CN108941904A - Vacuum laser soldering and sealing tooling and vacuum laser welder - Google Patents
Vacuum laser soldering and sealing tooling and vacuum laser welder Download PDFInfo
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- CN108941904A CN108941904A CN201810885826.9A CN201810885826A CN108941904A CN 108941904 A CN108941904 A CN 108941904A CN 201810885826 A CN201810885826 A CN 201810885826A CN 108941904 A CN108941904 A CN 108941904A
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- 238000007789 sealing Methods 0.000 title claims abstract description 143
- 238000005476 soldering Methods 0.000 title claims abstract description 142
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 105
- 238000010521 absorption reaction Methods 0.000 claims abstract description 98
- 238000009434 installation Methods 0.000 claims abstract description 80
- 238000009738 saturating Methods 0.000 claims description 28
- 238000003466 welding Methods 0.000 claims description 21
- 230000002035 prolonged effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 description 9
- 238000001179 sorption measurement Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 6
- 239000013078 crystal Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 230000008901 benefit Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 206010054949 Metaplasia Diseases 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000015689 metaplastic ossification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/206—Laser sealing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/1224—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0426—Fixtures for other work
- B23K37/0435—Clamps
- B23K37/0443—Jigs
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention provides a kind of vacuum laser soldering and sealing tooling and vacuum laser welder, vacuum laser soldering and sealing tooling includes soldering and sealing disk, is provided with multiple workpiece installation slots, workpiece installation slot it is opening up, workpiece pedestal is mounted in workpiece installation slot;Magnetic-disc is provided with multiple magnetic absorption members, and magnetic-disc is removably disposed in the lower section of soldering and sealing disk, and the center of magnetic absorption member and the center of workpiece installation slot correspond;When workpiece cover board is mounted on the top of workpiece pedestal, the adsorbable workpiece cover board of magnetic absorption member, so that workpiece cover board is fixed in workpiece pedestal.Vacuum laser soldering and sealing tooling provided by the invention, the center for the magnetic absorption member being arranged in magnetic-disc and the center of workpiece installation slot correspond, when workpiece cover board is mounted on the top of workpiece pedestal, workpiece cover board is tightly held in workpiece pedestal by the magnetic attraction that magnetic absorption member generates, and then workpiece pedestal and workpiece cover board directly can be sent into vacuum chamber and be carried out vacuum laser soldering and sealing.
Description
Technical field
The present invention relates to sealing device technical fields, true in particular to a kind of vacuum laser soldering and sealing tooling and one kind
Empty Laser seal welding machine.
Background technique
Quartz-crystal resonator is one of mating key element in all kinds of communication electronics digital products, recently as intelligence
Communication and the development of various digitizing techniques, the consumer smart electronics product of the people's livelihood is more and more, this has also driven its mating
Key components quartz-crystal resonator great demand, the packaged type of traditional quartz-crystal resonator is parallel resistance
Weldering or low temperature glass weldering, laser welding is at low cost with its in recent years, high-efficient feature, starts to introduce crystal resonator cover board
With the encapsulation manufacturing field of pedestal.But the vacuum laser soldering and sealing of the pedestal and cover board of existing Miniaturized crystal resonator is universal
The problem of encountering pedestal and cover board positioning is difficult, needing first preparatory fixed cover board on the base, Laser seal welding in the related technology
The fixed form of cover board and pedestal has two classes, and one kind is the outer dimension of cover board to be accomplished big or bigger as pedestal, utilization
Soldering and sealing jig station hole is limited in cover board in the range substantially as pedestal outer dimension, and laser is recycled to carry out soldering and sealing.
But this solid mode, since jig station pore size tolerance is big, Laser seal welding back shroud opposite base deviation is more, product shape
Dimensional discrepancy is big, and products application is caused to be restricted.Another kind of is first to push down cover board for one one with claw or spring stack, and use is a set of
Laser seal welding system first carries out diagonal spot welding or half of cover board prewelding in nitrogen environment, is re-fed into vacuum chamber and carries out cover board and base
The complete peripheral Laser Welding of seat, this fixed form cause soldering and sealing to have to two sets of Laser seal welding systems, and the device is complicated, at high cost.
Summary of the invention
The present invention is directed to solve at least one of the technical problems existing in the prior art or related technologies.
For this purpose, one aspect of the present invention is, a kind of vacuum laser soldering and sealing tooling is proposed.
Another aspect of the present invention is, proposes a kind of vacuum laser welder.
In view of this, according to an aspect of the invention, there is provided a kind of vacuum laser soldering and sealing tooling, comprising: soldering and sealing disk,
Be provided with multiple workpiece installation slots, workpiece installation slot it is opening up, workpiece pedestal is mounted in workpiece installation slot;Magnetic
Disk, is provided with multiple magnetic absorption members, and magnetic-disc is removably disposed in the lower section of soldering and sealing disk, the center of magnetic absorption member and work
The center of part mounting groove corresponds;When workpiece cover board is mounted on the top of workpiece pedestal, the adsorbable workpiece of magnetic absorption member
Cover board, so that workpiece cover board is fixed in workpiece pedestal.
