CN108966518A - A kind of method of the internal layer DES line of environment-friendly water-saving - Google Patents
A kind of method of the internal layer DES line of environment-friendly water-saving Download PDFInfo
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- CN108966518A CN108966518A CN201810930642.XA CN201810930642A CN108966518A CN 108966518 A CN108966518 A CN 108966518A CN 201810930642 A CN201810930642 A CN 201810930642A CN 108966518 A CN108966518 A CN 108966518A
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- water
- rinse bath
- circuit board
- saving
- internal layer
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
Abstract
The present invention relates to printed circuit board processing technique field more particularly to a kind of methods of the internal layer DES line of environment-friendly water-saving；According to each chemical treatment cylinder chemical properties, each difference chemical characteristic or identical chemical characteristic, similar acid washing and acid washing overflow is taken to use, alkalinity washing and alkaline water-cleaning overflow, the principle closed in acid washing and alkalinity washing mutually, the mode of any processing overflow is not added online, reduce the design of water inlet and discharge outlet, reduction water consumption can be reached, also it can be reduced the discharge amount of sewage and reduce concentration of wastewater, it can also play the role of presoaking chemical treatment solution cylinder position and protect, the effect of preimpregnation protection back segment chemical medicinal liquid is also effectively played while effectively reducing environmental pollution, reduce the additive amount of chemical treatment liquid medicine, improve the stability and product quality of chemical treatment liquid medicine；Not only environmental protection and saving, and improve the quality of product.
Description
Technical field
The present invention relates to printed circuit board processing technique field more particularly to a kind of sides of the internal layer DES line of environment-friendly water-saving
Method.
Background technique
DES line is that internal layer develops, etches, taking off the printed circuit inner cord logic circuit processing that three lines of film link together
Equipment；But equipment can add clear water behind each chemical treatment section and wash at present, and each clear washing section design have into
Otherwise the mouth of a river and sewage draining exit will lead to and generate pollution of reporting to the leadship after accomplishing a task between different sections of chemical treatment liquid medicine and will make for the attainment of one's purpose
It is cleaned with a large amount of clear water and removes the remaining chemical treatment liquid medicine of plate face, while also producing a large amount of sewage discharge, thus
Cause the waste of great lot of water resources, the pollution of environment and higher cost.
Summary of the invention
It is an object of the invention to overcome above-mentioned the deficiencies in the prior art, a kind of internal layer DES line of environment-friendly water-saving is provided
Method.
The technical solution adopted by the present invention to solve the technical problems is: constructing a kind of internal layer DES line of environment-friendly water-saving
Method, comprising:
S1: circuit board is put into the first rinse bath of developer solution and carries out development treatment；It is put into the second rinse bath later
Middle progress dirt removal water process；
S2: carrying out the pressurization washing of six stage countercurrent water for the processed circuit board of S1, and by first order pressure (hydraulic) water in the step
The water for washing a part after using imports the second rinse bath in S1；
S3: by the processed circuit board of S2 be put into third rinse bath carry out clear water wash, and will third rinse bath use after
Water is for the 6th grade of pressurization washing in S2；
S4: the processed circuit board of S3 is put into and carries out blotting processing in the 4th rinse bath, and checks whether and blots；
S5: the processed circuit board of S4 is subjected to etching process at least once, and compensates etching process；It puts later
Enter progress dirt removal water process in the 5th rinse bath；
S6: carrying out the pressurization washing of Pyatyi counter-flow water for the processed circuit board of S5, and by first order pressure (hydraulic) water in the step
It washes the water after using and imports the 5th rinse bath in S5；
S7: the processed circuit board of S6 is put into progress clear water in the 6th rinse bath and is washed；And after the 6th rinse bath is used
Water is for level V pressurization washing in S6；
S8: the processed circuit board of S7 is put into and carries out blotting processing in the 7th rinse bath, and checks whether and blots；
S9: by the processed circuit board of S8 carry out at least once take off film process, be put into the 8th rinse bath and carry out later
