CN108962775A - A kind of the binding mould group and device of chip - Google Patents
A kind of the binding mould group and device of chip Download PDFInfo
- Publication number
- CN108962775A CN108962775A CN201810639567.1A CN201810639567A CN108962775A CN 108962775 A CN108962775 A CN 108962775A CN 201810639567 A CN201810639567 A CN 201810639567A CN 108962775 A CN108962775 A CN 108962775A
- Authority
- CN
- China
- Prior art keywords
- area
- chip
- pressure head
- driving chip
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75302—Shape
- H01L2224/75303—Shape of the pressing surface
- H01L2224/75304—Shape of the pressing surface being curved
Abstract
The present invention provides the binding mould group and device of a kind of chip, and the binding mould group of this kind of chip includes: pressure head, for driving chip to be pressed together in the welding region of display panel；During the pressing process, the pressure of the first area is greater than the pressure of the second area, wherein the first area is region corresponding with the connection terminal of the driving chip in the pressure head；The second area is region corresponding with the region other than the connection terminal of the driving chip in the pressure head.The binding mould group and device of chip of the invention can prevent chip in bonding processes from warpage occurs and simplifies making technology.
Description
[technical field]
The present invention relates to field of display technology, more particularly to the binding mould group and device of a kind of chip.
[background technique]
In general, display device includes the display drive apparatus of display panel and welding on a display panel, display driving dress
Set may include flexible printed circuit board or driving chip.As shown in Figure 1, to make the display area 11 of display panel work (luminous),
It needs from welding region 12 (bonding area) input signal.As shown in Fig. 2, being directed to COG (Chip On Glass) and COP
Driving chip (IC) 20 is usually directly bound in welding region 12, to provide driving letter by the modular structure of (Chip On PI)
Number.Pressing EDS maps on driving chip 20 are as shown in figure 3, driving chip 20 includes input terminal 21 and output end 22, input terminal
It is spaced a distance between 21 and output end 22.As shown in figure 4, driving chip 20 can be pressed together on by pressure head 30 in pressing
On welding region 12, the input terminal of driving chip 20 and output end are specifically pressed together on the corresponding pin of welding region 12
(pad) on.Since 30 moment distribution of pressure head is uneven, often make the effect great efforts among pressure head 30, both ends active force is small.
As shown in figure 5, under normal circumstances, since 20 intermediate region of driving chip does not have the support of pin, so that when pressing
20 intermediate region of driving chip is easy to collapse, and leads to both ends warpage, and then makes the pin at both ends (namely by proximal edge) can not be good
Good contact, to influence display effect.
To avoid driving chip both ends warpage, existing widespread practice is idle in driving chip intermediate region one row of increase
The pin (dummy pad) of energy shown in dotted line frame as shown in FIG. 6, is played a supporting role in pressing.This mode needs
Also the non-functional pin of a row is made on substrate, to influence the signal routing on substrate, causes making technology to become complicated, drop
Low production efficiency.
Therefore, it is necessary to the binding mould group and device of a kind of chip be provided, to solve the problems of prior art.
[summary of the invention]
The purpose of the present invention is to provide the binding mould groups and device of a kind of chip, can prevent chip in bonding processes
Both ends occur warpage and simplify making technology, improve production efficiency.
In order to solve the above technical problems, the present invention provides a kind of binding mould group of chip comprising:
Pressure head, for driving chip to be pressed together in the welding region of display panel；During the pressing process, firstth area
The pressure in domain is greater than the pressure of the second area, wherein the first area is the company in the pressure head with the driving chip
The corresponding region of connecting terminal；The second area be the pressure head in the region pair other than the connection terminal of the driving chip
The region answered.
In the binding mould group of chip of the invention, the pressure head has a stitching surface, the stitching surface of the second area
For concave panel.
In the binding mould group of chip of the invention, the stitching surface of the second area has upward radian.
In the binding mould group of chip of the invention, the radius of curvature of the radian is located in preset range.
In the binding mould group of chip of the invention, buffer unit is embedded in the pressure head of the second area.
The present invention also provides a kind of binding devices of chip comprising: the binding mould group of chip comprising:
Pressure head, for driving chip to be pressed together in the welding region of display panel；During the pressing process, firstth area
The pressure in domain is greater than the pressure of the second area, wherein the first area is the company in the pressure head with the driving chip
The corresponding region of connecting terminal；The second area be the pressure head in the region pair other than the connection terminal of the driving chip
The region answered.
