CN109000440A - A kind of silicon wafer drying device and its drying means - Google Patents
A kind of silicon wafer drying device and its drying means Download PDFInfo
- Publication number
- CN109000440A CN109000440A CN201810807276.9A CN201810807276A CN109000440A CN 109000440 A CN109000440 A CN 109000440A CN 201810807276 A CN201810807276 A CN 201810807276A CN 109000440 A CN109000440 A CN 109000440A
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- China
- Prior art keywords
- silicon wafer
- drying
- silicon chip
- frame
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B9/00—Machines or apparatus for drying solid materials or objects at rest or with only local agitation; Domestic airing cupboards
- F26B9/06—Machines or apparatus for drying solid materials or objects at rest or with only local agitation; Domestic airing cupboards in stationary drums or chambers
- F26B9/08—Machines or apparatus for drying solid materials or objects at rest or with only local agitation; Domestic airing cupboards in stationary drums or chambers including agitating devices, e.g. pneumatic recirculation arrangements
- F26B9/082—Machines or apparatus for drying solid materials or objects at rest or with only local agitation; Domestic airing cupboards in stationary drums or chambers including agitating devices, e.g. pneumatic recirculation arrangements mechanically agitating or recirculating the material being dried
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/001—Drying-air generating units, e.g. movable, independent of drying enclosure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/04—Agitating, stirring, or scraping devices
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Drying Of Solid Materials (AREA)
Abstract
This application discloses a kind of silicon wafer drying device and its drying means, are related to silicon wafer processing and manufacturing field, comprising: a kind of silicon wafer drying device, it include: a frame body, the frame body includes through-hole, and the through-hole connects inside and outside the frame body, and the through-hole is at least one；One drying unit, the drying unit include: a hair dryer, resistance heating wire, an exhaust fan；One shaking device；One apparatus for placing, the apparatus for placing include: a silicon chip drying frame, and the silicon chip drying frame is connect by the through-hole with the shaking device, solve the problems, such as that silicon wafer drying efficiency is low in the prior art.
Description
Technical field
The present invention relates to silicon wafers to fabricate field, is related specifically to a kind of silicon wafer drying device and its drying means.
Background technique
It in the process of manufacture of silicon wafer, needs that silicon wafer is dried, silicon wafer drying machine in the prior art is most
It can generate residual liquid because silicon wafer is there are tiny scratch, dent using hot wind dry-cure and silicon chip surface to be dried is residual
The liquid water film tension stayed is larger, and above-mentioned silicon wafer drying machine in the prior art is low to the drying efficiency of silicon wafer, existing skill
It is also cleaned using ultrasonic signal in art, but ultrasonic wave usually requires to apply in liquid environment, when dry to silicon wafer
It is difficult to apply, it is therefore desirable to a kind of efficient silicon wafer drying device.
Such as notification number be CN 205903720U China it is practical it is new in, disclose a kind of with bag-type dust function
Silicon wafer drying machine, in which: driving pulley is connect by transmission belt with driven pulley, and driven pulley is coaxially connected with transmission wheel,
Transmission wheel and transmission band connection, body are fixedly connected with partition, and partition is equipped with stomata, and blower is connected by air inlet pipe and heater
Logical, heater is connected to by intake stack with body, and body is connected to cloth bag by wind pipe to dry silicon wafer.On but
State in technical solution, only unilaterally is dry to silicon wafer by air inlet and heater heating flowing gas, due to scratch in silicon wafer,
Residual liquid in dent, and due to the surface tension effects of residual liquid film in silicon wafer, when drying residual liquid, liquid exists
Degree of volatility in dry gas is smaller, causes the drying efficiency to silicon wafer low.
Summary of the invention
The application first purpose is to provide a kind of silicon wafer drying device, solves that silicon wafer drying efficiency is low in the prior art asks
Topic, using a kind of silicon wafer drying device of the application, with silicon chip surface easy to clean similar to the residual liquid of scratch, dent etc.,
And the surface tension of silicon chip surface residual liquid film can be destroyed, so that residual liquid in silicon wafer is sufficiently volatilized and the fully gas with heat
Body contact, has the effect of high to silicon wafer drying efficiency.The second purpose of the application be to provide it is a kind of with solve technical problem it
A kind of one corresponding drying means of silicon wafer drying device.
