CN108995322A - A kind of Halogen plating resist copper-clad plate - Google Patents
A kind of Halogen plating resist copper-clad plate Download PDFInfo
- Publication number
- CN108995322A CN108995322A CN201810884504.2A CN201810884504A CN108995322A CN 108995322 A CN108995322 A CN 108995322A CN 201810884504 A CN201810884504 A CN 201810884504A CN 108995322 A CN108995322 A CN 108995322A
- Authority
- CN
- China
- Prior art keywords
- plating resist
- copper
- parts
- clad plate
- halogen plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09D11/107—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a kind of Halogen plating resist copper-clad plate, the present invention can form multi-layer board with common copper-clad plate, it can be achieved that selective copper facing in hole, promotes PCB signal transmission rate.A kind of Halogen plating resist copper-clad plate including insulating layer and is fixed on the copper foil of insulating layer end face, and the insulating layer is made of Halogen plating resist resin material.The Halogen plating resist resin material is Halogen plating resist resin ink.The Halogen plating resist resin ink is made by the raw material of following mass fraction: water-based acrylic resin 60-80%, and chlorinated polypropylene resinoid 2-5%, polyurethane resin 3-6%, aqueous color paste 3-10%, deionized water 5-10%, surplus is ammonium hydroxide.
Description
Technical field
The present invention relates to copper-clad plate fields, more particularly to a kind of Halogen plating resist copper-clad plate.
Background technique
Copper-clad plate also known as substrate.Supporting material is soaked with resin, one or both sides are coated with copper foil, through one kind made of hot pressing
Board-like material, referred to as copper-clad laminate (CCL).It is the basic material for doing PCB (printed circuit board), is often substrate.When it
It is produced for multi-layer board, is also core plate (CORE).Printed wiring board is formed after route makes by copper-clad plate, copper-clad plate by
Glass cloth and the resin layer being attached on the glass cloth are obtained with conductor layer hot pressing, therefore the main performance of pcb board, especially
Signal transmission performance is mainly determined by CCL, while the performance of CCL and resin matrix relationship are very big.
As electronic product develops to light, thin, small, high density, multifunction, element packing density and integrated level are increasingly
Height, transmitting signal frequency is higher and higher, and the route interlamellar spacing for playing transmitting signal function is smaller and smaller, and line width is more and more narrow, this is right
More stringent requirements are proposed for base electronic material, predominantly high-fire resistance, excellent dielectric properties, high-insulativity, suitable machine
Tool performance and processability, especially dielectric properties.The relative dielectric coefficient of material is smaller, and the transmission speed of signal is faster；It is situated between
The electrical loss factor is smaller, as soon as loss power of the signal in transmission process keeps timing, the frequency for allowing to transmit is higher, that is, exists
Under signal frequency is identical, dielectric loss value is smaller, and distortion rate is lower in signals transmission.
Summary of the invention
It is an object of the invention to overcome the deficiencies of the prior art and provide a kind of Halogen plating resist copper-clad plate, the present invention can be with
Multi-layer board is formed with common copper-clad plate, it can be achieved that random layer copper facing in multi-layer board through-hole, promotes PCB signal transmission rate.
The object of the present invention is achieved like this:
A kind of Halogen plating resist copper-clad plate including insulating layer and is fixed on the copper foil of insulating layer end face, and the insulating layer is adopted
It is made of Halogen plating resist resin material.
Preferably, the Halogen plating resist resin material is Halogen plating resist resin ink.
Preferably, the Halogen plating resist resin ink is made by the raw material of following mass fraction: water-based acrylic resin
60-80%, chlorinated polypropylene resinoid 2-5%, polyurethane resin 3-6%, aqueous color paste 3-10%, deionized water 5-10%,
Surplus is ammonium hydroxide.
Preferably, the water-based acrylic resin is made by the raw material of following mass parts: methymethacrylate 10-16
Part, 14-20 parts of butyl acrylate, 4-8 parts of acrylic acid, 1.5-2.5 parts of second rouge of acrylic acid hydroxyl, 0.5-1 parts of Diacetone Acrylamide,
Third 38-45 parts of dimethyl ether amyl acetate, 14-20 parts of dimethylformamide, 2-4 parts of ethylene oxide ether, 2-6 parts of Sodium Polyacrylate, azo
0.5-1 parts of bis-isobutyronitrile, 0.6-0.8 parts of adipic dihydrazide, 1.2-2.8 parts of triethylamine, 2-5 parts of ammonium hydroxide, distilled water 40-60
Part.
