CN108990289A - A kind of processing method improving polytetrafluoroethylene (PTFE) printed circuit sheet metal forming burr - Google Patents
A kind of processing method improving polytetrafluoroethylene (PTFE) printed circuit sheet metal forming burr Download PDFInfo
- Publication number
- CN108990289A CN108990289A CN201810936103.7A CN201810936103A CN108990289A CN 108990289 A CN108990289 A CN 108990289A CN 201810936103 A CN201810936103 A CN 201810936103A CN 108990289 A CN108990289 A CN 108990289A
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- ptfe
- polytetrafluoroethylene
- circuit board
- phenolic aldehyde
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
Abstract
The present invention is suitable for circuit board processing technique field, a kind of processing method improving polytetrafluoroethylene (PTFE) printed circuit sheet metal forming burr is provided, the described method includes: being drilled by gong machine to the first phenolic aldehyde backing plate, the second phenolic aldehyde backing plate and several brown paper according to the molding location hole of polytetrafluoroethylene (PTFE) printed circuit board；First phenolic aldehyde backing plate, polytetrafluoroethylene (PTFE) printed circuit board, the second phenolic aldehyde backing plate are successively packed on the bakelite plate for being implanted into pin as required in advance；First phenolic aldehyde backing plate, polytetrafluoroethylene (PTFE) printed circuit board are arranged by brown paper interval between the second phenolic aldehyde backing plate, and clamp milling cutter by gong machine main shaft and cut to it, and process velocity is set as 0.2m/min~0.4m/min；It can be effectively improved polytetrafluoroethylene (PTFE) printed circuit sheet metal forming burr, and can be realized and milling cutter simultaneous processing 12-18 piece polytetrafluoroethylene (PTFE) printed circuit board, high production efficiency are clamped by gong machine main shaft, input cost substantially reduces.
Description
Technical field
The invention belongs to circuit board processing technique field, more particularly to a kind of improvement polytetrafluoroethylene (PTFE) printed circuit board at
The processing method of type burr.
Background technique
The one kind of polytetrafluoroethylene (PTFE) printed circuit board as high-frequency microwave printed circuit plate is low because of substrate material used in it
The property of dielectric constant and low dielectric loss can be used for the signal transmission of high speed, low-loss, low latency, high-fidelity.
The conventional machining mode of polytetrafluoroethylene (PTFE) printed circuit board is to carry out excision forming, but its using milling cutter using gong machine
Quality is softer, and section is also easy to produce a large amount of burrs, influences product reliability.Some enterprise utilized laser cutting in recent years
Mode carries out laser formation, although can guarantee the smooth impulse- free robustness in section, which input cost is very high, primary only to allow
The polytetrafluoroethylene (PTFE) printed circuit board that 1 thickness is less than or equal to 2 millimeters is processed, production efficiency is low, and it is raw to be only suitable for small lot
It produces.
Summary of the invention
The embodiment of the present invention provides a kind of processing method for improving polytetrafluoroethylene (PTFE) printed circuit sheet metal forming burr, it is intended to solve
The certainly above technical problem.
The embodiments of the present invention are implemented as follows, a kind of processing side improving polytetrafluoroethylene (PTFE) printed circuit sheet metal forming burr
Method, which comprises
Polytetrafluoroethylene (PTFE) printed circuit board, the first phenolic aldehyde backing plate, the second phenolic aldehyde backing plate and several brown paper are taken, it is spare；It is described
Include molding location hole on polytetrafluoroethylene (PTFE) printed circuit board；
According to the molding location hole of the polytetrafluoroethylene (PTFE) printed circuit board, by gong machine to the first phenolic aldehyde backing plate, second
Phenolic aldehyde backing plate and several brown paper drill；
According to the drilling, the first phenolic aldehyde backing plate, polytetrafluoroethylene (PTFE) printed circuit board, the second phenolic aldehyde backing plate are successively packed into
It is implanted into as required on the bakelite plate of pin in advance；The first phenolic aldehyde backing plate, polytetrafluoroethylene (PTFE) printed circuit board, the second phenolic aldehyde
It is arranged between backing plate by brown paper interval；
Milling cutter, which is clamped, by gong machine main shaft cuts the polytetrafluoroethylene (PTFE) printed circuit board, the first phenolic aldehyde backing plate, the second phenolic aldehyde pad
Plate and several brown paper, process velocity are set as 0.2m/min~0.4m/min.