Vacuum laser soldering and sealing tooling provided by the invention includes soldering and sealing disk and magnetic-disc, and multiple openings are provided on soldering and sealing disk
Workpiece installation slot upward, workpiece pedestal are mounted in workpiece installation slot, and specifically, workpiece pedestal can be overturn or be led to by machine
Machine movement is crossed to be placed in workpiece installation slot;Multiple magnetic absorption members are provided in magnetic-disc, magnetic-disc is arranged under soldering and sealing disk
It is detachably connected between Fang Bingyu soldering and sealing disk, wherein the center for the magnetic absorption member being arranged in magnetic-disc and workpiece installation slot
Center correspond, when workpiece cover board is mounted on the top of workpiece pedestal, magnetic absorption member can adsorb workpiece cover board, magnetic
It inhales the magnetic attraction that part generates workpiece cover board is firmly secured in workpiece pedestal, and then can be directly by workpiece pedestal and workpiece
Cover board is sent into vacuum chamber and carries out vacuum laser soldering and sealing, the form accuracy after improving workpiece pedestal and workpiece cover board Laser seal welding,
Realize automated production;Specifically, workpiece cover board can be by being placed in workpiece pedestal, preferably after machine overturning and machine movement
Ground, machine have suction nozzle, and the adsorbable workpiece cover board of suction nozzle is moved and rotated on soldering and sealing disk, so that workpiece cover board is placed on work
On part pedestal.Vacuum laser soldering and sealing tooling provided by the invention, can cancel and be needed in the related technology to workpiece pedestal and workpiece lid
Plate carries out the step of laser prewelding, and workpiece cover board is fixed in correspondingly workpiece pedestal by the magnetic attraction that magnetic absorption member generates,
The workpiece pedestal and workpiece cover board fixed is directly entered the vacuum laser soldering and sealing step that vacuum chamber carries out next step, disposable complete
At the vacuum laser soldering and sealing of product, also, since workpiece cover board is firmly secured to correspondingly by the magnetic attraction that magnetic absorption member generates
In workpiece pedestal, so that the position of workpiece pedestal and workpiece cover board will not generate offset, workpiece pedestal and workpiece cover board are improved
Form accuracy after Laser seal welding simplifies between workpiece pedestal and workpiece cover board while the sperm quality for ensuring product
Vacuum laser soldering and sealing step, vacuum laser soldering and sealing efficiency is effectively promoted.
In addition, the vacuum laser soldering and sealing tooling in the above-mentioned technical proposal provided according to the present invention, can also have as follows
Additional technical feature:
In the above-mentioned technical solutions, it is preferable that the width of magnetic absorption member is less than or equal to the width of workpiece cover board;The length of magnetic absorption member
Degree is less than or equal to the length of workpiece cover board.
In the technical scheme, the width of magnetic absorption member is preferably arranged to the width less than or equal to workpiece cover board, magnetic absorption member
Length is preferably arranged to the length less than or equal to workpiece cover board;Due to the center of magnetic absorption member and the centre bit of workpiece installation slot
One-to-one correspondence is set, and workpiece pedestal is mounted in workpiece installation slot, so that when workpiece cover board is mounted on the top of workpiece pedestal,
Magnetic absorption member can be by workpiece cover board being adsorbed in workpiece pedestal tightly, and the length and width that magnetic absorption member is arranged are respectively smaller than equal to work
The length and width of part cover board, so that magnetic absorption member generates magnetic to workpiece cover board in the range of the length of workpiece cover board and width
Power, thus magnetic attraction can be by workpiece cover board being adsorbed in workpiece pedestal tightly, and can avoid magnetic absorption member and be located at workpiece cover board
Magnetic attraction is generated to workpiece cover board outside length and the range of width and workpiece cover board is caused to overturn or deviate, it is ensured that workpiece cover board
Accuracy is installed, improves the packaging efficiency of product, and can guarantee the assembling quality of product.
In any of the above-described technical solution, it is preferable that vacuum laser soldering and sealing tooling further include: saturating magnetic mouth is arranged in workpiece
The slot bottom of mounting groove, the width of saturating magnetic mouth are less than the width of magnetic absorption member;And/or saturating magnetic mouth, it is arranged on magnetic-disc, saturating magnetic mouth position
In the top of magnetic absorption member, the width of saturating magnetic mouth is less than the width of magnetic absorption member.
In the technical scheme, the slot bottom of workpiece installation slot is provided with magnetic mouth, the magnetic that may make magnetic absorption member to generate
Power is more entered in workpiece installation slot by saturating magnetic mouth, to increase magnetic absorption member to the workpiece being set in workpiece installation slot
The adsorption capacity of pedestal and workpiece cover board, so that workpiece cover board is preferably fixed in workpiece pedestal;Further, magnetic is set
The width of mouth is less than the width of magnetic absorption member, so that magnetic absorption member can not be by saturating magnetic mouth, so that the workpiece peace around magnetic mouth thoroughly
The slot bottom of tankage can avoid magnetic absorption member from being detached from magnetic-disc by magnetic absorption member backstop outside.And/or on magnetic-disc magnetic absorption member top
Magnetic mouth is set, and the magnetic attraction that may make magnetic absorption member to generate more is entered in workpiece installation slot by saturating magnetic mouth, to increase
Big magnetic absorption member is to the workpiece pedestal being set in workpiece installation slot and the adsorption capacity of workpiece cover board, so that workpiece cover board is preferably
It is fixed in workpiece pedestal;Further, the width that magnetic mouth is arranged is less than the width of magnetic absorption member, so that magnetic absorption member can not pass through
Saturating magnetic mouth, so that the magnetic-disc around magnetic mouth including magnetic absorption member backstop, can will avoid magnetic absorption member from being detached from magnetic-disc thoroughly.
In any of the above-described technical solution, it is preferable that soldering and sealing disk from top to bottom successively includes: guide layer, alignment layers, increases
Layer and backplane level, guide layer, alignment layers are increased between layer and backplane level through spot welding or thermal-adhering connection.
