CN108963400B - H-shaped mushroom-shaped ultra-wideband common mode noise suppression circuit - Google Patents
H-shaped mushroom-shaped ultra-wideband common mode noise suppression circuit Download PDFInfo
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- CN108963400B CN108963400B CN201810580014.3A CN201810580014A CN108963400B CN 108963400 B CN108963400 B CN 108963400B CN 201810580014 A CN201810580014 A CN 201810580014A CN 108963400 B CN108963400 B CN 108963400B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/212—Frequency-selective devices, e.g. filters suppressing or attenuating harmonic frequencies
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Abstract
The invention discloses an H-shaped mushroom-shaped ultra-wideband common mode noise suppression circuit which comprises a medium substrate, wherein a meandering differential coupling line is arranged at the top of the medium substrate, the differential coupling line is symmetrical about a signal transmission direction, an H-shaped metal patch is arranged in the medium substrate, the H-shaped metal patch comprises two rectangular patches and a bridge connecting the two rectangular patches, only one rectangular patch is loaded with two short circuit branches symmetrical about the signal transmission direction, the bottom of the medium substrate is provided with a stratum, and the differential coupling line and the short circuit branches are connected with a grounding layer through metalized through holes. The invention has the advantages of miniaturization, wide common mode resistance bandwidth, deep common mode rejection depth and low differential mode insertion loss.
Description
Technical Field
The invention relates to electromagnetic field and microwave technology, in particular to an H-shaped mushroom-shaped ultra-wideband common mode noise suppression circuit.
Background
The common mode noise suppression circuit is a circuit structure designed based on electromagnetic field and microwave technical theory, and mainly has the main functions of ensuring the complete transmission of high-speed differential signals in an electronic circuit system and simultaneously suppressing common mode noise.
Differential signals are widely used to transmit high-speed digital signals due to their advantages of noise immunity and low electromagnetic interference. For example, high-speed interfaces such as HDMI, USB3.0, SATA-iii, and PCI-E use differential wiring to transmit Gbps high-speed digital signals. However, in an actual circuit, due to asymmetry of differential wiring and imbalance of differential signals (unequal rise and fall times and inconsistent amplitude and phase), common mode noise is effectively excited, thereby affecting transmission of the differential signals; in particular, when common mode noise is transmitted to the cable along with the differential signal, it causes serious electromagnetic interference, which affects the normal operation of the surrounding circuits. Therefore, it is important to design a common mode noise suppression circuit with excellent performance. However, the design of common mode noise suppression circuits also faces a number of challenges, such as: the digital signal rates of Gbps transmitted by different electronic circuit systems are not consistent, and the frequency bands of common-mode noise are scattered; the electronic circuit system with high integration level occupies smaller and smaller volume, and further requirements are provided for miniaturization of the common mode noise suppression circuit. Therefore, low differential mode insertion loss, ultra-wide common mode rejection band and miniaturization are hot spots of common mode noise suppression circuit design in recent years.
At present, most common mode noise suppression circuits are designed mainly around a defected ground structure, a mushroom-type multilayer circuit structure and a transmission line theory, and have some problems while realizing broadband common mode noise suppression performance, for example, a single circuit structure common mode stop band has a relatively narrow bandwidth and shallow suppression depth, in practical application, a plurality of circuit units need to be cascaded to widen the common mode stop band and deepen the suppression depth of the stop band, which also increases the occupied area of the actual circuit. Therefore, a new miniaturized high-performance common mode noise suppression circuit unit structure is needed to be further designed.
Disclosure of Invention
The purpose of the invention is as follows: the invention aims to provide an H-shaped mushroom-shaped ultra-wideband common mode noise suppression circuit which is small in size, wide in common mode resistance bandwidth, deep in common mode suppression depth and low in differential mode insertion loss.