In embodiments of the present invention, by gong machine to the first phenolic aldehyde backing plate, the second phenolic aldehyde backing plate and several ox-hides
Paper drills, and according to drilling, by the first phenolic aldehyde backing plate, polytetrafluoroethylene (PTFE) printed circuit board, the second phenolic aldehyde backing plate according to
It is secondary pack into advance as required be implanted into pin bakelite plate on, wherein the first phenolic aldehyde backing plate, polytetrafluoroethylene (PTFE) printed circuit board,
It is arranged between second phenolic aldehyde backing plate by brown paper interval, milling cutter is clamped by gong machine main shaft and cuts the polytetrafluoroethylene (PTFE) printing
Circuit board, the first phenolic aldehyde backing plate, the second phenolic aldehyde backing plate and several brown paper, process velocity are set as 0.2m/min~0.4m/
Min can be effectively improved polytetrafluoroethylene (PTFE) printed circuit sheet metal forming burr, and can be realized and clamp milling cutter simultaneously by gong machine main shaft
Processing 12-18 piece polytetrafluoroethylene (PTFE) printed circuit board, high production efficiency, meanwhile, input cost substantially reduces.
Detailed description of the invention
Fig. 1 is a kind of polytetrafluoroethylene (PTFE) printed circuit sheet metal forming lamination diagrammatic cross-section that the embodiment of the present invention 1 provides；
Fig. 2 is a kind of polytetrafluoroethylene (PTFE) printed circuit sheet metal forming lamination diagrammatic cross-section that the embodiment of the present invention 2 provides.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
The term used in embodiments of the present invention is only to be not intended to be limiting merely for for the purpose of describing particular embodiments
The present invention.Packet is also intended in the "an" and "the" of the embodiment of the present invention and singular used in the attached claims
Most forms are included, unless the context clearly indicates other meaning.It is also understood that term "and/or" used herein
Refer to and includes that one or more associated any or all of project listed may combine.
It will be appreciated that though various information may be described in embodiments of the present invention using term first, second etc., but
These information should not necessarily be limited by these terms.These terms are only used to for same type of information being distinguished from each other out.
A kind of processing method improving polytetrafluoroethylene (PTFE) printed circuit sheet metal forming burr provided in an embodiment of the present invention, passes through
First phenolic aldehyde backing plate, polytetrafluoroethylene (PTFE) printed circuit board, the second phenolic aldehyde backing plate are successively packed into and are implanted into pin as required in advance
Bakelite plate on, wherein the first phenolic aldehyde backing plate, polytetrafluoroethylene (PTFE) printed circuit board, between the second phenolic aldehyde backing plate by brown paper
Interval setting clamps milling cutter by gong machine main shaft and cuts the polytetrafluoroethylene (PTFE) printed circuit board, the first phenolic aldehyde backing plate, the second phenol
Aldehyde backing plate and several brown paper, process velocity are set as 0.2m/min~0.4m/min, can be effectively improved polytetrafluoroethylene (PTFE) print
Circuit board molding burr processed, and can be realized and the printing of milling cutter simultaneous processing 12-18 piece polytetrafluoroethylene (PTFE) is clamped by gong machine main shaft
Circuit board, high production efficiency, meanwhile, input cost substantially reduces.
In the embodiment of the present invention, gong machine includes 6 main shafts, the number of processing polytetrafluoroethylregenerated printed circuit board on each main shaft
Amount is 1-3 piece.
In the embodiment of the present invention, when the quantity of processing polytetrafluoroethylregenerated printed circuit board is 2 on each main shaft, every poly-
It is arranged between tetrafluoroethene printed circuit board by brown paper interval.
In the embodiment of the present invention, when the quantity of processing polytetrafluoroethylregenerated printed circuit board is 3 on each main shaft, every poly-
It is arranged between tetrafluoroethene printed circuit board by brown paper interval.
In the embodiment of the present invention, the first phenolic aldehyde backing plate, polytetrafluoroethylene (PTFE) printed circuit board, the ox between the second phenolic aldehyde backing plate
Mulberry paper quantity is greater than or equal to 1.
In the embodiment of the present invention, phenolic aldehyde back plate sizes are greater than or equal to polytetrafluoroethylene (PTFE) printed circuit board size.
In embodiments of the present invention, ox-hide paper size is greater than or equal to polytetrafluoroethylene (PTFE) printed circuit board size.
In embodiments of the present invention, the molding that boring aperture is greater than or equal to the polytetrafluoroethylene (PTFE) printed circuit board positions
The aperture in hole.
In embodiments of the present invention, the thickness of polytetrafluoroethylene (PTFE) printed circuit board is less than or equal to 2 millimeters.
In embodiments of the present invention, process velocity is preferably 0.3m/min.
