CN109029236A - It is a kind of to eliminate the engineering structure mechanical strain test method and device that temperature influences - Google Patents
It is a kind of to eliminate the engineering structure mechanical strain test method and device that temperature influences Download PDFInfo
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- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
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Abstract
The invention discloses a kind of engineering structure mechanical strain test method that elimination temperature influences and devices, it is by the actual strain of discovery engineering structure in addition to construction machine strain, also influenced comprising engineering structure by external constraint or material itself, expansion or shrinkage is caused to deform and can not freely occur, it is strained so as to cause the effective temperature of engineering structure corresponding to engineering structure stress, from there through the relationship of the first strain constructing environment temperature and the first dependent variable of engineering structure when being acted at a temperature of temperature-compensation method acquisition varying environment without external mechanical load；And then measure the actual strain of structure when having mechanical load action under operating ambient temperature；According to unitary variant principle, the first strain of engineering structure strains when being subtracted under corresponding temperature according to the actual strain of engineering structure under operating ambient temperature without the effect of external mechanical load to counteract the effective temperature of engineering structure, obtain the mechanical load strain of engineering structure, to accurately reflect that external mechanical load acts on the influence to structure, be conducive to the Performance Evaluation of engineering structure.
Description
Technical Field
The invention belongs to the field of mechanical strain testing of engineering structures, and particularly relates to a method and a device for testing mechanical strain of an engineering structure, which are used for eliminating temperature influence.
Background
The structural resistance strain testing technology is characterized in that a resistance strain gauge is pasted on the surface of a testing structure, the cooperative deformation of the structure and the strain gauge is guaranteed, the strain of the structure is calculated by measuring the resistance change of the resistance strain gauge, and then the stress of a structural testing point is obtained. However, the resistance value of the sensitive grid of the resistance strain gauge changes along with the change of temperature, the strain measurement data of the sensitive grid of the resistance strain gauge cannot reflect the actual strain of the engineering structure, and the problem is generally solved by adopting a temperature strain compensation method, namely, a material block which is made of the same material as the tested structure is selected, a temperature strain compensation gauge (forming a temperature strain compensation gauge) which is of the same type as the working strain gauge is adhered on the surface of the material block, and the material block is placed in the same environment temperature as the working strain gauge of the engineering structure to be tested; the temperature strain of the working strain gauge is eliminated by utilizing the connecting mode of a Wheatstone bridge in the resistance strain gauge.
FIG. 1 and FIG. 2 are schematic diagrams of a cantilever beam resistance strain test arrangement in the prior art and a Wheatstone circuit 1/4 bridge schematic diagram for temperature strain compensation in the prior art, respectively, as shown in FIG. 1, a rectangular constant section beam AB of length l, with an end A fixed and an end B spaced from another fixed surface by a distance delta, a resistance strain working sheet Y1 is adhered to the bottom surface of the beam, a temperature strain compensation block adhered with a temperature compensation sheet Y2 is placed adjacent thereto, the working sheet Y1 and the compensation sheet Y2 exactly constitute the 1/4 bridge circuit shown in FIG. 2, when the ambient temperature rises by delta T (a uniform temperature field is formed and no external force is applied), the beam AB extends by delta (delta < α delta Tl), at which the temperature strain of the beam AB is changed into epsilon1Delta/l, while the temperature compensation block is free to expand, its temperature-rise strain becomes epsilon2α Δ T (where α is the coefficient of thermal expansion of the material.) due to the action of the adhesive, the strain gage deforms in coordination with the structure, and the strain e corresponding to the working strain gage Y11Strain epsilon corresponding to temperature compensation strain gage Y2 [ delta ]/l2finally, the strain epsilon obtained by measuring with a resistance strain gauge is epsilon1-ε2δ/l- α Δ T, which is the effective temperature strain of the engineered structure corresponding to the temperature induced structure induced stress, howeverThe engineering structure has no external mechanical load, that is, the mechanical strain of the structure is 0, which indicates that the temperature strain component of the structure cannot be removed from the actual strain of the obtained structure by the existing resistance strain testing technology, and the mechanical strain of the engineering structure cannot be accurately obtained by the existing temperature strain compensation technology.
