CN108962553A - One kind having hot pipe conducting high-efficient heat-dissipating encapsulating class transformer reactance device structure - Google Patents

One kind having hot pipe conducting high-efficient heat-dissipating encapsulating class transformer reactance device structure Download PDF

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Publication number
CN108962553A
CN108962553A CN201810770462.XA CN201810770462A CN108962553A CN 108962553 A CN108962553 A CN 108962553A CN 201810770462 A CN201810770462 A CN 201810770462A CN 108962553 A CN108962553 A CN 108962553A
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CN
China
Prior art keywords
heat
product
dissipating
enclosure body
device structure
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Pending
Application number
CN201810770462.XA
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Chinese (zh)
Inventor
李月明
曹帅
乔志杰
李川
张兆图
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SHENZHEN JINSHUNYI ELECTRONICS Co Ltd
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SHENZHEN JINSHUNYI ELECTRONICS Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by SHENZHEN JINSHUNYI ELECTRONICS Co Ltd filed Critical SHENZHEN JINSHUNYI ELECTRONICS Co Ltd
Priority to CN201810770462.XA priority Critical patent/CN108962553A/en
Publication of CN108962553A publication Critical patent/CN108962553A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/08Cooling; Ventilating
    • H01F27/22Cooling by heat conduction through solid or powdered fillings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/02Casings
    • H01F27/025Constructional details relating to cooling

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention discloses one kind to have hot pipe conducting high-efficient heat-dissipating encapsulating class transformer reactance device structure, including aluminium shell, reactor core and casting glue, the reactor core inner wrap has reactor winding, the aluminium shell includes enclosure body, heat conducting module is equipped on the inside of the reactor winding, heat conducting module upper end is connected with heat-conductive thermo tube, heat dissipation tooth plate is installed, enclosure body middle inside is equipped with and the mutually matched heat pipe connecting hole of heat-conductive thermo tube in the middle part of the enclosure body rear and front end.The present invention, aluminum shell is subjected to special designing, is allowed under the premise of meeting glue filling, the effect that installation is confined, while the radiating requirements of product, and heat conductive process is conducted by traditional by casting glue, the best heat-conductive thermo tube of current heating conduction is changed to as transmitting medium, is made in product design under same product requirement, so that product has smaller volume, to substantially reduce product cost, increase the competitiveness of product in market, high reliablity is worthy to be popularized.

