mounting plate (9) is provided with a positioning pin (11), the positioning pin (11) is fixedly connected with the inner wall of the soldering tin chamber (8), the PCB mounting plate (9) is provided with a slot corresponding to the positioning pin (11), and the slot and the positioning pin (11) are matched with each other.
4. The environment-friendly flue gas treatment device for PCB soldering tin of claim 1, wherein the PCB mounting plate (9) is provided with mounting holes (25), and the mounting holes (25) are arranged at the edge of the PCB mounting plate (9).
5. The environment-friendly flue gas treatment device for PCB soldering tin of claim 1, wherein the sealing plate (10) is provided with a fixing through hole (26), the fixing through hole (26) is communicated with the end surfaces of two sides of the sealing plate (10), the inner side surface of the sealing plate (10) is provided with a sealing ring (27), the sealing ring (27) and the sealing plate (10) are pasted and connected through the effect of glue, the side wall of the soldering tin chamber (8) is provided with a mounting area (29) corresponding to the position of the sealing plate (10), the middle position of the mounting area (29) is provided with a through hole (28), and the PCB mounting plate (9) passes through the through hole (28) and is mounted inside the soldering tin chamber (8).
6. The environment-friendly flue gas treatment device for PCB soldering tin according to claim 5, wherein the mounting area (29) is provided with a fixing column (30), the fixing column (30) is fixedly connected with the mounting area (29) in a welding manner, and the fixing column (30) corresponds to the fixing through hole (26) in position.
7. The environmentally friendly flue gas processing apparatus for PCB soldering according to claim 1, wherein the end of the communication pipe (15) disposed inside the flue gas processing chamber (17) is provided with a diffusion cover (16), the diffusion cover (16) is disposed downward, and the diffusion cover (16) and the inside of the communication pipe (15) are communicated with each other.
8. The environment-friendly flue gas treatment device for PCB soldering tin of claim 1, wherein a water pump (23) is arranged inside the water storage chamber (19), and the water conduit (21) is communicated with the output end of the water pump (23) through the action of a connecting water pipe (24).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201810807289.6A CN109047977B (en) | 2018-07-21 | 2018-07-21 | Environment-friendly flue gas treatment device for PCB soldering tin |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810807289.6A CN109047977B (en) | 2018-07-21 | 2018-07-21 | Environment-friendly flue gas treatment device for PCB soldering tin |
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| CN109047977A CN109047977A (en) | 2018-12-21 |
| CN109047977B true CN109047977B (en) | 2020-10-30 |
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| CN110202233B (en) * | 2019-04-19 | 2021-02-09 | 湖南科技学院 | Circuit board tin soldering device for electronic product production |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05211391A (en) * | 1992-01-21 | 1993-08-20 | Hitachi Ltd | Method and device for high precision soldering |
| CN100471606C (en) * | 2007-04-09 | 2009-03-25 | 盐城市康杰机械制造有限公司 | Intermittent type gas protecting soldering furnace |
| JP2011165897A (en) * | 2010-02-09 | 2011-08-25 | Green Technologies Corp | Soldering device |
| CN203791784U (en) * | 2014-01-17 | 2014-08-27 | 浙江田中精机股份有限公司 | Safety protective cover structure of linear soldering tin machine |
| CN107051111A (en) * | 2017-06-27 | 2017-08-18 | 重庆多道电子技术有限公司 | A kind of pcb board welds exhaust gas absorption device |
| CN107350587A (en) * | 2017-07-12 | 2017-11-17 | 江苏康杰机械股份有限公司 | Curtain room waste gas purification auxiliary equipment before and after soldering oven |
| CN207077064U (en) * | 2017-08-25 | 2018-03-09 | 浙江力庆制冷设备有限公司 | A kind of solderer |
| CN107378169A (en) * | 2017-08-31 | 2017-11-24 | 阜阳扬宇充电设备有限公司 | Tin furnace structure is used in a kind of power module manufacture |
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Effective date of registration: 20221201 Address after: 404500 Floor 1-3, Building 14, Huangling Cluster, Qinglong Street Industrial Park, Yunyang County, Chongqing (self commitment) Patentee after: Chongqing Yunyang Electronic Technology Co.,Ltd. Address before: 225500 260 people's road, Jiangyan District, Taizhou, Jiangsu Patentee before: Lei Lei |
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