Patent document CN10319600A discloses a mathematical temperature compensation method for a strain-type load sensor, in which a curve of a load value output by the load sensor changing with the temperature of an elastomer is obtained by applying standard loads to the load sensor step by step at different environmental temperatures, the curve is subjected to numerical fitting and then set in a temperature correction module, and when the temperature correction module works, the temperature correction module calls a curve equation to automatically correct the load value output by the load sensor and the temperature value of the elastomer acquired by a thermistor, so as to achieve a compensation effect. The method needs to apply standard load to the load sensor step by step at each environmental temperature, is only suitable for the condition of small-sized structure and small load, and is not feasible for the condition of large-sized engineering structure and large load, such as measuring the strain of a bridge structure under the action of vehicle load, and obtaining the curve of the load value output by the load sensor along with the change of different temperatures, so that a mechanical strain test method widely suitable for the engineering structure needs to be found.
Disclosure of Invention
Aiming at the above defects or improvement requirements of the prior art, the existing resistance strain testing technology is researched, and it is found that the strain obtained by the working strain gauge mainly comprises the temperature strain of the structure, the mechanical strain of the structure and the temperature strain of the working strain gauge, and the strain obtained by the compensating strain gauge mainly comprises the temperature strain of the compensating block and the temperature strain of the compensating strain gauge. In order to accurately reflect the influence of the external mechanical load action on the structure and obtain the mechanical strain of the structure under the mechanical load, the effective temperature strain in the actual strain of the engineering structure after the existing temperature compensation needs to be eliminated.
According to the invention, the first strain of the engineering structure without external mechanical load action at different environmental temperatures is obtained by the conventional temperature compensation method, the actual strain of the engineering structure without external mechanical load action at the working environmental temperature is further measured, and according to a single variable principle, the first strain of the engineering structure without external mechanical load action at the corresponding temperature is subtracted from the actual strain of the engineering structure at the working environmental temperature, so that the effective temperature strain of the engineering structure is counteracted, and the mechanical load strain of the engineering structure is obtained, so that the influence of the external mechanical load action on the engineering structure is accurately reflected, and the performance evaluation of the engineering structure is facilitated.
In order to achieve the above object, according to an aspect of the present invention, there is provided a method for testing mechanical strain of an engineering structure without temperature influence, including the following steps:
s1, determining a relation between the environment temperature and a first strain variable of an engineering structure, namely measuring the first strain variable of the engineering structure in a mechanical load-free state at different environment temperatures by a temperature compensation method, and further constructing the relation between the environment temperature of the engineering structure and the first strain variable;
s2, measuring the environmental temperature of the engineering structure under the mechanical load and the actual dependent variable of the engineering structure under the corresponding temperature by a temperature compensation method;
and S3, determining the first strain variable of the engineering structure at the ambient temperature according to the relationship between the ambient temperature and the first strain variable in the step S1, and further calculating the difference value between the actual strain quantity of the engineering structure with the mechanical load at the ambient temperature in the step S2 and the first strain variable of the engineering structure at the ambient temperature, wherein the difference value is the mechanical strain quantity of the engineering structure with the mechanical load and the temperature influence of the engineering structure is eliminated.
As a further improvement of the invention, the temperature compensation method is realized by arranging a mechanical strain measurement circuit with a temperature compensation sheet on the engineering structure.
As a further improvement of the invention, the mechanical strain measurement circuit is a Wheatstone bridge circuit, the bridge circuit comprises a resistance strain working sheet and a temperature compensation sheet, the resistance strain working sheet is arranged on the surface of a measuring point of the engineering structure, the temperature compensation block is arranged on the surface of the compensation sheet made of the same material as the engineering structure, and the resistance strain working sheet and the temperature compensation sheet are connected through the Wheatstone 1/4 bridge circuit.
As a further improvement of the present invention, the relationship between the ambient temperature and the first strain variable of the engineering structure constructed in step S1 can be implemented by performing curve fitting according to the measured temperature values at different times and the first strain value of the engineering structure without mechanical load.