Description

One kind having hot pipe conducting high-efficient heat-dissipating encapsulating class transformer reactance device structure
Technical field
It is specifically a kind of to have hot pipe conducting high-efficient heat-dissipating encapsulating class the present invention relates to transformer reactance device technical field Transformer reactance device structure.
Background technique
High frequency encapsulating class transformer reactance device product has high antifouling grade, stress levels and seismic behavior.Especially It is the industry that rail traffic, outdoor photovoltaic etc. have particular/special requirement to application environment, particularly having indicated need to be using through dosing technology The infrastructure product of the transformer reactance device of processing.
Encapsulating class transformer reactance device product generally by: aluminum shell, product body and casting glue three parts form. Wherein aluminum shell mainly serves: installation confinement, product body realize product function, casting glue realize body it is thermally conductive, confine, The effects of insulation pressure resistance.The characteristics of such product is that body is wrapped up by casting glue completely, and the heat that body generates need to all pass through The heating conduction of casting glue dissipates temperature through aluminum shell surface, and to meet the temperature rise model of product, while casting glue is hard It spends performance and determines the noise specification generated under product low frequency by vibration.It can be seen that each performance indicator of casting glue, to product Reliability has vital effect.Especially the industries such as rail traffic and outdoor photovoltaic also propose flame retardant property clear Index.
However the casting glue cost for being able to satisfy various aspects of performance index currently on the market is all higher, reaches several hundred or even thousands of First per kilogram, so the transformer reactance device product handled through dosing technology is general in price to be all significantly larger than other technique classes The product of type, with a kind of increasingly fierce, encapsulating class transformer for the high-efficient heat-dissipating reducing product cost of market competition Reactor has had very big market value.
Summary of the invention
The purpose of the present invention is to provide one kind to have hot pipe conducting high-efficient heat-dissipating encapsulating class transformer reactance device structure, To solve the problems mentioned in the above background technology.
To achieve the above object, the invention provides the following technical scheme:
One kind having hot pipe conducting high-efficient heat-dissipating encapsulating class transformer reactance device structure, including aluminium shell, reactor core And casting glue, the reactor core inner wrap have reactor winding, the aluminium shell includes enclosure body, the reactance Heat conducting module is equipped on the inside of device coil, heat conducting module upper end is connected with heat-conductive thermo tube, peace in the middle part of the enclosure body rear and front end Equipped with heat dissipation tooth plate, enclosure body middle inside is equipped with and the mutually matched heat pipe connecting hole of heat-conductive thermo tube.
As a further solution of the present invention: the enclosure body bottom end is equipped with mounting hole, in enclosure body left and right ends Portion is equipped with outlet hole.
As a further solution of the present invention: the reactor winding is electrically connected with lead-out wire, and lead-out wire passes through outlet On the outside of hole to aluminium casing.
As a further solution of the present invention: the casting glue is epoxy pouring sealant.
As further scheme of the invention: the enclosure body is made of that the aluminium that the trade mark is 6063 T5 does substrate.
Compared with prior art, the beneficial effects of the present invention are:
Described a kind of with hot pipe conducting high-efficient heat-dissipating encapsulating class transformer reactance device structure, structurally reasonable, novel design will Aluminum shell carries out special designing, is allowed under the premise of meeting glue filling, the effect that installation is confined, while the heat dissipation of product Demand, and heat conductive process is conducted by traditional by casting glue, is changed to the best heat-conductive thermo tube conduct of current heating conduction Transmitting medium makes in product design under same product requirement, so that product has smaller volume, to substantially reduce Product cost, increases the competitiveness of product in market, and high reliablity is worthy to be popularized.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram with hot pipe conducting high-efficient heat-dissipating encapsulating class transformer reactance device structure.
Fig. 2 is a kind of structure with aluminium casing in hot pipe conducting high-efficient heat-dissipating encapsulating class transformer reactance device structure Schematic diagram.
Fig. 3 is a kind of facing structure signal with hot pipe conducting high-efficient heat-dissipating encapsulating class transformer reactance device structure Figure.
Fig. 4 is a kind of side view structure signal with hot pipe conducting high-efficient heat-dissipating encapsulating class transformer reactance device structure Figure.
Specific embodiment
It should be noted that in the absence of conflict, the feature in embodiment and embodiment in the present invention can phase Mutually combination.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", "upper", "lower", The orientation or positional relationship of the instructions such as "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside" is It is based on the orientation or positional relationship shown in the drawings, is merely for convenience of description of the present invention and simplification of the description, rather than instruction or dark Show that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as pair Limitation of the invention.In addition, term " first ", " second " etc. are used for description purposes only, it is not understood to indicate or imply phase To importance or implicitly indicate the quantity of indicated technical characteristic.The feature for defining " first ", " second " etc. as a result, can To explicitly or implicitly include one or more of the features.In the description of the present invention, unless otherwise indicated, " multiple " It is meant that two or more.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected;It can To be mechanical connection, it is also possible to be electrically connected;It can be directly connected, can also can be indirectly connected through an intermediary Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood by concrete condition Concrete meaning in the present invention.
The present invention will be described in detail below with reference to the accompanying drawings and embodiments.
Refering to fig. 1~4, in the embodiment of the present invention, one kind having hot pipe conducting high-efficient heat-dissipating encapsulating class transformer reactance Device structure, including aluminium shell 1, reactor core 5 and casting glue 3, the reactor core 5 are the main magnetic circuit of product, are increased The function of magnetic flux, for the aluminium shell 1 for realizing casting glue barricade and heat sinking function, the casting glue 3 is epoxy sealing Glue is further ensured that the mechanical strength of product, reinforces the pressure-resistant function that insulate, and 5 inner wrap of reactor core has reactor Voltage change function is simultaneously realized by electromagnetic induction principle in coil 7, product energization excitation part, and the reactor winding 7 is electrically It is connected with lead-out wire 2, realizes that the external connection function of product, lead-out wire 2 pass through outlet hole 11 to 1 outside of aluminium casing, the aluminium Shell 1 processed includes enclosure body 8, and the enclosure body 8 does substrate by the aluminium that the trade mark is made of 6063 T5, and 6063 T5 aluminium close The thermal coefficient of golden material is about 201W/m.K, be a kind of most material of current heat sink applications it have that processability is good, table Surface treatment is easy, the distinguishing features such as low in cost, keeps its cost while meeting properties of product minimum, so that product be made to have more The standby market competitiveness, 8 bottom end of enclosure body are equipped with mounting hole 9, realize product complete machine installation function, enclosure body 8 or so It is equipped with outlet hole 11 in the middle part of both ends, realizes that product is lifted one's head and draws function, heat conducting module 6 is equipped on the inside of the reactor winding 7, with The connection of heat-conductive thermo tube 4 realizes that interiors of products is externally connected with heat-conductive thermo tube 4 in thermally conductive function, 6 upper end of heat conducting module, with encapsulating aluminum The connection of the heat conducting module 6 of shell 1 and interiors of products, realization conduct interiors of products heat to aluminum hull shell 1, utilize aluminium shell 1 heat sinking function reduces the function of interiors of products temperature rise, and heat dissipation tooth plate 10 is equipped in the middle part of 8 rear and front end of enclosure body, For realizing the function of heat dissipation increasing heat radiation area, 8 middle inside of enclosure body is equipped with and the mutually matched heat pipe of heat-conductive thermo tube 4 Connecting hole 12, for realizing the linkage function of heat-conductive thermo tube 4 and aluminium casing 1.
The working principle of the invention is: carrying out special designing to traditional encapsulating aluminium shell 1, increasing heat dissipation tooth plate 10 makes It is meeting outside function itself, is provided simultaneously with the heat sinking function of product, it is specifically intended that the heat conductive process in this structure By traditional different by the casting glue heat-conducting effect of casting glue 3(difference thermal coefficient) conduction, it is changed to current heating conduction most The thermal conductivity of good heat-conductive thermo tube 4(heat pipe is approximately 3000 times of copper, is the hundreds of thousands times of casting glue) as transmitting medium, because The thermal conductivity of heat pipe is far longer than casting glue, so can make in product design under same product requirement, so that product With smaller volume, to substantially reduce product cost, increase the competitiveness of product in market.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention Within mind and principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.

