CN108960218A - A kind of ultrasonic fingerprint sensor and fingerprint recognition mould group - Google Patents
A kind of ultrasonic fingerprint sensor and fingerprint recognition mould group Download PDFInfo
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- CN108960218A CN108960218A CN201811116368.9A CN201811116368A CN108960218A CN 108960218 A CN108960218 A CN 108960218A CN 201811116368 A CN201811116368 A CN 201811116368A CN 108960218 A CN108960218 A CN 108960218A
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- 230000005540 biological transmission Effects 0.000 claims abstract description 16
- 238000000926 separation method Methods 0.000 claims abstract description 15
- 239000010410 layer Substances 0.000 claims description 58
- 239000011241 protective layer Substances 0.000 claims description 18
- 239000011521 glass Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 7
- 125000004122 cyclic group Chemical group 0.000 claims 1
- 239000012774 insulation material Substances 0.000 claims 1
- 230000035515 penetration Effects 0.000 abstract description 8
- 238000010586 diagram Methods 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000002604 ultrasonography Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002305 electric material Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/1365—Matching; Classification
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- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
A kind of ultrasonic fingerprint sensor and fingerprint recognition mould group, are related to sensor field.The ultrasonic fingerprint sensor of the embodiment of the present invention includes: emitting portion, is flood structure including electrode, transmission piezoelectric layer and transmitting top electrode, transmission piezoelectric layer under the transmitting that is superposed from the bottom to top；Separation layer is superposed in emitting portion；Receiving portion, including being superposed the electrode under the reception on separation layer from the bottom to top, receiving piezoelectric layer and receiving top electrode, the processing technology difficulty and processing cost of the ultrasonic fingerprint sensor are low, are conducive to volume production；And ultrasonic wave transmitting and penetration capacity are strong.The fingerprint recognition mould group of the embodiment of the present invention includes above-mentioned ultrasonic fingerprint sensor, which can generate clearly fingerprint image.
Description
Technical field
The present invention relates to sensor fields, in particular to a kind of ultrasonic fingerprint sensor and fingerprint recognition mould group.
Background technique
Ultrasonic fingerprint sensor identifies fingerprint by emitting and detecting reflected ultrasonic wave.Existing ultrasonic fingerprint
Sensor is generally by piezoelectric layer, the composition such as emission electrode, receiving electrode, wherein piezoelectric layer includes the piezo column of arrayed in columns, is connect
Receiving electrode includes receiving pole that is a plurality of and being formed in one end face of piezoelectric layer, and emission electrode includes a plurality of and to be formed in piezoelectric layer another
The emitter of end face.Piezoelectric layer has piezoelectric effect, can be used to emit or receive ultrasonic wave, each receiving pole it is corresponding with
The connection of one column piezo column, each emitter correspondence is connect with a line piezo column, in this way, which emitter and receiving pole can be single
Solely ultrasonic wave is excited and received to a certain piezo column.
The penetration capacity of ultrasonic fingerprint sensor is a critically important index, and penetrability is better, is more conducive to generate
Clearly fingerprint image, to improve the accuracy of fingerprint recognition.Penetration capacity performance, size and shape phase with piezo column again
It closes.In order to obtain stronger transmitting and penetration capacity, piezo column is usually designed as long column shape, it is therefore an objective to using it in the side d33
Upward strong vibration ability.But the long column shape piezo column of ceramics is difficult to process, processing cost is high, brings to volume production greatly tired
It is difficult.
Therefore, it is necessary to one kind to be easily worked, and ultrasonic wave transmitting and the strong ultrasonic fingerprint sensor of penetration capacity.
Summary of the invention
The purpose of the present invention is to provide a kind of ultrasonic fingerprint sensors, and processing technology difficulty and processing cost are low,
Be conducive to volume production；And ultrasonic wave transmitting and penetration capacity are strong.
Another object of the present invention is to provide a kind of fingerprint recognition mould groups, can generate clearly fingerprint image.
The embodiment of the present invention is achieved in that
A kind of ultrasonic fingerprint sensor comprising:
Emitting portion, including electrode, transmission piezoelectric layer and transmitting top electrode, transmitting under the transmitting that is superposed from the bottom to top
Piezoelectric layer is flood structure；
Separation layer is superposed in emitting portion；
Receiving portion, including being superposed the electrode under the reception on separation layer from the bottom to top, receiving piezoelectric layer and reception
Top electrode.