In the binding device of chip of the invention, the pressure head has a stitching surface, the stitching surface of the second area
For concave panel.
In the binding device of chip of the invention, the stitching surface of the second area has upward radian.
In the binding device of chip of the invention, the radius of curvature of the radian is located in preset range.
In the binding device of chip of the invention, buffer unit is embedded in the pressure head of the second area.
The binding mould group and device of chip of the invention, since the pressure setting among pressure head to be less than to the pressure at pressure head edge
Power so as to avoid the intermediate region of driving chip in bonding processes from collapsing, and then prevents the both ends of chip from sticking up
Song, while making technology can also be simplified, improve production efficiency.
[Detailed description of the invention]
Fig. 1 is the top view of existing display panel；
Fig. 2 is the structural schematic diagram when pressing of existing display panel has driving chip；
Fig. 3 is the top view of 2 driving chip stitching surfaces in figure；
Fig. 4 is structural schematic diagram when existing pressure head presses driving chip；
Fig. 5 is the structural schematic diagram of driving chip after the completion of existing pressing；
Fig. 6 is the top view of existing driving chip stitching surface；
Fig. 7 is structural schematic diagram when one pressure head of the embodiment of the present invention presses driving chip；
Fig. 8 is structural schematic diagram when two pressure head of the embodiment of the present invention presses driving chip.
[specific embodiment]
The explanation of following embodiment is to can be used to the particular implementation of implementation to illustrate the present invention with reference to additional schema
Example.The direction term that the present invention is previously mentioned, such as "upper", "lower", "front", "rear", "left", "right", "inner", "outside", " side "
Deng being only the direction with reference to annexed drawings.Therefore, the direction term used be to illustrate and understand the present invention, rather than to
The limitation present invention.The similar unit of structure is to be given the same reference numerals in the figure.
Please referring to Fig. 7 to 8, Fig. 7 is structural schematic diagram when pressure head of the present invention presses driving chip.
As shown in fig. 7, the binding mould group of chip of the invention includes: pressure head 40, pressure head 40 is used to driving chip pressing 20
It closes in the welding region of display panel 10；In conjunction with Fig. 2, wherein being provided with one between driving chip 20 and welding region 12
Layer anisotropy conductiving glue (not shown), anisotropy conductiving glue mainly includes resin adhesive agent, the big portion of conducting particles two
Point, the function of resin adhesive agent include it is moisture-proof, stick together, heat-resisting and insulation function, resin adhesive agent is mainly used for driving chip
20 are bundled on welding region 12.Driving chip 20 is pressed particular by pressure head 40, to act on conducting resinl generation
Power makes driving chip 20 be bundled in welding region 12, so that driving chip 20 and welding region 12 are electrically connected.
It is provided with pin 121 on welding region 12, multiple connection terminals are provided on driving chip 20, the connecting pin
Attached bag includes input terminal 21 and output end 22 namely the position of pin 121 and the position of connection terminal is corresponding.
Region corresponding with the connection terminal of the driving chip 20 in the pressure head 40 is known as first area；It will be described
Region corresponding with the region other than the connection terminal of the driving chip 20 is known as second area namely the secondth area in pressure head 40
Domain is corresponding with the region of not set connection terminal in the driving chip 20.During the pressing process, the firstth area of the pressure head 40
The pressure in domain is greater than the pressure of the second area of the pressure head 40.For example, in an embodiment, the connection of the driving chip 20
Terminal is located at the two sides of the driving chip 20, and the pressure of 40 two side areas of pressure head is greater than the intermediate region of the pressure head
Pressure.
The pressure head 40 has a stitching surface 41, which, can be by the pressure head 40 close to 20 side of driving chip
Stitching surface 41 be set as non-flat configuration so that state the first area of pressure head 40 pressure be greater than the pressure head 40 the secondth area
The pressure in domain.
In one embodiment, the stitching surface 411 of the second area is concave panel.
For example, the first area is two side areas, the second area is intermediate region, can be by the middle area of pressure head
The stitching surface 411 in domain is set as concave panel, and the recess direction of the concave panel is upward.It should be understood that the stitching surface of first area
412 for the surface of smooth face namely fringe region be even curface.
In one embodiment, the stitching surface 411 of the second area has upward radian.Namely the second area
Stitching surface 411 be the arc being bent upwards.
In order to preferably avoid the two sides of driving chip that warpage occurs, the radius of curvature of the radian is located at preset range
It is interior.
