CN109002587A - A kind of two-sided layout design method, two-sided domain and two-sided layerout cutting method - Google Patents
A kind of two-sided layout design method, two-sided domain and two-sided layerout cutting method Download PDFInfo
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- CN109002587A CN109002587A CN201810662185.0A CN201810662185A CN109002587A CN 109002587 A CN109002587 A CN 109002587A CN 201810662185 A CN201810662185 A CN 201810662185A CN 109002587 A CN109002587 A CN 109002587A
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- 238000005520 cutting process Methods 0.000 title claims abstract description 46
- 238000000034 method Methods 0.000 title claims abstract description 38
- 239000010409 thin film Substances 0.000 abstract description 7
- 238000010586 diagram Methods 0.000 description 7
- 238000003698 laser cutting Methods 0.000 description 5
- 230000001788 irregular Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/392—Floor-planning or layout, e.g. partitioning or placement
Abstract
The embodiment of the invention discloses a kind of two-sided layout design methods, belong to thin film circuit processing technique field.This method comprises: being combined to the design configuration for needing typesetting, the identical design configuration of 4 shapes constitutes a unit, and the graph area of 4 design configurations in a unit is about horizontally and vertically symmetrical；Design configuration is respectively placed in four graph areas of a unit, it is overlapped it with graph area shape, any two design configuration is arranged in front domain in one unit, other two design configuration is arranged in reverse side domain, the projection of frontal design figure and reverse side design configuration is about horizontally and vertically symmetrically, reverse side active graphical area and front active graphical area be not be overlapped；Multiple units are subjected to array typesetting, complete the front and back sides graphic designs of monolith domain.Using above-described embodiment, reduce the quantity of cutting-up Cutting Road, reduce the time of shape cutting, improve the efficiency of shape cutting, improves the type quality of wedge angle position.
Description
Technical field
The present invention relates to thin film circuit processing technique field, in particular to a kind of layout design method, further relate to it is a kind of by
According to the two-sided domain that this method is related to, a kind of method cut to the two-sided domain is further related to.
Background technique
In microwave and millimeter wave thin film circuit, needs first to carry out typesetting design to design circuit, then carry out processing system again
Make, in the layout design process, needs to comprehensively consider the utilization rate of substrate, the operability of processing procedure and convenience, later period shape
Efficiency of cutting etc..
Correct layout design can with it is effectively guaranteed that in thin film circuit later stage work physical Design and implementation it is smooth into
Row, in terms of the Optimality for guaranteeing electronic device, being promoted, the quality of layout design be highly important influence because
Element.But it is directed to the layout design of certain irregular figures, design configuration as shown in Figure 1, common domain type-setting mode such as Fig. 2
It is shown, in circuit manufacture procedure, when cutting profile, need then to recycle scribing machine first with the shape of laser machine cutting bevel edges
Cutting-up label along X, Y-axis carries out cutting-up, to obtain required shape.Although this type-setting mode can guarantee that substrate is filled
Divide and utilize, but cutting efficiency is low, and cutting-up is likely to result in the shape generation defect of wedge angle position.To guarantee cutting
Type quality drops then arrangement mode cannot arrange the circuit of identical quantity as shown in Figure 2 so as to cause the utilization rate of substrate
It is low.
Therefore, while how guaranteeing thin film circuit layout design utilization rate and type quality, and meet cutting process
Operability and efficiency are current urgent problems to be solved.
Summary of the invention
The embodiment of the invention provides a kind of two-sided layout design method, two-sided domain and two-sided layerout cutting methods, protect
While demonstrate,proving thin film circuit layout design utilization rate and type quality, and meet the operability and efficiency of cutting process.
According to the first aspect of the invention, a kind of two-sided layout design method is provided.
In some optional embodiments, the two-sided layout design method includes the following steps:
The design configuration for needing typesetting is combined, the identical design configuration of 4 shapes constitutes a unit, a list
The graph area of 4 design configurations in member is about horizontally and vertically symmetrical；
Design configuration is respectively placed in four graph areas of a unit, is overlapped it with graph area shape, a list
Any two design configuration is arranged in front domain in member, and other two design configuration is arranged in reverse side domain, frontal design figure
The projection of shape and reverse side design configuration is about horizontally and vertically symmetrically, reverse side active graphical area is not weighed with front active graphical area
It is folded；
Multiple units are subjected to array typesetting, complete the front and back sides graphic designs of monolith domain.
Using above-mentioned alternative embodiment, reduce the quantity of cutting-up Cutting Road, and the distance laser machined and previous row
Version mode is identical, so reducing the time of shape cutting, improves the efficiency of shape cutting.
According to the second aspect of the invention, a kind of two-sided domain is provided.
In some optional embodiments, the two-sided domain is designed according to the two-sided layout design method.
According to the third aspect of the invention we, a kind of two-sided layerout cutting method is provided.
