CN108966483B - Manufacturing process of high-heat-conductivity high-order high-density printed circuit board - Google Patents
Manufacturing process of high-heat-conductivity high-order high-density printed circuit board Download PDFInfo
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- CN108966483B CN108966483B CN201810866123.1A CN201810866123A CN108966483B CN 108966483 B CN108966483 B CN 108966483B CN 201810866123 A CN201810866123 A CN 201810866123A CN 108966483 B CN108966483 B CN 108966483B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a manufacturing process of a novel high-heat-conduction high-order high-density printed circuit board, comprising the following steps of S2, manufacturing a unit circuit board (2); s3, manufacturing a plurality of unit circuit boards, stacking the unit circuit boards from top to bottom in sequence, and supporting the lower supporting legs (10) of the unit circuit board (2) at the bottommost layer on the ground; the lower support leg (10) of the unit circuit board (2) located above is placed on the upper support leg (9) of the unit circuit board (2) located below. The invention has the beneficial effects that: the manufactured product is convenient to maintain, the manufactured product is convenient for workers to maintain quickly, etching solution is saved, and manufacturing cost is reduced.
Description
Technical Field
The invention relates to a manufacturing process of a high-grade high-density printed circuit board with high thermal conductivity.
Background
The traditional high-heat-conductivity high-order high-density printed circuit board is formed by alternately laminating a plurality of substrates formed with circuits and bonding material layers and performing hot pressing, and then the connection and conduction functions among the circuits of each layer are achieved by utilizing the processes of drilling and metallization in holes.
Since high-order high-density printed circuit boards with high thermal conductivity are increasingly integrated, i.e., substrates are bonded by means of an adhesive material, if one substrate or a wiring layer thereon is damaged, it is difficult to perform maintenance, because the damaged substrate can be separately taken out and maintained outside by separating the adhesive material between the substrates, which undoubtedly increases maintenance costs and is inconvenient to operate.
In addition, in order to realize the conduction between the circuit layers on the circuit units, copper bars are usually welded on two sides of the high-thermal-conductivity high-order high-density printed circuit board, and the copper bars are in contact with the circuit layers on the circuit units, so that the communication between the circuit units is realized. However, the two copper bars are equivalent to packaging the unit circuit board between the two copper bars, and in the same reason, if one substrate or a circuit layer thereon is damaged, the maintenance is difficult, and the maintenance difficulty is increased.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide the manufacturing process of the high-heat-conduction high-order high-density printed circuit board, which is convenient to maintain, convenient to quickly maintain by workers, saves etching solution and reduces manufacturing cost.
The purpose of the invention is realized by the following technical scheme: a manufacturing process of a high-heat-conduction high-order high-density printed circuit board comprises the following steps:
s1, an etching step, which specifically comprises the following steps:
s11, welding copper plates on the top and the bottom of the substrate, and bonding adhesive tapes on the top of the upper-layer copper plate and the bottom of the lower-layer copper plate to ensure that the shape of the adhesive tapes is consistent with that of the required circuit layer;
s12, manufacturing etching machine: rotating shafts are rotatably arranged on two sides of the etching tank, a hand wheel is arranged at one end of each rotating shaft, a bearing table is welded on each rotating shaft, two blind holes are formed in the top of each bearing table, extension springs are welded in the blind holes, and a pressing plate is welded on the top of each spring to ensure that the pressing plate is pressed against the top of each bearing table under the action of the tensile force of the springs; finally, an air compressor is arranged on the side wall of the etching groove, and an air outlet pipe is connected to an air outlet of the air compressor, so that the etching machine is manufactured;
s13, lifting the two pressing plates upwards by a worker, then placing one end of the substrate to be etched below one pressing plate, simultaneously placing the other end of the substrate below the other pressing plate, then loosening the two pressing plates, resetting the pressing plates under the restoring force of the extension springs, and then pressing the substrate between the bearing table and the pressing plates, so that the rapid tooling of the substrate is realized;
s14, a worker rotates the hand wheel to enable the rotating shaft to rotate 180 degrees around the bearing seat, so that the circuit board is immersed in the etching solution in the groove body, and the etching solution corrodes the copper plate which is not covered with the adhesive tape to obtain a circuit layer; after etching for a period of time, a worker operates the hand wheel to rotate in the reverse direction for 180 degrees, the bearing table is reset, the air compressor is started, the high-pressure gas produced by the air compressor blows off the moisture on the surface of the substrate, and the etching solution returns to the etching tank again after being blown off, so that the etching solution is recycled, and the production cost is saved;
s15, tearing off the adhesive tape on the substrate to obtain a circuit layer;
s2, manufacturing a unit circuit board: the method comprises the following specific steps:
s21, adhering upper heat-conducting glue on the top of the upper circuit layer, adhering lower heat-conducting glue on the bottom of the lower circuit layer, and arranging a plurality of clamping grooves on the top surface of the upper heat-conducting glue and the bottom surface of the lower heat-conducting glue along the length direction of the upper heat-conducting glue and the bottom surface of the lower heat-conducting glue;
