CN108912791A - A kind of printed wiring board PTC organosilicon hole-blocking agent - Google Patents
A kind of printed wiring board PTC organosilicon hole-blocking agent Download PDFInfo
- Publication number
- CN108912791A CN108912791A CN201810722210.XA CN201810722210A CN108912791A CN 108912791 A CN108912791 A CN 108912791A CN 201810722210 A CN201810722210 A CN 201810722210A CN 108912791 A CN108912791 A CN 108912791A
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- CN
- China
- Prior art keywords
- parts
- wiring board
- hole
- blocking agent
- pptc
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/34—Filling pastes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
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- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Conductive Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present invention provides a kind of printed wiring board PTC organosilicon hole-blocking agent, which is characterized in that each weight ratio of constituents is：100 parts of dihydroxy dimethylsilane, 600-800 parts of conductive agent, 3-6 parts of coupling agent, 20-25 parts of methyl-silicone oil, 8-10 parts of methyl tributanoximo silane, 1-2 parts of organotin；PPTC organosilicon hole-blocking agent application method is for two-sided or multi-layer ceramics wiring board through-hole conductive fill, play the role of that wiring board upper layer and lower layer route is connected, resistance, which sharply increases, when electric current is excessive or overheat, at plug-hole realizes circuit shutdown, can be self-healing conducting after troubleshooting.
Description
Technical field
The invention belongs to electronic materials and adhesive to synthesize field, be related to a kind of system of the polyurethane adhesive of PTC function
Preparation Method.
Background technique
Polymer-based positive temperature coefficient (PPTC) material is widely used on all kinds of electronic circuit protection components.PPTC material
Material has lower room temperature resistivity, and resistivity increases with the raising of temperature, sharply increases in some temperature spot resistance, big
Resistance, which sharply increases, under current heating state realizes circuit shutdown, and can voluntarily restore low resistive state after troubleshooting.Currently,
It is to develop more mature application mode in the market that the resistance of PPTC function, which is made into SMD surface mount elements, and technique is more mature, busy line
Road plate space is smaller, but the factors such as its welding, route design as discrete component also will increase the manufacturing cost of integral device.
Organosilicon material has brilliant cold-and-heat resistent impact, anti-aging property, it is made in conjunction with conductive filler two-sided
Or the hole-blocking agent of multilayer circuit board conductive through hole, the function of circuit connection and excess-current excess-temperature truncation protection can be played.
Summary of the invention
For prior art defect, the purpose of the present invention is to provide a kind of printed wiring board PTC organosilicon hole-blocking agent,
It is characterized in that, each weight ratio of constituents is：
100 parts of dihydroxy dimethylsilane
600-800 parts of conductive agent
3-6 parts of coupling agent
20-25 parts of methyl-silicone oil
8-10 parts of methyl tributanoximo silane
1-2 parts of organotin
PPTC organosilicon hole-blocking agent application method is to play for two-sided or multi-layer ceramics wiring board through-hole conductive fill
The effect that wiring board upper layer and lower layer route is connected, when electric current is excessive or overheat, resistance sharply increases realization circuit at plug-hole
It turns off, can be self-healing conducting after troubleshooting.
The conductive agent includes one of silver powder or silver-plated copper powder, and grain diameter is between 0.05 micron to 5 microns, grain
Diameter draw ratio is less than 50.
The coupling agent is monoalkoxy type titanate coupling agent, monoalkoxy pyrophosphoric acid ester type coupling agent, chelating type titanium
One of acid esters coupling agent, corrdination type titanate coupling agent, quaternary titanate coupling agent or combinations thereof.
The organotin includes one of stannous methide, dioctyl tin, tributyl tin, tin dilaurate tin diethyl.
Preparation method is that after mediating dihydroxy dimethylsilane, conductive agent, coupling agent in kneader uniformly, it is added
His component, is uniformly mixed.
The present invention is using the medium of PTC current-limiting protection function as two-sided or multi-layer ceramics wiring board through-hole conductive fill
Agent is greatly reduced compared to traditional circuit plate plating process for filling hole cost, while to save in PTC function insertion wiring board
Wiring board area promotes device circuit reliability.
The contents of the present invention and feature have revealed that as above, however the present invention that describes of front only briefly or pertains only to this
The specific part of invention, feature of the invention may be more than what content disclosed herein was related to.Therefore, protection model of the invention
The revealed content of embodiment should be not limited to by enclosing, and should include the combination of all the elements embodied in different piece, with
And it is various without departing substantially from replacement and modification of the invention, and covered by claims of the present invention.
Specific embodiment
Embodiment 1：
Preparation method is by 100 parts of dihydroxy dimethylsilanes, 800 parts of silver powder, 6 parts of monoalkoxy type titanate coupling agents
After mediating uniformly in kneader, 25 parts of methyl-silicone oils, 8 parts of methyl tributanoximo silanes, 2 parts of stannous methides are added, stir
It is uniformly mixed, obtains PPTC organosilicon hole-blocking agent, application method is to fill out for two-sided or multi-layer ceramics wiring board through-hole conduction
It fills, plays the role of that wiring board upper layer and lower layer route is connected.Hole-blocking agent shear strength：6.1MPa；Conductivity：65Scm-1；PTC
Intensity：3.0.