In order to achieve the above object, according to another aspect of the present invention, there is provided an engineering structure mechanical strain testing apparatus for eliminating temperature influence, the apparatus comprising an engineering structure strain testing module, a temperature measuring module and a main control module, wherein,
the engineering structure strain testing module is used for measuring a first strain quantity and an actual strain quantity of an engineering structure, and the temperature measuring module is used for measuring the temperature at a measuring point of the engineering structure;
the main control module is connected with the engineering structure strain test module and the temperature test module, and determines the relationship between the environmental temperature and the first strain variable of the engineering structure, namely the engineering structure strain test module measures the first strain variable of the engineering structure under the condition of no mechanical load at different environmental temperatures, so as to construct the relationship between the environmental temperature of the engineering structure and the first strain variable;
the temperature measuring module and the engineering structure strain testing module are used for measuring the environmental temperature of the engineering structure under the mechanical load and the actual strain of the engineering structure under the corresponding temperature;
and further determining a first strain of the engineering structure at the environment temperature according to the relationship between the environment temperature and the first strain, and further calculating a difference value between the actual strain of the engineering structure with the mechanical load at the environment temperature and the first strain of the engineering structure at the environment temperature, wherein the difference value is the mechanical strain of the engineering structure with the mechanical load, which eliminates the temperature influence.
As a further improvement of the invention, the engineering structure strain test module is realized by providing a mechanical strain measurement circuit with a temperature compensation sheet.
As a further improvement of the invention, the engineering structure strain testing module is provided with a measuring bridge, the measuring bridge comprises a resistance strain working sheet and a temperature compensation sheet, the resistance strain working sheet is arranged on the surface of a measuring point of the engineering structure, the temperature compensation sheet is arranged on the surface of a compensation block made of the same material as the engineering structure, and the resistance strain working sheet and the temperature compensation sheet are connected through a Wheatstone 1/4 bridge circuit.
As a further improvement of the invention, the engineering structure strain test module further comprises a signal amplifier for amplifying the test signal of the measuring bridge, so that the main control module can accurately read the measurement data of the measuring bridge.
As a further improvement of the invention, the relationship between the environmental temperature and the first strain quantity of the engineering structure constructed by the main control module can be realized by curve fitting according to the measured temperature values at different moments and the first strain value of the engineering structure without mechanical load.
As a further improvement of the invention, the device also comprises a data display module which is connected with the main control module and is used for displaying the calculation result of the main control module.
Generally, compared with the prior art, the above technical solution conceived by the present invention has the following beneficial effects:
according to the engineering structure mechanical strain testing method and device for eliminating temperature influence, the first strain of the engineering structure without external mechanical load action at different environmental temperatures is obtained through the existing temperature compensation method, then the actual strain of the engineering structure with mechanical load action at the working environmental temperature is measured, and the first strain of the engineering structure without external mechanical load action is subtracted from the actual strain of the engineering structure at the working environmental temperature, so that the effective temperature strain of the engineering structure is counteracted to obtain the mechanical load strain of the engineering structure, the problem that the temperature strain compensation in the existing resistance strain testing technology cannot accurately obtain the mechanical strain of the engineering structure is solved, the influence of the external mechanical load action on the engineering structure can be accurately reflected, and the performance evaluation of the engineering structure is facilitated.
According to the engineering structure mechanical strain testing method and device for eliminating the temperature influence, the first strain-environment temperature relation of the engineering structure without the mechanical load effect is obtained by curve fitting of the first strain-environment temperature relation data of the existing engineering structure, and can also be obtained by directly importing the existing data, so that the existing data are fully utilized, and the measuring efficiency is improved.
According to the engineering structure mechanical strain testing method and device for eliminating temperature influence, the engineering structure strain testing module is provided with the signal amplifier which is used for amplifying the measuring signal so as to facilitate the main control module to read data, and therefore the engineering structure mechanical strain testing method and device are suitable for various types of engineering structure tests.
Drawings
FIG. 1 is a schematic diagram of a prior art cantilever beam resistive strain test arrangement;
FIG. 2 is a schematic diagram of a prior art temperature strain compensated Wheatstone circuit 1/4 bridge;
FIG. 3 is a schematic structural diagram of an engineering structure mechanical strain testing device for eliminating temperature influence according to an embodiment of the present invention;
FIG. 4 is a graph of a first strain value versus ambient temperature for a build process structure according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other. The present invention will be described in further detail with reference to specific embodiments.
