CN108912357B - APU/Cu flexible composite film with dielectric constant and preparation method and application thereof - Google Patents
APU/Cu flexible composite film with dielectric constant and preparation method and application thereof Download PDFInfo
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- CN108912357B CN108912357B CN201810575979.3A CN201810575979A CN108912357B CN 108912357 B CN108912357 B CN 108912357B CN 201810575979 A CN201810575979 A CN 201810575979A CN 108912357 B CN108912357 B CN 108912357B
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2375/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
- C08J2375/04—Polyurethanes
- C08J2375/14—Polyurethanes having carbon-to-carbon unsaturated bonds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
Abstract
The invention discloses an APU/Cu flexible composite film with a dielectric constant and a preparation method and application thereof. The preparation method comprises the following steps: step 1: adding copper powder into acrylic polyurethane, and mechanically stirring; step 2: carrying out ultrasonic oscillation on the mechanically stirred solution; and step 3: spraying the solution after ultrasonic oscillation on a substrate; and 4, step 4: and cooling at room temperature to obtain the APU/Cu flexible composite film with the dielectric constant. According to the invention, the excellent temperature resistance of acrylic polyurethane is utilized, and the copper powder is doped, so that the flexible composite film which is almost not influenced by temperature and frequency, has a certain dielectric constant and low loss is obtained on the premise of ensuring simple and convenient process and low manufacturing cost. The invention expands the application range of the high polymer-based dielectric material in severe environments such as temperature change, medium and low frequency, widens the use limit of electric and electronic devices, and plays a certain role in promoting the integration development of the future microelectronic field.
Description
Technical Field
The invention relates to the technical field of high polymers and electromagnetic materials, in particular to an acrylic Acid Polyurethane (APU)/copper (Cu) flexible composite film with a dielectric constant, and a preparation method and application thereof.
Background
The dielectric constant, a physical parameter that characterizes the dielectric or polarization properties of a dielectric material, may represent the magnitude of the dielectric material's electrical storage capacity, also known as permittivity. In the information age of the 21 st century, along with the improvement of the level of science and technology, electrical and electronic devices are also rapidly developed and widely applied in the middle and low frequency fields, however, in order to adapt to the high-speed development of the microelectronic industry, the devices mainly take miniaturization, integration, multi-functionalization and the like as the development directions at present. Due to the physical parameter of dielectric constant, dielectric materials play an irreplaceable role in the field of electromagnetic materials, electrical and electronics. In addition, the method has wide application prospect and important scientific significance for the interdisciplinary fields of physics, optics and the like.
In the field of microelectronics, sometimes a dielectric material with a certain dielectric constant and low loss, which is normally and continuously operated in a severe environment, is sought instead of the high dielectric constant of the material, for example, compared with a ceramic matrix composite material with a high dielectric constant, the dielectric material is not easy to process, and the dielectric loss is often large; the polymer-based composite material does not have the characteristic of high dielectric constant, but can be easily processed and applied to special working environments such as medium and low frequency, high temperature change and the like on the basis of having a certain dielectric constant.
Chinese patent CN107057065A utilizes the designability of the polymer molecular chain side group to introduce a linear rigid group into the meta position of the side group benzene ring or biphenyl chain segment structure to prepare a polymer with low dielectric constant; chinese patent CN106139915A prepares a high dielectric constant micro-ultrafiltration membrane by including a high dielectric constant modifier and a membrane material in the micro-ultrafiltration membrane. In the above patents, the former has flexibility, but does not take into account the influence of temperature-dependent environment, and the latter increases the dielectric constant of the medium, but the working temperature and frequency are not guaranteed.
Disclosure of Invention
The invention aims to provide an APU/Cu flexible composite film with a dielectric constant, a preparation method and application thereof, so as to solve the problems of the prior art.
In order to achieve the above purpose, the invention provides a preparation method of an APU/Cu flexible composite film with dielectric constant, which comprises the following steps:
step 1: adding copper powder into acrylic polyurethane, and mechanically stirring;
step 2: carrying out ultrasonic oscillation on the mechanically stirred solution;
and step 3: spraying the solution after ultrasonic oscillation on a substrate;
and 4, step 4: and cooling at room temperature to obtain the APU/Cu flexible composite film with the dielectric constant.
The preparation method of the APU/Cu flexible composite film with the dielectric constant is characterized in that the volume ratio of the acrylic polyurethane to the copper powder is (81-99): (1-19).
The preparation method of the APU/Cu flexible composite film with the dielectric constant is characterized in that the mechanical stirring time is 10-60 minutes.
The preparation method of the APU/Cu flexible composite film with the dielectric constant is characterized in that the ultrasonic oscillation time is 10-60 minutes.
The preparation method of the APU/Cu flexible composite film with the dielectric constant comprises the following steps: and adding the solution after ultrasonic oscillation into a spray gun, and spraying the solution on the substrate by using the spray gun.
The preparation method of the APU/Cu flexible composite film with the dielectric constant is characterized in that the substrate is a polytetrafluoroethylene plate.
The preparation method of the APU/Cu flexible composite film with the dielectric constant is characterized in that the cooling time at room temperature is 24-60 hours.
The invention also provides the APU/Cu flexible composite film with the dielectric constant, which is prepared by the preparation method.
The APU/Cu flexible composite film with the dielectric constant is characterized in that the thickness of the APU/Cu flexible composite film is 0.2-0.8 mm.
The invention also provides an application of the APU/Cu flexible composite film with the dielectric constant in the preparation of electronic devices.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, the excellent temperature resistance of acrylic polyurethane is utilized, and the copper powder is doped, so that the flexible composite film which is almost not influenced by temperature and frequency, has a certain dielectric constant and low loss is obtained on the premise of ensuring simple and convenient process and low manufacturing cost. The invention expands the application range of the polymer-based dielectric material in relatively severe environments of temperature change, medium and low frequency, and the like, and has simple process flow and lower cost. The invention widens the use limit of electric and electronic devices and plays a certain role in promoting the integration development of the subsequent microelectronic field.
Drawings
FIG. 1 is a graph of dielectric constant versus frequency of a fabricated APU/Cu flexible composite film;
FIG. 2 is a graph of dielectric constant versus temperature (at 50 KHz) of the prepared APU/Cu flexible composite film.
Detailed Description
The invention will be further described by the following specific examples in conjunction with the drawings, which are provided for illustration only and are not intended to limit the scope of the invention.
The invention provides a preparation method of an APU/Cu flexible composite film with a dielectric constant, which comprises the following steps:
step 1: adding copper powder into acrylic polyurethane, and mechanically stirring; preferably, the volume ratio of acrylic polyurethane to copper powder is (81-99): (1-19); the mechanical stirring time is 10-60 minutes;
step 2: carrying out ultrasonic oscillation on the mechanically stirred solution; preferably, the time of ultrasonic oscillation is 10-60 minutes;
and step 3: spraying the solution after ultrasonic oscillation on a substrate; preferably, the spraying method comprises the following steps: adding the solution after ultrasonic oscillation into a spray gun, and spraying the solution on a substrate by using the spray gun; the substrate is a polytetrafluoroethylene plate;
and 4, step 4: cooling at room temperature to prepare an APU/Cu flexible composite film with dielectric constant; preferably, the cooling time at room temperature is 24-60 hours.
The invention also provides the APU/Cu flexible composite film with the dielectric constant, which is prepared by the preparation method; preferably, the thickness of the APU/Cu flexible composite film is 0.2-0.8 mm.
The invention also provides an application of the APU/Cu flexible composite film with the dielectric constant in the preparation of electronic devices.
Example 1:
(1) weighing 9 g of acrylic polyurethane and 1 g of copper powder (the volume unit is 99: 1);
(2) adding the weighed copper powder into acrylic polyurethane, and mechanically stirring for 30 minutes;
(3) carrying out ultrasonic oscillation on the mechanically stirred solution for 30 minutes;
(4) adding the solution after ultrasonic oscillation into a high-viscosity spray gun, and spraying the solution on a prepared polytetrafluoroethylene plate by using the spray gun;
(5) and cooling for 48 hours at room temperature to obtain the APU/Cu flexible composite film.
Example 2:
(1) weighing 7 g of acrylic polyurethane and 3 g of copper powder (the volume unit is 96: 4);
(2) adding the weighed copper powder into acrylic polyurethane, and mechanically stirring for 30 minutes;
(3) carrying out ultrasonic oscillation on the mechanically stirred solution for 30 minutes;
(4) adding the solution after ultrasonic oscillation into a high-viscosity spray gun, and spraying the solution on a prepared polytetrafluoroethylene plate by using the spray gun;
(5) and cooling for 48 hours at room temperature to obtain the APU/Cu flexible composite film.
Example 3:
(1) weighing 5 g of acrylic acid polyurethane and 5 g of copper powder (the volume unit is 91: 9);
(2) adding the weighed copper powder into acrylic polyurethane, and mechanically stirring for 30 minutes;
(3) carrying out ultrasonic oscillation on the mechanically stirred solution for 30 minutes;
(4) adding the solution after ultrasonic oscillation into a high-viscosity spray gun, and spraying the solution on a prepared polytetrafluoroethylene plate by using the spray gun;
(5) and cooling for 48 hours at room temperature to obtain the APU/Cu flexible composite film.