In some optional embodiments, the two-sided layerout cutting method is for processing the two-sided domain, in processing electricity
It when the shape of road, is cut first with laser machine along cutting track, after cutting, then with cutting-up machine according to cutting-up label edge stroke
Butt to carry out cutting-up.
Using above-mentioned alternative embodiment, wedge angle position all using laser cutting, can guarantee consistent cutting error and
Angular profile molding, improves the type quality of wedge angle position.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is irregular shape design configuration schematic diagram；
Fig. 2 is the domain type-setting mode schematic diagram of existing irregular shape；
Fig. 3 is the schematic diagram of one optional embodiment in assembled unit graph area of two-sided layout design method；
Fig. 4 is the schematic diagram of one optional embodiment of front description unit of two-sided layout design method；
Fig. 5 is the schematic diagram of an optional embodiment of front domain array typesetting；
Fig. 6 is the schematic diagram of one optional embodiment of reverse side pattern unit of two-sided layout design method；
Fig. 7 is the schematic diagram of an alternative embodiment of the shape cutting track of two-sided layerout cutting method；
Fig. 8 is the flow chart of an alternative embodiment of two-sided layout design method；
Wherein, 701,702 it is front design configuration, 703,704 be reverse side design configuration, 707 be cutting-up label, 705 is
Laser cutting trajectory line, 706 be cutting-up direction, 801 be front graphic element, 802 be reverse side pattern unit.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Fig. 8 shows an alternative embodiment of the two-sided layout design method.
In the alternative embodiment, the two-sided layout design method includes the following steps:
Step 101, the design configuration for needing typesetting is combined, the identical design configuration of 4 shapes constitutes a list
Member, the graph area of 4 design configurations in a unit is about horizontally and vertically symmetrical.
Fig. 3 shows an optional embodiment of the step 101.
In the optional embodiment, design configuration is non-rectangle irregular shape figure, such as design configuration shown in Fig. 4
701, using the shape of design configuration 701 as original figure area A, graph area A is subjected to axial symmetry along x-axis first, forms graph area
Then graph area A and graph area B is carried out axial symmetry along y-axis, graph area C and graph area D is formed, to obtain 4 shapes by B
Identical graph area A, B, C, D.It is of course also possible to which graph area A is carried out axial symmetry rotation distribution along y-axis first, figure is formed
Then graph area A and D is carried out axial symmetry rotation distribution along x-axis, graph area B and C is formed, to obtain 4 shape phases by area D
Same graph area A, B, C, D.
Step 102, design configuration is respectively placed in four graph areas A, B, C, D of a unit, makes itself and graph area
A, B, C, D shape are overlapped, and any two design configuration is arranged in front domain, other two design configuration arrangement in a unit
In reverse side domain, the projection of frontal design figure and reverse side design configuration is about horizontally and vertically symmetrical, reverse side active graphical area
It is not be overlapped with front active graphical area.
Fig. 3, Fig. 4 and Fig. 6 show an optional embodiment of the step 102.
In the optional embodiment, design configuration 701 is first placed in graph area A, is overlapped it with graph area A shape,
By design configuration along center basic point rotate 180 degree, by rotate 180 degree after design configuration 702 be placed in graph area C, make its with
Graph area C shape is overlapped, and the design configuration of graph area A and graph area C are combined into front description unit 801；By front description
Unit 801 carries out axial symmetry along x-axis, the projection for being located at the design configuration of graph area B and graph area D is obtained, according to the throwing
Shadow is combined into reverse side pattern unit 802, front description unit in reverse side domain layout planning chart shape 703 and design configuration 704
801 and reverse side pattern unit 802 constitute a unit.
Step 103, multiple units are subjected to array typesetting, complete the front and back sides graphic designs of monolith domain.
Fig. 5 shows an optional embodiment of outer former image array typesetting.
In the optional embodiment, reverse side active graphical area is graph area B, D, the positive non-graphic region of face, front
Active graphical area is graph area A, C, the non-graphic area of face reverse side；Front and back sides array element number is consistent, and with front and back sides figure
It is aligned by alignment mark, completes front and back sides figure layout design.
Optionally, domain array typesetting rule are as follows: domain active graphical region length and width is respectively d and w, the front elevation
The length and width of shape unit (such as front description unit 801) and reverse side pattern unit (such as reverse side pattern unit 802) is respectively d1
And w1, cutting slit width f determines the line number of domain array, the maximum value M of columnsh、Nh, Mh1=[d/ (d1+ f)], Nh1=[w/
(w1+ f)], [] indicates downward round numbers, Mh1、Nh1Round numbers, Mh2=[d/ (w1+ f)], Nh2=[w/ (d1+ f)], [] indicate to
Lower round numbers, Mh2、Nh2Round numbers determines the maximum value G of domain array element numberh, Gh=max { Mh1×Nh1, Mh2×Nh2,
Middle max { } indicates to take the maximum value in two products, the line number of domain array, columns take the line number calculated when unit number maximum and
Columns.