In one embodiment, the cross sectional shape triangle of the stitching surface 411 of the second area.Certainly, described second
The cross sectional shape of the stitching surface 411 in region is not limited to above several, and the cross sectional shape of the stitching surface 411 of the second area may be used also
Think other shapes, for example be quadrangle, trapezoidal etc., as long as the stitching surface of second area can be made to generate recess.
In another embodiment, it is embedded with buffer unit 42 as shown in figure 8, being located in the pressure head 40 of the second area,
Namely buffer unit 42 is embedded in second area.The buffer unit 42 during the pressing process, discharges the pressure of a part of pressure head.
Preferably, the bottom of the intermediate region of the pressure head 40 is arranged in the buffer unit 42, it will of course be understood that
, which also can be set the centre or the top in 40 intermediate region of pressure head.The shape of the buffer unit 42
It is not construed as limiting.
Due to, the pressure of the first area of pressure head 40 of the invention is greater than the pressure of the second area of the pressure head 40, because
This makes in bonding processes, avoids the pressure of intermediate region excessive, so that the intermediate region of driving chip collapses, Jin Erfang
Only warpage occurs for the both ends of chip, while can also simplify making technology, improves production efficiency.
The binding mould group of chip of the invention, since the pressure setting among pressure head to be less than to the pressure at pressure head edge, from
And can be collapsed to avoid the intermediate region of driving chip in bonding processes, and then prevent the both ends of chip from warpage occurs, together
When can also simplify making technology, improve production efficiency.
The present invention also provides a kind of binding devices of chip comprising: the binding mould group of chip, as shown in fig. 7, of the invention
The binding mould group of chip include: pressure head 40, pressure head 40 is used to closing driving chip pressure 20 into the welding regions in display panel 10
In；In conjunction with Fig. 2, wherein being provided with one layer of anisotropy conductiving glue between driving chip 20 and welding region 12 (in figure not
Show), anisotropy conductiving glue mainly includes resin adhesive agent, conducting particles two large divisions, and the function of resin adhesive agent includes
It is moisture-proof, stick together, heat-resisting and insulation function, resin adhesive agent is mainly used for for driving chip 20 being bundled on welding region 12.Tool
Body is to be pressed by pressure head 40 to driving chip 20, to generate active force to conducting resinl, driving chip 20 is made to be bundled in weldering
Region 12 is connect, so that driving chip 20 and welding region 12 are electrically connected.
It is provided with pin 121 on welding region 12, multiple connection terminals are provided on driving chip 20, the connecting pin
Attached bag includes input terminal 21 and output end 22 namely the position of pin 121 and the position of connection terminal is corresponding.
Region corresponding with the connection terminal of the driving chip 20 in the pressure head 40 is known as first area；It will be described
Region corresponding with the region other than the connection terminal of the driving chip 20 is known as second area namely the secondth area in pressure head 40
Domain is corresponding with the region of not set connection terminal in the driving chip 20.During the pressing process, the firstth area of the pressure head 40
The pressure in domain is greater than the pressure of the second area of the pressure head 40.For example, in an embodiment, the connection of the driving chip 20
Terminal is located at the two sides of the driving chip 20, and the pressure of 40 two side areas of pressure head is greater than the intermediate region of the pressure head
Pressure.
The pressure head 40 has a stitching surface 41, which, can be by the pressure head 40 close to 20 side of driving chip
Stitching surface 41 be set as non-flat configuration so that state the first area of pressure head 40 pressure be greater than the pressure head 40 the secondth area
The pressure in domain.
In one embodiment, the stitching surface 411 of the second area is concave panel.
For example, the first area is two side areas, the second area is intermediate region, can be by the middle area of pressure head
The stitching surface 411 in domain is set as concave panel, and the recess direction of the concave panel is upward.It should be understood that the stitching surface of first area
412 for the surface of smooth face namely fringe region be even curface.
In one embodiment, the stitching surface 411 of the second area has upward radian.Namely the second area
Stitching surface 411 be the arc being bent upwards.
In order to preferably avoid the two sides of driving chip that warpage occurs, the radius of curvature of the radian is located at preset range
It is interior.
In one embodiment, the cross sectional shape of the stitching surface 411 of the second area is triangle.Certainly, described
The cross sectional shape of the stitching surface 411 in two regions is not limited to above several, and the cross sectional shape of the stitching surface 411 of the second area is also
It can be other shapes, for example be quadrangle, trapezoidal etc., as long as the stitching surface of second area can be made to generate recess.
