CN109012771A - A kind of micro-fluidic acoustics bulk wave chip of all-transparent and preparation method thereof - Google Patents
A kind of micro-fluidic acoustics bulk wave chip of all-transparent and preparation method thereof Download PDFInfo
- Publication number
- CN109012771A CN109012771A CN201810811436.7A CN201810811436A CN109012771A CN 109012771 A CN109012771 A CN 109012771A CN 201810811436 A CN201810811436 A CN 201810811436A CN 109012771 A CN109012771 A CN 109012771A
- Authority
- CN
- China
- Prior art keywords
- glass
- sheet glass
- acoustics
- fluidic
- micro
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
- B01L2200/10—Integrating sample preparation and analysis in single entity, e.g. lab-on-a-chip concept
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/08—Geometry, shape and general structure
- B01L2300/0861—Configuration of multiple channels and/or chambers in a single devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/08—Geometry, shape and general structure
- B01L2300/0887—Laminated structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/12—Specific details about materials
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Dispersion Chemistry (AREA)
- Analytical Chemistry (AREA)
- General Health & Medical Sciences (AREA)
- Hematology (AREA)
- Clinical Laboratory Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Micromachines (AREA)
Abstract
The invention discloses micro-fluidic acoustics bulk wave chips of a kind of all-transparent and preparation method thereof.Its product is made of three blocks of sheet glass and one piece of piezoelectric material.Three blocks of sheet glass stack the standing wave reaction chamber of composition from top to bottom, and upper layer sheet glass is provided with the aperture passed in and out for fluid using laser, and one piece of thicker dimethyl silicone polymer (PDMS) for being provided with corresponding aperture is bonded on the aperture of surface；The channel of glass preparation micron level is penetrated on the sheet glass of middle layer by laser cutting；Lower layer's sheet glass is complete glass, is used for package cavity.Piezoelectric material uses lithium niobate monocrystal, and upper and lower surface plates layer of transparent tin-doped indium oxide (ITO) conductive membrane layer and is sticked to resonant cavity lower surface, and two conducting wires are drawn by silver paste solidification in lithium niobate crystal chip two sides.Chip prepared by the present invention is fully transparent, visual high, can be used for cell/particle equal samples aggregation, separation and manipulation；Preparation process of the invention is simple, low in cost.
Description
Technical field
The invention belongs to micro-total analysis system field, in particular to the micro-fluidic acoustics bulk wave chip of a kind of all-transparent and its
Preparation method.
Background technique
Due to the very fast development of micro electro mechanical processing technology (MicroElectrical-Mechanical System, MEMS),
The research of microflow control technique, which also starts to obtain everybody, widely to be paid close attention to.In this is nearest 30 years, it is based on micro-machined miniflow
It controls chip and shows good application prospect in fields such as physics, chemistry, biologies.Micro-fluidic chip has miniaturization due to it
The characteristics of with being easily integrated, so that the detection of sample, control and analysis multiple functions are complete in the chip top of a coin-size
At being possibly realized.Small-sized, high sensitivity, bio-compatibility are high, integration is high, contactless since it has for acoustics micro-fluidic chip
Etc. advantages have received widespread attention, become one of the hot spot studied now.
Currently, the general method by wet etching etches micro- on the hard materials such as silicon wafer in microfluidic system
Network structure is drilled on silicon wafer with pulse laser, then glass is bonded to etching by micro- knot by way of anode linkage
Sound wave chip is formed on the silicon wafer of structure.This sound wave chip airtightness is preferable, but it will use and be worth millions of anode linkages
Equipment improves preparation cost, limits its scope of application.It needing using materials such as silicon wafer and heat resistant glasses, consumptive material price is high,
In addition it only one be above it is transparent, be unfavorable for observation and optical analysis identification etc..
Summary of the invention
In order to solve the above technical problems, the present invention is intended to provide a kind of preparation process is simple, low in cost and safe and convenient
The micro-fluidic acoustics bulk wave chip of all-transparent and preparation method thereof.