To reach one of above-mentioned purpose, the embodiment of the present application uses following technical scheme:
A kind of silicon wafer drying device a, comprising: frame body, the frame body include through-hole, and the through-hole connects in the frame body
Outside, the through-hole is at least one；One drying unit, the drying unit include: a hair dryer 1, and resistance heating wire 2, and one takes out
Blower 3；One shaking device；One apparatus for placing, the apparatus for placing include: a silicon chip drying frame 4, and the silicon chip drying frame 4 is logical
The through-hole is crossed to connect with the shaking device.
In the above-mentioned technical solutions, the embodiment of the present application resistance heating wire 2, is taken out by setting shaking device, hair dryer 1
Blower 3, shaking device solve the problems, such as that silicon wafer drying efficiency is low in the prior art.In the present embodiment, pass through shaking device
Vibration to silicon wafer makes silicon wafer remaining fluid thrill, is blown into dry gas by hair dryer 1, gas contact resistance heater strip 2 adds
Heat, dry silicon wafer, exhaust fan 3 extract hot and humid gas out, reduce the intracorporal humidity of frame, make gas of the residual liquid fully with heat
Contact, sufficiently dries silicon wafer by drying unit.
Further, according to the embodiment of the present application, wherein the bottom of the frame body, the pumping is arranged in the hair dryer 1
The top of the frame body is arranged in blower 3, accelerates gaseous exchange.
Further, according to the embodiment of the present application, wherein the resistance heating wire 2 includes being arranged in the frame body
The top of wall and the hair dryer 1, and be arranged in 1 top of the hair dryer the resistance heating wire 2 and the hair dryer 1 it
Between there are gaps not to contact, so that gas is sufficiently contacted heating with resistance heating wire 2.
Further, according to the embodiment of the present application, wherein the shaking device includes a ultrasonic equipment 5, a ultrasonic wave
Energy converter 6, the ultrasonic transducer 6 are connect with the ultrasonic equipment 5 by electric wire, an amplitude transformer 7, the amplitude transformer 7
One end is connect with the ultrasonic transducer 6, and the other end passes through the through-hole and connect with the silicon chip drying frame 4, ultrasonic waves
Energy device 6 converts ultrasonic energy as mechanical energy, and amplitude transformer 7 and ultrasonic transducer 6 drive silicon wafer to dry to transmit mechanical shock
It quarrels silicon wafer in 4 to shake, reaches cleaning silicon wafer surface similar to the residual liquid in scratch, dent etc., and silicon chip surface can be destroyed
The surface tension of residual liquid film.
Further, according to the embodiment of the present application, wherein there are gap, institutes between the through-hole and the amplitude transformer 7
It states and is provided with woolliness material 8 in gap.Heat losses in frame body are completely cut off by woolliness material 8 and will not make because of amplitude transformer 7
Vibration generates the adverse effect with through-hole.
Further, according to the embodiment of the present application, wherein the silicon chip drying frame 4 includes: a silicon chip drying frame entrance
401；One silicon chip drying frame air intake vent 402,401 inside of the silicon chip drying frame entrance with inside silicon chip drying frame air intake vent 402
It is connected.Silicon wafer is placed by silicon chip drying frame entrance 401, silicon chip drying frame air intake vent 402 is passed through the drying silicon wafer of heat.
Further, according to the embodiment of the present application, wherein be provided with a door-plate at the top of the frame body, set on the door-plate
Hot air vents are equipped with, so that frame body is opened to be put into silicon wafer, humid air is accelerated to be pulled out frame body.
Further, according to the embodiment of the present application, wherein be provided with a shaft 9 at the top of the frame body；The door-plate
It is movably connect by the shaft 9 with frame body, is easily opened door-plate.
Further, according to the embodiment of the present application, wherein the door-plate has a door handle 10, and door-plate is facilitated to open and close.