In the technical scheme, soldering and sealing disk from top to bottom successively includes: guide layer, alignment layers, increases layer and backplane level, excellent
Selection of land, guide layer, alignment layers are increased and are connected between layer and backplane level by spot welding or thermal-adhering so that guide layer, alignment layers,
The connection increased between layer and backplane level is simple, firm.
In any of the above-described technical solution, it is preferable that soldering and sealing disk further include: guide part is arranged on guide layer, guiding
Portion is the oblique angle being arranged at the notch of workpiece installation slot, and oblique angle is by the side wall of workpiece installation slot towards the outside of workpiece installation slot
Extend.
In the technical scheme, guide part is provided on the guide layer of soldering and sealing disk, guide part is preferably arranged on workpiece
Oblique angle at the notch of mounting groove, oblique angle are extended by the side wall of workpiece installation slot towards the external of workpiece installation slot, guide part
It is arranged so that the slot-open-section of workpiece installation slot becomes large-sized, so that workpiece pedestal is easier to enter workpiece by guide part
In mounting groove, convenient for the placement of workpiece pedestal.Further, oblique angle and vertical direction at the notch of workpiece installation slot are set
The value range of tilt angle be preferably 30 ° to 60 °, in the range, not only improve the processing of guide part, and make workpiece
Pedestal is easy to install in workpiece installation slot by guide part.
In any of the above-described technical solution, it is preferable that be provided with positioning port, the size and workpiece base of positioning port on alignment layers
The size of seat is adapted, and workpiece pedestal is located in positioning port;The value range of the thickness of alignment layers is less than or equal to 0.2mm;Bottom
The slot bottom of plate layer formation workpiece installation slot;Backplane level is non-magnetic bottom plate layer.
In the technical scheme, positioning port, the size and workpiece pedestal of positioning port are provided on the alignment layers of soldering and sealing disk
Size be adapted, workpiece pedestal is located in positioning port, i.e., positioning port be workpiece installation slot a part, the thickness of alignment layers
Value range is less than or equal to 0.2mm, due to the thinner thickness of alignment layers, so that positioning port can pass through etch process or wire cutting
Technique is formed on alignment layers, so that the dimensional accuracy of positioning port is higher, is placed on to limit workpiece pedestal by positioning port
The precision of position in workpiece installation slot improves the accuracy of the position of workpiece pedestal, it is preferable that the size of positioning port with
The difference of the size of workpiece pedestal is less than or equal to 0.03mm.Backplane level forms the slot bottom of workpiece installation slot, when workpiece pedestal is installed
When in workpiece installation slot, backplane level support workpiece pedestal, saturating magnetic mouth is preferably provided on backplane level, to increase magnetic absorption member pair
The adsorption capacity of the workpiece pedestal and workpiece cover board that are set in workpiece installation slot, so that workpiece cover board is preferably fixed on workpiece
On pedestal;Further, backplane level is preferably non-magnetic bottom plate layer, and backplane level is avoided to generate magnetic to the magnetic absorption member being disposed below
Suction, magnetic absorption member is adsorbed on backplane level as backplane level is mobile, to further keep away when preventing soldering and sealing disk from separating with magnetic-disc
Exempt from magnetic absorption member and is detached from magnetic-disc.
In any of the above-described technical solution, it is preferable that magnetic-disc includes: magnetic-disc bottom plate;Magnetic-disc middle layer is arranged in magnetic
On sucker bottom plate, multiple mounting holes are offered on magnetic-disc middle layer, magnetic absorption member is mounted in mounting hole;Magnetic-disc upper cover, setting
On magnetic-disc middle layer, magnetic-disc upper cover lid is located on mounting hole.
In the technical scheme, magnetic-disc bottom plate, magnetic-disc middle layer and magnetic-disc upper cover, wherein the setting of magnetic-disc middle layer
On magnetic-disc bottom plate, multiple mounting holes are offered on magnetic-disc middle layer, magnetic absorption member is mounted in mounting hole, in magnetic-disc middle layer
Top be provided with magnetic-disc upper cover, magnetic-disc upper cover lid is located on mounting hole, avoid magnetic absorption member be detached from magnetic-disc, further
Ground, saturating magnetic mouth are arranged on magnetic-disc on lid, and the magnetic attraction that may make magnetic absorption member to generate more enters work by saturating magnetic mouth
In part mounting groove, thus increase magnetic absorption member to the workpiece pedestal being set in workpiece installation slot and the adsorption capacity of workpiece cover board,
So that workpiece cover board is preferably fixed in workpiece pedestal;Preferably, magnetic-disc bottom plate, magnetic-disc middle layer and magnetic-disc upper cover it
Between connected by spot welding or thermal-adhering so that the connection between magnetic-disc bottom plate, magnetic-disc middle layer and magnetic-disc upper cover is simple, steady
Gu.
In any of the above-described technical solution, it is preferable that vacuum laser soldering and sealing tooling further include: positioning pin is arranged in soldering and sealing
On one in disk and magnetic-disc;Location hole is arranged on another in soldering and sealing disk and magnetic-disc;Positioning pin and location hole phase
Adaptation, soldering and sealing disk and magnetic-disc are positioned by positioning pin and location hole.
In the technical scheme, vacuum laser soldering and sealing tooling further includes positioning pin and location hole, and positioning pin is arranged in soldering and sealing
On one in disk and magnetic-disc, location hole is arranged on another in soldering and sealing disk and magnetic-disc, positioning pin and location hole phase
Adaptation, soldering and sealing disk and magnetic-disc are positioned by positioning pin and location hole, to be mounted on the top of magnetic-disc in soldering and sealing disk
When, it is ensured that the center of the magnetic absorption member on the center and magnetic-disc of the workpiece installation slot on soldering and sealing disk corresponds, from
And ensure the installation accuracy between workpiece pedestal and workpiece cover board, it is outer after improving workpiece pedestal and workpiece cover board Laser seal welding
Shape precision improves the sperm quality of product.