s22, inserting a heat dissipation tooth sheet into each clamping groove by a worker;
s23, respectively welding an upper supporting leg at each of two ends of the upper heat-conducting glue by a worker, and respectively welding a lower supporting leg at each of two ends of the lower heat-conducting glue;
s24, drilling a through hole which sequentially penetrates through the upper heat-conducting glue, the upper circuit layer, the substrate, the lower circuit layer and the lower heat-conducting glue from top to bottom in the middle of the unit circuit board, and thus processing the unit circuit board;
s3, manufacturing a plurality of unit circuit boards, stacking the unit circuit boards from top to bottom in sequence, and supporting the lower support legs of the unit circuit board at the bottommost layer on the ground; placing the lower support leg of the unit circuit board located above on the upper support leg of the unit circuit board located below;
s4, the copper pipe penetrates through the through holes of the unit circuit boards from top to bottom in sequence to ensure the electric communication of the circuit layers on the unit circuit boards, and finally the high-grade high-density printed circuit board with high heat conductivity is manufactured.
The invention has the following advantages: the product manufactured by the invention is convenient to maintain, the manufactured product is convenient for workers to maintain quickly, the etching solution is saved, and the manufacturing cost is reduced.
Drawings
Fig. 1 is a schematic structural view of a high-thermal-conductivity high-order high-density printed circuit board manufactured by the present invention.
Detailed Description
The present invention is further described below, and the scope of protection of the present invention is not limited to the following:
a manufacturing process of a high-heat-conductivity high-order high-density printed circuit board (1) comprises the following steps:
s1, an etching step, which specifically comprises the following steps:
s11, welding copper plates on the top and the bottom of the substrate 3, and bonding adhesive tapes on the top of the upper-layer copper plate and the bottom of the lower-layer copper plate to ensure that the shapes of the adhesive tapes are consistent with the shape of the required circuit layer;
s12, manufacturing etching machine: rotating shafts are rotatably arranged on two sides of the etching tank, a hand wheel is arranged at one end of each rotating shaft, a bearing table is welded on each rotating shaft, two blind holes are formed in the top of each bearing table, extension springs are welded in the blind holes, and a pressing plate is welded on the top of each spring to ensure that the pressing plate is pressed against the top of each bearing table under the action of the tensile force of the springs; finally, an air compressor is arranged on the side wall of the etching groove, and an air outlet pipe is connected to an air outlet of the air compressor, so that the etching machine is manufactured;
s13, lifting the two pressing plates upwards by a worker, then placing one end of the substrate to be etched below one pressing plate, simultaneously placing the other end of the substrate below the other pressing plate, then loosening the two pressing plates, resetting the pressing plates under the restoring force of the extension springs, and then pressing the substrate between the bearing table and the pressing plates, so that the rapid tooling of the substrate is realized;
s14, a worker rotates the hand wheel to enable the rotating shaft to rotate 180 degrees around the bearing seat, so that the circuit board is immersed in the etching solution in the groove body, and the etching solution corrodes the copper plate which is not covered with the adhesive tape to obtain a circuit layer; after etching for a period of time, a worker operates the hand wheel to rotate in the reverse direction for 180 degrees, the bearing table is reset, the air compressor is started, the high-pressure gas produced by the air compressor blows off the moisture on the surface of the substrate, and the etching solution returns to the etching tank again after being blown off, so that the etching solution is recycled, and the production cost is saved;
s15, tearing off the adhesive tape on the substrate 3 to obtain the circuit layer 4;
s2, manufacturing the unit circuit board 2: the method comprises the following specific steps:
s21, adhering an upper heat-conducting glue 6 on the top of the upper circuit layer 4, adhering a lower heat-conducting glue 7 on the bottom of the lower circuit layer 4, and arranging a plurality of clamping grooves on the top surface of the upper heat-conducting glue 6 and the bottom surface of the lower heat-conducting glue 7 along the length direction;
s22, inserting a heat dissipation toothed sheet 5 into each clamping groove by a worker;
s23, respectively welding an upper supporting leg 9 at each end of the upper heat-conducting glue 6 by a worker, and respectively welding a lower supporting leg 10 at each end of the lower heat-conducting glue 7 by the worker;
s24, drilling a through hole 11 which sequentially penetrates through the upper heat-conducting glue 6, the upper circuit layer 4, the substrate 3, the lower circuit layer 4 and the lower heat-conducting glue 7 from top to bottom in the middle of the unit circuit board 2, and thus processing the unit circuit board;
s3, manufacturing a plurality of unit circuit boards, stacking the unit circuit boards from top to bottom in sequence, and supporting the lower support legs 10 of the unit circuit board 2 at the bottommost layer on the ground; placing the lower support leg 10 of the unit circuit board 2 located above on the upper support leg 9 of the unit circuit board 2 located below;
s4, sequentially passing the copper tube 1 through the through holes 11 of the unit circuit boards 2 from top to bottom to ensure the electrical connection of the circuit layers 4 on the unit circuit boards 2, so as to finally manufacture a high-grade high-density printed circuit board with high thermal conductivity, as shown in fig. 1.