To achieve the above object two, the embodiment of the present application the technical solution adopted is as follows:
A kind of drying means of silicon wafer drying device, comprising the following steps:
(1) step 1: pull handle 10, opens door-plate, from the silicon chip drying frame entrance for being set to 4 center of silicon chip drying frame
401 are put into silicon wafer to be dried, reclose door-plate；
(2) step 2: 2 electrified regulation of resistance heating wire, while hair dryer 1 and exhaust fan 3 being opened, the hair dryer 1 to
On be blown into gas, gas first passes around the heating of resistance heating wire 2, and gas is blown into the dry silicon wafer of silicon chip drying frame air intake vent 402 again,
The last exhaust fan 3 will more clammy gas extraction；
(3) step 3: starting ultrasonic equipment 5, starts ultrasonic transducer 6, the ultrasonic equipment 5 issues ultrasonic wave
Ultrasonic wave is converted into the mechanical shock of amplitude transformer 7 by signal, the ultrasonic transducer 6, and the amplitude transformer 7 drives silicon chip drying
Silicon wafer in frame 4 does small vibration, and the ultrasonic equipment 5 was worked with two minutes, intermittent loading method work in one minute；
(4) step 4: pull handle 10, opens door-plate for dried silicon chip extracting and repeat above operation step.
In the above-mentioned technical solutions, the application passes through ultrasonic equipment 5, ultrasonic transducer 6, conducting wire, amplitude transformer first
7, ultrasonic wave is propagated, is converted into small vibration to silicon wafer by through-hole, drying unit, makes residual in the tiny scratch of silicon wafer, dent
Liquid storage body is detached from silicon wafer by vibration, and by the surface tension of small vibration limits silicon chip surface residual liquid film, makes residual
Liquid stay is more likely to volatilize, and completely cuts off through-hole heat losses by woolliness material 8, and the vibration and through-hole for being also prevented from amplitude transformer 7 act on
Adverse effect is generated, heating and clammy gas to dry gas are completed secondly by hair dryer 1, resistance heating wire 2, exhaust fan 3
Detaching for body accelerates drying to silicon wafer, be arranged in the frame body inner wall Resistant heating dried silicon wafer with wetly and
The lower gas of temperature, the gas temperature decline that can prevent the gaseous exchange generated by vibration from generating, resistance heating wire and vibration
Device, which combines, can be only achieved the effect for accelerating dry silicon wafer, is in the prior art usually only to be arranged above hair dryer 1, finally leads to
The dry gas drying that the silicon wafer being placed at silicon chip drying frame entrance 401 is passed into silicon chip drying frame air intake vent 402 is crossed, is solved
The low problem of silicon wafer drying efficiency in the prior art has achieved the effect that improve the drying to silicon wafer.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples.
Fig. 1 is a kind of silicon wafer drying device structural schematic diagram of the present invention.
Fig. 2 is the structural schematic diagram of silicon chip drying frame in the application.
In attached drawing
1, hair dryer 2, resistance heating wire 3, exhaust fan
4, silicon chip drying frame 401, silicon chip drying frame entrance 402, silicon chip drying frame air intake vent
5, ultrasonic equipment 6, ultrasonic transducer 7, amplitude transformer
8, woolliness material 9, shaft 10, handle
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to embodiments, this place is retouched
The specific embodiment stated is only used to explain the application, is not used to limit the application.In the description of the present application, need to illustrate
It is that the orientation or positional relationship of the instructions such as term " top ", " bottom ", "upper", "lower", "left", "right", "inner", "outside" is base
In orientation or positional relationship shown in the drawings, it is merely for convenience of description the application and simplifies description, rather than indication or suggestion
Signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as to this
The limitation of application.
As shown in Figure 1, present embodiment discloses a kind of silicon wafer drying device, including: a frame body, the frame body include
Through-hole, the through-hole connect inside and outside the frame body, and through-hole is at least one；One shaking device, the shaking device include: a ultrasonic wave
Equipment 5, a ultrasonic transducer 6, ultrasonic transducer 6 are connect with ultrasonic equipment 5 by electric wire, an amplitude transformer 7, the luffing
7 one end of bar is connect with ultrasonic transducer 6, and the other end passes through through-hole, there are gap between through-hole and amplitude transformer 7, is set in gap
It is equipped with woolliness material 8, the woolliness material 8 temperature insulating material soft using heat-preservation cotton etc., which fills full gap, by logical
Hole connection frame inside and outside, ultrasonic transducer 6 convert ultrasonic energy as mechanical energy, amplitude transformer 7 and ultrasonic transducer 6 to
Mechanical shock is transmitted, woolliness material 8 completely cuts off the heat losses in through-hole, and prevents the vibration of amplitude transformer 7 to the bad of frame body etc.
It influences；One apparatus for placing, the apparatus for placing include: a silicon chip drying frame 4, silicon chip drying frame entrance 401, silicon chip drying frame inlet air
Mouthfuls 402,401 inside of silicon chip drying frame entrance be connected inside silicon chip drying frame air intake vent 402, stoving rack 4 is at least arranged
There is one group, silicon chip drying frame entrance 401 places silicon wafer to be dried, which connect with amplitude transformer 7, by amplitude transformer 7
Mechanical shock is conducted to silicon chip drying frame 4, and the remaining liquid in the tiny scratch of silicon wafer, dent is made to be detached from silicon wafer by vibration, with
And the surface tension by small vibration limits silicon chip surface residual liquid film, it is more likely to volatilize residual liquid, which dries
The dry gas that air intake vent 402 is passed through heat is quarreled, which can be nitrogen etc., by the liquid gasification in silicon wafer, and take away this
The liquid of gasification；The bottom of frame body is arranged in one drying unit, a hair dryer 1, hair dryer 1, and resistance heating wire 2, an exhaust fan
3, the top of frame body is arranged in exhaust fan 3, which is oppositely arranged with exhaust fan 3, and hair dryer 1 is blown into dry room temperature gas
Body, resistance heating wire 2 heat the gas of the gas being blown into and cooling, and exhaust fan 3 takes the gas for having had liquefied gas in silicon wafer away
Body reduces air humidity in frame body；Resistance heating wire 2 includes the top that frame body inner wall and hair dryer 1 is arranged in, the resistance of surrounding
Heater strip 2 makes the air of flowing be maintained at certain high temperature, and resistance heating wire 2 and the hair dryer 1 of 1 top of hair dryer is arranged in
Between there are gaps not to contact, so that the gas at normal temperature being passed through fully is contacted heating with resistance heating wire 2；It is set at the top of the frame body
Be equipped with: a door-plate, a shaft 9, the door-plate are movably connect by shaft 9 with frame body, and door-plate has a door handle 10, pass through door-plate
Facilitate folding with the handle 10 on shaft 9 and door-plate, reaches and be conveniently put into and take out silicon wafer, be provided with hot air vents on door-plate, just
It will more clammy gas extraction in exhaust fan 3.
More specifically, as shown in Fig. 2, in the present embodiment, the upper of silicon chip drying frame 4 is arranged in silicon chip drying frame entrance 401
The upside of silicon chip drying frame 4 is arranged in side, silicon chip drying frame air intake vent 402, and the direction of silicon chip drying frame entrance 401 corresponds to frame body
The door-plate at top, 402 direction of silicon chip drying frame air intake vent correspond to the hair dryer 1 of frame body bottom；Silicon chip drying frame air intake vent 402 is set
Air intake vent there are two setting, the opposite two sides that silicon chip drying frame entrance 401 is set of the two air intake vents；Pass through silicon chip drying frame
Entrance 401 is put into silicon wafer, and the gas for the heat being blown into from silicon chip drying frame air intake vent 402 flows through the two sides of silicon wafer, is passed through from two sides
Gas reduces gas turbulence caused by vibration, increases the contact area of silicon wafer and gas, accelerates the volatilization of residual liquid, add
The drying of fast silicon wafer.
As shown in Figs. 1-2, a kind of drying means of silicon wafer drying device, comprising the following steps:
(1) step 1: pull handle 10, opens door-plate, from the silicon chip drying frame entrance for being set to 4 center of silicon chip drying frame
401 are put into silicon wafer to be dried, reclose door-plate；
(3) step 2: 2 electrified regulation of resistance heating wire, while hair dryer 1 and exhaust fan 3 being opened, the hair dryer 1 to
On be blown into gas, gas first passes around the heating of resistance heating wire 2, and gas is blown into the dry silicon wafer of silicon chip drying frame air intake vent 402 again,
The last exhaust fan 3 will more clammy gas extraction；
(2) step 3: starting ultrasonic equipment 5, starts ultrasonic transducer 6, the ultrasonic equipment 5 issues ultrasonic wave
Signal, the ultrasonic transducer 6 shake the milli machine that ultrasonic wave is converted into amplitude transformer 7, and the amplitude transformer 7 drives silicon wafer
Silicon wafer in stoving rack 4 does small vibration, and the ultrasonic equipment 5 was worked with two minutes, one minute intermittent loading method work
Make；
(4) step 4: pull handle 10, opens door-plate for dried silicon chip extracting and repeat above operation step.
Present embodiment discloses a kind of silicon wafer drying devices, pass through ultrasonic equipment 5, ultrasonic transducer 6, conducting wire, change
Ultrasonic wave is propagated, is converted into small vibration to silicon wafer by width bar 7, through-hole, drying unit, makes in the tiny scratch of silicon wafer, dent
Remaining liquid silicon wafer is detached from by vibration, and by the surface tension of small vibration limits silicon chip surface residual liquid film,
It is more likely to volatilize residual liquid, through-hole heat losses are completely cut off by woolliness material 8, are also prevented from vibration and the through-hole of amplitude transformer 7
Effect generates adverse effect, completes secondly by hair dryer 1, resistance heating wire 2, exhaust fan 3 to the heating of dry gas and wet
Cold air detaches the drying accelerated to silicon wafer, and silicon wafer has been dried in the heating of resistance heating wire 2 that the frame body inner wall is arranged in
With the lower gas of wetly and temperature, the gas temperature decline that can prevent the gaseous exchange generated by vibration from generating, resistance adds
Heated filament 2 can achieve the effect that accelerate dry silicon wafer in conjunction with shaking device, in the prior art be usually only to set above hair dryer 1
Resistance heating wire 2 is set, is oppositely disposed at 401 two sides of silicon chip drying frame entrance finally by from silicon chip drying frame air intake vent 402,
The gas for the heat being blown into flows through the two sides of silicon wafer, reduces the gas turbulence generated by shaking device vibration gas, makes silicon chip drying
Gas temperature at frame 4 maintains higher temperature, increases the contact area of silicon wafer and gas, accelerates the gasification finish of residual liquid,
It to reach the drying for accelerating silicon wafer, solves the problems, such as that silicon wafer drying efficiency is low in the prior art, has reached raising to silicon wafer
Drying effect.
Although the illustrative specific embodiment of the present invention is described above, in order to the technology of the art
Personnel are it will be appreciated that the present invention, but the present invention is not limited only to the range of specific embodiment, to the common skill of the art
For art personnel, as long as long as various change the attached claims limit and determine spirit and scope of the invention in, one
The innovation and creation using present inventive concept are cut in the column of protection.
Claims (10)
1. a kind of silicon wafer drying device, comprising:
One frame body, the frame body include through-hole, and the through-hole connects inside and outside the frame body, and the through-hole is at least one；
One drying unit, the drying unit include: a hair dryer (1), resistance heating wire (2), an exhaust fan (3)；
One shaking device；
One apparatus for placing, the apparatus for placing include: a silicon chip drying frame (4), and the silicon chip drying frame (4) passes through the through-hole
It is connect with the shaking device.
2. a kind of silicon wafer drying device according to claim 1, wherein the frame body is arranged in the hair dryer (1)
The top of the frame body is arranged in bottom, the exhaust fan (3).
3. a kind of silicon wafer drying device according to claim 2, wherein the resistance heating wire (2) includes being arranged in institute
State the top of frame body inner wall and the hair dryer (1), and the resistance heating wire (2) being arranged above the hair dryer (1)
There are gaps not to contact between the hair dryer (1).
4. a kind of silicon wafer drying device according to claim 1, wherein the shaking device includes:
One ultrasonic equipment (5),
One ultrasonic transducer (6), the ultrasonic transducer (6) are connect with the ultrasonic equipment (5) by electric wire,
One amplitude transformer (7), described amplitude transformer (7) one end are connect with the ultrasonic transducer (6), and the other end passes through the through-hole
It is connect with the silicon chip drying frame (4).
5. a kind of silicon wafer drying device according to claim 4, wherein stayed between the through-hole and the amplitude transformer (7)
There is gap, woolliness material (8) are provided in the gap.
6. a kind of silicon wafer drying device according to claim 1, wherein the silicon chip drying frame (4) includes:
Silicon chip drying frame entrance (401)；
Silicon chip drying frame air intake vent (402), silicon chip drying frame entrance (401) inside and silicon chip drying frame air intake vent (402)
Inside is connected, and the silicon chip drying frame (4) is dried at least provided with silicon chip drying frame entrance (401) described in one group, the silicon wafer
Quarrel air intake vent (402).
7. a kind of silicon wafer drying device according to claim 1, wherein be provided at the top of the frame body
One door-plate is provided with hot air vents on the door-plate.
8. a kind of silicon wafer drying device according to claim 7, wherein be provided at the top of the frame body
One shaft (9)；The door-plate is movably connect by the shaft (9) with frame body.
9. a kind of silicon wafer drying device according to claim 7, wherein the door-plate has a door handle (10).
10. a kind of drying means of silicon wafer drying device described in -9 according to claim 1, comprising the following steps:
(1) step 1: pull handle (10), opens door-plate, from the silicon chip drying frame entrance for being set to silicon chip drying frame (4) center
(401) silicon wafer to be dried is put into, recloses door-plate；
(2) step 2: resistance heating wire (2) electrified regulation, while hair dryer (1) and exhaust fan (3), the hair dryer being opened
(1) it is blown upward gas, gas first passes around resistance heating wire (2) heating, and hot gas is blown into again is set to the silicon wafer baking
Air intake vent (402) dry silicon wafer is quarreled, the last exhaust fan (3) will more clammy gas extraction；
(3) step 3: starting ultrasonic equipment (5), starts ultrasonic transducer (6), the ultrasonic equipment (5) issues ultrasound
Ultrasonic wave is converted into the mechanical shock of amplitude transformer (7) by wave signal, the ultrasonic transducer (6), and the amplitude transformer (7) drives
Silicon wafer vibration in silicon chip drying frame (4), the ultrasonic equipment (5) were worked with two minutes, one minute intermittent loading method
Work；
(4) step 4: pull handle (10), opens door-plate for dried silicon chip extracting and repeat above operation step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810807276.9A CN109000440A (en) | 2018-07-21 | 2018-07-21 | A kind of silicon wafer drying device and its drying means |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810807276.9A CN109000440A (en) | 2018-07-21 | 2018-07-21 | A kind of silicon wafer drying device and its drying means |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109000440A true CN109000440A (en) | 2018-12-14 |
Family
ID=64597671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810807276.9A Pending CN109000440A (en) | 2018-07-21 | 2018-07-21 | A kind of silicon wafer drying device and its drying means |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109000440A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114993028A (en) * | 2022-06-17 | 2022-09-02 | 广东高景太阳能科技有限公司 | Silicon wafer drying treatment method and system |
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| EP0306779A2 (en) * | 1987-09-09 | 1989-03-15 | Hans Baltes | Process for drying, airing and sterilizing goods |
| CN102359011A (en) * | 2011-08-26 | 2012-02-22 | 岐周 | Clothes hanger with blowing function |
| CN102478347A (en) * | 2010-11-23 | 2012-05-30 | 无锡尚德太阳能电力有限公司 | Air knife and silicon wafer loading device with same |
| CN205505591U (en) * | 2016-03-30 | 2016-08-24 | 吉林工商学院 | High -efficiency biological sample stoving case |
| CN206056154U (en) * | 2016-08-30 | 2017-03-29 | 重庆科技学院 | Use for laboratory ultrasonic assistant resistance drying baker |
| CN108212903A (en) * | 2018-03-23 | 2018-06-29 | 郑州金恒电子技术有限公司 | A kind of automatic cleaning, drying equipment about silicon chip |
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2018
- 2018-07-21 CN CN201810807276.9A patent/CN109000440A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0306779A2 (en) * | 1987-09-09 | 1989-03-15 | Hans Baltes | Process for drying, airing and sterilizing goods |
| CN102478347A (en) * | 2010-11-23 | 2012-05-30 | 无锡尚德太阳能电力有限公司 | Air knife and silicon wafer loading device with same |
| CN102359011A (en) * | 2011-08-26 | 2012-02-22 | 岐周 | Clothes hanger with blowing function |
| CN205505591U (en) * | 2016-03-30 | 2016-08-24 | 吉林工商学院 | High -efficiency biological sample stoving case |
| CN206056154U (en) * | 2016-08-30 | 2017-03-29 | 重庆科技学院 | Use for laboratory ultrasonic assistant resistance drying baker |
| CN108212903A (en) * | 2018-03-23 | 2018-06-29 | 郑州金恒电子技术有限公司 | A kind of automatic cleaning, drying equipment about silicon chip |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114993028A (en) * | 2022-06-17 | 2022-09-02 | 广东高景太阳能科技有限公司 | Silicon wafer drying treatment method and system |
| CN114993028B (en) * | 2022-06-17 | 2023-05-30 | 高景太阳能股份有限公司 | Silicon wafer drying treatment method and system |
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Application publication date: 20181214 |