Dirt removal water process；
S10: carrying out the pressurization washing of two-stage countercurrent water for the processed circuit board of S9, and by first order pressure (hydraulic) water in the step
It washes the water after using and imports the 8th rinse bath in S9；
S11: by the processed circuit board of S10 be put into the 9th rinse bath carry out clear water wash, and will the 9th rinse bath use after
Water for pressurization washing in the second level in S10；It is put into the tenth rinse bath later and carries out microetch processing；
S12: the processed circuit board of S11 is subjected to the pressurization washing of two-stage countercurrent water, and the first order in the step is pressurizeed
Water after washing is used imports the 9th rinse bath in S11, while first order pressurization in S2 being washed to the water of another part after using
Import the 9th rinse bath in S11；
S13: the processed circuit board of S12 is put into the 11st rinse bath and carries out clear water and washes, and by the 11st rinse bath
Water after is for pressurization washing in the second level in S12；It is put into the 12nd rinse bath later and carries out pickling processes；
S14: the processed circuit board of S13 is subjected to the pressurization washing of Pyatyi counter-flow water, and the first order in the step is pressurizeed
Water after washing is used imports the 11st rinse bath in S13；
S15: the processed circuit board of S14 is put into the 13rd rinse bath and carries out clear water and washes, and by the 13rd rinse bath
Water after carries out blotting processing later for level V pressurization washing in S14；
S16: the processed circuit board of S15 is successively subjected to high wind drying processing and hot blast drying is handled, is carried out down later
Material processing.
The method of the internal layer DES line of environment-friendly water-saving of the present invention, wherein etching process twice is carried out in the S5.
The method of the internal layer DES line of environment-friendly water-saving of the present invention, wherein taken off film process twice in the S9.
The method of the internal layer DES line of environment-friendly water-saving of the present invention, wherein first order pressure (hydraulic) water is in the S2 with 5:5
Ratio be diverted in the S1 the 9th rinse bath in the second rinse bath and the S11 respectively.
The method of the internal layer DES line of environment-friendly water-saving of the present invention, wherein set in second rinse bath of the S1
There is the first sewage draining exit.
The method of the internal layer DES line of environment-friendly water-saving of the present invention, wherein set in the third rinse bath of the S3
There is the first water inlet.
The method of the internal layer DES line of environment-friendly water-saving of the present invention, wherein set in the 5th rinse bath of the S5
There is the second sewage draining exit.
The method of the internal layer DES line of environment-friendly water-saving of the present invention, wherein set in the 6th rinse bath of the S7
There is the second water inlet.
The method of the internal layer DES line of environment-friendly water-saving of the present invention, wherein set in the 8th rinse bath of the S9
Three sewage draining exits having.
The method of the internal layer DES line of environment-friendly water-saving of the present invention, wherein the 13rd rinse bath of the S15
It is interior to be equipped with third water inlet.
The beneficial effects of the present invention are: a kind of method of the internal layer DES line of environment-friendly water-saving of the present invention, at each chemistry
Cylinder chemical properties, each difference chemical characteristic or identical chemical characteristic are managed, similar acid washing and acid washing overflow are taken
Using the principle closed in, alkalinity washing and alkaline water-cleaning overflow, acid washing and alkalinity washing mutually, any processing is not added online
The mode of overflow, reduce water inlet and discharge outlet design, reduction water consumption can be reached, also can be reduced sewage discharge amount and
Reduce concentration of wastewater, moreover it is possible to play the role of presoaking chemical treatment solution cylinder position and protect, effectively reduce the same of environmental pollution
When also effectively play preimpregnation protection back segment chemical medicinal liquid effect, reduce chemical treatment liquid medicine additive amount, improve chemistry
Handle the stability and product quality of liquid medicine；Through the invention, effectively solve that water consumption is big, blowdown flow rate is big and environmental pollution
Problem, reduces the additive amount of chemical treatment liquid medicine, and it is highly stable to be chemically treated liquid medicine, thoroughly solves line side corrosion
The problem of；Not only environmental protection and saving, and improve the quality of product.