Material used in chip prepared by the present invention is transparent material, and main selection is that glass-encapsulated is humorous as sound wave
Shake chamber, and lithium niobate monocrystal piezoelectric material is as sound wave generator, since material used in the present invention is transparent material, assembling
It is still carried out after the completion with the state of all-transparent using visuality is greatly improved.On the whole with traditional silicon substrate-glass
Differ widely, selection of the invention is transparent component entirely, be conducive to optical analysis, such as cell on opposite phase imaging, light
Raman analysis etc. is learned, the application range of micro-fluidic chip is extended；It is and traditional in addition, selection of the invention is simple glass
The specific glass type of needs in silicon substrate-glass-chip, more convenient and save the cost of drawing materials；Furthermore on present invention process,
Chip needed for laser large-scale processing can be used, it is integrated convenient for the device of monster chip.In using effect, this chip and existing
The chip that some is prepared using anode linkage is compared to substantially quite.
Offer technical solution of the invention is as follows:
A kind of micro-fluidic acoustics bulk wave chip of all-transparent stacks the acoustic resonant cavity and piezoelectric material that constitute by sheet glass
It constitutes, and:
1) acoustic resonant cavity is stacked by three blocks of sheet glass and is formed；
2) acoustic resonant cavity upper layer sheet glass is provided with hole location and passes in and out for liquid；
3) acoustic resonant cavity middle layer sheet glass is provided with the channel of micron level；
4) the acoustic resonant cavity lower layer sheet glass structural integrity is encapsulated for resonant cavity；
5) the two-sided bottom for being coated with transparent conductive film and being pasted on acoustic resonant cavity of piezoelectric material described in, and two
Two copper wire are drawn as signal input lead in face.
Further, it is described 1) in three blocks of sheet glass with a thickness of 300-500 microns.
Further, it is glued by UV-cured resin layer through ultraviolet light solidification between the triplex glass piece
Patch.
Further, it is described 2) in hole location be divided into injection port and outlet.
Further, it is described 3) in channel run through middle layer thickness of glass direction, by a tap drain road and two and tap drain road
The sheath stream lateral sulcus road of drift angle at 45 ° forms.The design of the channel is conducive to internal liquid and keeps laminar condition, realizes particle in liquid
Steady flow.
Further, 5) the piezoelectric material is that 36 ° of Y cut LiNbO3Monocrystalline is simultaneously bonded in silicon wafer by epoxy resin
Bottom.
Further, 5) the transparent conductive film is transparent conductive film；The piezoelectric material is with a thickness of 1 milli
Rice.
Resonant cavity, piezoelectric material, bonding agent and conductive film use transparent material, so that the chip after assembling is also transparent,
It improves visual.
Another object of the present invention is to provide a kind of preparation method of above-mentioned micro-fluidic acoustics bulk wave chip, including it is following
Step:
1) three block sizes of cutting it is identical, with a thickness of 300-500 micron of three sheet glass, upper layer sheet glass is by laser boring
Aperture of the preparation for fluid disengaging；The channel of glass preparation micron level is penetrated on the sheet glass of middle layer by laser cutting；Lower layer
Sheet glass is complete glass, is used for package cavity；
2) UV-cured resin is spun on to upper layer lower glass surface and lower layer's glass top surface respectively, is then glued respectively
It is attached to the two sides of intermediate glass, guarantees hole location alignment, acoustic resonant cavity preparation is completed by ultraviolet radiation-curable；Finally upper
Dimethyl silicone polymer (PDMS) block that one piece is provided with corresponding aperture is bonded above layer sheet glass aperture to pass in and out for liquid；
3) it plates conductive layer below on the piezoelectric materials and is pasted onto the bottom of acoustic resonant cavity by epoxy resin, and
Two copper wire are drawn as signal input lead in two sides.
Piezoelectric material in above-mentioned steps (3) is lithium niobate monocrystal；Conductive layer is transparent conductive film.
The conducting wire that piezoelectric material the two poles of the earth are drawn in above-mentioned steps (3) is welded to the copper conductor of piezoelectric monocrystal on piece.