In another embodiment, it is embedded with buffer unit 42 as shown in figure 8, being located in the pressure head 40 of the second area,
Namely buffer unit 42 is embedded in second area.The buffer unit 42 during the pressing process, discharges the pressure of a part of pressure head.
Preferably, the bottom of the intermediate region of the pressure head 40 is arranged in the buffer unit 42, it will of course be understood that
, which also can be set the centre or the top in 40 intermediate region of pressure head.The shape of the buffer unit 42
It is not construed as limiting.
Due to, the pressure of the first area of pressure head 40 of the invention is greater than the pressure of the second area of the pressure head 40, because
This makes in bonding processes, avoids the pressure of intermediate region excessive, so that the intermediate region of driving chip collapses, Jin Erfang
Only warpage occurs for the both ends of chip, while can also simplify making technology, improves production efficiency.
The binding device of chip of the invention, since the pressure setting among pressure head to be less than to the pressure at pressure head edge, from
And can be collapsed to avoid the intermediate region of driving chip in bonding processes, and then prevent the both ends of chip from warpage occurs, together
When can also simplify making technology, improve production efficiency.
In conclusion although the present invention has been disclosed above in the preferred embodiment, but above preferred embodiment is not to limit
The system present invention, those skilled in the art can make various changes and profit without departing from the spirit and scope of the present invention
Decorations, therefore protection scope of the present invention subjects to the scope of the claims.
Claims (10)
1. a kind of binding mould group of chip characterized by comprising
Pressure head, for driving chip to be pressed together in the welding region of display panel；During the pressing process, the first area
Pressure is greater than the pressure of the second area, wherein the first area is the connecting pin in the pressure head with the driving chip
The corresponding region of son；The second area is corresponding with the region other than the connection terminal of the driving chip in the pressure head
Region.
2. the binding mould group of chip according to claim 1, which is characterized in that the pressure head has a stitching surface, described
The stitching surface of second area is concave panel.
3. the binding mould group of chip according to claim 2, which is characterized in that the stitching surface of the second area have to
On radian.
4. the binding mould group of chip according to claim 3, which is characterized in that the radius of curvature of the radian is located at default
In range.
5. the binding mould group of chip according to claim 1, which is characterized in that embedding in the pressure head of the second area
Enter to have buffer unit.
6. a kind of binding device of chip characterized by comprising the binding mould group of chip comprising:
Pressure head, for driving chip to be pressed together in the welding region of display panel；During the pressing process, the first area
Pressure is greater than the pressure of the second area, wherein the first area is the connecting pin in the pressure head with the driving chip
The corresponding region of son；The second area is corresponding with the region other than the connection terminal of the driving chip in the pressure head
Region.
7. the binding device of chip according to claim 6, which is characterized in that the pressure head has a stitching surface, described
The stitching surface of second area is concave panel.
8. the binding device of chip according to claim 7, which is characterized in that the stitching surface of the second area have to
On radian.
9. the binding device of chip according to claim 8, which is characterized in that the radius of curvature of the radian is located at default
In range.
10. the binding device of chip according to claim 6, which is characterized in that in the pressure head of the second area
It is embedded with buffer unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810639567.1A CN108962775A (en) | 2018-06-20 | 2018-06-20 | A kind of the binding mould group and device of chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810639567.1A CN108962775A (en) | 2018-06-20 | 2018-06-20 | A kind of the binding mould group and device of chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108962775A true CN108962775A (en) | 2018-12-07 |
Family