The technical means and efficacy taken in order to which the present invention is further explained for the predetermined goal of the invention of realization, below in conjunction with
Attached drawing and preferred embodiment, to specific embodiment, structure, feature and its effect according to the present invention, detailed description are as follows.
Embodiment 1
Firstly, taking polytetrafluoroethylene (PTFE) printed circuit board 18, wherein the aperture of the location hole of polytetrafluoroethylene (PTFE) printed circuit board is
3.0mm, polytetrafluoroethylene (PTFE) printed circuit board is having a size of 450*550mm, with a thickness of 2mm；Take the first phenol having a size of 450*550mm
Aldehyde backing plate, the second phenolic aldehyde backing plate equal 6 and brown paper 24 are opened；It brings secondly, importing corresponding gong to gong machine system, in gong machine
The location hole that several apertures are 2.9mm is bored on bakelite plate；The pin that diameter is 2.95mm is implanted into positioning hole；Again, sharp
Phenolic aldehyde backing plate and brown paper are drilled by the molding positioning hole pattern of polytetrafluoroethylene (PTFE) printed circuit board with gong machine, aperture is
3.0mm；By 2 sets of the first phenolic aldehyde backing plate on the bakelite plate 1 for being implanted into pin 6 as required；One brown paper 3 is stacked in the first phenol
On aldehyde backing plate 2；The polytetrafluoroethylene (PTFE) printed circuit board 4 processed will be needed to be stacked on brown paper 3；One brown paper 3 is folded
On polytetrafluoroethylene (PTFE) printed circuit board 4；The polytetrafluoroethylene (PTFE) printed circuit board 4 processed will be needed to be stacked on brown paper 3；
By one 3 sets of brown paper on polytetrafluoroethylene (PTFE) printed circuit board 4；The polytetrafluoroethylene (PTFE) printed circuit board 4 that needs are processed
It covers on brown paper 3；By one 3 sets of brown paper on polytetrafluoroethylene (PTFE) printed circuit board 4；Second phenolic aldehyde backing plate 5 is folded
To get polytetrafluoroethylene (PTFE) printed circuit sheet metal forming lamination as shown in Figure 1 on brown paper 3, gong machine main shaft clamps milling cutter cutting
Above-mentioned polytetrafluoroethylene (PTFE) printed circuit sheet metal forming lamination；Process velocity is set as 0.4m/min；Other 5 main shafts of gong machine referring to
Upper lamination requirement.
Embodiment 2
Firstly, taking polytetrafluoroethylene (PTFE) printed circuit board 12, wherein the aperture of the location hole of polytetrafluoroethylene (PTFE) printed circuit board is
3.0mm, polytetrafluoroethylene (PTFE) printed circuit board is having a size of 450*550mm, with a thickness of 1.9mm；Take first having a size of 550*550mm
Phenolic aldehyde backing plate, the second phenolic aldehyde backing plate equal 6 and brown paper 36 are opened；It brings secondly, importing corresponding gong to gong machine system, in gong
The location hole that several apertures are 2.95mm is bored on electromechanical plank；The pin that diameter is 3.0mm is implanted into positioning hole；Again,
Phenolic aldehyde backing plate and brown paper are drilled by the molding positioning hole pattern of polytetrafluoroethylene (PTFE) printed circuit board using gong machine, aperture
For 3.05mm；By 8 sets of the first phenolic aldehyde backing plate on the bakelite plate 7 for being implanted into pin 12 as required；One brown paper 9 is stacked in
On one phenolic aldehyde backing plate 8；The polytetrafluoroethylene (PTFE) printed circuit board 10 processed will be needed to be stacked on brown paper 9；By an ox-hide
Paper 9 is stacked on polytetrafluoroethylene (PTFE) printed circuit board 10；The polytetrafluoroethylene (PTFE) printed circuit board 10 processed will be needed to be stacked in ox-hide
On paper 9；By one 9 sets of brown paper on polytetrafluoroethylene (PTFE) printed circuit board 10；Second phenolic aldehyde backing plate 11 is stacked in ox-hide
To get polytetrafluoroethylene (PTFE) printed circuit sheet metal forming lamination as shown in Figure 2 on paper 9, it is above-mentioned poly- that gong machine main shaft clamps milling cutter cutting
Tetrafluoroethene printed circuit sheet metal forming lamination；Process velocity is set as 0.3m/min；Other 5 main shafts of gong machine are referring to the above lamination
It is required that.