Bulk wave standing wave of the present invention derives from polarized piezoelectric material --- the lithium niobate monocrystal for being bonded in silicon wafer bottom,
Working frequency is determined by self property.The intensity and frequency for adjusting input signal, may be implemented the richness to samples such as particle/cells
Collection, manipulation and separation.
Beneficial effects of the present invention:
1. the material using all-transparent is assembled, optical performance is greatly improved, so that it is used for real-time optical
It analyzes and identifies and is possibly realized, such as opposite phase imaging technique, optics Raman analysis；
2. in selection with the monocrystalline silicon piece and high temperature resistant borosilicate glass of valuableness needed for traditional si-glass acoustics bulk wave chip
Glass is compared, and selection of the present invention is simple glass, more convenient and save the cost；
3. in bonding technology, expensive anode linkage equipment is not needed, it is easy to operate with spin coating UV glue method, it greatlys save
Cost；
4. the generation and adjusting of ultrasonic standing wave field are controllable；
5. chip integrated operation is simple, using safe and convenient, without operating under conditions of high temperature high voltage；And it can be with
The lower integrated development of price large-scale industry device；
6. the manipulation to samples such as particle/cells, capture, separation etc. can be easily carried out using the present invention；Accordingly,
It the composite can be widely applied to the fields such as life science, pharmaceutical science and medicine, such as blood platelet, circulating tumor cell, myeloma
Capture and purifying of the blood cells such as cell etc., are of great significance to life science.
Detailed description of the invention
Fig. 1 is overall structure diagram of the invention；
Fig. 2 is the relative position schematic diagram of resonant cavity and piezoelectricity lithium niobate monocrystal of the present invention；
Fig. 3 is the application effect of the prior art (form ultrasonic bulk wave with anode linkage sheet glass and silicon wafer and sort chip)
Figure；
Fig. 4 is application effect figure of the invention；
In attached drawing: 1-36 ° of Y cuts lithium niobate monocrystal, 2- UV-curable epoxy layer, 3- sheet glass, 4- poly dimethyl
Siloxanes, 5- epoxy resin layer, 6- microfluidic channels, 7- injection port, 8- outlet.
Specific embodiment
The following further describes the present invention with reference to the drawings, and the contents of the present invention are completely without being limited thereto.
Embodiment 1
The preparation of the micro-fluidic bulk wave chip of all-transparent
Preparation step is as follows:
1) cutting size it is identical three pieces with a thickness of 300-500 microns of sheet glass 3, upper layer sheet glass is provided with using laser
For the injection port 7 and outlet 8 of fluid disengaging, the quantity of inlet and outlet is 3；It is worn on the sheet glass of middle layer by laser cutting
Saturating glass is carved with the channel 6 of micron level, and three injection ports 7 converge on central channel and are diverted to three outlets 8 again；Under
Layer sheet glass is complete glass, is used for package cavity；
2) UV-curable epoxy layer 2 is uniformly spin-coated on by sol evenning machine by the top and bottom glass surface,
Then the two sides of intermediate glass is pasted respectively, is guaranteed the hole location alignment of the inlet and outlet of upper layer glass and middle layer glass, is passed through
Ultraviolet radiation-curable is bonded to complete acoustic resonant cavity preparation；Upper one is finally bonded on the sheet glass inlet and outlet of upper layer
Thicker dimethyl silicone polymer (PDMS) block 4 that block is provided with corresponding aperture is passed in and out for liquid；
3) it uses lithium niobate monocrystal as piezoelectric material, passes through magnetron sputtering in 1 upper and lower surface of piezoelectricity lithium niobate monocrystal
It plates ITO conductive layer and is pasted on the bottom of acoustic resonant cavity by epoxy resin 5, and draw two copper wire as letter on two sides
Number input lead.