Claims (5)

1. one kind has hot pipe conducting high-efficient heat-dissipating encapsulating class transformer reactance device structure, including aluminium shell (1), reactor Magnetic core (5) and casting glue (3), reactor core (5) inner wrap have reactor winding (7), aluminium shell (1) packet Include enclosure body (8), which is characterized in that be equipped with heat conducting module (6) on the inside of the reactor winding (7), heat conducting module (6) upper end It is connected with heat-conductive thermo tube (4), heat dissipation tooth plate (10) is installed in the middle part of enclosure body (8) rear and front end, enclosure body (8) is interior Middle side part is equipped with and the mutually matched heat pipe connecting hole (12) of heat-conductive thermo tube (4).
2. one kind according to claim 1 has hot pipe conducting high-efficient heat-dissipating encapsulating class transformer reactance device structure, It is characterized in that, enclosure body (8) bottom end is equipped with mounting hole (9), and outlet hole is equipped in the middle part of enclosure body (8) left and right ends (11).
3. one kind according to claim 1 has hot pipe conducting high-efficient heat-dissipating encapsulating class transformer reactance device structure, It is characterized in that, the reactor winding (7) is electrically connected with lead-out wire (2), and lead-out wire (2) passes through outlet hole (11) to aluminum shell On the outside of body (1).
4. one kind according to claim 1 has hot pipe conducting high-efficient heat-dissipating encapsulating class transformer reactance device structure, It is characterized in that, the casting glue (3) is epoxy pouring sealant.
5. one kind according to claim 1 has hot pipe conducting high-efficient heat-dissipating encapsulating class transformer reactance device structure, It is characterized in that, the enclosure body (8) does substrate by the aluminium that the trade mark is made of 6063 T5.
CN201810770462.XA 2018-07-13 2018-07-13 One kind having hot pipe conducting high-efficient heat-dissipating encapsulating class transformer reactance device structure Pending CN108962553A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180366257A1 (en) * 2017-06-15 2018-12-20 Radyne Corporation Use of Thermally Conductive Powders as Heat Transfer Materials for Electrical Components
CN110211773A (en) * 2019-07-10 2019-09-06 深圳市金顺怡电子有限公司 Electric device based on phase-change radiation system
CN112652464A (en) * 2020-12-29 2021-04-13 重庆电子工程职业学院 High-efficient radiating embedment class transformer
US20210265095A1 (en) * 2020-02-24 2021-08-26 Phihong Technology Co., Ltd. Electromagnetic apparatus with heat sink structure