The technical scheme is as follows: in order to achieve the purpose, the invention adopts the following technical scheme:
the H-shaped mushroom-shaped ultra-wideband common mode noise suppression circuit comprises a medium substrate, wherein a meandering differential coupling line is arranged at the top of the medium substrate, the differential coupling line is symmetrical relative to a signal transmission direction, an H-shaped metal patch is arranged inside the medium substrate and comprises two rectangular patches and a bridge connected with the two rectangular patches, only one rectangular patch is loaded with two short circuit branch sections symmetrical relative to the signal transmission direction, the bottom of the medium substrate is provided with a ground layer, and the differential coupling line and the short circuit branch sections are connected with the ground layer through metalized through holes.
Furthermore, a surface-mounted bonding pad is arranged on the stratum, and the metalized through hole connected with the differential coupling line is connected with the surface-mounted bonding pad. This makes the circuit more suitable for engineering applications.
Furthermore, a circle of groove line is arranged around the surface-mounted bonding pad. Therefore, impedance discontinuity between the surface-mounted bonding pad and the differential coupling line can be reduced, the integrity of differential mode signal transmission is ensured, and insertion loss is reduced.
Further, the edge of the slot line is parallel to the edge of the surface-mounted pad. Therefore, impedance discontinuity between the surface-mounted bonding pad and the differential coupling line can be further reduced, the integrity of differential mode signal transmission is further ensured, and insertion loss is further reduced.
Further, the length w of the rectangular patch in the H-shaped metal patch4Width l of rectangular patch 4mm72.1mm, length of bridge l61.2mm, width w of the bridge3=1.1mm。
Further, the length l of the short circuit branch section80.5mm, width w of the short-circuit branch5The distance from the short stub to the bridge is 1.63mm, 0.16 mm.
Further, the H-shaped metal patch is located right below the differential coupling line.
Has the advantages that: the invention discloses an H-shaped mushroom-shaped ultra-wideband common mode noise suppression circuit, which has the following beneficial effects compared with the prior art:
1) the differential coupling line is designed to be in a winding shape, so that the miniaturization of the circuit is realized;
2) the metal patch is designed into an H shape, so that a stepped impedance resonator can be formed, and the performance of the whole circuit can be adjusted by adjusting the impedance ratio;
3) the metal patches are designed into an H shape, only one rectangular patch is loaded with two short circuit branches, and the other rectangular patch is not loaded with the short circuit branches, so that an asymmetric short circuit branch loading structure is formed, induced current distribution on the H-shaped metal patch under common mode excitation is asymmetric, four resonance modes are effectively excited, each resonance mode correspondingly generates a common mode transmission zero point at a specific frequency band, the four resonance modes are mutually coupled, and the bandwidth of a common mode stop band is effectively widened; and moreover, as the number of resonant modes is large, the rejection depth of the common-mode stop band is deepened.
Drawings
FIG. 1 is an overall circuit diagram of an embodiment of the present invention;
FIG. 2 is a dimension diagram of a differentially coupled line according to an embodiment of the present invention;
FIG. 3 is a dimensional diagram of an H-shaped metal patch in accordance with an embodiment of the present invention;
FIG. 4 is a plot of the dimensions of a formation in accordance with an embodiment of the present invention;
FIG. 5 is a diagram of simulation results of a circuit according to an embodiment of the present invention.
Detailed Description
The technical solution of the present invention will be further described with reference to the following detailed description and accompanying drawings.
The specific embodiment discloses an H-shaped mushroom-shaped ultra-wideband common mode noise suppression circuit, which comprises a dielectric substrate 6, wherein the dielectric substrate 6 is divided into two layers, the upper layer is a first layer, and the thickness of the first layer is H1The next layer is a second layer having a thickness h2It is obvious that1+h2Is the total thickness of the dielectric substrate 6. The dielectric substrate 6 has a plate material Dupont 951, and the relevant electrical parameters are as follows: epsilonr7.8, tan δ 0.002. The circuit is processed by a low-temperature co-fired ceramic (LTCC) process.