To sum up, the processing method of polytetrafluoroethylene (PTFE) printed circuit board provided by 1-2 of the embodiment of the present invention, can be effectively improved
Polytetrafluoroethylene (PTFE) printed circuit sheet metal forming burr, burr improvement rate is up to 75% or more；And it can be realized to clamp by gong machine main shaft and mill
Knife simultaneous processing 12-18 piece polytetrafluoroethylene (PTFE) printed circuit board, high production efficiency, meanwhile, input cost substantially reduces.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (10)
1. a kind of processing method for improving polytetrafluoroethylene (PTFE) printed circuit sheet metal forming burr, which is characterized in that the described method includes:
Polytetrafluoroethylene (PTFE) printed circuit board, the first phenolic aldehyde backing plate, the second phenolic aldehyde backing plate and several brown paper are taken, it is spare；It is described
Include molding location hole on polytetrafluoroethylene (PTFE) printed circuit board；
According to the molding location hole of the polytetrafluoroethylene (PTFE) printed circuit board, by gong machine to the first phenolic aldehyde backing plate, second
Phenolic aldehyde backing plate and several brown paper drill；
According to the drilling, the first phenolic aldehyde backing plate, polytetrafluoroethylene (PTFE) printed circuit board, the second phenolic aldehyde backing plate are successively packed into
It is implanted into as required on the bakelite plate of pin in advance；The first phenolic aldehyde backing plate, polytetrafluoroethylene (PTFE) printed circuit board, the second phenolic aldehyde
It is arranged between backing plate by brown paper interval；
Milling cutter, which is clamped, by gong machine main shaft cuts the polytetrafluoroethylene (PTFE) printed circuit board, the first phenolic aldehyde backing plate, the second phenolic aldehyde pad
Plate and several brown paper, process velocity are set as 0.2m/min~0.4m/min.
2. processing method according to claim 1, which is characterized in that the gong machine includes 6 main shafts, is added on each main shaft
The quantity of work polytetrafluoroethylene (PTFE) printed circuit board is 1-3 piece.
3. processing method according to claim 2, which is characterized in that processing polytetrafluoroethylregenerated printed circuit on the main shaft
The quantity of plate is 2, is arranged between every polytetrafluoroethylene (PTFE) printed circuit board by brown paper interval.
4. processing method according to claim 2, which is characterized in that processing polytetrafluoroethylregenerated printed circuit on the main shaft
The quantity of plate is 3, is arranged between every polytetrafluoroethylene (PTFE) printed circuit board by brown paper interval.
5. processing method according to claim 1, which is characterized in that the first phenolic aldehyde backing plate, polytetrafluoroethylene (PTFE) printing
Brown paper quantity between circuit board, the second phenolic aldehyde backing plate is greater than or equal to 1.
6. processing method according to claim 1, which is characterized in that the phenolic aldehyde back plate sizes are greater than or equal to polytetrafluoro
Ethylene printed circuit board size.
7. processing method according to claim 1, which is characterized in that the ox-hide paper size is greater than or equal to polytetrafluoroethyl-ne
Alkene printed circuit board size.
8. processing method according to claim 1, which is characterized in that the boring aperture is greater than or equal to the polytetrafluoro
The aperture of the molding location hole of ethylene printed circuit board.
9. processing method according to claim 1, which is characterized in that the thickness of the polytetrafluoroethylene (PTFE) printed circuit board is small
In or equal to 2 millimeters.
10. processing method according to claim 1, which is characterized in that the process velocity is set as 0.3m/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810936103.7A CN108990289A (en) | 2018-08-16 | 2018-08-16 | A kind of processing method improving polytetrafluoroethylene (PTFE) printed circuit sheet metal forming burr |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810936103.7A CN108990289A (en) | 2018-08-16 | 2018-08-16 | A kind of processing method improving polytetrafluoroethylene (PTFE) printed circuit sheet metal forming burr |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108990289A true CN108990289A (en) | 2018-12-11 |
Family
ID=64553061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810936103.7A Pending CN108990289A (en) | 2018-08-16 | 2018-08-16 | A kind of processing method improving polytetrafluoroethylene (PTFE) printed circuit sheet metal forming burr |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108990289A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109561591A (en) * | 2018-12-17 | 2019-04-02 | 四川英创力电子科技股份有限公司 | A method of promoting LED lamp panel formed precision |