A method for testing mechanical strain of an engineering structure for eliminating temperature influence specifically comprises the following steps:
s1, determining the relation between the environment temperature and a first strain variable of the engineering structure, namely measuring the first strain variable of the engineering structure in a mechanical load-free state at different environment temperatures by a temperature compensation method, and further constructing the relation between the environment temperature of the engineering structure and the first strain variable. The method specifically comprises the following steps: respectively measuring the environmental temperature of the engineering structure at different moments without mechanical load and the first strain value epsilon of the engineering structure corresponding to the temperature by using a temperature compensation method, carrying out curve fitting according to the measured corresponding data, and constructing the first strain value epsilon of the engineering structureΔT-a relation curve of the ambient temperature T and storing the relation curve data in a storage unit of the main control module; for the existing engineering structure with related data, the storage unit of the main control module can also directly import the first strain value epsilon of the existing engineering structureΔT-ambient temperature T-relation, making full use of existing data, thereby improving measurement efficiency;
s2, measuring the environmental temperature of the engineering structure under the mechanical load by using a temperature compensation methodCorresponding to the actual strain of the engineering structure at the temperature. The method specifically comprises the following steps: further measuring the environmental temperature value T of the engineering structure with mechanical load at the working environmental temperature by a temperature compensation method0And corresponding engineering structure actual strain value epsilon;
and S3, determining the first strain variable of the engineering structure at the ambient temperature according to the relationship between the ambient temperature and the first strain variable in the step S1, and further calculating the difference value between the actual strain quantity of the engineering structure with the mechanical load at the ambient temperature in the step S2 and the first strain variable of the engineering structure at the ambient temperature, wherein the difference value is the mechanical strain quantity of the engineering structure with the mechanical load and the temperature influence of the engineering structure is eliminated. The method specifically comprises the following steps: according to the engineering structure of step S1, the first strain εΔT-ambient temperature T relation curve, calculating ambient temperature as T0Engineering structure first strain epsilon corresponding to timeΔTFinally obtaining the mechanical strain value epsilon of the engineering structure without the temperature influenceF. Wherein,
εF＝ε-εΔT(1)
the influence of external mechanical load action on the structure can be accurately reflected according to the mechanical strain value of the engineering structure, so that the performance evaluation of the engineering structure is facilitated.
Based on the resistance strain testing method for eliminating the temperature influence, the invention also designs an engineering structure mechanical strain testing device for eliminating the temperature influence. FIG. 3 is a schematic structural diagram of the engineering structure mechanical strain testing device for eliminating temperature influence according to the present invention. As shown in fig. 3, the device includes an engineering structure strain test module, a temperature measurement module, a main control module, and a data display module. The engineering structure strain test module comprises a measuring bridge which is a Wheatstone bridge and is connected in a 1/4 bridge mode, a resistance strain working piece Y1 is pasted on the surface of a measuring point of a tested structure, a temperature compensation piece Y2 is pasted on a compensation block, and the compensation block and a temperature sensor are arranged near the working piece Y1, so that the working piece Y1 and the temperature compensation piece Y2 are at the same ambient temperature, and the engineering structure strain test module is beneficial to the improvement of the temperature of the tested structureThe wheatstone circuit 1/4 bridge is used to connect the active plate and the temperature compensation plate as shown in fig. 2, wherein the operation principle of the measuring bridge is as follows: the working plate Y1 and the compensating plate Y2 just form a 1/4 bridge circuit shown in figure 2, when the ambient temperature rises delta T (a uniform temperature field is formed and no external force acts), due to the action of the adhesive, the working strain plate Y1 and the engineering structure are coordinated and deformed, the corresponding resistance value of the working strain plate Y1 changes, the compensating block freely expands, the corresponding resistance value of the temperature compensating strain plate Y2 changes, and at the moment, the measuring bridge outputs a strain value, namely a first strain value epsilon of the engineering structureΔT；
The engineering structure strain test module is also provided with a signal amplifier, the input end of the signal amplifier is connected with the output end of the measuring bridge and used for amplifying the measuring signal of the measuring bridge so as to facilitate the main control module to read data.