The top of the dielectric substrate 6 is provided with a meandering differential coupling line 1, and the differential coupling line 1 is composed of two lines, symmetrical with respect to the signal transmission direction, as shown in fig. 1 and 2. As shown in fig. 2, the dimensions of each part of the differentially coupled line 1 are: l1=1.5mm,l2=0.6mm,l3=3.3mm,l4=0.6mm,l5=0.8mm,w1=0.15mm,w2=0.3mm,r1=0.08mm。
As shown in fig. 1, an H-shaped metal patch 2 is disposed at the bottom of the first layer of the dielectric substrate 6, and the H-shaped metal patch 2 is located right below the differential coupling line 1. As shown in fig. 3, the H-shaped metal patch 2 includes a first rectangular patch 21, a second rectangular patch 22, and a bridge 23 connecting the two rectangular patches, and only the first rectangular patch 21 is loaded with two short-circuit stubs symmetric with respect to the signal transmission direction, which are a first short-circuit stub 211 and a second short-circuit stub 212. As shown in fig. 3, the dimensions of each part of the H-shaped metal patch 2 are: l6=1.2mm,l7=2.1mm,l8=0.5mm,w3=1.1mm,w4=4mm,w5=2r20.16mm and 1 mm. It can be seen that the distance from both short-circuit stubs to the bridge 23 is 1.63 mm.
As shown in FIG. 1, a ground layer 4 is arranged at the bottom of a medium substrate 6, and a surface-mounted bonding pad is arranged on the ground layer 4And 5, the differential coupling line 1 is connected with the circular surface-mounted bonding pad 5 through a metalized through hole 31. A circle of annular groove line 7 is arranged around the surface bonding pad 5. The first short-circuit stub 211 is connected to the ground 4 via a metallized via 32 and the second short-circuit stub 212 is connected to the ground 4 via a metallized via 33. As shown in fig. 4, the dimensions of the portions of the formation 4 are: l9=7mm,w6=5mm,r3=0.43mm,r4=0.26mm。
FIG. 5 is a simulation diagram of the present embodiment, Sdd21And Scc21Respectively, the transmission coefficient curves of the differential mode and common mode signals through the circuit structure. It can be seen that the differential mode signal insertion loss (| S) is observed in the dc-12GHz frequency rangedd21I) is less than 1dB, which shows that the common mode noise suppression circuit can well ensure the complete transmission of differential mode signals; meanwhile, the common mode noise rejection depth in the frequency band of 2.77-10.43GHz is over-10 dB (S)cc21<-10dB), the relative bandwidth of the common mode stop band reaches 116%, and the bandwidth of the common mode stop band is ultra-wide. In the frequency band of the common-mode stop band, the common-mode transmission zero is totally four and is respectively positioned at 3.6GHz, 5.48GHz, 7.72GHz and 9.55GHz, the four common-mode transmission zeros are uniformly distributed in the stop band, so that the common-mode noise rejection depth is deeper, and the common-mode noise rejection depth is more than-15 dB (S) (within the frequency band of 3.07-10.11 GHz)cc21<15dB), the relative bandwidth reaches 106.8%, and the practicability is strong.
Claims (6)
1. An H-shaped mushroom-shaped ultra wide band common mode noise suppression circuit is characterized in that: including medium base plate (6), medium base plate (6) top is equipped with sinuous differential coupling line (1), differential coupling line (1) is symmetrical about the signal transmission direction, medium base plate (6) inside is equipped with H shape metal patch (2), H shape metal patch (2) are located differential coupling line (1) under, H shape metal patch (2) include two rectangle patches and the bridge of connecting two rectangle patches, only loaded two short circuit branch festivals about the signal transmission direction symmetry on the rectangle patch, the both sides that are located the bridge of two short circuit branch festivals symmetries, medium base plate (6) bottom is equipped with stratum (4), differential coupling line (1) and short circuit branch festival all are through metallization through-hole ground plane (4).
2. The H-shaped mushroom ultra-wideband common mode noise suppression circuit according to claim 1, wherein: and a surface-mounted pad (5) is arranged on the stratum (4), and the metalized through hole connected with the differential coupling line (1) is connected with the surface-mounted pad (5).
3. The H-shaped mushroom ultra-wideband common mode noise suppression circuit according to claim 2, wherein: and a circle of groove line (7) is also arranged around the surface mounting bonding pad (5).
4. The H-shaped mushroom ultra-wideband common mode noise suppression circuit according to claim 3, wherein: the edge of the slot line (7) is parallel to the edge of the surface-mounted bonding pad (5).
5. The H-shaped mushroom ultra-wideband common mode noise suppression circuit according to claim 1, wherein: the length w of the rectangular patch in the H-shaped metal patch (2)4Width l of rectangular patch 4mm72.1mm, length of bridge l61.2mm, width w of the bridge3=1 .1mm。
6. The H-shaped mushroom ultra-wideband common mode noise suppression circuit according to claim 5, wherein: length l of the short circuit branch80.5mm, width w of the short-circuit branch5The distance from the short stub to the bridge is 1.63mm, 0.16 mm.
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5407085A (en) * | 1993-08-11 | 1995-04-18 | Colgate-Palmolive Company | Display rack |
CN1830116A (en) * | 2003-07-28 | 2006-09-06 | 皇家飞利浦电子股份有限公司 | High frequency component |
KR101207667B1 (en) * | 2010-12-01 | 2012-12-03 | 주식회사 아모텍 | common mode filter for HDMI |
CN204361223U (en) * | 2015-01-07 | 2015-05-27 | 成都九洲迪飞科技有限责任公司 | Wideband microstrip filter |
CN105811057A (en) * | 2016-05-12 | 2016-07-27 | 南通大学 | Balance type common-mode filter with adjustable broad band |
CN106299671A (en) * | 2016-10-17 | 2017-01-04 | 山西大学 | Double frequency-band filter antenna |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120098627A1 (en) * | 2009-07-07 | 2012-04-26 | Elmec Corporation | Common mode filter |
CN203218417U (en) * | 2013-04-07 | 2013-09-25 | 华南理工大学 | Ultra-wide-band coplanar waveguide filter employing H-type resonator with terminal short circuit |
CN104579220B (en) * | 2015-02-03 | 2017-12-05 | 深圳市麦捷微电子科技股份有限公司 | Multiple layer ceramic dielectric chip low pass filter |
CN104638323B (en) * | 2015-02-06 | 2017-04-19 | 南京理工大学 | High-selectivity broadband multi-order band-pass filter based on LTCC (Low Temperature Co-Fired Ceramic) technology |
CN205752465U (en) * | 2016-06-22 | 2016-11-30 | 东北大学 | Based on parallel coupled line and the difference filter of open circuit minor matters |
CN109194299B (en) * | 2018-10-11 | 2023-10-27 | 深圳市麦捷微电子科技股份有限公司 | Ultra-miniature LTCC low-pass filter |
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5407085A (en) * | 1993-08-11 | 1995-04-18 | Colgate-Palmolive Company | Display rack |
CN1830116A (en) * | 2003-07-28 | 2006-09-06 | 皇家飞利浦电子股份有限公司 | High frequency component |
KR101207667B1 (en) * | 2010-12-01 | 2012-12-03 | 주식회사 아모텍 | common mode filter for HDMI |
CN204361223U (en) * | 2015-01-07 | 2015-05-27 | 成都九洲迪飞科技有限责任公司 | Wideband microstrip filter |
CN105811057A (en) * | 2016-05-12 | 2016-07-27 | 南通大学 | Balance type common-mode filter with adjustable broad band |
CN106299671A (en) * | 2016-10-17 | 2017-01-04 | 山西大学 | Double frequency-band filter antenna |
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