Pervious domain array manner, cutting-up Cutting Road quantity are (Mh+Nh+ 2), according to the two-sided of above-mentioned alternative embodiment
Layout design method can make microwave and millimeter wave thin film circuit in shape process, guarantee that the quantity of circuit will not become
Under the premise of change, it is all made of laser cutting at the bevel edge of figure, does not use cutting-up machine-cut and cuts, cutting-up Cutting Road quantity is (Mh/
2+Nh+ 2), therefore reduce the quantity of cutting-up Cutting Road, and the distance laser machined with previous type-setting mode be it is identical,
So reducing the time of shape cutting, the efficiency of shape cutting is improved.
The invention also provides a kind of two-sided domain, which is designed according to the method described above.
Fig. 7 shows an alternative embodiment of two-sided layerout cutting method.
In the alternative embodiment, as shown in fig. 7, in processing circuit shape, first with laser machine along cutting track 705 into
Row cutting, after cutting, then with cutting-up machine carries out cutting-up along cutting-up direction 706 according to cutting-up label 704.Cutting-up is labeled as
" ten " word mark, each cutting-up label is located at the center of X, Y-direction Cutting Road, and the width marked is slightly less than Cutting Road
Width.
In pervious domain type-setting mode, the cutting of figure wedge angle position needs the bevel edge first with laser cutting shape,
Then cutting-up machine-cut is reused to cut, cutting-up machine-cut, which is cut, can generate offset error, Cutting Road to bevel edge direction deviate, extremely it is possible that
Wedge angle position is switched to, the shape in the region is destroyed, according to the two-sided layerout cutting method of above-mentioned alternative embodiment, wedge angle position
All using laser cutting, it can guarantee consistent cutting error and angular profile molding, improve the outer form quality of wedge angle position
Amount.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Within mind and principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (5)
1. a kind of two-sided layout design method, which comprises the steps of:
The design configuration for needing typesetting is combined, 4 shapes, one unit of identical design configuration composition, in a unit
4 design configurations graph area about horizontally and vertically symmetrical；
Design configuration is respectively placed in four graph areas of a unit, is overlapped it with graph area shape, in a unit
Any two design configuration is arranged in front domain, and other two design configuration is arranged in reverse side domain, frontal design figure with
The projection of reverse side design configuration is about horizontally and vertically symmetrically, reverse side active graphical area and front active graphical area be not be overlapped；
Multiple units are subjected to array typesetting, complete the front and back sides graphic designs of monolith domain.
2. a kind of two-sided layout design method as described in claim 1, which is characterized in that the array typesetting rule are as follows:
Domain active graphical region length and width is respectively d and w, the length and width difference of the front description unit and reverse side pattern unit
For d1And w1, cutting slit width f determines the line number of domain array, the maximum value of columns, for front domain, Mh1=[d/ (d1+
F)], Nh1=[w/ (w1+ f)], [] indicates downward round numbers, for reverse side domain, Mh2=[d/ (w1+ f)], Nh2=[w/ (d1+
F)], [] indicates downward round numbers；Determine the maximum value G of domain array element numberh, Gh=max { Mh1×Nh1, Mh2×Nh2,
Middle max { } indicates to take the maximum value in two products, the line number of domain array, columns take the line number calculated when unit number maximum and
Columns.
3. a kind of two-sided domain, which is designed according to the method as described in claims 1 or 2.
4. a kind of two-sided layerout cutting method, for processing two-sided domain as claimed in claim 3, which is characterized in that processing
It when circuit shape, is cut first with laser machine along cutting track, after cutting, then with cutting-up machine according to cutting-up label edge
Cutting-up direction carries out cutting-up.
5. a kind of two-sided layerout cutting method as claimed in claim 4, which is characterized in that
Cutting-up is labeled as " ten " word mark, and each cutting-up label is located at the center of X, Y-direction Cutting Road, and the width marked
It is slightly less than the width of Cutting Road.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810662185.0A CN109002587A (en) | 2018-06-25 | 2018-06-25 | A kind of two-sided layout design method, two-sided domain and two-sided layerout cutting method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810662185.0A CN109002587A (en) | 2018-06-25 | 2018-06-25 | A kind of two-sided layout design method, two-sided domain and two-sided layerout cutting method |
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| CN109002587A true CN109002587A (en) | 2018-12-14 |
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| CN201810662185.0A Pending CN109002587A (en) | 2018-06-25 | 2018-06-25 | A kind of two-sided layout design method, two-sided domain and two-sided layerout cutting method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117077611A (en) * | 2023-10-13 | 2023-11-17 | 青岛展诚科技有限公司 | Integrated circuit layout graph cutting method |
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Cited By (2)
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| CN117077611B (en) * | 2023-10-13 | 2024-01-23 | 青岛展诚科技有限公司 | Integrated circuit layout graph cutting method |
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