Comparative example 1
Using the acoustics bulk wave chip of anode linkage equipment making
Si-glass is prepared using anode linkage machine (WB-100A, Suzhou Memstools Semiconductor Technology Co., Ltd., China)
Acoustics bulk wave chip, 350 DEG C of bonding temperature, voltage 800-1000V, after high pressure-temperature is handled, in si-glass silicon atom and
The realization chemical bonds of oxygen atom realize that silicon chip surface and particular glass surface are realized viscous glutinous in chip, finally realize chip
Encapsulation.
Embodiment 2
The application effect of embodiment 1 and comparative example 1 compares
Attached drawing 3 is the application effect figure of comparative example 1.15 μm of polystyrene microsphere is apparent in the channel as seen from Figure 3
It is pooled in two lines, can achieve the effect of particle buildup and manipulation.
Attached drawing 4 is the application effect figure of embodiment 1.In figure 15 μm of silicon dioxide microsphere under sound field reflecting in the channel
It is pooled in the parallel two lines in intermediate region.
It can be seen that chip prepared by the present invention in actual use from attached drawing 3 and attached drawing 4, with prior art products
It has the same effect.
The foregoing is only a preferred embodiment of the present invention, but the scope of protection of the invention be not limited thereto,
Any modification that anyone skilled in the art is made in the technical scope disclosed by the present invention, equivalent replacement and
Improve etc., it should be included within the protection scope of invention.
Claims (10)
1. a kind of micro-fluidic acoustics bulk wave chip of all-transparent, which is characterized in that stack the acoustic resonant cavity constituted by sheet glass
It is constituted with piezoelectric material, and:
1) acoustic resonant cavity is stacked by three blocks of sheet glass and is formed；
2) acoustic resonant cavity upper layer sheet glass is provided with hole location and passes in and out for liquid；
3) acoustic resonant cavity middle layer sheet glass is provided with the channel of micron level；
4) the acoustic resonant cavity lower layer sheet glass structural integrity is encapsulated for resonant cavity；
5) the two-sided bottom for being coated with transparent conductive film and being pasted on acoustic resonant cavity of piezoelectric material described in, and draw on two sides
Two copper wire are as signal input lead out.
2. micro-fluidic acoustics bulk wave chip according to claim 1, it is characterised in that: it is described 1) in three blocks of sheet glass thickness
Degree is 300-500 microns.
3. micro-fluidic acoustics bulk wave chip according to claim 1 or 2, it is characterised in that: the triplex glass piece it
Between by UV-curable epoxy layer through ultraviolet light solidification pasted.
4. micro-fluidic acoustics bulk wave chip according to claim 1, it is characterised in that: it is described 2) in hole location be divided into injection port
And outlet.
5. micro-fluidic acoustics bulk wave chip according to claim 1, it is characterised in that: it is described 3) in channel run through middle layer glass
Glass piece thickness direction is made of the sheath stream lateral sulcus road of a tap drain road and two and tap drain road drift angle at 45 °.
6. micro-fluidic acoustics bulk wave chip according to claim 1, it is characterised in that: 5) the piezoelectric material is 36 ° of Y
Cut LiNbO3Monocrystalline and the bottom that silicon wafer is bonded in by epoxy resin；The piezoelectric material is with a thickness of 1 millimeter.
7. micro-fluidic acoustics bulk wave chip according to claim 1, it is characterised in that: 5) the transparent conductive film is
Transparent conductive film.
8. a kind of preparation method of micro-fluidic acoustics bulk wave chip described in claim 1, which is characterized in that including following step
It is rapid:
1) three block sizes of cutting it is identical, with a thickness of 300-500 micron of sheet glass, upper layer sheet glass is by laser boring preparation use
In the aperture of fluid disengaging；The channel of glass preparation micron level is penetrated on the sheet glass of middle layer by laser cutting；Lower layer's sheet glass
It is complete glass, is used for package cavity；
2) UV-cured resin is spun on to upper layer lower glass surface and lower layer's glass top surface respectively, is then pasted respectively
The two sides of intermediate glass guarantees hole location alignment, completes acoustic resonant cavity preparation by ultraviolet radiation-curable；Finally in upper layer glass
Dimethyl silicone polymer (PDMS) block that one piece is provided with corresponding aperture is bonded above glass piece aperture to pass in and out for liquid；
3) it plates conductive layer below on the piezoelectric materials and is pasted onto the bottom of acoustic resonant cavity by epoxy resin, and on two sides
Two copper wire are drawn as signal input lead.