In any of the above-described technical solution, it is preferable that vacuum laser soldering and sealing tooling further include: the first dismounting notch, setting
At the edge of soldering and sealing disk, the first dismounting notch is the first groove from the side wall of soldering and sealing disk to the inner recess of soldering and sealing disk;And/or
Second dismounting notch, is arranged in the edge of magnetic-disc, and the second dismounting notch is from the side wall of magnetic-disc to the inner-concave of soldering and sealing disk
The second sunken groove;First dismounting notch is not overlapped with the position of the second dismounting notch.
In the technical scheme, the edge of soldering and sealing disk is provided with the first dismounting notch, the first dismounting notch is by soldering and sealing
Inner recess from the side wall of disk to soldering and sealing disk the first groove, can be by the first dismounting notch by the connection of soldering and sealing disk and magnetic-disc
It dismantles, simplifies the disassembly process between soldering and sealing disk and magnetic-disc, the quantity of the first dismounting notch is preferably two;And/or
The edge of magnetic-disc is provided with the second dismounting notch, and the second dismounting notch is from the side wall of magnetic-disc to the inner recess of soldering and sealing disk
The second groove, and the first dismounting notch is not overlapped with the position of the second dismounting notch, can dismount notch for soldering and sealing by second
The connection of disk and magnetic-disc is dismantled, and the disassembly process between soldering and sealing disk and magnetic-disc is simplified, and the quantity of the second dismounting notch is excellent
Two are selected as, further, the first dismounting notch is not overlapped with the position of the second dismounting notch, is easily facilitated from different directions
Soldering and sealing disk and magnetic-disc are dismounted by the first dismounting notch and the second dismounting notch.
The second aspect of the present invention proposes a kind of vacuum laser welder, is proposed including any of the above-described technical solution
Vacuum laser soldering and sealing tooling.
Vacuum laser welder proposed by the present invention, the vacuum laser soldering and sealing work proposed including any of the above-described technical solution
Dress, therefore whole technical effects with above-mentioned vacuum laser soldering and sealing tooling, details are not described herein.
Additional aspect and advantage of the invention will become obviously in following description section, or practice through the invention
Recognize.
Detailed description of the invention
Above-mentioned and/or additional aspect of the invention and advantage will become from the description of the embodiment in conjunction with the following figures
Obviously and it is readily appreciated that, in which:
Fig. 1 shows the structural representation of the soldering and sealing disk of vacuum laser soldering and sealing tooling according to one embodiment of present invention
Figure;
Fig. 2 shows the structural representations of the magnetic-disc of vacuum laser soldering and sealing tooling middle according to one embodiment of present invention
Figure;
Fig. 3 shows one of the soldering and sealing disk and magnetic-disc of vacuum laser soldering and sealing tooling according to one embodiment of present invention
The partial enlarged view of a station.
Wherein, corresponding relationship of the Fig. 1 into Fig. 3 between appended drawing reference and component names are as follows:
10 soldering and sealing disks, 102 workpiece installation slots, 104 saturating magnetic mouths, 106 guide layers, 108 alignment layers, 110 increase layer, 112 bottoms
Plate layer, 114 guide parts, 116 positioning ports, 118 positioning pins, 120 first dismounting notches, 20 magnetic-discs, 202 magnetic absorption members, 204 magnetic
It tries to get to the heart of a matter plate, 206 magnetic-disc middle layers, 208 magnetic-disc upper covers, 210 mounting holes, 212 location holes, 214 second dismounting notches, 30 workpiece
Pedestal, 40 workpiece cover boards.
Specific embodiment
To better understand the objects, features and advantages of the present invention, with reference to the accompanying drawing and specific real
Applying mode, the present invention is further described in detail.It should be noted that in the absence of conflict, the implementation of the application
Feature in example and embodiment can be combined with each other.
In the following description, numerous specific details are set forth in order to facilitate a full understanding of the present invention, still, the present invention may be used also
To be implemented using other than the one described here other modes, therefore, protection scope of the present invention is not by described below
Specific embodiment limitation.
The vacuum laser soldering and sealing tooling described according to some embodiments of the invention is described referring to Fig. 1 to Fig. 3 and vacuum swashs
Light welder.
As shown in Figure 1 to Figure 3, according to an aspect of the invention, there is provided a kind of vacuum laser soldering and sealing tooling, comprising:
Soldering and sealing disk 10, is provided with multiple workpiece installation slots 102, workpiece installation slot 102 it is opening up, workpiece pedestal 30 is mounted on
In workpiece installation slot 102;Magnetic-disc 20, is provided with multiple magnetic absorption members 202, and magnetic-disc 20 is removably disposed in soldering and sealing disk
10 lower section, the center of magnetic absorption member 202 and the center of workpiece installation slot 102 correspond;When workpiece cover board 40 is pacified
When mounted in the top of workpiece pedestal 30, the adsorbable workpiece cover board 40 of magnetic absorption member 202, so that workpiece cover board 40 is fixed on workpiece pedestal
On 30.