When the high-order high-density high-thermal-conductivity circuit board operates for a long time, heat is generated on each circuit layer 4 on each unit circuit board 2, wherein the heat generated by the circuit layer 4 on the upper portion is transmitted to the upper thermal-conductivity glue 6, then the heat is transmitted to the heat dissipation toothed sheet 5 on the upper thermal-conductivity glue 6 by the upper thermal-conductivity glue 6, the heat is transmitted to the outside by the heat dissipation toothed sheet 5, the heat generated by the circuit layer 4 on the lower portion is transmitted to the lower thermal-conductivity glue 7, then the heat is transmitted to the heat dissipation toothed sheet 5 on the lower thermal-conductivity glue 7 by the lower thermal-conductivity glue 7, and the heat is transmitted to the outside by the heat dissipation toothed sheet 5, so that the high-order high-density high-thermal-conductivity.
After the base plate 3 or the circuit layer 4 of arbitrary one unit circuit board 2 damaged, upwards extract copper pipe 1 earlier, maintenance personal only need down take down normal unit circuit board 2 from last this moment, until the unit circuit board 2 that will damage exposes at the top, thereby make things convenient for maintenance personal to maintain the base plate 3 or the circuit layer 4 of the unit circuit board 2 that damages, the problem of the unit circuit board maintenance difficulty of traditional high density interconnected circuit board has effectively been solved, the later maintenance for the circuit board provides the advantage.
Claims (1)
1. A manufacturing process of a high-heat-conduction high-order high-density printed circuit board is characterized by comprising the following steps of: it comprises the following steps:
s1, an etching step, which specifically comprises the following steps:
s11, welding copper plates on the top and the bottom of the substrate (3), and bonding adhesive tapes on the top of the upper-layer copper plate and the bottom of the lower-layer copper plate to ensure that the shapes of the adhesive tapes are consistent with the shape of the required circuit layer;
s12, manufacturing etching machine: rotating shafts are rotatably arranged on two sides of the etching tank, a hand wheel is arranged at one end of each rotating shaft, a bearing table is welded on each rotating shaft, two blind holes are formed in the top of each bearing table, extension springs are welded in the blind holes, and a pressing plate is welded on the top of each spring to ensure that the pressing plate is pressed against the top of each bearing table under the action of the tensile force of the springs; finally, an air compressor is arranged on the side wall of the etching groove, and an air outlet pipe is connected to an air outlet of the air compressor, so that the etching machine is manufactured;
s13, lifting the two pressing plates upwards by a worker, then placing one end of the substrate to be etched below one pressing plate, simultaneously placing the other end of the substrate below the other pressing plate, then loosening the two pressing plates, resetting the pressing plates under the restoring force of the extension springs, and then pressing the substrate between the bearing table and the pressing plates, so that the rapid tooling of the substrate is realized;
s14, a worker rotates the hand wheel to enable the rotating shaft to rotate 180 degrees around the bearing seat, so that the circuit board is immersed in the etching solution in the groove body, and the etching solution corrodes the copper plate which is not covered with the adhesive tape to obtain a circuit layer; after etching for a period of time, a worker operates the hand wheel to rotate in the reverse direction for 180 degrees, the bearing table is reset, the air compressor is started, the high-pressure gas produced by the air compressor blows off the moisture on the surface of the substrate, and the etching solution returns to the etching tank again after being blown off, so that the etching solution is recycled, and the production cost is saved;
s15, tearing off the adhesive tape on the substrate (3) to obtain the circuit layer (4);
s2, manufacturing a unit circuit board (2): the method comprises the following specific steps:
s21, adhering an upper heat-conducting glue (6) to the top of the upper circuit layer (4), adhering a lower heat-conducting glue (7) to the bottom of the lower circuit layer (4), and arranging a plurality of clamping grooves on the top surface of the upper heat-conducting glue (6), the bottom surface of the lower heat-conducting glue (7) and along the length direction of the upper heat-conducting glue and the bottom surface of the lower heat-conducting glue (7);