Specific embodiment
In order to keep the purposes, technical schemes and advantages of the embodiment of the present invention clearer, implement below in conjunction with the present invention
Technical solution in example carries out clear, complete description, it is clear that and described embodiment is section Example of the invention, and
It is not all of embodiment.Based on the embodiment of the present invention, those of ordinary skill in the art are not before making the creative labor
Every other embodiment obtained is put, protection scope of the present invention is belonged to.
Therefore, the detailed description of the embodiment of the present invention is not intended to limit the range of claimed invention, but
It is merely representative of selected embodiment of the invention.Based on the embodiments of the present invention, those of ordinary skill in the art are not making
Every other embodiment obtained, shall fall within the protection scope of the present invention under the premise of creative work.
Term " first ", " second ", " third " etc. are only used for distinguishing description, are not understood to indicate or imply relatively heavy
The property wanted.
In the description of the present invention, it is also necessary to which explanation is unless specifically defined or limited otherwise, term " setting ",
" installation ", " connected ", " connection " shall be understood in a broad sense, for example, it may be fixedly connected, may be a detachable connection or one
Connect to body；It can be directly connected, the connection inside two elements can also be can be indirectly connected through an intermediary.
For the ordinary skill in the art, the concrete meaning of above-mentioned term in the present invention can be understood with concrete condition.
Referenced herein " embodiment " is it is meant that a particular feature, structure, or characteristic described can wrap in conjunction with the embodiments
Containing at least one embodiment of the present invention.Each position in the description occur the phrase might not each mean it is identical
Embodiment, nor the independent or alternative embodiment with other embodiments mutual exclusion.Those skilled in the art explicitly and
Implicitly understand, embodiment described herein can be combined with other embodiments.
A kind of method of the internal layer DES line of environment-friendly water-saving of present pre-ferred embodiments, comprising the following steps: S1: will be electric
Road plate, which is put into the first rinse bath of developer solution, carries out development treatment；It is put into the second rinse bath and is carried out at dirt removal water later
Reason；S2: by S1 processed circuit board progress six stage countercurrent water pressurization washing, and will be after first order pressurization washing use in the step
A part water import S1 in the second rinse bath；S3: the processed circuit board of S2 is put into third rinse bath and carries out clear water
It washes, and water of the third rinse bath after is used in S2 the 6th grade of pressurization washing；S4: the processed circuit board of S3 is put into the 4th
It carries out blotting processing in rinse bath, and checks whether and blot；S5: the processed circuit board of S4 is carried out at etching at least once
Reason, and compensate etching process；It is put into progress dirt removal water process in the 5th rinse bath later；S6: by the processed circuit of S5
Plate carries out the pressurization washing of Pyatyi counter-flow water, and the water after first order pressurization washing is used in the step is imported the 5th cleaning in S5
Slot；S7: the processed circuit board of S6 is put into progress clear water in the 6th rinse bath and is washed；And water of the 6th rinse bath after is used for
Level V pressurization washing in S6；S8: the processed circuit board of S7 is put into and carries out blotting processing in the 7th rinse bath, and is checked
Whether blot；S9: by the processed circuit board of S8 carry out at least once take off film process, be put into the 8th rinse bath and carry out later
Dirt removal water process；S10: the processed circuit board of S9 is subjected to the pressurization washing of two-stage countercurrent water, and the first order in the step is added
Water after pressure washing is used imports the 8th rinse bath in S9；S11: the processed circuit board of S10 is put into the 9th rinse bath and is carried out
Clear water is washed, and water of the 9th rinse bath after is used for pressurization washing in the second level in S10；It is micro- that it is put into the progress of the tenth rinse bath later
Erosion processing；S12: carrying out the pressurization washing of two-stage countercurrent water for the processed circuit board of S11, and by first order pressure (hydraulic) water in the step
It washes the water after using and imports the 9th rinse bath in S11, while the water of the another part of first order pressurization washing after in S2 also being led
Enter the 9th rinse bath in S11；S13: the processed circuit board of S12 being put into the 11st rinse bath and carries out clear water and washes, and by the
