CN109036631A - Low viscosity conductive silver paste - Google Patents
Low viscosity conductive silver paste Download PDFInfo
- Publication number
- CN109036631A CN109036631A CN201811056260.5A CN201811056260A CN109036631A CN 109036631 A CN109036631 A CN 109036631A CN 201811056260 A CN201811056260 A CN 201811056260A CN 109036631 A CN109036631 A CN 109036631A
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- CN
- China
- Prior art keywords
- parts
- conductive silver
- silver paste
- low viscosity
- bismuth oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Conductive Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention relates to the technical fields of silver paste, more particularly to are related to a kind of low viscosity conductive silver paste.This low viscosity conductive silver paste includes the component of following mass parts: 100-106 parts of high dispersive conductive silver powder, 10-12 parts of ethyl cellulose, 0.3-1 parts of dipotassium tetraborate, 0.06-0.1 parts of bismuth oxide, 1-2 parts of polyoxypropyleneglycol.It is unique that the present invention designs, and rationally, preparation is convenient for composition, with excellent electric conductivity, and it is good with substrate adhesive force, while improving conductive coating, mechanical performance, it ensure that cementability, the workability, hardness, diffusivity of coating, while environmental pollution is small.
Description
Technical field
The present invention relates to a kind of silver paste more particularly to a kind of low viscosity conductive silver pastes.
Background technique
Electrocondution slurry is as a kind of functional print material because its good physical property obtains extensively in electronics and IT products
Application, as electronic product develops to lighter, thinner, functional more powerful and more environmentally friendly direction, to its performance it is also proposed that
Higher requirement.Wherein low temperature Halogen conductive silver paste is widely used in film because of its excellent electric conductivity, thermal conductivity and practicability
Switch, capacitance electrode, touch screen etc..Low-temperature conductive silver paste be using conductive silver powder as conductive filler, with polymeric resin,
Solvent, curing agent, auxiliary agent etc. are agitated, disperse and manufactured uniform sizing material.After conductive silver paste is coated on substrate, in low temperature ring
(generally below 160 DEG C) are dried under border, after solvent release, resin and curing agent step-reaction, solidification ultimately form densification
Conductive film layer.
In electronics industry, in order to meet high intensity, the high-mechanical property demand of product, after low-temperature conductive silver paste solidification
Conductive film layer generally has mechanical requirement (film hardness, film layer and substrate adhesive force etc.).Conductive silver powder is metal-powder, firmly
Spend relatively high, but the hardness of the high polymers such as resin is then general poor.And when by improve in a manner of silver powder loading meet it is high hard
When degree demand, the resin of relatively small amount cannot abundant, effective coated silver, cause silver powder absorption in surface layer loosely to occur falling off existing
As.
Summary of the invention
Present invention seek to address that drawbacks described above, provides a kind of low viscosity conductive silver paste.
In order to overcome defect present in background technique, the technical solution adopted by the present invention to solve the technical problems is:
This low viscosity conductive silver paste includes the component of following mass parts: 100-106 parts of high dispersive conductive silver powder, ethyl cellulose 10-
12 parts, 0.3-1 parts of dipotassium tetraborate, 0.06-0.1 parts of bismuth oxide, 1-2 parts of polyoxypropyleneglycol.
It according to another embodiment of the invention, further comprise 106 parts of high dispersive conductive silver powder, ethyl cellulose 12
Part, 1 part of dipotassium tetraborate, 0.1 part of bismuth oxide, 2 parts of polyoxypropyleneglycol.
It according to another embodiment of the invention, further comprise 100 parts of high dispersive conductive silver powder, ethyl cellulose 10
Part, 0.3 part of dipotassium tetraborate, 0.06 part of bismuth oxide, 1 part of polyoxypropyleneglycol.
It according to another embodiment of the invention, further comprise 103 parts of high dispersive conductive silver powder, ethyl cellulose 11
Part, 0.6 part of dipotassium tetraborate, 0.08 part of bismuth oxide, 1 part of polyoxypropyleneglycol.
The beneficial effects of the present invention are: the present invention designs uniqueness, rationally, preparation is convenient for composition, with excellent electric conductivity
Can, and it is good with substrate adhesive force, while improving conductive coating, mechanical performance, it ensure that cementability, the Yi Jia of coating
Work, hardness, diffusivity, while environmental pollution is small.
Specific embodiment
This low viscosity conductive silver paste includes the component of following mass parts: 100-106 parts of high dispersive conductive silver powder, ethyl are fine
Tie up 10-12 parts of element, 0.3-1 parts of dipotassium tetraborate, 0.06-0.1 parts of bismuth oxide, 1-2 parts of polyoxypropyleneglycol.
Embodiment
106 parts of high dispersive conductive silver powder, 12 parts of ethyl cellulose, 1 part of dipotassium tetraborate, 0.1 part of bismuth oxide, polypropylene oxide
2 parts of glycol.
Embodiment
100 parts of high dispersive conductive silver powder, 10 parts of ethyl cellulose, 0.3 part of dipotassium tetraborate, 0.06 part of bismuth oxide, polyoxygenated
1 part of propylene glycol.
Embodiment
103 parts of high dispersive conductive silver powder, 11 parts of ethyl cellulose, 0.6 part of dipotassium tetraborate, 0.08 part of bismuth oxide, polyoxygenated
1 part of propylene glycol.
The beneficial effects of the present invention are: the present invention designs uniqueness, rationally, preparation is convenient for composition, with excellent electric conductivity
Can, and it is good with substrate adhesive force, while improving conductive coating, mechanical performance, it ensure that cementability, the Yi Jia of coating
Work, hardness, diffusivity, while environmental pollution is small.
Claims (4)
1. a kind of low viscosity conductive silver paste, it is characterised in that: the component including following mass parts: high dispersive conductive silver powder 100-
106 parts, 10-12 parts of ethyl cellulose, 0.3-1 parts of dipotassium tetraborate, 0.06-0.1 parts of bismuth oxide, 1-2 parts of polyoxypropyleneglycol.
2. low viscosity conductive silver paste as described in claim 1, it is characterised in that: 106 parts of high dispersive conductive silver powder, ethyl cellulose
Plain 12 parts, 1 part of dipotassium tetraborate, 0.1 part of bismuth oxide, 2 parts of polyoxypropyleneglycol.
3. low viscosity conductive silver paste as described in claim 1, it is characterised in that: 100 parts of high dispersive conductive silver powder, ethyl cellulose
Plain 10 parts, 0.3 part of dipotassium tetraborate, 0.06 part of bismuth oxide, 1 part of polyoxypropyleneglycol.
4. low viscosity conductive silver paste as described in claim 1, it is characterised in that: 103 parts of high dispersive conductive silver powder, ethyl cellulose
Plain 11 parts, 0.6 part of dipotassium tetraborate, 0.08 part of bismuth oxide, 1 part of polyoxypropyleneglycol.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811056260.5A CN109036631A (en) | 2018-09-11 | 2018-09-11 | Low viscosity conductive silver paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811056260.5A CN109036631A (en) | 2018-09-11 | 2018-09-11 | Low viscosity conductive silver paste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109036631A true CN109036631A (en) | 2018-12-18 |
Family
ID=64620928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811056260.5A Withdrawn CN109036631A (en) | 2018-09-11 | 2018-09-11 | Low viscosity conductive silver paste |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109036631A (en) |
-
2018
- 2018-09-11 CN CN201811056260.5A patent/CN109036631A/en not_active Withdrawn
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20181218 |
|
| WW01 | Invention patent application withdrawn after publication |