The temperature measuring module in the device is used for measuring the temperature at the strain measuring point of the engineering structure, namely the temperature sensor is used for measuring the ambient temperature of the working piece Y1 and the compensating piece Y2; the data display module is used for displaying the result obtained by the calculation of the main control module;
the main control module obtains environmental temperatures of different moments of the engineering structure under the action of mechanical load and engineering structure first strain numerical values corresponding to the temperatures measured by the temperature measurement module and the engineering structure strain test module respectively, performs curve fitting according to the measured corresponding data, and constructs engineering structure first strain numerical values epsilonΔT-a relation curve of the ambient temperature T, in particular: respectively measuring the environmental temperature of the engineering structure at different moments and the first strain value of the engineering structure corresponding to the temperature under the action of no mechanical load by using a temperature measuring module and an engineering structure strain testing module, and constructing the relation between the first strain value of the engineering structure and the environmental temperature according to the measured corresponding data, wherein curve fitting can be performed according to the measured corresponding data value to construct the first strain value epsilon of the engineering structureΔT-a relation curve of the ambient temperature T and storing the relation curve data in a storage unit of the main control module; for the existing engineering structure with related data, the master control moduleThe memory location of the block can also be directly imported with the first strain value epsilon of the existing engineering structureΔTAmbient temperature T-relation data, making full use of existing data, thereby improving measurement efficiency. The specific curve fitting method is shown in table 1 below:
| ambient temperature T (degree) without mechanical load | First strain value epsilonΔT |
| 14.5 | 24 |
| 15.0 | 25 |
| 15.5 | 32 |
| 16.0 | 37 |
| 16.5 | 37 |
| 17.0 | 43 |
| 17.5 | 47 |
| 18.0 | 59 |
| 18.5 | 63 |
TABLE 1
FIG. 4 is a graph of a first strain value versus ambient temperature for a build process structure according to an embodiment of the present invention. Curve fitting is performed according to the measured corresponding data values as described in fig. 4, resulting in the following relationship:
εΔT＝0.0006*(T)3.9646(2)
the resulting relationship is shown in FIG. 4.
The main control module further measures the ambient temperature value T of the engineering structure with mechanical load0And the actual strain value epsilon of the corresponding engineering structure.
According to the first strain epsilon stored in the storage unit of the main control moduleΔT-ambient temperature T relation curve, the master control module calculating the ambient temperature T0First strain epsilon of time correspondenceΔTThe mechanical strain value epsilon of the engineering mechanism with temperature influence eliminated can be obtained according to the formula (1)FMeanwhile, the main control module eliminates the temperature influence on the mechanical strain value epsilon of the engineering mechanismFThe temperature strain compensation method is used for sending the temperature strain compensation data to a data display module for displaying a final calculation result, and meanwhile, the performance of the engineering structure can be accurately evaluated according to the mechanical strain value with the temperature influence eliminated, so that the problem that the mechanical strain of the engineering structure cannot be accurately obtained through temperature strain compensation in the existing resistance strain test technology is solved, and the performance evaluation of the engineering structure is facilitated.
Let it be assumed here that T is taken018.2 deg., 400 deg., and T0Substituting formula (2) to obtain:
εΔT＝0.0006*(18.2)3.9646＝59.406
will epsilonΔTSubstitution of 59.406 for formula (1) yields:
εF＝ε-εΔT＝400-59.406＝340.594
i.e. the value of the mechanical strain of the structure with the temperature influence eliminated is epsilonF＝340.594。
It will be understood by those skilled in the art that the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the invention, and that any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (10)
1. A method for testing mechanical strain of an engineering structure for eliminating temperature influence specifically comprises the following steps:
s1, determining a relation between the environment temperature and a first strain variable of an engineering structure, namely measuring the first strain variable of the engineering structure in a mechanical load-free state at different environment temperatures by a temperature compensation method, and further constructing the relation between the environment temperature of the engineering structure and the first strain variable;
s2, measuring the actual dependent variable of the engineering structure at the environment temperature and the corresponding temperature of the engineering structure under the mechanical load by the temperature compensation method;
s3, determining the first strain variable of the engineering structure at the environment temperature according to the relationship between the environment temperature and the first strain variable in the step S1, and further calculating the difference value between the actual strain quantity of the engineering structure with the mechanical load at the environment temperature in the step S2 and the first strain variable of the engineering structure at the environment temperature, wherein the difference value is the mechanical strain quantity of the engineering structure with the mechanical load, and the temperature influence of the engineering structure is eliminated.