| CN112638045A (en) * | 2021-03-09 | 2021-04-09 | 福莱盈电子股份有限公司 | Method for processing through hole and blind hole of multilayer flexible board |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1063833A (en) * | 1991-02-07 | 1992-08-26 | 霍尔德斯科技有限公司 | Printed circuit board drilling and used lead-in plate and backing plate |
| CN102573303A (en) * | 2010-12-31 | 2012-07-11 | 北大方正集团有限公司 | Circuit board forming method and circuit board |
| CN102781173A (en) * | 2012-07-24 | 2012-11-14 | 景旺电子（深圳）有限公司 | Method for machining and molding printed circuit board (PCB) made of polytetrafluoroethylene (PTFE) material |
| CN103428999A (en) * | 2012-05-25 | 2013-12-04 | 北大方正集团有限公司 | PCB board moulding processing method and laminated plate |
| CN203407091U (en) * | 2013-08-07 | 2014-01-22 | 东莞森玛仕格里菲电路有限公司 | Milling structure for a plurality of base material sheets |
| CN103874331A (en) * | 2014-03-25 | 2014-06-18 | 广东达进电子科技有限公司 | Manufacturing method of teflon high-frequency circuit board |
| CN206402516U (en) * | 2016-12-30 | 2017-08-11 | 上海嘉捷通信息科技有限公司 | A kind of multi-disc printed circuit board structure for reducing burr burr |
-
2018
- 2018-08-16 CN CN201810936103.7A patent/CN108990289A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1063833A (en) * | 1991-02-07 | 1992-08-26 | 霍尔德斯科技有限公司 | Printed circuit board drilling and used lead-in plate and backing plate |
| CN102573303A (en) * | 2010-12-31 | 2012-07-11 | 北大方正集团有限公司 | Circuit board forming method and circuit board |
| CN103428999A (en) * | 2012-05-25 | 2013-12-04 | 北大方正集团有限公司 | PCB board moulding processing method and laminated plate |
| CN102781173A (en) * | 2012-07-24 | 2012-11-14 | 景旺电子（深圳）有限公司 | Method for machining and molding printed circuit board (PCB) made of polytetrafluoroethylene (PTFE) material |
| CN203407091U (en) * | 2013-08-07 | 2014-01-22 | 东莞森玛仕格里菲电路有限公司 | Milling structure for a plurality of base material sheets |
| CN103874331A (en) * | 2014-03-25 | 2014-06-18 | 广东达进电子科技有限公司 | Manufacturing method of teflon high-frequency circuit board |
| CN206402516U (en) * | 2016-12-30 | 2017-08-11 | 上海嘉捷通信息科技有限公司 | A kind of multi-disc printed circuit board structure for reducing burr burr |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109561591A (en) * | 2018-12-17 | 2019-04-02 | 四川英创力电子科技股份有限公司 | A method of promoting LED lamp panel formed precision |
| CN112638045A (en) * | 2021-03-09 | 2021-04-09 | 福莱盈电子股份有限公司 | Method for processing through hole and blind hole of multilayer flexible board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106385766B (en) | A kind of production method of PCB irregularly-shaped hole flash removed burr | |
| CN102036492B (en) | Drilling method for printed circuit board (PCB) | |
| CN108990289A (en) | A kind of processing method improving polytetrafluoroethylene (PTFE) printed circuit sheet metal forming burr | |
| CN102036483A (en) | Method and system for forming blind gongs on printed circuit board (PCB) and circuit board | |
| CN109379845A (en) | A kind of multilayer circuit board processing technology containing PTFE | |
| CN108377612A (en) | A kind of PCB blind slots bottom circuit processing technology | |
| CN110418505A (en) | A kind of precision PCB blank plate and its processing molding method | |
| CN102833949A (en) | Method for milling groove in FPC (Flexible Printed Circuit) | |
| CN101954403B (en) | For the manufacture of the method for rotor sheet and stator piece | |
| CN201586776U (en) | Processing cutting tool structure of printed circuit board | |
| CN111112697B (en) | Tapping tool and method for manufacturing the same | |
| CN111587160B (en) | Drill bit | |
| CN217573199U (en) | Punching hollow drill cutter component of ticket binding machine | |
| CN208178535U (en) | Milling cutter | |
| CN104159394B (en) | A kind of PCB sections and preparation method thereof | |
| CN201079854Y (en) | Integral hard alloy printing circuit board drill | |
| CN201947534U (en) | Multilayer printed circuit board with high thickness-diameter ratio | |
| CN102350520A (en) | Printed circuit board symmetrical drill with double chip dividing grooves | |
| CN104723400A (en) | Method for drilling plastic plates | |
| CN113787207A (en) | Aluminum substrate drilling process | |
| CN113043374B (en) | Ultrashort slotted hole processing method for circuit board | |
| CN201969927U (en) | Miniature drill bit structure for printed circuit boards | |
| JP2009248233A (en) | Small-diameter drill for printed board and method of thinning shape processing thereof | |
| CN107801304B (en) | Circuit board made from circuit board manufacturing method and the production method | |
| CN103586508A (en) | Dual-edge eccentric copper-foil punching tool with improved structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181211 |
|
| RJ01 | Rejection of invention patent application after publication |