Water after 11 rinse baths are used is washed for second level pressurization in S12；It is put into the 12nd rinse bath later and carries out pickling processes；
S14: by the processed circuit board progress Pyatyi counter-flow water pressurization washing of S13, and will be after first order pressurization washing use in the step
Water import S13 in the 11st rinse bath；S15: the processed circuit board of S14 is put into the 13rd rinse bath and carries out clear water
It washes, and water of the 13rd rinse bath after is used for level V pressurization washing in S14, carry out blotting processing later；S16: by S15
Processed circuit board successively carries out high wind drying processing and hot blast drying processing, carries out blanking processing later；By current DES
In line, takes off the water inlet that clear water after the water inlet and microetch that clear water after film is washed is washed and cancel, the water inlet washed with clear water after pickling is total
With principle is to wash used behind pickling by way of overflow as the washing after the microetch of chemical property altogether, microetch
It is overflowed to and is taken off behind film as being washed after taking off film by way of overflow again after using, because behind pickling behind washing and microetch
Washing is all in acidity, and takes off film for alkalinity, and at this moment we are being used as washing just after being used to take off film for the subsequent washing of pickling and microetch
It is closed in good soda acid；According to each chemical treatment cylinder chemical properties, each difference chemical characteristic or identical chemical characteristic are taken similar
Acid washing and acid washing overflow are used, are closed in alkalinity washing and alkaline water-cleaning overflow, acid washing and alkalinity washing mutually
Principle, be not added online it is any processing overflow mode, reduce water inlet and discharge outlet design, reduction water can be reached
Amount also can be reduced the discharge amount of sewage and reduce concentration of wastewater, moreover it is possible to play the work to the preimpregnation protection of chemical treatment solution cylinder position
With, while effectively reducing environmental pollution also effectively play preimpregnation protection back segment chemical medicinal liquid effect, reduce chemical place
The additive amount for managing liquid medicine improves the stability and product quality of chemical treatment liquid medicine；Through the invention, water consumption is effectively solved
Greatly, the problem of blowdown flow rate is big and environmental pollution, reduces the additive amount of chemical treatment liquid medicine, and be chemically treated liquid medicine very
Stablize, thoroughly solves the problems, such as line side corrosion；Not only environmental protection and saving, and improve the quality of product.
Development is that will be covered with light-sensitive surface, and the plate of exposure image, the light-sensitive surface of unwanted part by developer solution
Development removal, manifests unwanted copper face, developer solution is mainly formulated with sodium carbonate；It is etched to by using hydrochloric acid, chlorine
Change the corrosive solution that the powerful oxidation agents such as sodium are formulated, Strong oxdiative erosion removal is carried out to the copper face revealed after exposure image
Fall, forms useful logic conducting channel；Taking off film is that the plate for having formed logic conducting channel is prepared molten by sodium hydroxide
Liquid removes the light-sensitive surface against corrosion of circuit surface；Thus in order to reduce water consumption and quantity of wastewater effluent, according to different chemical treatments
The characteristic washed after section takes the mode that any processing overflow is not added online, reduces the design of water inlet and discharge outlet, Ji Nengda
It also can be reduced the discharge amount and reduction concentration of wastewater of sewage to water consumption is reduced, can also play and chemical treatment solution cylinder position is presoaked
The effect of protection.
First order pressure (hydraulic) water is diverted to the second rinse bath and the S11 in the S1 with the ratio of 5:5 respectively in the S2
In the 9th rinse bath；The first sewage draining exit is equipped in second rinse bath of the S1；In the third rinse bath of the S3
Equipped with the first water inlet；The second sewage draining exit is equipped in the 5th rinse bath of the S5；The 6th rinse bath of the S7
Inside it is equipped with the second water inlet；Three sewage draining exits being equipped in the 8th rinse bath of the S9；The described 13rd of the S15 is clear
Third water inlet is equipped in washing trough；Water inlet and Sewage outlet are respectively 5 at present；It is changed to water inlet and sewage through the invention
Discharge outlet is respectively 3, few 2 more each than current water inlet and Sewage outlet.