ID=64490486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810639567.1A Pending CN108962775A (en) | 2018-06-20 | 2018-06-20 | A kind of the binding mould group and device of chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108962775A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110544655A (en) * | 2019-09-03 | 2019-12-06 | 云谷（固安）科技有限公司 | Binding device and binding method |
| CN112188830A (en) * | 2020-10-16 | 2021-01-05 | Tcl华星光电技术有限公司 | Adsorption mechanism, pressing device and pressing method of display module |
| CN112748613A (en) * | 2020-12-31 | 2021-05-04 | 湖北长江新型显示产业创新中心有限公司 | Display substrate, display panel and display device |
| CN113823183A (en) * | 2021-09-30 | 2021-12-21 | 武汉华星光电技术有限公司 | Display panel and display device |
| CN114071907A (en) * | 2020-08-04 | 2022-02-18 | Oppo广东移动通信有限公司 | Decorative film, electronic equipment shell, manufacturing method of electronic equipment shell, mold and electronic equipment |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000150584A (en) * | 1998-11-13 | 2000-05-30 | Matsushita Electric Ind Co Ltd | Semiconductor device mounting device |
| JP2008210842A (en) * | 2007-02-23 | 2008-09-11 | Henkel Corp | Mounting method of electronic component with bump |
| JP2009260379A (en) * | 2009-07-31 | 2009-11-05 | Casio Comput Co Ltd | Bonding apparatus and bonding method using the same |
| CN203133430U (en) * | 2013-03-13 | 2013-08-14 | 深圳市华星光电技术有限公司 | Anisotropic conductive film bonding head and attaching equipment with same |
| US20140106484A1 (en) * | 2012-10-16 | 2014-04-17 | Samsung Display Co., Ltd. | Bonding apparatus and method for display device |
| CN104678604A (en) * | 2013-11-27 | 2015-06-03 | 浙江金徕镀膜有限公司 | Crimping device |
| US20170221934A1 (en) * | 2016-02-02 | 2017-08-03 | Japan Display Inc. | Display device |
| CN107621710A (en) * | 2017-11-10 | 2018-01-23 | 京东方科技集团股份有限公司 | Driving chip, display base plate, the preparation method of display device and display device |
| CN207068372U (en) * | 2017-08-29 | 2018-03-02 | 京东方科技集团股份有限公司 | Lower flattening bench and bonding component |
-
2018
- 2018-06-20 CN CN201810639567.1A patent/CN108962775A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000150584A (en) * | 1998-11-13 | 2000-05-30 | Matsushita Electric Ind Co Ltd | Semiconductor device mounting device |
| JP2008210842A (en) * | 2007-02-23 | 2008-09-11 | Henkel Corp | Mounting method of electronic component with bump |
| JP2009260379A (en) * | 2009-07-31 | 2009-11-05 | Casio Comput Co Ltd | Bonding apparatus and bonding method using the same |
| US20140106484A1 (en) * | 2012-10-16 | 2014-04-17 | Samsung Display Co., Ltd. | Bonding apparatus and method for display device |
| CN203133430U (en) * | 2013-03-13 | 2013-08-14 | 深圳市华星光电技术有限公司 | Anisotropic conductive film bonding head and attaching equipment with same |
| CN104678604A (en) * | 2013-11-27 | 2015-06-03 | 浙江金徕镀膜有限公司 | Crimping device |
| US20170221934A1 (en) * | 2016-02-02 | 2017-08-03 | Japan Display Inc. | Display device |
| CN207068372U (en) * | 2017-08-29 | 2018-03-02 | 京东方科技集团股份有限公司 | Lower flattening bench and bonding component |
| CN107621710A (en) * | 2017-11-10 | 2018-01-23 | 京东方科技集团股份有限公司 | Driving chip, display base plate, the preparation method of display device and display device |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110544655A (en) * | 2019-09-03 | 2019-12-06 | 云谷（固安）科技有限公司 | Binding device and binding method |
| CN110544655B (en) * | 2019-09-03 | 2021-09-14 | 云谷（固安）科技有限公司 | Binding device and binding method |
| CN114071907A (en) * | 2020-08-04 | 2022-02-18 | Oppo广东移动通信有限公司 | Decorative film, electronic equipment shell, manufacturing method of electronic equipment shell, mold and electronic equipment |
| CN114071907B (en) * | 2020-08-04 | 2023-03-28 | Oppo广东移动通信有限公司 | Decorative film, electronic equipment shell, manufacturing method of electronic equipment shell, mold and electronic equipment |
| CN112188830A (en) * | 2020-10-16 | 2021-01-05 | Tcl华星光电技术有限公司 | Adsorption mechanism, pressing device and pressing method of display module |
| CN112188830B (en) * | 2020-10-16 | 2021-09-03 | Tcl华星光电技术有限公司 | Adsorption mechanism, pressing device and pressing method of display module |
| CN112748613A (en) * | 2020-12-31 | 2021-05-04 | 湖北长江新型显示产业创新中心有限公司 | Display substrate, display panel and display device |
| CN112748613B (en) * | 2020-12-31 | 2022-07-26 | 湖北长江新型显示产业创新中心有限公司 | Display substrate, display panel and display device |
| CN113823183A (en) * | 2021-09-30 | 2021-12-21 | 武汉华星光电技术有限公司 | Display panel and display device |
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Application publication date: 20181207 |