Vacuum laser soldering and sealing tooling provided by the invention includes soldering and sealing disk 10 and magnetic-disc 20, is provided on soldering and sealing disk 10 more
A opening up workpiece installation slot 102, workpiece pedestal 30 are mounted in workpiece installation slot 102, and specifically, workpiece pedestal 30 can
It is overturn by machine or is placed in workpiece installation slot 102 by machine movement;Multiple magnetic absorption members are provided in magnetic-disc 20
202, the lower section of soldering and sealing disk 10 and detachably connected between soldering and sealing disk 10 is arranged in magnetic-disc 20, wherein in magnetic-disc 20
The center of the magnetic absorption member 202 of setting and the center of workpiece installation slot 102 correspond, when workpiece cover board 40 is mounted on
When the top of workpiece pedestal 30, magnetic absorption member 202 can adsorb workpiece cover board 40, and the magnetic attraction that magnetic absorption member 202 generates is by workpiece lid
Plate 40 is firmly secured in workpiece pedestal 30, so can directly by workpiece pedestal 30 and workpiece cover board 40 be sent into vacuum chamber into
Row vacuum laser soldering and sealing, the form accuracy after improving workpiece pedestal 30 and 40 Laser seal welding of workpiece cover board, realizes automatic metaplasia
It produces;Specifically, workpiece cover board 40 can be by being placed in workpiece pedestal 30 after machine overturning and machine movement, it is preferable that machine
With suction nozzle, the adsorbable workpiece cover board 40 of suction nozzle is moved and is rotated on soldering and sealing disk 10, so that workpiece cover board 40 is placed on work
On part pedestal 30.Vacuum laser soldering and sealing tooling provided by the invention, can cancel and be needed in the related technology to workpiece pedestal 30 and work
Part cover board 40 carries out the step of laser prewelding, and workpiece cover board 40 is fixed on accordingly by the magnetic attraction generated by magnetic absorption member 202
In workpiece pedestal 30, the workpiece pedestal 30 and workpiece cover board 40 fixed is directly entered the vacuum laser that vacuum chamber carries out next step
Soldering and sealing step, the disposable vacuum laser soldering and sealing for completing product, also, the magnetic attraction generated due to magnetic absorption member 202 are by workpiece lid
Plate 40 is tightly held in corresponding workpiece pedestal 30, so that the position of workpiece pedestal 30 and workpiece cover board 40 will not generate partially
It moves, the form accuracy after improving workpiece pedestal 30 and 40 Laser seal welding of workpiece cover board, in the same of the sperm quality for ensuring product
When, the vacuum laser soldering and sealing step between workpiece pedestal 30 and workpiece cover board 40 is simplified, vacuum laser envelope is effectively promoted
Weld efficiency.
In one embodiment of the invention, it is preferable that the width of magnetic absorption member 202 is less than or equal to the width of workpiece cover board 40
Degree;The length of magnetic absorption member 202 is less than or equal to the length of workpiece cover board 40.
In this embodiment, the width of magnetic absorption member 202 is preferably arranged to the width less than or equal to workpiece cover board 40, magnetic absorption member
202 length is preferably arranged to the length less than or equal to workpiece cover board 40;Since the center of magnetic absorption member 202 and workpiece are installed
The center of slot 102 corresponds, and workpiece pedestal 30 is mounted in workpiece installation slot 102, so that when workpiece cover board 40 is pacified
When mounted in the top of workpiece pedestal 30, workpiece cover board 40 can be tightly adsorbed in workpiece pedestal 30 by magnetic absorption member 202, and magnetic is arranged
The length and width for inhaling part 202 are respectively smaller than length and width equal to workpiece cover board 40, so that magnetic absorption member 202 is in workpiece cover board
Magnetic attraction is generated to workpiece cover board 40 in the range of 40 length and width, thus magnetic attraction can tightly inhale workpiece cover board 40
It is attached in workpiece pedestal 30, and can avoid magnetic absorption member 202 and be located at outside the length of workpiece cover board 40 and the range of width to workpiece lid
Plate 40 generates magnetic attraction and workpiece cover board 40 is caused to overturn or deviate, it is ensured that the installation accuracy of workpiece cover board 40 improves production
The packaging efficiency of product, and can guarantee the assembling quality of product.
As shown in figure 3, in one embodiment of the invention, it is preferable that vacuum laser soldering and sealing tooling further include: saturating magnetic mouth
104, the slot bottom of workpiece installation slot 102 is set, and the width of saturating magnetic mouth 104 is less than the width of magnetic absorption member 202;And/or saturating magnetic mouth
104, it is arranged on magnetic-disc 20, saturating magnetic mouth 104 is located at the top of magnetic absorption member 202, and the width of saturating magnetic mouth 104 is less than magnetic absorption member
202 width.
In this embodiment, the slot bottom of workpiece installation slot 102 is provided with magnetic mouth 104, magnetic absorption member 202 may make to generate
Magnetic attraction more entered in workpiece installation slot 102 by saturating magnetic mouth 104, to increase magnetic absorption member 202 to being set to work
The adsorption capacity of workpiece pedestal 30 and workpiece cover board 40 in part mounting groove 102, so that workpiece cover board 40 is preferably fixed on work
On part pedestal 30;Further, the width that magnetic mouth 104 is arranged is less than the width of magnetic absorption member 202, so that magnetic absorption member 202 can not
By saturating magnetic mouth 104, so that the slot bottom of the workpiece installation slot 102 around magnetic mouth 104 can exist 202 backstop of magnetic absorption member thoroughly
Outside, magnetic absorption member 202 is avoided to be detached from magnetic-disc 20.And/or saturating magnetic mouth 104 is arranged in the top of magnetic absorption member 202 on magnetic-disc 20, it can
So that the magnetic attraction that magnetic absorption member 202 generates more is entered in workpiece installation slot 102 by saturating magnetic mouth 104, to increase magnetic
Part 202 is inhaled to the workpiece pedestal 30 being set in workpiece installation slot 102 and the adsorption capacity of workpiece cover board 40, so that workpiece cover board
40 are preferably fixed in workpiece pedestal 30;Further, the width that magnetic mouth 104 is arranged is less than the width of magnetic absorption member 202, makes
Obtaining magnetic absorption member 202 can not be by saturating magnetic mouth 104, so that the magnetic-disc 20 around magnetic mouth 104 can be by 202 backstop of magnetic absorption member thoroughly
Inside, magnetic absorption member 202 is avoided to be detached from magnetic-disc 20.