In preferred embodiments of the present invention, above-mentioned reception piezoelectric layer includes the piezo column being arranged in array, and reception powers on
Pole includes a plurality of upper polar curve, and every upper polar curve is connected with the piezo column of corresponding row, and the lower electrode of reception includes a plurality of lower polar curve, and every
Lower polar curve and the piezo column of respective column connect.
In preferred embodiments of the present invention, above-mentioned receiving portion further includes the filled layer being filled between piezo column.
In preferred embodiments of the present invention, the edge of above-mentioned emitting portion and receiving portion flushes or emitting portion
Edge with respect to receiving portion protrude or receiving portion edge relative transmission part protrusion.
In preferred embodiments of the present invention, above-mentioned emitting portion is box shape or ring-type.
In preferred embodiments of the present invention, above-mentioned ultrasonic fingerprint sensor further includes being covered in receiving portion upper surface
Up-protective layer, and be covered in the lower protective layer of emitting portion lower surface.
In preferred embodiments of the present invention, above-mentioned up-protective layer and lower protective layer with a thickness of 1~50 μm.
In preferred embodiments of the present invention, the material of above-mentioned separation layer is insulating materials；With a thickness of 1 μm~1mm.
A kind of fingerprint recognition mould group comprising above-mentioned ultrasonic fingerprint sensor.
In preferred embodiments of the present invention, above-mentioned fingerprint recognition mould group includes glass cover-plate, ultrasonic fingerprint sensor
With control chip, glass cover-plate is set in the receiving portion of ultrasonic fingerprint sensor, and control chip is located at ultrasonic fingerprint
Under the emitting portion of sensor.
The beneficial effect of the embodiment of the present invention is: the ultrasonic fingerprint sensor of the embodiment of the present invention includes: emitting portion,
It is flood structure including electrode, transmission piezoelectric layer and transmitting top electrode, transmission piezoelectric layer under the transmitting that is superposed from the bottom to top；
Separation layer is superposed in emitting portion；Receiving portion, it is electric including being superposed under the reception on separation layer from the bottom to top
Pole receives piezoelectric layer and receives top electrode, and the processing technology difficulty and processing cost of the ultrasonic fingerprint sensor are low, are conducive to
Volume production；And ultrasonic wave transmitting and penetration capacity are strong.The fingerprint recognition mould group of the embodiment of the present invention includes above-mentioned ultrasonic fingerprint
Sensor, the fingerprint recognition mould group can generate clearly fingerprint image.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of range for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
Fig. 1 is a kind of structural schematic diagram for ultrasonic fingerprint sensor that first embodiment of the invention provides；
Fig. 2 is the structural schematic diagram in the embodiment of the present invention between emitting portion and receiving portion；
Fig. 3 is a kind of structural schematic diagram for ultrasonic fingerprint sensor that second embodiment of the invention provides；
Fig. 4 is a kind of structural schematic diagram for fingerprint recognition mould group that third embodiment of the invention provides.
Icon: 100- ultrasonic fingerprint sensor；110- emitting portion；111- emits lower electrode；112- transmission piezoelectric layer；
113- emits top electrode；120- separation layer；130- receiving portion；131- receives lower electrode；132- receives piezoelectric layer；133- is received
Top electrode；134- piezo column；135- filled layer；141- up-protective layer；142- lower protective layer；200- ultrasonic fingerprint sensor；
300- fingerprint recognition mould group；310- glass cover-plate；320- controls chip.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.The present invention being usually described and illustrated herein in the accompanying drawings is implemented
The component of example can be arranged and be designed with a variety of different configurations.
Therefore, the detailed description of the embodiment of the present invention provided in the accompanying drawings is not intended to limit below claimed
The scope of the present invention, but be merely representative of selected embodiment of the invention.Based on the embodiments of the present invention, this field is common
Technical staff's every other embodiment obtained without creative efforts belongs to the model that the present invention protects
It encloses.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.
In the description of the present invention, it should be noted that the instructions such as term " center ", "upper", "lower", "inner", "outside"
Orientation or positional relationship be based on the orientation or positional relationship shown in the drawings or the invention product using when usually put
Orientation or positional relationship is merely for convenience of description of the present invention and simplification of the description, rather than the device of indication or suggestion meaning or
Element must have a particular orientation, be constructed and operated in a specific orientation, therefore be not considered as limiting the invention.