2. The engineering structure mechanical strain testing method for eliminating the temperature influence as claimed in claim 1, wherein the temperature compensation method is realized by arranging a mechanical strain measurement circuit with a temperature compensation sheet on the engineering structure.
3. The engineering structure mechanical strain testing method for eliminating the temperature influence as claimed in claim 2, wherein the mechanical strain measuring circuit is a wheatstone bridge circuit, the bridge circuit comprises a resistance strain working piece and a temperature compensation piece, the resistance strain working piece is arranged on the surface of a measuring point of the engineering structure, the temperature compensation piece is arranged on the surface of a compensation block made of the same material as the engineering structure, and the resistance strain working piece and the temperature compensation piece are connected through the wheatstone 1/4 bridge circuit.
4. The method for testing mechanical strain of engineering structure to eliminate temperature influence according to any one of claims 1 to 3, wherein the step S1 of constructing the relationship between the environmental temperature of the engineering structure and the first strain variable is implemented by curve fitting according to the measured temperature values at different time and the first strain value of the engineering structure without mechanical load.
5. An engineering structure mechanical strain testing device for eliminating temperature influence is characterized by comprising an engineering structure strain testing module, a temperature measuring module and a main control module, wherein,
the engineering structure strain testing module is used for measuring a first strain variable and an actual strain variable of an engineering structure, and the temperature measuring module is used for measuring the temperature at a measuring point of the engineering structure;
the main control module is connected with the engineering structure strain test module and the temperature test module, and determines the relationship between the environmental temperature and the first strain variable of the engineering structure, namely the engineering structure strain test module measures the first strain variable of the engineering structure under the state without mechanical load at different environmental temperatures, and further constructs the relationship between the environmental temperature of the engineering structure and the first strain variable;
the temperature measuring module and the engineering structure strain testing module are obtained to measure the environmental temperature of the engineering structure under the mechanical load and the actual strain of the engineering structure under the corresponding temperature;
and then determining a first strain quantity of the engineering structure at the environment temperature according to the relation between the environment temperature and the first strain quantity, further calculating a difference value between the actual strain quantity of the engineering structure with the mechanical load at the environment temperature and the first strain quantity of the engineering structure at the environment temperature, wherein the difference value is the mechanical strain quantity of the engineering structure with the mechanical load, and the temperature influence of the engineering structure is eliminated.
6. The engineering structure mechanical strain testing device for eliminating the temperature influence according to claim 5, wherein the engineering structure strain testing module is implemented by providing a mechanical strain measurement circuit with a temperature compensation sheet.
7. The engineering structure mechanical strain testing device for eliminating the temperature influence as claimed in claim 6, wherein the engineering structure strain testing module is provided with a measuring bridge, the measuring bridge comprises a resistance strain working piece and a temperature compensation piece, the resistance strain working piece is arranged on the surface of a measuring point of the engineering structure, the temperature compensation piece is arranged on the surface of a compensation block made of the same material as the engineering structure, and the resistance strain working piece and the temperature compensation piece are connected through a Wheatstone 1/4 bridge circuit.
8. The engineering structure mechanical strain testing device for eliminating the temperature influence according to claim 7, wherein the engineering structure strain testing module further comprises a signal amplifier for amplifying the testing signal of the measuring bridge, so that the main control module can accurately read the measuring data of the measuring bridge.
9. The device for testing mechanical strain of engineering structure to eliminate temperature influence according to any one of claims 5 to 8, wherein the main control module is configured to implement curve fitting on the relationship between the ambient temperature of the engineering structure and the first strain variable according to the measured temperature values at different time and the first strain value of the engineering structure without mechanical load.
10. The engineering structure mechanical strain testing device for eliminating the temperature influence according to any one of claims 5 to 9, wherein the device further comprises a data display module, and the data display module is connected with the main control module and used for displaying the calculation result of the main control module.
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