9. the preparation method of micro-fluidic acoustics bulk wave chip according to claim 8, it is characterised in that: the step (3)
In piezoelectric material be lithium niobate monocrystal；Conductive layer is transparent conductive film.
10. the preparation method of micro-fluidic acoustics bulk wave chip according to claim 8, it is characterised in that: the step (3)
The conducting wire that middle piezoelectric material the two poles of the earth are drawn is welded to the copper conductor of piezoelectric monocrystal on piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810811436.7A CN109012771B (en) | 2018-07-23 | 2018-07-23 | Full-transparent microfluidic acoustic bulk wave chip and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810811436.7A CN109012771B (en) | 2018-07-23 | 2018-07-23 | Full-transparent microfluidic acoustic bulk wave chip and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109012771A true CN109012771A (en) | 2018-12-18 |
| CN109012771B CN109012771B (en) | 2020-06-09 |
Family
ID=64645125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810811436.7A Active CN109012771B (en) | 2018-07-23 | 2018-07-23 | Full-transparent microfluidic acoustic bulk wave chip and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109012771B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109865543A (en) * | 2019-04-02 | 2019-06-11 | 武汉大学 | Micro-fluidic bulk wave sorting chip of a kind of high throughput and preparation method thereof |
| CN110215938A (en) * | 2019-04-02 | 2019-09-10 | 武汉大学 | A kind of micro-fluidic sorting chip of the spiral acoustic bulk wave of all-transparent and preparation method thereof |
| CN111351848A (en) * | 2020-03-19 | 2020-06-30 | 山东科技大学 | Preparation method of sensor, sensor and detection method of sensor |
| CN111389473A (en) * | 2020-03-25 | 2020-07-10 | 武汉大学 | Vertical channel tunable high-flux acoustic flow control sorting chip and preparation method thereof |
| CN112457978A (en) * | 2020-11-23 | 2021-03-09 | 武汉大学 | Blood cell separation chip based on bulk acoustic wave and application |
| CN112973986A (en) * | 2019-12-14 | 2021-06-18 | 深圳先进技术研究院 | Centrifugal device |
| CN113270142A (en) * | 2021-05-19 | 2021-08-17 | 东南大学 | Space transcriptome sequencing decoding method based on transient coding |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101966473A (en) * | 2010-10-26 | 2011-02-09 | 武汉大学 | Micro fluid control screening chip based on ultrasonic standing wave and preparation method thereof |
| CN103116227A (en) * | 2013-01-30 | 2013-05-22 | 福建福晶科技股份有限公司 | Acousto-optic device enabling packaging quality to be easy to detect |
| CN106391151A (en) * | 2016-08-31 | 2017-02-15 | 清华大学 | Manufacturing method of multilayer microfluidic chip suitable for batch production |
| CN207012988U (en) * | 2017-05-05 | 2018-02-16 | 广东工业大学 | A kind of micro-fluidic chip |
-
2018
- 2018-07-23 CN CN201810811436.7A patent/CN109012771B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101966473A (en) * | 2010-10-26 | 2011-02-09 | 武汉大学 | Micro fluid control screening chip based on ultrasonic standing wave and preparation method thereof |
| CN103116227A (en) * | 2013-01-30 | 2013-05-22 | 福建福晶科技股份有限公司 | Acousto-optic device enabling packaging quality to be easy to detect |
| CN106391151A (en) * | 2016-08-31 | 2017-02-15 | 清华大学 | Manufacturing method of multilayer microfluidic chip suitable for batch production |
| CN207012988U (en) * | 2017-05-05 | 2018-02-16 | 广东工业大学 | A kind of micro-fluidic chip |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109865543A (en) * | 2019-04-02 | 2019-06-11 | 武汉大学 | Micro-fluidic bulk wave sorting chip of a kind of high throughput and preparation method thereof |
| CN110215938A (en) * | 2019-04-02 | 2019-09-10 | 武汉大学 | A kind of micro-fluidic sorting chip of the spiral acoustic bulk wave of all-transparent and preparation method thereof |