Preferably, the Halogen plating resist resin ink is by way of silk-screen printing on silk-screen to copper foil.
Preferably, thickness of insulating layer is controlled by the number of the mesh number of silk-screen halftone and silk-screen.
Preferably, it is equipped with copper foil in the insulating layer both ends of the surface, after on insulating layer silk-screen a to copper foil, another
Copper foil hot pressing is fixed on insulating layer.
Preferably, the copper-clad plate of Halogen plating resist is equipped with normal direction through-hole.
Preferably, Halogen plating resist copper-clad plate is placed in sodium hydroxide solution and is impregnated, taken off except Halogen plating resist resin ink,
Realize that layer and interlayer separate.
Preferably, the depth of lateral cloth hole is determined according to concentration of sodium hydroxide solution, soaking time；The transverse direction cloth hole
Aperture is equal to the thickness of Halogen plating resist resin ink.
By adopting the above-described technical solution, the invention has the following beneficial effects:
1. the present invention can be used as core plate and common copper-clad plate forms multi-layer board, since insulating layer cannot be electroplated, and it is common
The insulating layer of copper-clad plate can be electroplated, therefore can realize selective copper-plating technique in hole, solve back drill 0stub technology, promote PCB
Signal transmission rate.
2. Halogen plating resist copper-clad plate has reversed existing copper-clad plate, on the basis of guaranteeing original copper-clad plate function, Halogen plating resist is covered
Copper sheet, which can be placed in sodium hydroxide solution, to be impregnated, and is taken off except Halogen plating resist resin ink, realizes lateral cloth hole.
3. Halogen plating resist resin ink inertial forces mainly include chemical bond force (i.e. interatomic active force), intermolecular
Active force, interface electrostatic attraction and mechanicals efforts.These act on the effect between resin binder and substrate or copper foil.
For different copper foils, PP (adhesive sheet), select suitable resin binder also just at key, in general, for PE, PP etc.
Non-polar substrate, even if carrying out Corona Surface Treatment, surface tension also can only achieve 38 dynes or so, should use resin structure
To be nonpolar such as chlorinated polypropylene resinoid binder；And for the surface polarities substrate such as PET, PA, then polyurethane can be used
Resinoid binder.
The ink adhesive system is poly- by adding on a small quantity dedicated for the adhesion promoter of PP, PE, or with chlorination
Propylene resin spells the additive for being used as water-based acrylic resin with polyurethane resin on a small quantity, can solve in non-polar substrate
On adhesion problem (plating resist or nonpolar action), have been able to the problem of accomplishing a kind of resin binder versatility, simultaneously
Solve the problems, such as to remain using chlorinated polypropylene as the toluene solvant that binder is easy to appear it is exceeded, advocate it is environmentally protective
21 century, this point break through be particularly important.
Detailed description of the invention
Fig. 1 is the structural diagram of the present invention；
Fig. 2 is preparation flow figure of the invention.
Appended drawing reference
In attached drawing, 1 is Halogen plating resist resin ink, and 2 be copper foil.
Specific embodiment
Referring to Fig. 1, a kind of Halogen plating resist copper-clad plate including insulating layer and is fixed on the copper foil of insulating layer end face, described
Insulating layer is made of Halogen plating resist resin material.The Halogen plating resist resin material is Halogen plating resist resin ink.The nothing
Halogen plating resist resin ink is made by the raw material of following mass fraction: water-based acrylic resin 60-80%, chlorinated polypropylene class tree
Rouge 2-5%, polyurethane resin 3-6%, aqueous color paste 3-10%, deionized water 5-10%, surplus are ammonium hydroxide.The aqueous acrylamide
Acid resin is made by the raw material of following mass parts: 10-16 parts of methymethacrylate, 14-20 parts of butyl acrylate, and acrylic acid
4-8 parts, 1.5-2.5 parts of second rouge of acrylic acid hydroxyl, 0.5-1 parts of Diacetone Acrylamide, the third 38-45 parts of dimethyl ether amyl acetate, diformazan
14-20 parts of base formamide, 2-4 parts of ethylene oxide ether, 2-6 parts of Sodium Polyacrylate, 0.5-1 parts of azodiisobutyronitrile, two acyl of adipic acid
0.6-0.8 parts of hydrazine, 1.2-2.8 parts of triethylamine, 2-5 parts of ammonium hydroxide, 40-60 parts of distilled water.