As shown in figure 3, in one embodiment of the invention, it is preferable that soldering and sealing disk 10 from top to bottom successively includes: guiding
Layer 106, increases layer 110 and backplane level 112 at alignment layers 108, and guide layer 106, alignment layers 108 increase layer 110 and backplane level 112
Between connected by spot welding or thermal-adhering.
In this embodiment, soldering and sealing disk 10 from top to bottom successively include: guide layer 106, alignment layers 108, increase layer 110 and
Backplane level 112, it is preferable that guide layer 106, alignment layers 108 are increased between layer 110 and backplane level 112 through spot welding or thermal-adhering
Connection, so that guide layer 106, alignment layers 108, the connection increased between layer 110 and backplane level 112 are simple, firm.
As shown in figure 3, in one embodiment of the invention, it is preferable that soldering and sealing disk 10 further include: guide part 114 is set
It sets on guide layer 106, guide part 114 is the oblique angle being arranged at the notch of workpiece installation slot 102, and oblique angle is by workpiece installation slot
102 side wall extends towards the external of workpiece installation slot 102.
In this embodiment, guide part 114 is provided on the guide layer 106 of soldering and sealing disk 10, guide part 114 is preferably set
Set the oblique angle at the notch of workpiece installation slot 102, oblique angle is by the side wall of workpiece installation slot 102 towards workpiece installation slot 102
Outside extends, and the setting of guide part 114 is so that the slot-open-section of workpiece installation slot 102 becomes large-sized, so that workpiece pedestal
30 are easier to be entered in workpiece installation slot 102 by guide part 114, convenient for the placement of workpiece pedestal 30.Further, setting exists
The value range of the tilt angle at oblique angle and vertical direction at the notch of workpiece installation slot 102 is preferably 30 ° to 60 °, at this
In range, the processing of guide part 114 is not only improved, and workpiece pedestal 30 is made to be easy to be installed by guide part 114 into workpiece peace
In tankage 102.
As shown in figure 3, in one embodiment of the invention, it is preferable that positioning port 116 is provided on alignment layers 108, it is fixed
The size of position mouth 116 is adapted with the size of workpiece pedestal 30, and workpiece pedestal 30 is located in positioning port 116;The thickness of alignment layers 108
The value range of degree is less than or equal to 0.2mm;The slot bottom of the formation workpiece installation slot 102 of backplane level 112;Backplane level 112 is non-magnetic
Property backplane level.
In this embodiment, be provided with positioning port 116 on the alignment layers 108 of soldering and sealing disk 10, the size of positioning port 116 with
The size of workpiece pedestal 30 is adapted, and workpiece pedestal 30 is located in positioning port 116, i.e., positioning port 116 is workpiece installation slot 102
A part, the value range of the thickness of alignment layers 108 be less than or equal to 0.2mm, due to the thinner thickness of alignment layers 108 so that
Positioning port 116 can be formed on alignment layers 108 by etch process or wire cutting technology, so that the dimensional accuracy of positioning port 116
It is higher, to limit the precision that workpiece pedestal 30 is placed on the position in workpiece installation slot 102 by positioning port 116, promoted
The accuracy of the position of workpiece pedestal 30, it is preferable that the size of positioning port 116 and the difference of the size of workpiece pedestal 30 be less than
Equal to 0.03mm.Backplane level 112 forms the slot bottom of workpiece installation slot 102, when workpiece pedestal 30 is mounted in workpiece installation slot 102
When, 112 support workpiece pedestal 30 of backplane level, saturating magnetic mouth 104 is preferably provided on backplane level 112, so that it is right to increase magnetic absorption member 202
The adsorption capacity of the workpiece pedestal 30 and workpiece cover board 40 that are set in workpiece installation slot 102, so that workpiece cover board 40 is preferably
It is fixed in workpiece pedestal 30;Further, backplane level 112 is preferably non-magnetic bottom plate layer, avoids backplane level 112 to positioned at it
The magnetic absorption member 202 of lower section generates magnetic attraction, and magnetic absorption member 202 is adsorbed on backplane level when preventing soldering and sealing disk 10 from separating with magnetic-disc 20
As backplane level 112 is mobile on 112, so that further avoiding magnetic absorption member 202 is detached from magnetic-disc 20.
As shown in figure 3, in one embodiment of the invention, it is preferable that magnetic-disc 20 includes: magnetic-disc bottom plate 204;Magnetic
Sucker middle layer 206 is arranged on magnetic-disc bottom plate 204, multiple mounting holes 210, magnetic absorption member is offered on magnetic-disc middle layer 206
202 are mounted in mounting hole 210;Magnetic-disc upper cover 208 is arranged on magnetic-disc middle layer 206, and the lid of magnetic-disc upper cover 208 is located at
On mounting hole 210.
In this embodiment, magnetic-disc bottom plate 204, magnetic-disc middle layer 206 and magnetic-disc upper cover 208, wherein in magnetic-disc
Layer 206 is arranged on magnetic-disc bottom plate 204, multiple mounting holes 210 is offered on magnetic-disc middle layer 206, magnetic absorption member 202 is mounted on
In mounting hole 210, the top in magnetic-disc middle layer 206 is provided with magnetic-disc upper cover 208, the lid of magnetic-disc upper cover 208 is located at installation
On hole 210, magnetic absorption member 202 is avoided to be detached from magnetic-disc 20, further, saturating magnetic mouth 104 is arranged in magnetic-disc upper cover 208, can
So that the magnetic attraction that magnetic absorption member 202 generates more is entered in workpiece installation slot 102 by saturating magnetic mouth 104, to increase magnetic
Part 202 is inhaled to the workpiece pedestal 30 being set in workpiece installation slot 102 and the adsorption capacity of workpiece cover board 40, so that workpiece cover board
40 are preferably fixed in workpiece pedestal 30;Preferably, magnetic-disc bottom plate 204, magnetic-disc middle layer 206 and magnetic-disc upper cover 208
Between connected by spot welding or thermal-adhering so that between magnetic-disc bottom plate 204, magnetic-disc middle layer 206 and magnetic-disc upper cover 208
It connects simple, firm.
As depicted in figs. 1 and 2, in one embodiment of the invention, it is preferable that vacuum laser soldering and sealing tooling further include:
Positioning pin 118 is arranged on one in soldering and sealing disk 10 and magnetic-disc 20;Location hole 212 is arranged in soldering and sealing disk 10 and magnetic-disc
On another in 20;Positioning pin 118 is adapted with location hole 212, and soldering and sealing disk 10 and magnetic-disc 20 by positioning pin 118 and are determined
Position hole 212 is positioned.
In this embodiment, vacuum laser soldering and sealing tooling further includes positioning pin 118 and location hole 212, and positioning pin 118 is arranged
On one in soldering and sealing disk 10 and magnetic-disc 20, location hole 212 is arranged on another in soldering and sealing disk 10 and magnetic-disc 20,
Positioning pin 118 is adapted with location hole 212, and soldering and sealing disk 10 and magnetic-disc 20 are determined by positioning pin 118 and location hole 212
Position, thus when soldering and sealing disk 10 is mounted on the top of magnetic-disc 20, it is ensured that the centre bit of the workpiece installation slot 102 on soldering and sealing disk 10
Set and corresponded with the center of the magnetic absorption member 202 on magnetic-disc 20, so that it is guaranteed that workpiece pedestal 30 and workpiece cover board 40 it
Between installation accuracy, the form accuracy after improving workpiece pedestal 30 and 40 Laser seal welding of workpiece cover board improves the essence of product
Spend quality.
As depicted in figs. 1 and 2, in one embodiment of the invention, it is preferable that vacuum laser soldering and sealing tooling further include:
First dismounting notch 120, is arranged in the edge of soldering and sealing disk 10, and the first dismounting notch 120 is from the side wall of soldering and sealing disk 10 to soldering and sealing
First groove of the inner recess of disk 10;And/or the second dismounting notch 214, the edge of magnetic-disc 20 is set, and the second dismounting lacks
Mouth 214 is the second groove from the side wall of magnetic-disc 20 to the inner recess of soldering and sealing disk 10;First dismounting notch 120 is torn open with second
The position of dress notch 214 is not overlapped.
In this embodiment, the edge of soldering and sealing disk 10 is provided with the first dismounting notch 120, the first dismounting notch 120 is
From the side wall of soldering and sealing disk 10 to the first groove of the inner recess of soldering and sealing disk 10, notch 120 can be dismounted by soldering and sealing disk by first
10 dismantle with the connection of magnetic-disc 20, simplify the disassembly process between soldering and sealing disk 10 and magnetic-disc 20, the first dismounting notch 120
Quantity be preferably two;And/or the edge of magnetic-disc 20 is provided with the second dismounting notch 214, the second dismounting notch 214 is
From the side wall of magnetic-disc 20 to the second groove of the inner recess of soldering and sealing disk 10, and the first dismounting notch 120 and the second dismounting lack
The position of mouth 214 is not overlapped, and can be dismantled soldering and sealing disk 10 and the connection of magnetic-disc 20 by the second dismounting notch 214, be simplified
The quantity of disassembly process between soldering and sealing disk 10 and magnetic-disc 20, the second dismounting notch 214 is preferably two, further, the
One dismounting notch 120 is not overlapped with the position of the second dismounting notch 214, is easily facilitated and is lacked from different directions by the first dismounting
Mouth 120 and the second dismounting notch 214 dismount soldering and sealing disk 10 and magnetic-disc 20.
The second aspect of the present invention proposes a kind of vacuum laser welder, is proposed including any of the above-described embodiment true
Empty Laser seal welding tooling.
Vacuum laser welder proposed by the present invention, the vacuum laser soldering and sealing work proposed including any of the above-described embodiment
Dress, therefore whole technical effects with above-mentioned vacuum laser soldering and sealing tooling, details are not described herein.
In the present invention, term " multiple " then refers to two or more, unless otherwise restricted clearly.Term " peace
Dress ", " connected ", " connection ", the terms such as " fixation " shall be understood in a broad sense, can also be with for example, " connection " may be a fixed connection
It is to be detachably connected, or be integrally connected;" connected " can be directly connected, can also be indirectly connected through an intermediary.It is right
For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
In the description of this specification, the description of term " one embodiment ", " some embodiments ", " specific embodiment " etc.