| CN112973986A (en) * | 2019-12-14 | 2021-06-18 | 深圳先进技术研究院 | Centrifugal device |
| CN111351848A (en) * | 2020-03-19 | 2020-06-30 | 山东科技大学 | Preparation method of sensor, sensor and detection method of sensor |
| CN111389473A (en) * | 2020-03-25 | 2020-07-10 | 武汉大学 | Vertical channel tunable high-flux acoustic flow control sorting chip and preparation method thereof |
| CN112457978A (en) * | 2020-11-23 | 2021-03-09 | 武汉大学 | Blood cell separation chip based on bulk acoustic wave and application |
| CN113270142A (en) * | 2021-05-19 | 2021-08-17 | 东南大学 | Space transcriptome sequencing decoding method based on transient coding |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109012771B (en) | 2020-06-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109012771A (en) | A kind of micro-fluidic acoustics bulk wave chip of all-transparent and preparation method thereof | |
| CN109012769B (en) | Micro-fluidic liquid drop generation device and method based on surface acoustic wave | |
| CN104726331B (en) | Acoustic surface wave based microfluidic plasma separating chip and method | |
| CN107583692B (en) | Liquid drop micro-fluidic chip and preparation method thereof | |
| CN103107737B (en) | Piezoelectricity friction combined type micro-nano generator and preparation method thereof | |
| CN100428500C (en) | Photoelectric sensor based on one-dimensional semiconductor nano structure and manufacturing method thereof | |
| CN103840075B (en) | Micro piezoelectric vibration energy amount collector and its manufacture method | |
| CN111085281B (en) | Surface acoustic wave regulated high-flux micro-droplet generation device and method | |
| CN103170383A (en) | Nano-material electrode modification based electrochemical integrated digital micro-fluidic chip | |
| Xu et al. | Progress in wafer bonding technology towards MEMS, high-power electronics, optoelectronics, and optofluidics | |
| CN103589631B (en) | Biological chip packaging structure and packaging method | |
| CN105185898B (en) | Flexible transparent functional device and preparation method thereof | |
| US20090314062A1 (en) | Fluid Actuator, and Heat Generating Device and Analysis Device Using the Same | |
| WO2022253146A1 (en) | Platelet detection microfluidic chip | |
| CN106914288B (en) | A kind of micro-fluidic high frequency sound focusing chip and preparation method thereof | |
| CN109540771A (en) | A kind of the acousto-optic micro-fluidic chip and its method for separating of accurate sorting leukocyte sub-type | |
| CN109482121A (en) | Micro-and nano-particles highly effective reaction micro-fluidic chip based on surface acoustic wave | |
| CN110215938A (en) | A kind of micro-fluidic sorting chip of the spiral acoustic bulk wave of all-transparent and preparation method thereof | |
| Shen et al. | Improving the dielectric properties of an electrowetting-on-dielectric microfluidic device with a low-pressure chemical vapor deposited Si3N4 dielectric layer | |
| CN106475160B (en) | A kind of cell based on traveling wave dielectrophoresis and particle separating chips and the preparation method and application thereof | |
| US20220297122A1 (en) | Microfluidic assembly for surface acoustic wave particle manipulation | |
| CN116393183A (en) | Microfluidic device for particle sorting based on phonon crystal structure | |
| CN207703706U (en) | It is a kind of based on lateral opening and dumbbell optical fiber all -fiber micro flow chip | |
| CN207728534U (en) | A kind of micro-fluidic transfer tube based on piezoelectric ceramics | |
| Shu et al. | An improved bulk acoustic waves chip based on a PDMS bonding layer for high-efficient particle enrichment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |