CN108916674A - A kind of high-heat-dispersion LED - Google Patents
A kind of high-heat-dispersion LED Download PDFInfo
- Publication number
- CN108916674A CN108916674A CN201810975551.8A CN201810975551A CN108916674A CN 108916674 A CN108916674 A CN 108916674A CN 201810975551 A CN201810975551 A CN 201810975551A CN 108916674 A CN108916674 A CN 108916674A
- Authority
- CN
- China
- Prior art keywords
- lead
- cylindrical portion
- via hole
- heat
- luminescent wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
- F21V21/02—Wall, ceiling, or floor bases; Fixing pendants or arms to the bases
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/86—Ceramics or glass
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
The present invention provides a kind of high-heat-dispersion LED, including pedestal, luminescent wafer, first lead, the second lead, positive pin, negative pin and covering colloid.High-heat-dispersion LED of the invention does LED substrate using ceramics, and easy processing is easy for installation, quickly passes out the heat inside luminescent wafer, and preventing luminescent wafer from causing because temperature is excessively high, LED luminance decaying is too fast and the service life is short, and heat dissipation effect is more preferable, and the service life is higher.
Description
Technical field
The present invention relates to lighting area, in particular to a kind of high-heat-dispersion LED.
Background technique
LED is as an electric light source luminescent device, due to its long working life, fast, small in size, light-weight, the resistance to punching of response
Hit, it is environmentally protective do not pollute the environment, being easy to dim toning, controllability is big, power consumption is low, has other electric light source luminescent devices more
Superior advantage, increasingly by the concern of people.With eliminating for incandescent lamp, also started using LED as the light bulb of light source
It is popular.
Existing LED light weak heat-dissipating, assembling parts are difficult, and higher cost, and heat dissipation effect is relatively undesirable, is produced into
This is more high, and use is more inconvenient.
Summary of the invention
In view of the foregoing deficiencies of prior art, the main purpose of the present invention is to provide a kind of high-heat-dispersion LED lamp,.
In order to achieve the above objects and other related objects, technical solution of the present invention is as follows：
A kind of high-heat-dispersion LED, including：
Pedestal, the pedestal are ceramic bases, the pedestal include the first cylindrical portion and in the first cylindrical portion
Two cylindrical portions, the diameter of the second cylindrical portion is less than the first cylindrical portion, so that rank is collectively formed in the first cylindrical portion and the second cylindrical portion
Halfpace is provided with the first via hole and the second via hole on the pedestal；
Luminescent wafer is arranged in the second cylindrical portion；
First lead, described first lead one end are connect with luminescent wafer, and the other end passes through the first via hole；
Second lead, second lead one end are connect with luminescent wafer, and the other end passes through the second via hole；
Positive pin, the positive pin are connect with the first lead for passing through the first via hole；
Negative pin, the negative pin are connect with the second lead for passing through the second via hole；
Covering colloid, the covering colloid is set on the base, and luminescent wafer and the second cylindrical portion are encapsulated in it.
Further, layers of copper is coated in the via hole.
Further, the luminous lead is gold thread.
Further, the positive pin and negative pin on be provided with positioning card.
As described above, the present invention at least has the advantages that：
High-heat-dispersion LED of the invention does LED substrate using ceramics, and easy processing is easy for installation, quickly passes out luminescent wafer
Internal heat, preventing luminescent wafer from causing because temperature is excessively high, LED luminance decaying is too fast and the service life is short, and heat dissipation effect is more preferable, the longevity
It orders higher.
Detailed description of the invention
Fig. 1 is the structural diagram of the present invention.
Description of symbols in embodiment：Pedestal 1, first lead 2, the second lead 3, positive pin 4, negative pin 5, shine crystalline substance
Piece 6, covering colloid 7, positioning card 45, the first cylindrical portion 11, the second cylindrical portion 12, the second via hole 13, the first via hole 14.
Specific embodiment
Embodiments of the present invention are illustrated by particular specific embodiment below, those skilled in the art can be by this explanation
Content disclosed by book is understood other advantages and efficacy of the present invention easily.
A kind of high-heat-dispersion LED, referring to Fig. 1, including pedestal 1, luminescent wafer 6, first lead 2, the second lead 3, positive pin
4, negative pin 5, covering colloid 7.
Wherein, pedestal 1 is ceramic base 1, the pedestal 1 include the first cylindrical portion 11 and in the first cylindrical portion 11 the
Two cylindrical portions 12, the diameter of the second cylindrical portion 12 is less than the first cylindrical portion 11, so that the first cylindrical portion 11 and the second cylindrical portion 12
Ladder platform is collectively formed, the first via hole 14 and the second via hole 13 are provided on the pedestal 1；
Wherein, luminescent wafer 6 is arranged in the second cylindrical portion 12；
Wherein, 2 one end of first lead is connect with luminescent wafer 6, and the other end passes through the first via hole 14；
Wherein, 3 one end of the second lead is connect with luminescent wafer 6, and the other end passes through the second via hole 13；
Wherein, positive pin 4 is connect with the first lead 2 for passing through the first via hole 14；
Wherein, negative pin 5 is connect with the second lead 3 for passing through the second via hole 13；
Wherein, the setting of covering colloid 7 is encapsulated in it on pedestal 1, and by luminescent wafer 6 and the second cylindrical portion 12.
High-heat-dispersion LED of the invention does LED substrate using ceramics, and easy processing can be mounted directly using positive and negative pin 5,
It is easy for installation, the heat inside luminescent wafer 6 is quickly passed out, prevents luminescent wafer 6 from causing LED luminance to decay because temperature is excessively high
The too fast and service life is short, and heat dissipation effect is more preferable, and the service life is higher.
Optimization, it is coated with layers of copper in the via hole, enables chip that heat exchange occurs with the external world, heat dissipation effect is more preferable.
Optimization, which is gold thread, and thermally conductive fast, heat dissipation effect is more preferable.
Optimization, the positive pin 4 and negative pin 5 on be provided with positioning card 45, in use, circuit board can be directly inserted in
On, installation is more convenient.
Any person skilled in the art all without departing from the spirit and scope of the present invention, carries out above-described embodiment
Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from disclosed spirit with
All equivalent modifications completed under technical idea or change should be covered by the claims of the present invention.
Claims (4)
1. a kind of high-heat-dispersion LED, which is characterized in that including：
Pedestal, the pedestal are ceramic bases, and the pedestal includes the first cylindrical portion and the second circle in the first cylindrical portion
Column portion, the diameter of the second cylindrical portion is less than the first cylindrical portion, so that ladder platform is collectively formed in the first cylindrical portion and the second cylindrical portion,
The first via hole and the second via hole are provided on the pedestal；
Luminescent wafer is arranged in the second cylindrical portion；
First lead, described first lead one end are connect with luminescent wafer, and the other end passes through the first via hole；
Second lead, second lead one end are connect with luminescent wafer, and the other end passes through the second via hole；
Positive pin, the positive pin are connect with the first lead for passing through the first via hole；
Negative pin, the negative pin are connect with the second lead for passing through the second via hole；
Covering colloid, the covering colloid is set on the base, and luminescent wafer and the second cylindrical portion are encapsulated in it.
2. the lamp housing of LED light according to claim 1, it is characterised in that：Layers of copper is coated in the via hole.
3. the lamp housing of LED light according to claim 1, it is characterised in that：The luminous lead is gold thread.
4. the lamp housing of LED light according to claim 1, it is characterised in that：The positive pin and negative pin on be respectively provided with
There is positioning card.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810975551.8A CN108916674A (en) | 2018-08-24 | 2018-08-24 | A kind of high-heat-dispersion LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810975551.8A CN108916674A (en) | 2018-08-24 | 2018-08-24 | A kind of high-heat-dispersion LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108916674A true CN108916674A (en) | 2018-11-30 |
Family
ID=64406584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810975551.8A Pending CN108916674A (en) | 2018-08-24 | 2018-08-24 | A kind of high-heat-dispersion LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108916674A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201053654Y (en) * | 2007-04-05 | 2008-04-30 | 黄志高 | Large power LED direct touch type heat-conductive circuit board |
| CN201187741Y (en) * | 2008-04-28 | 2009-01-28 | 东莞市彦升电子有限公司 | Array type LED encapsulation structure |
| CN102767724A (en) * | 2012-07-26 | 2012-11-07 | 中山伟强科技有限公司 | Ceramic substrate LED module and high-power LED lamp |
| CN203671319U (en) * | 2013-12-26 | 2014-06-25 | 江苏索尔光电科技有限公司 | G4 lamp with LED light source |
-
2018
- 2018-08-24 CN CN201810975551.8A patent/CN108916674A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201053654Y (en) * | 2007-04-05 | 2008-04-30 | 黄志高 | Large power LED direct touch type heat-conductive circuit board |
| CN201187741Y (en) * | 2008-04-28 | 2009-01-28 | 东莞市彦升电子有限公司 | Array type LED encapsulation structure |
| CN102767724A (en) * | 2012-07-26 | 2012-11-07 | 中山伟强科技有限公司 | Ceramic substrate LED module and high-power LED lamp |
| CN203671319U (en) * | 2013-12-26 | 2014-06-25 | 江苏索尔光电科技有限公司 | G4 lamp with LED light source |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181130 |
|
| RJ01 | Rejection of invention patent application after publication |