CN109000713A - A kind of mold monitoring system - Google Patents
A kind of mold monitoring system Download PDFInfo
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- CN109000713A CN109000713A CN201810555157.9A CN201810555157A CN109000713A CN 109000713 A CN109000713 A CN 109000713A CN 201810555157 A CN201810555157 A CN 201810555157A CN 109000713 A CN109000713 A CN 109000713A
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- fluid
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- alarm
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The invention discloses a kind of mold monitoring systems, comprising: temperature sensor, pressure sensor, flow sensor and viscosity transducer in mold runner, and the mold monitor on mold；Mold monitor is equipped with molding count detection module, data memory module, mold state analyzing module, mold locating module and communication module.Inventive die monitoring system, the molding number of energy supervision molding, moreover it is possible to the fluid temperature (F.T.) in mold runner, Fluid pressure, fluid flow, fluid viscosity are monitored, and identification positioning is carried out to mold convenient for external equipment.
Description
Technical field
The present invention relates to a kind of mold monitoring systems.
Background technique
The use of mold needs to monitor, and such as needs the molding number of supervision molding, to grasp whether mold exceeds use
Service life, in addition, fluid temperature (F.T.), Fluid pressure in mold runner, fluid flow, fluid viscosity are also required to monitor, these factors
Also it will affect the service life of mold.
Summary of the invention
The purpose of the present invention is to provide a kind of mold monitoring system, the molding numbers of energy supervision molding, moreover it is possible to mould
Fluid temperature (F.T.), Fluid pressure in tool runner, fluid flow, fluid viscosity are monitored.
To achieve the above object, the technical scheme is to design a kind of mold monitoring systems, comprising:
Temperature sensor in mold runner detects the temperature of fluid in mold runner, and outward detected by output
Fluid temperature data；
Pressure sensor in mold runner detects the pressure of fluid in mold runner, and outward detected by output
Fluid pressure data；
Flow sensor in mold runner detects the flow of fluid in mold runner, and outward detected by output
Fluid flow data；
Viscosity transducer in mold runner detects the viscosity of fluid in mold runner, and outward detected by output
Fluid viscosity data；
And the mold monitor on mold, it is equipped with molding count detection module, data memory module, mold state point
Analyse module and communication module；
The molding count detection module, detects the molding number of mold, and exports detected mold clamping time outward
Number data；
The data memory module, receive and store above-mentioned fluid temperature data, fluid pressure data, fluid flow data,
Fluid viscosity data and mold clamping number data；
The mold state analyzing module, transferred from data memory module above-mentioned fluid temperature data, fluid pressure data,
Fluid flow data, fluid viscosity data and mold clamping number data, and judge fluid temperature data, fluid pressure data,
Whether fluid flow data, fluid viscosity data and mold clamping number data are exceeded, when judging that fluid temperature data is exceeded
When the outside exceeded signal of output fluid temperature, the outside exceeded letter of output fluid pressure when judging that fluid pressure data is exceeded
Number, the exceeded signal of fluid flow is exported outward when judging fluid flow superscalar data, when judging that fluid viscosity data are super
Fluid viscosity exceeded signal is exported when mark outward, the outside output mask molding time when judging mold clamping number superscalar data
The exceeded signal of number；
The communication module, be used for to external device communication, and to external equipment send the exceeded signal of above-mentioned fluid temperature (F.T.),
The exceeded signal of Fluid pressure, the exceeded signal of fluid flow, the exceeded signal of fluid viscosity and the exceeded signal of mold clamping number.
Preferably, the exceeded alarm of fluid temperature (F.T.), the exceeded alarm of Fluid pressure, fluid flow are additionally provided on the mold
The exceeded alarm of exceeded alarm, fluid viscosity and the exceeded alarm of mold clamping number；
The exceeded alarm of fluid temperature (F.T.), by the exceeded signal triggering alarm of above-mentioned fluid temperature (F.T.)；
The exceeded alarm of Fluid pressure, by the exceeded signal triggering alarm of above-mentioned Fluid pressure；
The exceeded alarm of fluid flow, by the exceeded signal triggering alarm of above-mentioned fluid flow；
The exceeded alarm of fluid viscosity, by the exceeded signal triggering alarm of above-mentioned fluid viscosity；
The exceeded alarm of mold clamping number, by the exceeded signal triggering alarm of above-mentioned mold clamping number.
Preferably, the mold monitor is additionally provided with the mold locating module connecting with communication module；External equipment can lead to
Communication module inquiry mold locating module is crossed, identification positioning is carried out to mold.