Etching process twice is carried out in the S5；Film process is taken off twice in the S9；Convenient for making to etch and taking off film all
Obtain thorough working process.
Scheme is made according to the present invention, by testing follow-up for a long time and carrying out to the PCB circuit board processed
Reliability test, before change design, DES line original is designed as 5 water inlets and 5 discharge outlet, and each water inlet flow set is every
400 liters of hour, water consumption are 2000 liters per hour；It is 3 water inlets and 3 rows after the change design of DES line after change design
The mouth of a river, 400 liters per hour of each water inlet flow set, water consumption is 1200 liters per hour, than change design after change design
Preceding to use 800 liters of water less per hour, quantity of wastewater effluent decreases 800 liters per hour.Each preceding point of the change design of chemical treatment liquid medicine
Compliance rate 95% is analysed, change design post analysis compliance rate is 99.5%, and liquid medicine stability must greatly promote；Product qualification rate, more
Changing design front side corrosion fraction defective is 3%, and change design rear side corrosion fraction defective is 0%
It should be understood that for those of ordinary skills, it can be modified or changed according to the above description,
And all these modifications and variations should all belong to the protection domain of appended claims of the present invention.
Claims (10)
1. a kind of method of the internal layer DES line of environment-friendly water-saving, which comprises the following steps:
S1: circuit board is put into the first rinse bath of developer solution and carries out development treatment；Be put into the second rinse bath later into
Row dirt removal water process；
S2: the processed circuit board of S1 is subjected to the pressurization washing of six stage countercurrent water, and first order pressurization washing in the step is used
The water of a part afterwards imports the second rinse bath in S1；
S3: the processed circuit board of S2 is put into progress clear water in third rinse bath and is washed, and the water after third rinse bath use is used
The 6th grade of pressurization washing in S2；
S4: the processed circuit board of S3 is put into and carries out blotting processing in the 4th rinse bath, and checks whether and blots；
S5: the processed circuit board of S4 is subjected to etching process at least once, and compensates etching process；It is put into later
Dirt removal water process is carried out in five rinse baths；
S6: the processed circuit board of S5 is subjected to the pressurization washing of Pyatyi counter-flow water, and first order pressurization washing in the step is used
Water afterwards imports the 5th rinse bath in S5；
S7: the processed circuit board of S6 is put into progress clear water in the 6th rinse bath and is washed；And the water after using the 6th rinse bath is used
The level V pressurization washing in S6；
S8: the processed circuit board of S7 is put into and carries out blotting processing in the 7th rinse bath, and checks whether and blots；
S9: by the processed circuit board of S8 carry out at least once move back film process, be put into the 8th rinse bath later and carry out dirt removal
Water process；
S10: the processed circuit board of S9 is subjected to the pressurization washing of two-stage countercurrent water, and first order pressurization washing in the step is used
Water afterwards imports the 8th rinse bath in S9；
S11: by the processed circuit board of S10 be put into the 9th rinse bath carry out clear water wash, and by the 9th rinse bath use after water
For pressurization washing in the second level in S10；It is put into the tenth rinse bath later and carries out microetch processing；
S12: the processed circuit board of S11 is subjected to the pressurization washing of two-stage countercurrent water, and first order pressurization in the step is washed
Water after imports the 9th rinse bath in S11, while the water of the another part of first order pressurization washing after in S2 being also introduced into
9th rinse bath in S11；
S13: by the processed circuit board of S12 be put into the 11st rinse bath carry out clear water wash, and will the 11st rinse bath use after
Water for pressurization washing in the second level in S12；It is put into the 12nd rinse bath later and carries out pickling processes；
S14: the processed circuit board of S13 is subjected to the pressurization washing of Pyatyi counter-flow water, and first order pressurization in the step is washed
Water after imports the 11st rinse bath in S13；
S15: by the processed circuit board of S14 be put into the 13rd rinse bath carry out clear water wash, and will the 13rd rinse bath use after
Water for level V pressurization washing in S14, carry out blotting processing later；
S16: the processed circuit board of S15 is successively subjected to high wind drying processing and hot blast drying is handled, is carried out at blanking later
Reason.