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4009459A (en) * 1975-05-05 1977-02-22 Benson William H Resin-empotted dry-type electromagnet for dusty and gassey locations
CN202887914U (en) * 2012-10-08 2013-04-17 王爱民 Electric reactor with heat conduction device or transformer with heat conduction device
CN103117151A (en) * 2013-02-26 2013-05-22 上海鹰峰电子科技有限公司 Water-cooled reactor with heat conducted by heat tubes
CN104715896A (en) * 2015-04-08 2015-06-17 薛建仁 Novel epoxy-bucket iron core reactor adopting heat tube heat dissipation
CN205230741U (en) * 2015-12-24 2016-05-11 重庆益堡科技有限公司 Inductor that heat dispersion is good
CN106329808A (en) * 2016-09-29 2017-01-11 华南理工大学 Heat pipe type winding enhanced heat motor
CN106816273A (en) * 2017-03-06 2017-06-09 株洲南车奇宏散热技术有限公司 Heat dissipating method of encapsulation type magnetic element and products thereof
CN107799282A (en) * 2017-11-01 2018-03-13 深圳市英大科特技术有限公司 One kind radiating high frequency transformer, reactor and power electronic equipment

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4009459A (en) * 1975-05-05 1977-02-22 Benson William H Resin-empotted dry-type electromagnet for dusty and gassey locations
CN202887914U (en) * 2012-10-08 2013-04-17 王爱民 Electric reactor with heat conduction device or transformer with heat conduction device
CN103117151A (en) * 2013-02-26 2013-05-22 上海鹰峰电子科技有限公司 Water-cooled reactor with heat conducted by heat tubes
CN104715896A (en) * 2015-04-08 2015-06-17 薛建仁 Novel epoxy-bucket iron core reactor adopting heat tube heat dissipation
CN205230741U (en) * 2015-12-24 2016-05-11 重庆益堡科技有限公司 Inductor that heat dispersion is good
CN106329808A (en) * 2016-09-29 2017-01-11 华南理工大学 Heat pipe type winding enhanced heat motor
CN106816273A (en) * 2017-03-06 2017-06-09 株洲南车奇宏散热技术有限公司 Heat dissipating method of encapsulation type magnetic element and products thereof
CN107799282A (en) * 2017-11-01 2018-03-13 深圳市英大科特技术有限公司 One kind radiating high frequency transformer, reactor and power electronic equipment

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180366257A1 (en) * 2017-06-15 2018-12-20 Radyne Corporation Use of Thermally Conductive Powders as Heat Transfer Materials for Electrical Components
CN110211773A (en) * 2019-07-10 2019-09-06 深圳市金顺怡电子有限公司 Electric device based on phase-change radiation system
CN110211773B (en) * 2019-07-10 2023-11-21 深圳市金顺怡电子有限公司 Power device based on phase-change heat dissipation system
US20210265095A1 (en) * 2020-02-24 2021-08-26 Phihong Technology Co., Ltd. Electromagnetic apparatus with heat sink structure
US11594360B2 (en) * 2020-02-24 2023-02-28 Phihong Technology Co., Ltd. Electromagnetic apparatus with heat sink structure
CN112652464A (en) * 2020-12-29 2021-04-13 重庆电子工程职业学院 High-efficient radiating embedment class transformer

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Application publication date: 20181207

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