Advantages and advantages of the present invention are to provide a kind of mold monitoring system, the molding time of energy supervision molding
Number, moreover it is possible to the fluid temperature (F.T.) in mold runner, Fluid pressure, fluid flow, fluid viscosity are monitored, and convenient for outside
Equipment carries out identification positioning to mold.
Specific embodiment
With reference to embodiment, the specific embodiment of the present invention is further described.Following embodiment is only used for more
Add and clearly demonstrate technical solution of the present invention, and not intended to limit the protection scope of the present invention.
The technical solution that the present invention embodies is:
A kind of mold monitoring system, comprising:
Temperature sensor in mold runner detects the temperature of fluid in mold runner, and outward detected by output
Fluid temperature data；
Pressure sensor in mold runner detects the pressure of fluid in mold runner, and outward detected by output
Fluid pressure data；
Flow sensor in mold runner detects the flow of fluid in mold runner, and outward detected by output
Fluid flow data；
Viscosity transducer in mold runner detects the viscosity of fluid in mold runner, and outward detected by output
Fluid viscosity data；
And the mold monitor on mold, it is equipped with molding count detection module, data memory module, mold state point
Analyse module and communication module；
The molding count detection module, detects the molding number of mold, and exports detected mold clamping time outward
Number data；
The data memory module, receive and store above-mentioned fluid temperature data, fluid pressure data, fluid flow data,
Fluid viscosity data and mold clamping number data；
The mold state analyzing module, transferred from data memory module above-mentioned fluid temperature data, fluid pressure data,
Fluid flow data, fluid viscosity data and mold clamping number data, and judge fluid temperature data, fluid pressure data,
Whether fluid flow data, fluid viscosity data and mold clamping number data are exceeded, when judging that fluid temperature data is exceeded
When the outside exceeded signal of output fluid temperature, the outside exceeded letter of output fluid pressure when judging that fluid pressure data is exceeded
Number, the exceeded signal of fluid flow is exported outward when judging fluid flow superscalar data, when judging that fluid viscosity data are super
Fluid viscosity exceeded signal is exported when mark outward, the outside output mask molding time when judging mold clamping number superscalar data
The exceeded signal of number；
The communication module, be used for to external device communication, and to external equipment send the exceeded signal of above-mentioned fluid temperature (F.T.),
The exceeded signal of Fluid pressure, the exceeded signal of fluid flow, the exceeded signal of fluid viscosity and the exceeded signal of mold clamping number.
Preferably, the exceeded alarm of fluid temperature (F.T.), the exceeded alarm of Fluid pressure, fluid flow are additionally provided on the mold
The exceeded alarm of exceeded alarm, fluid viscosity and the exceeded alarm of mold clamping number；
The exceeded alarm of fluid temperature (F.T.), by the exceeded signal triggering alarm of above-mentioned fluid temperature (F.T.)；
The exceeded alarm of Fluid pressure, by the exceeded signal triggering alarm of above-mentioned Fluid pressure；
The exceeded alarm of fluid flow, by the exceeded signal triggering alarm of above-mentioned fluid flow；
The exceeded alarm of fluid viscosity, by the exceeded signal triggering alarm of above-mentioned fluid viscosity；
The exceeded alarm of mold clamping number, by the exceeded signal triggering alarm of above-mentioned mold clamping number.
Preferably, the mold monitor is additionally provided with the mold locating module connecting with communication module；External equipment can lead to
Communication module inquiry mold locating module is crossed, identification positioning is carried out to mold.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, without departing from the technical principles of the invention, several improvements and modifications can also be made, these improvements and modifications
Also it should be regarded as protection scope of the present invention.
Claims (3)
1. a kind of mold monitoring system characterized by comprising
Temperature sensor in mold runner detects the temperature of fluid in mold runner, and outward detected by output
Fluid temperature data；
Pressure sensor in mold runner detects the pressure of fluid in mold runner, and outward detected by output
Fluid pressure data；
Flow sensor in mold runner detects the flow of fluid in mold runner, and outward detected by output
Fluid flow data；
Viscosity transducer in mold runner detects the viscosity of fluid in mold runner, and outward detected by output
Fluid viscosity data；
And the mold monitor on mold, it is equipped with molding count detection module, data memory module, mold state point
Analyse module and communication module；
The molding count detection module, detects the molding number of mold, and exports detected mold clamping time outward
Number data；
The data memory module, receive and store above-mentioned fluid temperature data, fluid pressure data, fluid flow data,
Fluid viscosity data and mold clamping number data；
The mold state analyzing module, transferred from data memory module above-mentioned fluid temperature data, fluid pressure data,
Fluid flow data, fluid viscosity data and mold clamping number data, and judge fluid temperature data, fluid pressure data,
Whether fluid flow data, fluid viscosity data and mold clamping number data are exceeded, when judging that fluid temperature data is exceeded
When the outside exceeded signal of output fluid temperature, the outside exceeded letter of output fluid pressure when judging that fluid pressure data is exceeded
Number, the exceeded signal of fluid flow is exported outward when judging fluid flow superscalar data, when judging that fluid viscosity data are super
Fluid viscosity exceeded signal is exported when mark outward, the outside output mask molding time when judging mold clamping number superscalar data
The exceeded signal of number；
The communication module, be used for to external device communication, and to external equipment send the exceeded signal of above-mentioned fluid temperature (F.T.),
The exceeded signal of Fluid pressure, the exceeded signal of fluid flow, the exceeded signal of fluid viscosity and the exceeded signal of mold clamping number.
2. mold monitoring system according to claim 1, which is characterized in that it is exceeded to be additionally provided with fluid temperature (F.T.) on the mold
The exceeded alarm of alarm, Fluid pressure, the exceeded alarm of fluid flow, the exceeded alarm of fluid viscosity and mold clamping number
Exceeded alarm；
The exceeded alarm of fluid temperature (F.T.), by the exceeded signal triggering alarm of above-mentioned fluid temperature (F.T.)；
The exceeded alarm of Fluid pressure, by the exceeded signal triggering alarm of above-mentioned Fluid pressure；
The exceeded alarm of fluid flow, by the exceeded signal triggering alarm of above-mentioned fluid flow；
The exceeded alarm of fluid viscosity, by the exceeded signal triggering alarm of above-mentioned fluid viscosity；
The exceeded alarm of mold clamping number, by the exceeded signal triggering alarm of above-mentioned mold clamping number.
3. mold monitoring system according to claim 2, which is characterized in that the mold monitor is additionally provided with and communicates mould
The mold locating module of block connection；External equipment can inquire mold locating module by communication module, and it is fixed identify to mold
Position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810555157.9A CN109000713A (en) | 2018-06-01 | 2018-06-01 | A kind of mold monitoring system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810555157.9A CN109000713A (en) | 2018-06-01 | 2018-06-01 | A kind of mold monitoring system |
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| CN109000713A true CN109000713A (en) | 2018-12-14 |
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| CN201810555157.9A Pending CN109000713A (en) | 2018-06-01 | 2018-06-01 | A kind of mold monitoring system |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102213667A (en) * | 2011-03-21 | 2011-10-12 | 浙江工业大学 | Measurement and control system oriented to solid-liquid two-phase soft grain flow precision processing |
| CN103817890A (en) * | 2014-03-19 | 2014-05-28 | 常州大学 | Data acquisition and feedback system for injection mold |
| CN204894446U (en) * | 2015-08-06 | 2015-12-23 | 四川省宜宾普什模具有限公司 | Injection mold monitoring device and intelligent management system thereof |
| CN205705170U (en) * | 2016-04-12 | 2016-11-23 | 深圳亿加智能系统有限公司 | A kind of Multi-channel hot runner drives module, controller and control system |
| CN205722293U (en) * | 2016-05-27 | 2016-11-23 | 上海弘圣电子科技有限公司 | Mould countdown warning device |
| CN107479480A (en) * | 2017-10-13 | 2017-12-15 | 东莞市和镁五金有限公司 | A kind of die casting matched moulds safety in production Visualized Monitoring System and monitoring method |
-
2018
- 2018-06-01 CN CN201810555157.9A patent/CN109000713A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102213667A (en) * | 2011-03-21 | 2011-10-12 | 浙江工业大学 | Measurement and control system oriented to solid-liquid two-phase soft grain flow precision processing |
| CN103817890A (en) * | 2014-03-19 | 2014-05-28 | 常州大学 | Data acquisition and feedback system for injection mold |
| CN204894446U (en) * | 2015-08-06 | 2015-12-23 | 四川省宜宾普什模具有限公司 | Injection mold monitoring device and intelligent management system thereof |
| CN205705170U (en) * | 2016-04-12 | 2016-11-23 | 深圳亿加智能系统有限公司 | A kind of Multi-channel hot runner drives module, controller and control system |
| CN205722293U (en) * | 2016-05-27 | 2016-11-23 | 上海弘圣电子科技有限公司 | Mould countdown warning device |
| CN107479480A (en) * | 2017-10-13 | 2017-12-15 | 东莞市和镁五金有限公司 | A kind of die casting matched moulds safety in production Visualized Monitoring System and monitoring method |
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Application publication date: 20181214 |
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| RJ01 | Rejection of invention patent application after publication |