In the description of the present invention, it is also necessary to which explanation is unless specifically defined or limited otherwise, term " setting ",
" installation ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integrally connect
It connects；It can be mechanical connection, be also possible to be electrically connected；It can be directly connected, can also indirectly connected through an intermediary, it can
To be the connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood with concrete condition
Concrete meaning in the present invention.
First embodiment
It please refers to shown in Fig. 1, the present embodiment provides a kind of ultrasonic fingerprint sensors 100 comprising:
Emitting portion 110, including under the transmitting that is superposed from the bottom to top in electrode 111, transmission piezoelectric layer 112 and transmitting
Electrode 113, transmission piezoelectric layer 112 are flood structure；
Separation layer 120 is superposed in emitting portion 110；
Receiving portion 130, including being superposed the electrode 131 under the reception on separation layer 120 from the bottom to top, receiving piezoelectricity
Layer 132 and reception top electrode 133.
The ultrasonic fingerprint sensor 100 of the present embodiment is mainly by emitting portion 110, receiving portion 130 and centre
The hybrid architecture that separation layer 120 forms, receiving portion 130 is in upper part, close to the sensitive surface of ultrasonic fingerprint sensor 100
Surface, emitting portion 110 is in lower part, close to 100 bottom surface of ultrasonic fingerprint sensor.Wherein, using mutually independent transmitting
Piezoelectric layer 112 and reception piezoelectric layer 132, transmission piezoelectric layer 112 and reception piezoelectric layer 132 are ceramic material, transmission piezoelectric layer
112 achieve the purpose that improve emissivities for a monolithic piezoelectric, receive piezoelectric layer 132 at this time there is no need to too long, can reduce
Technology difficulty and processing cost, are more advantageous to volume production.
In the present embodiment, receiving portion 130 is similar to conventional ultrasound fingerprint sensor 100, specific structure are as follows: receives pressure
Electric layer 132 includes the piezo column 134 being arranged in array, and receives piezoelectric layer 132 and is located at reception top electrode 133 and receives lower electrode
Between 131；Receiving top electrode 133 includes a plurality of upper polar curve, and upper polar curve is corresponded at row (column) piezo column 134, on every
Polar curve is connected with the piezo column 134 of corresponding row (column)；Receiving lower electrode 131 includes a plurality of lower polar curve, lower polar curve with press in column
(row) electricity column corresponds, and every lower polar curve is connect with the piezo column 134 of respective column (row).So, ranks can be passed through
Integrated positioning can individually control each piezo column 134 by upper polar curve and lower polar curve to any piezo column 134.
In the present embodiment, receiving portion 130 further includes the filled layer 135 being filled between piezo column 134.Filled layer 135
For insulating materials, the gap between 134 array of piezo column is filled using filled layer 135, on the one hand can prevent piezoelectricity
Column 134 between each other has an impact ultrasonic wave transmitting and reception, and then reduces lateral noise；On the other hand it can make piezo column
134 stable structure prevents the position of piezo column 134 from shifting.The material of filler can be epoxy resin, epoxy resin
Solidify rear surface light, there is excellent adhesion strength to the surface of metal and nonmetallic materials, and dielectric properties are good, deformation
Shrinking percentage is small, and product size stability is good.The material of filler can also be black glue insulating materials, resistance to good heatproof
Dissolubility, and solidify rear surface light, cementitiousness is strong.
In the present embodiment, emitting portion 110 is similar to conventional Ultrasound wave launcher, and transmission piezoelectric layer 112 is a monolith, no
It is array arrangement, the transmission power of this made of one piece piezoelectric layer is sufficiently large, and ultrasonic wave is enabled easily to penetrate ultrasonic fingerprint
Each layer structure on 100 top of sensor, and the glass/metal layer cover board contacted with 100 surface layer of ultrasonic fingerprint sensor arrive
Up to finger.In addition, emit lower electrode 111 and transmitting top electrode 113 or flood structure, it is easy to process.
In the present embodiment, the material of separation layer 120 is insulating materials, such as epoxy resin etc.；With a thickness of 1 μm~1mm.
In the present embodiment, ultrasonic fingerprint sensor 100 further includes the up-protective layer for being covered in 130 upper surface of receiving portion
141, and it is covered in the lower protective layer 142 of 110 lower surface of emitting portion.The thickness one of up-protective layer 141 and lower protective layer 142
As be 1~50 μm.Up-protective layer 141 and lower protective layer 142 is respectively set on the two sides of ultrasonic fingerprint sensor 100, it can
Prevent the impurity such as dust or steam from entering ultrasonic fingerprint sensor 100.