Embodiment 2：
Preparation method is to pinch 100 parts of dihydroxy dimethylsilanes, 700 parts of silver powder, 3 parts of chelating titanate coupling agents
After being mediated uniformly in conjunction machine, 20 parts of methyl-silicone oils, 8 parts of methyl tributanoximo silanes, 1 part of dioctyl tin is added, is stirred
Uniformly, PPTC organosilicon hole-blocking agent is obtained, application method is to rise for two-sided or multi-layer ceramics wiring board through-hole conductive fill
To the effect of conducting wiring board upper layer and lower layer route.Hole-blocking agent shear strength：5.6MPa；Conductivity：69Scm-1；PTC intensity：
2.9。
Embodiment 3：
Preparation method is by 100 parts of dihydroxy dimethylsilanes, 600 parts of silver-plated copper powders, 4 parts of quaternary titanate esters couplings
After agent is mediated uniformly in kneader, 25 parts of methyl-silicone oils, 10 parts of methyl tributanoximo silanes, 2 parts of tributyl tins are added, stir
It mixes uniformly mixed, obtains PPTC organosilicon hole-blocking agent, application method is for two-sided or multi-layer ceramics wiring board through-hole conduction
Filling plays the role of that wiring board upper layer and lower layer route is connected.Hole-blocking agent shear strength：6.0MPa；Conductivity：61Scm-1；
PTC intensity：3.0.
Embodiment 4：
Preparation method is by 100 parts of dihydroxy dimethylsilanes, 700 parts of silver-plated copper powders, 5 parts of corrdination type titanate coupling agents
After mediating uniformly in kneader, 20 parts of methyl-silicone oils, 10 parts of methyl tributanoximo silanes, 1 part of tin dilaurate diethyl is added
Ji Xi is uniformly mixed, and obtains PPTC organosilicon hole-blocking agent, and application method is for two-sided or multi-layer ceramics wiring board through-hole
Conductive fill, play the role of be connected wiring board upper layer and lower layer route.Hole-blocking agent shear strength：5.4MPa；Conductivity：
70Scm-1；PTC intensity：2.6.
Claims (5)
1. a kind of printed wiring board PPTC organosilicon hole-blocking agent, which is characterized in that each weight ratio of constituents is：
100 parts of dihydroxy dimethylsilane
600-800 parts of conductive agent
3-6 parts of coupling agent
20-25 parts of methyl-silicone oil
8-10 parts of methyl tributanoximo silane
1-2 parts of organotin
PPTC organosilicon hole-blocking agent application method is to play conducting for two-sided or multi-layer ceramics wiring board through-hole conductive fill
The effect of wiring board upper layer and lower layer route, resistance, which sharply increases, when electric current is excessive or overheat, at plug-hole realizes circuit shutdown,
It can be self-healing conducting after troubleshooting.
2. a kind of printed wiring board PPTC organosilicon hole-blocking agent according to claim 1, which is characterized in that the conductive agent
Including one of silver powder or silver-plated copper powder, grain diameter is between 0.05 micron to 5 microns, and partial size draw ratio is less than 50.
3. a kind of printed wiring board PPTC organosilicon hole-blocking agent according to claim 1, which is characterized in that the coupling agent
For monoalkoxy type titanate coupling agent, monoalkoxy pyrophosphoric acid ester type coupling agent, chelating titanate coupling agent, corrdination type titanium
One of acid esters coupling agent, quaternary titanate coupling agent or combinations thereof.
4. a kind of printed wiring board PPTC organosilicon hole-blocking agent according to claim 1, which is characterized in that the organotin
Including one of stannous methide, dioctyl tin, tributyl tin, tin dilaurate tin diethyl.
5. a kind of printed wiring board PPTC organosilicon hole-blocking agent according to claim 1, which is characterized in that preparation method is
After dihydroxy dimethylsilane, conductive agent, coupling agent being mediated in kneader uniformly, other components are added, are stirred
It is even.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810722210.XA CN108912791A (en) | 2018-06-26 | 2018-06-26 | A kind of printed wiring board PTC organosilicon hole-blocking agent |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810722210.XA CN108912791A (en) | 2018-06-26 | 2018-06-26 | A kind of printed wiring board PTC organosilicon hole-blocking agent |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108912791A true CN108912791A (en) | 2018-11-30 |
Family
ID=64425430
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810722210.XA Withdrawn CN108912791A (en) | 2018-06-26 | 2018-06-26 | A kind of printed wiring board PTC organosilicon hole-blocking agent |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108912791A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101381592A (en) * | 2008-10-16 | 2009-03-11 | 广东恒大新材料科技有限公司 | Sealant composition with electro-magnetic screen function |
| CN102618208A (en) * | 2011-01-28 | 2012-08-01 | 深圳市百丽春粘胶实业有限公司 | Halogen-free flame-retardant heat-conduction organosilicon electronic pouring sealant and preparation technology thereof |
| CN106147698A (en) * | 2016-07-01 | 2016-11-23 | 广州市高士实业有限公司 | Photovoltaic component terminal box heat conductive flame-retarding organic silicon potting adhesive and preparation method |
-
2018
- 2018-06-26 CN CN201810722210.XA patent/CN108912791A/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101381592A (en) * | 2008-10-16 | 2009-03-11 | 广东恒大新材料科技有限公司 | Sealant composition with electro-magnetic screen function |
| CN102618208A (en) * | 2011-01-28 | 2012-08-01 | 深圳市百丽春粘胶实业有限公司 | Halogen-free flame-retardant heat-conduction organosilicon electronic pouring sealant and preparation technology thereof |
| CN106147698A (en) * | 2016-07-01 | 2016-11-23 | 广州市高士实业有限公司 | Photovoltaic component terminal box heat conductive flame-retarding organic silicon potting adhesive and preparation method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20181130 |
|
| WW01 | Invention patent application withdrawn after publication |