Referring to fig. 2, the Halogen plating resist resin ink is by way of silk-screen printing on silk-screen to copper foil.Pass through silk printing screen
The mesh number of version and the number of silk-screen control thickness of insulating layer.It is equipped with copper foil in the insulating layer both ends of the surface, when insulating layer silk-screen
After on to a copper foil, another copper foil hot pressing is fixed on insulating layer.Halogen plating resist copper-clad plate is equipped with normal direction through-hole, can be with
Multi-layer board is formed as core plate and common copper-clad plate, since the insulating layer of normal direction through-hole cannot be electroplated, and the method for common copper-clad plate
It can be electroplated to through-hole insulating layer, therefore can realize selective copper-plating technique in hole, solved back drill 0stub technology, promote PCB letter
Number transmission rate.
Halogen plating resist copper-clad plate is placed in sodium hydroxide solution and is impregnated, is taken off except Halogen plating resist resin ink, is realized horizontal
To cloth hole.The depth of lateral cloth hole is determined according to concentration of sodium hydroxide solution, soaking time；The aperture of the transverse direction cloth hole is equal to
The thickness of Halogen plating resist resin ink.
Finally, it is stated that preferred embodiment above is only used to illustrate the technical scheme of the present invention and not to limit it, although logical
It crosses above preferred embodiment the present invention is described in detail, however, those skilled in the art should understand that, can be
Various changes are made to it in form and in details, without departing from claims of the present invention limited range.
Claims (10)
1. a kind of Halogen plating resist copper-clad plate, including insulating layer and it is fixed on the copper foil of insulating layer end face, which is characterized in that described
Insulating layer is made of Halogen plating resist resin material.
2. a kind of Halogen plating resist copper-clad plate according to claim 1, which is characterized in that the Halogen plating resist resin material is
Halogen plating resist resin ink.
3. a kind of Halogen plating resist copper-clad plate according to claim 2, which is characterized in that the Halogen plating resist resin ink by
The raw material of following mass fraction are made: water-based acrylic resin 60-80%, chlorinated polypropylene resinoid 2-5%, polyurethane tree
Rouge 3-6%, aqueous color paste 3-10%, deionized water 5-10%, surplus are ammonium hydroxide.
4. a kind of Halogen plating resist copper-clad plate according to claim 3, which is characterized in that the water-based acrylic resin by with
The raw material of lower mass parts are made: 10-16 parts of methymethacrylate, 14-20 parts of butyl acrylate, and 4-8 parts of acrylic acid, propylene
1.5-2.5 parts of sour hydroxyl second rouge, 0.5-1 parts of Diacetone Acrylamide, the third 38-45 parts of dimethyl ether amyl acetate, dimethylformamide 14-
20 parts, 2-4 parts of ethylene oxide ether, 2-6 parts of Sodium Polyacrylate, 0.5-1 parts of azodiisobutyronitrile, 0.6-0.8 parts of adipic dihydrazide,
1.2-2.8 parts of triethylamine, 2-5 parts of ammonium hydroxide, 40-60 parts of distilled water.
5. a kind of Halogen plating resist copper-clad plate according to claim 2, which is characterized in that the Halogen plating resist resin ink is logical
It crosses on the mode silk-screen to copper foil of silk-screen printing.
6. a kind of Halogen plating resist copper-clad plate according to claim 5, which is characterized in that pass through the mesh number and silk of silk-screen halftone
The number of print controls thickness of insulating layer.
7. a kind of Halogen plating resist copper-clad plate according to claim 5, which is characterized in that be all provided in the insulating layer both ends of the surface
There is copper foil, after on insulating layer silk-screen a to copper foil, another copper foil hot pressing is fixed on insulating layer.
8. -7 any a kind of Halogen plating resist copper-clad plate according to claim 1, which is characterized in that in Halogen plating resist copper-clad plate
Equipped with normal direction through-hole.
9. according to a kind of any Halogen plating resist copper-clad plate of claim 2-7, which is characterized in that by Halogen plating resist copper-clad plate
It is placed in sodium hydroxide solution and impregnates, take off except Halogen plating resist resin ink, realize that layer and interlayer separate.