2. the method for the internal layer DES line of environment-friendly water-saving as described in claim 1, which is characterized in that carried out twice in the S5
Etching process.
3. the method for the internal layer DES line of environment-friendly water-saving as described in claim 1, which is characterized in that carried out twice in the S9
Move back film process.
4. the method for the internal layer DES line of environment-friendly water-saving as described in claim 1, which is characterized in that the first order adds in the S2
Pressure water is diverted in the S1 the 9th rinse bath in the second rinse bath and the S11 with the ratio of 5:5 respectively.
5. the method for the internal layer DES line of environment-friendly water-saving as described in claim 1, which is characterized in that described the second of the S1
The first sewage draining exit is equipped in rinse bath.
6. the method for the internal layer DES line of environment-friendly water-saving as described in claim 1, which is characterized in that the third of the S3
The first water inlet is equipped in rinse bath.
7. the method for the internal layer DES line of environment-friendly water-saving as described in claim 1, which is characterized in that the described 5th of the S5
The second sewage draining exit is equipped in rinse bath.
8. the method for the internal layer DES line of environment-friendly water-saving as described in claim 1, which is characterized in that the described 6th of the S7
The second water inlet is equipped in rinse bath.
9. the method for the internal layer DES line of environment-friendly water-saving as described in claim 1, which is characterized in that the described 8th of the S9
Three sewage draining exits being equipped in rinse bath.
10. the method for the internal layer DES line of environment-friendly water-saving as described in claim 1, which is characterized in that described the of the S15
Third water inlet is equipped in 13 rinse baths.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810930642.XA CN108966518A (en) | 2018-08-15 | 2018-08-15 | A kind of method of the internal layer DES line of environment-friendly water-saving |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810930642.XA CN108966518A (en) | 2018-08-15 | 2018-08-15 | A kind of method of the internal layer DES line of environment-friendly water-saving |
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| CN108966518A true CN108966518A (en) | 2018-12-07 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112533373A (en) * | 2020-11-07 | 2021-03-19 | 龙南骏亚柔性智能科技有限公司 | Water saving method for circuit board horizontal line equipment |
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|---|---|---|---|---|
| US5207867A (en) * | 1992-03-17 | 1993-05-04 | Macdermid, Incorporated | Composition and method for improving the surface insulation resistance of a printed circuit |
| CN102711385A (en) * | 2012-06-26 | 2012-10-03 | 北京凯迪思电路板有限公司 | Method for manufacturing circuit board by addition method |
| WO2013059985A1 (en) * | 2011-10-25 | 2013-05-02 | 建业（惠州）电路版有限公司 | Process for metallisation of holes in printed circuit board |
-
2018
- 2018-08-15 CN CN201810930642.XA patent/CN108966518A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5207867A (en) * | 1992-03-17 | 1993-05-04 | Macdermid, Incorporated | Composition and method for improving the surface insulation resistance of a printed circuit |
| WO2013059985A1 (en) * | 2011-10-25 | 2013-05-02 | 建业（惠州）电路版有限公司 | Process for metallisation of holes in printed circuit board |
| CN102711385A (en) * | 2012-06-26 | 2012-10-03 | 北京凯迪思电路板有限公司 | Method for manufacturing circuit board by addition method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112533373A (en) * | 2020-11-07 | 2021-03-19 | 龙南骏亚柔性智能科技有限公司 | Water saving method for circuit board horizontal line equipment |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181207 |