Shown in Figure 2, the structure between emitting portion 110 and receiving portion 130 has three ways, such as following: emitting portion
110 and the edge of receiving portion 130 flush the edge of perhaps emitting portion 110 and protrude or receive with respect to receiving portion 130
It protrudes the edge relative transmission part 110 of part 130.By ultrasonic technique, the ultrasonic wave for emitting emitting portion 110 encounters super
The fingerprint of 100 top of sound wave fingerprint sensor, which reflects, reaches receiving portion 130,130 ultrasounds received of receiving portion
Wave signal is converted to electric signal output, forms fingerprint image through special algorithm.
The working principle of ultrasonic fingerprint sensor 100 is:
Emitting portion 110 is first activated, the vibration of emitting portion 110 is made to generate ultrasonic wave, ultrasonic wave penetrates each layer and reaches ultrasound
The finger surface of 100 top of wave fingerprint sensor, the ridge of finger surface fingerprint and paddy generate different reflecting effects to ultrasonic wave.
The ultrasonic wave being reflected back, which reaches, receives piezoelectric, and piezoelectric effect makes piezo column 134 generate different electric signals, is connect by control
It receives the reception top electrode 133 at 132 both ends of piezoelectric layer and receives the ranks combination of lower electrode 131, each piezo column 134 is generated
Electric signal generates fingerprint image through special algorithm through driving IC output.
The receiving portion 130 and emitting portion 110 of ultrasonic fingerprint sensor 100 separate, and emission layer uses a monolith pressure
Electric material generates relatively high power ultrasonic wave；Receiving portion 130 is used to be imaged using 134 array of piezo column, receiving portion 130
Piezo column 134 can be very short.
Second embodiment
Referring to figure 3., the present embodiment provides a kind of ultrasonic fingerprint sensor 200, structure and first embodiment it is super
100 structure of sound wave fingerprint sensor is roughly the same, the difference is that: protective layer only includes being covered in table in receiving portion 130
The up-protective layer 141 in face is easy dust stratification this is because receiving portion 130 is provided with the bulge-structure of piezo column 134, so needing
Up-protective layer 141 is wanted to be protected, and emitting portion 110 is can not have to be protected for flat configuration.
3rd embodiment
Referring to figure 4., the present embodiment provides a kind of fingerprint recognition mould groups 300 comprising the ultrasonic wave of first embodiment refers to
Line sensor 100.Fingerprint recognition mould group 300 includes glass cover-plate 310, ultrasonic fingerprint sensor 100 and control chip 320,
Glass cover-plate 310 is set in the receiving portion 130 of ultrasonic fingerprint sensor 100, and control chip 320 is located at ultrasonic fingerprint
Under the emitting portion 110 of sensor 100.
The working principle of fingerprint recognition mould group 300 are as follows:
When finger is in contact with or close to glass cover-plate 310, there is the voltage of the resonant frequency in ultrasonic wave frequency band from outer
Portion is applied to emitting portion 110 and receiving portion 130, and transmission piezoelectric layer 112 and reception piezoelectric layer 132 can generate high-frequency fluctuation shape
Become, while launching ultrasonic signal；Ultrasonic signal is back to the pressure of receiving portion 130 via internal reflection super after finger
Electric column 134, deformation occurs under the action of ultrasonic wave for piezo column 134, and generates potential difference in the piezo column of different location 134,
Receiving portion 130 receives potential difference information, and control chip 320 handles the voltage data received, identifies fingerprint image.
In conclusion the processing technology difficulty and processing cost of the ultrasonic fingerprint sensor of the embodiment of the present invention are low, have
Conducive to volume production；And ultrasonic wave transmitting and penetration capacity are strong；The fingerprint recognition mould group of the embodiment of the present invention, which can generate, clearly to be referred to
Print image.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of ultrasonic fingerprint sensor, characterized in that it comprises:
Emitting portion, including electrode, transmission piezoelectric layer and transmitting top electrode, the transmitting under the transmitting that is superposed from the bottom to top
Piezoelectric layer is flood structure；
Separation layer is superposed in the emitting portion；
Receiving portion, including being superposed the electrode under the reception on the separation layer from the bottom to top, receiving piezoelectric layer and reception
Top electrode.
2. ultrasonic fingerprint sensor according to claim 1, which is characterized in that the reception piezoelectric layer includes in array
The piezo column of arrangement, the reception top electrode include a plurality of upper polar curve, and every upper polar curve is connected with the piezo column of corresponding row, described
Receiving lower electrode includes a plurality of lower polar curve, the piezo column connection of every lower polar curve and respective column.
3. ultrasonic fingerprint sensor according to claim 2, which is characterized in that the receiving portion further includes being filled in
Filled layer between the piezo column.
4. ultrasonic fingerprint sensor according to claim 1, which is characterized in that the emitting portion and the receiving unit
The edge divided flushes the relatively described receiving portion protrusion in edge or the side of the receiving portion of the perhaps emitting portion
Along the relatively described emitting portion protrusion.
5. ultrasonic fingerprint sensor according to claim 4, which is characterized in that the emitting portion be box shape or
It is cyclic annular.
6. ultrasonic fingerprint sensor according to claim 1, which is characterized in that the ultrasonic fingerprint sensor also wraps
The up-protective layer for being covered in the receiving portion upper surface is included, and is covered in the lower protective layer of the emitting portion lower surface.
7. ultrasonic fingerprint sensor according to claim 6, which is characterized in that the up-protective layer and the lower protection
Layer with a thickness of 1~50 μm.
8. ultrasonic fingerprint sensor according to claim 1, which is characterized in that the material of the separation layer is insulation material
Material；With a thickness of 1 μm~1mm.
9. a kind of fingerprint recognition mould group, which is characterized in that it includes that ultrasonic wave described in any item of the claim 1 to 8 such as refers to
Line sensor.
10. fingerprint recognition mould group according to claim 9, which is characterized in that the fingerprint recognition mould group includes glass cover
Plate, the ultrasonic fingerprint sensor and control chip, the glass cover-plate are set to connecing for the ultrasonic fingerprint sensor
On receiving portions, the control chip is located under the emitting portion of the ultrasonic fingerprint sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811116368.9A CN108960218A (en) | 2018-09-25 | 2018-09-25 | A kind of ultrasonic fingerprint sensor and fingerprint recognition mould group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811116368.9A CN108960218A (en) | 2018-09-25 | 2018-09-25 | A kind of ultrasonic fingerprint sensor and fingerprint recognition mould group |
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| Publication Number | Publication Date |
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| CN108960218A true CN108960218A (en) | 2018-12-07 |
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| CN201811116368.9A Pending CN108960218A (en) | 2018-09-25 | 2018-09-25 | A kind of ultrasonic fingerprint sensor and fingerprint recognition mould group |
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Cited By (8)
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| CN109522885A (en) * | 2019-01-08 | 2019-03-26 | 深圳市台技光电有限公司 | Tempered glass protective film and preparation method suitable for ultrasonic fingerprint identification function |
| CN110175586A (en) * | 2019-05-30 | 2019-08-27 | 京东方科技集团股份有限公司 | A kind of fingerprint recognition mould group and its fingerprint identification method, display device |
| CN110232363A (en) * | 2019-06-18 | 2019-09-13 | 京东方科技集团股份有限公司 | Ultrasonic fingerprint identification sensor and preparation method thereof, display device |
| CN110265544A (en) * | 2019-06-24 | 2019-09-20 | 京东方科技集团股份有限公司 | Piezoelectric transducer and preparation method, the method and electronic equipment that carry out fingerprint recognition |
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| CN110265544A (en) * | 2019-06-24 | 2019-09-20 | 京东方科技集团股份有限公司 | Piezoelectric transducer and preparation method, the method and electronic equipment that carry out fingerprint recognition |
| US12016249B2 (en) | 2019-06-24 | 2024-06-18 | Boe Technology Group Co., Ltd. | Piezoelectric sensor and manufacturing method thereof, method for recognizing fingerprint, and electronic device |
| WO2021159678A1 (en) * | 2020-02-10 | 2021-08-19 | 神盾股份有限公司 | Ultrasonic sensing device |
| CN112364771A (en) * | 2020-11-11 | 2021-02-12 | 京东方科技集团股份有限公司 | Sensing circuit unit, circuit, identification method, sensor, panel and device |
| WO2023051231A1 (en) * | 2021-09-30 | 2023-04-06 | 深圳市汇顶科技股份有限公司 | Ultrasonic fingerprint apparatus and electronic device |
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