10. a kind of Halogen plating resist copper-clad plate according to claim 9, which is characterized in that according to concentration of sodium hydroxide solution,
Soaking time determines the depth of lateral cloth hole；The aperture of the transverse direction cloth hole is equal to the thickness of Halogen plating resist resin ink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810884504.2A CN108995322B (en) | 2018-08-06 | 2018-08-06 | Halogen-free plating-resistant copper plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810884504.2A CN108995322B (en) | 2018-08-06 | 2018-08-06 | Halogen-free plating-resistant copper plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108995322A true CN108995322A (en) | 2018-12-14 |
| CN108995322B CN108995322B (en) | 2021-07-09 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810884504.2A Active CN108995322B (en) | 2018-08-06 | 2018-08-06 | Halogen-free plating-resistant copper plate |
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| Country | Link |
|---|---|
| CN (1) | CN108995322B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112812619A (en) * | 2021-02-21 | 2021-05-18 | 周天青 | Water-based ink for circuit board and preparation method and application thereof |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000349413A (en) * | 1999-06-09 | 2000-12-15 | Ibiden Co Ltd | Manufacture of printed wiring board |
| EP1265467A2 (en) * | 2001-06-07 | 2002-12-11 | Ngk Insulators, Ltd. | Multilayer board having precise perforations and circuit substrate having precise through-holes |
| US20080191354A1 (en) * | 2005-03-23 | 2008-08-14 | Endicott Interconnect Technologies, Inc. | Circuitized substrate with p-aramid dielectric layers and method of making same |
| CN102558765A (en) * | 2010-12-15 | 2012-07-11 | 新高电子材料（中山）有限公司 | Halogen-free fire-retardant high heat conducting insulating resin composition and heat dissipation metal-base copper clad plate |
| CN103772639A (en) * | 2012-10-21 | 2014-05-07 | 成都市新津托展油墨有限公司 | Polyurethane-polyacrylate ink resin and preparation method thereof |
| WO2016082146A1 (en) * | 2014-11-27 | 2016-06-02 | 江门崇达电路技术有限公司 | Method for manufacturing stepped copper column in pcb |
| CN106046235A (en) * | 2016-06-27 | 2016-10-26 | 合众（佛山）化工有限公司 | Water-based ink resin binder and preparation method thereof |
| CN107148169A (en) * | 2017-06-23 | 2017-09-08 | 湖北共铭电路有限公司 | The manufacture craft of multi-layer PCB board |
-
2018
- 2018-08-06 CN CN201810884504.2A patent/CN108995322B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000349413A (en) * | 1999-06-09 | 2000-12-15 | Ibiden Co Ltd | Manufacture of printed wiring board |
| EP1265467A2 (en) * | 2001-06-07 | 2002-12-11 | Ngk Insulators, Ltd. | Multilayer board having precise perforations and circuit substrate having precise through-holes |
| US20080191354A1 (en) * | 2005-03-23 | 2008-08-14 | Endicott Interconnect Technologies, Inc. | Circuitized substrate with p-aramid dielectric layers and method of making same |
| CN102558765A (en) * | 2010-12-15 | 2012-07-11 | 新高电子材料（中山）有限公司 | Halogen-free fire-retardant high heat conducting insulating resin composition and heat dissipation metal-base copper clad plate |
| CN103772639A (en) * | 2012-10-21 | 2014-05-07 | 成都市新津托展油墨有限公司 | Polyurethane-polyacrylate ink resin and preparation method thereof |
| WO2016082146A1 (en) * | 2014-11-27 | 2016-06-02 | 江门崇达电路技术有限公司 | Method for manufacturing stepped copper column in pcb |
| CN106046235A (en) * | 2016-06-27 | 2016-10-26 | 合众（佛山）化工有限公司 | Water-based ink resin binder and preparation method thereof |
| CN107148169A (en) * | 2017-06-23 | 2017-09-08 | 湖北共铭电路有限公司 | The manufacture craft of multi-layer PCB board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112812619A (en) * | 2021-02-21 | 2021-05-18 | 周天青 | Water-based ink for circuit board and preparation method and application thereof |
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| Publication number | Publication date |
|---|---|
| CN108995322B (en) | 2021-07-09 |
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Effective date of registration: 20211028 Address after: 405400 Baihe Industrial Park, Kaizhou District, Chongqing Patentee after: CHONGQING DEKAI INDUSTRY CO.,LTD. Address before: No. 20, East Road, University City, Chongqing, Shapingba District, Chongqing Patentee before: Chongqing University of Science & Technology |
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