s22, inserting a heat dissipation toothed sheet (5) into each clamping groove by a worker;
s23, respectively welding an upper supporting leg (9) at each end of the upper heat-conducting glue (6) by a worker, and respectively welding a lower supporting leg (10) at each end of the lower heat-conducting glue (7);
s24, drilling a through hole (11) which sequentially penetrates through the upper heat-conducting glue (6), the upper circuit layer (4), the substrate (3), the lower circuit layer (4) and the lower heat-conducting glue (7) from top to bottom in the middle of the unit circuit board (2), and thus processing the unit circuit board;
s3, manufacturing a plurality of unit circuit boards, stacking the unit circuit boards from top to bottom in sequence, and supporting the lower supporting legs (10) of the unit circuit board (2) at the bottommost layer on the ground; placing the lower support leg (10) of the unit circuit board (2) located above on the upper support leg (9) of the unit circuit board (2) located below; when the high-order high-density high-thermal-conductivity circuit board operates for a long time, heat is generated on each circuit layer (4) on each unit circuit board (2), wherein the heat generated by the circuit layer (4) on the upper part is transferred to the upper thermal-conductivity glue (6), then the heat is transferred to the heat dissipation toothed sheets (5) on the upper thermal-conductivity glue (6) by the upper thermal-conductivity glue (6), the heat is transferred to the outside by the heat dissipation toothed sheets (5), the heat generated by the circuit layer (4) on the lower part is transferred to the lower thermal-conductivity glue (7), then the heat is transferred to the heat dissipation toothed sheets (5) on the lower thermal-conductivity glue (7) by the lower thermal-conductivity glue (7), and the heat is transferred to the outside by the heat dissipation toothed sheets (5), so that the high-order high-density high-thermal-conductivity circuit board can;
s4, the copper pipe (1) sequentially penetrates through the through holes (11) of the unit circuit boards (2) from top to bottom to ensure the electric communication of the circuit layers (4) on the unit circuit boards (2), and therefore the high-grade high-density printed circuit board with high heat conductivity is manufactured finally.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810866123.1A CN108966483B (en) | 2018-08-01 | 2018-08-01 | Manufacturing process of high-heat-conductivity high-order high-density printed circuit board |
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| CN201810866123.1A CN108966483B (en) | 2018-08-01 | 2018-08-01 | Manufacturing process of high-heat-conductivity high-order high-density printed circuit board |
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| CN108966483A CN108966483A (en) | 2018-12-07 |
| CN108966483B true CN108966483B (en) | 2020-05-19 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110072332A (en) * | 2019-05-22 | 2019-07-30 | 四川海英电子科技有限公司 | A kind of metal core printed board and its manufacture craft |
| CN110139472A (en) * | 2019-05-22 | 2019-08-16 | 四川海英电子科技有限公司 | A kind of part buried metal core printed board and its manufacturing process |
| CN114126255B (en) * | 2021-11-17 | 2023-08-18 | 广德宝达精密电路有限公司 | Novel manufacturing process of high-heat-conductivity high-order high-density printed circuit board |
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|---|---|---|---|---|
| US4676865A (en) * | 1986-02-07 | 1987-06-30 | Delarge Richard S | Plasma desmear/etchback system and method of use |
| CN104869757A (en) * | 2015-06-02 | 2015-08-26 | 遂宁市广天电子有限公司 | COB thermoelectric separation copper substrate production process |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4113231A1 (en) * | 1990-04-23 | 1991-10-24 | Mitsubishi Gas Chemical Co | METHOD FOR PRODUCING A PRINT BOARD |
| CN2874982Y (en) * | 2005-12-20 | 2007-02-28 | 照敏企业股份有限公司 | Circuit board structure with radiation layer |
| CN101841974A (en) * | 2010-05-12 | 2010-09-22 | 珠海市荣盈电子科技有限公司 | High-thermal conductivity circuit board and method for producing same by using electroplating method |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4676865A (en) * | 1986-02-07 | 1987-06-30 | Delarge Richard S | Plasma desmear/etchback system and method of use |
| CN104869757A (en) * | 2015-06-02 | 2015-08-26 | 遂宁市广天电子有限公司 | COB thermoelectric separation copper substrate production process |
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