Mean that particular features, structures, materials, or characteristics described in conjunction with this embodiment or example are contained at least one reality of the invention
It applies in example or example.In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or reality
Example.Moreover, description particular features, structures, materials, or characteristics can in any one or more of the embodiments or examples with
Suitable mode combines.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of vacuum laser soldering and sealing tooling characterized by comprising
Soldering and sealing disk, is provided with multiple workpiece installation slots, the workpiece installation slot it is opening up, workpiece pedestal is mounted on work
In part mounting groove;
Magnetic-disc is provided with multiple magnetic absorption members, and the magnetic-disc is removably disposed in the lower section of the soldering and sealing disk, described
The center of magnetic absorption member and the center of the workpiece installation slot correspond;
When workpiece cover board is mounted on the top of the workpiece pedestal, the adsorbable workpiece cover board of magnetic absorption member, so that institute
Workpiece cover board is stated to be fixed in the workpiece pedestal.
2. vacuum laser soldering and sealing tooling according to claim 1, which is characterized in that
The width of the magnetic absorption member is less than or equal to the width of the workpiece cover board;
The length of the magnetic absorption member is less than or equal to the length of the workpiece cover board.
3. vacuum laser soldering and sealing tooling according to claim 1, which is characterized in that the vacuum laser soldering and sealing tooling is also wrapped
It includes:
Saturating magnetic mouth, is arranged in the slot bottom of the workpiece installation slot, and the width of the magnetic mouth is less than the width of the magnetic absorption member;
And/or
Saturating magnetic mouth, is arranged on the magnetic-disc, the magnetic mouth is located at the top of the magnetic absorption member, the width of the magnetic mouth
Less than the width of the magnetic absorption member.
4. vacuum laser soldering and sealing tooling according to any one of claim 1 to 3, which is characterized in that
The soldering and sealing disk from top to bottom successively includes: guide layer, alignment layers, increases layer and backplane level, the guide layer, described fixed
Position layer, described increase are connected between layer and the backplane level by spot welding or thermal-adhering.
5. vacuum laser soldering and sealing tooling according to claim 4, which is characterized in that
The soldering and sealing disk further include: guide part is arranged on the guide layer, and the guide part is that setting is pacified in the workpiece
Oblique angle at the notch of tankage, the oblique angle are prolonged by the outside of side wall towards the workpiece installation slot of the workpiece installation slot
It stretches.
6. vacuum laser soldering and sealing tooling according to claim 4, which is characterized in that
Positioning port is provided on the alignment layers, the size of the positioning port is adapted with the size of the workpiece pedestal, described
Workpiece pedestal is located in the positioning port;
The value range of the thickness of the alignment layers is less than or equal to 0.2mm;
The backplane level forms the slot bottom of the workpiece installation slot;
The backplane level is non-magnetic bottom plate layer.
7. vacuum laser soldering and sealing tooling according to any one of claim 1 to 3, which is characterized in that
The magnetic-disc includes:
Magnetic-disc bottom plate;
Magnetic-disc middle layer is arranged on the magnetic-disc bottom plate, multiple mounting holes, the magnetic is offered on the magnetic-disc middle layer
Part is inhaled to be mounted in the mounting hole;
Magnetic-disc upper cover is arranged on the magnetic-disc middle layer, and the magnetic-disc upper cover lid is located on the mounting hole.
8. vacuum laser soldering and sealing tooling according to any one of claim 1 to 3, which is characterized in that the vacuum laser
Soldering and sealing tooling further include:
Positioning pin is arranged on one in the soldering and sealing disk and the magnetic-disc;
Location hole is arranged on another in the soldering and sealing disk and the magnetic-disc;
The positioning pin is adapted with the location hole, and the soldering and sealing disk and the magnetic-disc pass through the positioning pin and described fixed
Position hole is positioned.
9. vacuum laser soldering and sealing tooling according to any one of claim 1 to 3, which is characterized in that the vacuum laser
Soldering and sealing tooling further include:
First dismounting notch, is arranged in the edge of the soldering and sealing disk, and the first dismounting notch is the side wall by the soldering and sealing disk
To the first groove of the inner recess of the soldering and sealing disk;And/or
Second dismounting notch, is arranged in the edge of the magnetic-disc, and the second dismounting notch is the side wall by the magnetic-disc
To the second groove of the inner recess of the soldering and sealing disk;
The first dismounting notch is not overlapped with the position of the second dismounting notch.
10. a kind of vacuum laser welder characterized by comprising
Vacuum laser soldering and sealing tooling as claimed in any one of claims 1-9 wherein.
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CN201810885826.9A CN108941904B (en) | 2018-08-06 | 2018-08-06 | Vacuum laser seal welding tool and vacuum laser seal welding machine |
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CN201810885826.9A CN108941904B (en) | 2018-08-06 | 2018-08-06 | Vacuum laser seal welding tool and vacuum laser seal welding machine |
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CN109570756A (en) * | 2018-12-26 | 2019-04-05 | 江苏省宜兴电子器件总厂有限公司 | A kind of thin type solder sheet and metalwork pre-fix method |
CN109676255A (en) * | 2019-02-27 | 2019-04-26 | 深圳市鑫德赢科技有限公司 | A kind of method for laser welding and a kind of crystal oscillator of crystal oscillator |
CN110113876A (en) * | 2019-06-04 | 2019-08-09 | 中国电子科技集团公司第二十四研究所 | A kind of gripping device manufacturing method and fixture for loading circuit |
CN110139487A (en) * | 2019-06-04 | 2019-08-16 | 中国电子科技集团公司第二十四研究所 | A kind of gripping device manufacturing method and fixture |
CN110449758A (en) * | 2019-08-29 | 2019-11-15 | 承德奥斯力特电子科技有限公司 | A kind of crystal normotopia device for Laser seal welding |
CN112894140A (en) * | 2019-12-04 | 2021-06-04 | 大族激光科技产业集团股份有限公司 | Vacuum laser welding method and device |
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