Example 4:
(1) 3 g of acrylic urethane and 7 g of copper powder (calculated as 81:19 in terms of volume) were weighed;
(2) adding the weighed copper powder into acrylic polyurethane, and mechanically stirring for 30 minutes;
(3) carrying out ultrasonic oscillation on the mechanically stirred solution for 30 minutes;
(4) adding the solution after ultrasonic oscillation into a high-viscosity spray gun, and spraying the solution on a prepared polytetrafluoroethylene plate by using the spray gun;
(5) and cooling for 48 hours at room temperature to obtain the APU/Cu flexible composite film.
The temperature change/frequency change-dielectric properties of the APU/Cu flexible composite film prepared in examples 1-4 of the invention are tested by an Agilent E4980al test table and a matched temperature changing console (the temperature of a test chamber is 40-105 ℃), and the results are shown in FIG. 1 and FIG. 2. As can be seen from the figure, the flexible composite film which is almost not influenced by temperature and frequency, has a certain dielectric constant and low loss is obtained on the premise of ensuring simple and convenient process and low manufacturing cost by doping copper powder by utilizing the excellent temperature resistance of the acrylic polyurethane. The invention expands the application range of the polymer-based dielectric material in relatively severe environments of temperature change, medium and low frequency, and the like, and has simple process flow and lower cost. The invention widens the use limit of electric and electronic devices and plays a certain role in promoting the integration development of the subsequent microelectronic field.
While the present invention has been described in detail with reference to the preferred embodiments, it should be understood that the above description should not be taken as limiting the invention. Various modifications and alterations to this invention will become apparent to those skilled in the art upon reading the foregoing description. Accordingly, the scope of the invention should be determined from the following claims.
Claims (9)
1. A preparation method of an APU/Cu flexible composite film with dielectric constant is characterized by comprising the following steps:
step 1: adding copper powder into acrylic polyurethane, wherein the volume ratio of the acrylic polyurethane to the copper powder is (81-99): (1-19), and mechanically stirring;
step 2: carrying out ultrasonic oscillation on the mechanically stirred solution;
and step 3: spraying the solution after ultrasonic oscillation on a substrate;
and 4, step 4: and cooling at room temperature to obtain the APU/Cu flexible composite film with the dielectric constant.
2. The method of claim 1 wherein the mechanical agitation is for a period of 10 to 60 minutes.
3. The method for preparing the APU/Cu flexible composite film with dielectric constant of claim 1, wherein the time of the ultrasonic oscillation is 10 to 60 minutes.
4. The method for preparing the APU/Cu flexible composite film with dielectric constant of claim 1, wherein the spraying method comprises the following steps: and adding the solution after ultrasonic oscillation into a spray gun, and spraying the solution on the substrate by using the spray gun.
5. The method of claim 1 wherein the substrate is a teflon sheet.
6. The method of claim 1 wherein the time for cooling at room temperature is 24-60 hours.
7. An APU/Cu flexible composite film with dielectric constant prepared by the preparation method of any one of claims 1 to 6.
8. The APU/Cu flexible composite film having a dielectric constant of claim 7, wherein the APU/Cu flexible composite film has a thickness of 0.2-0.8 mm.
9. Use of the APU/Cu flexible composite film with dielectric constant of claim 7 in the preparation of electronic devices.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810575979.3A CN108912357B (en) | 2018-06-06 | 2018-06-06 | APU/Cu flexible composite film with dielectric constant and preparation method and application thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810575979.3A CN108912357B (en) | 2018-06-06 | 2018-06-06 | APU/Cu flexible composite film with dielectric constant and preparation method and application thereof |
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| CN108912357A CN108912357A (en) | 2018-11-30 |
| CN108912357B true CN108912357B (en) | 2021-02-19 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103764781A (en) * | 2011-09-30 | 2014-04-30 | 日东电工株式会社 | Adhesive, adhesive layer and adhesive sheet |
| CN105131527A (en) * | 2015-09-17 | 2015-12-09 | 重庆市锦艺硅材料开发有限公司苏州分公司 | Copper clad laminate with low dielectric constant and manufacturing method of copper clad laminate |
| EP3076145A1 (en) * | 2015-03-31 | 2016-10-05 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Textile material with incorporated elastomer sensors |
-
2018
- 2018-06-06 CN CN201810575979.3A patent/CN108912357B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103764781A (en) * | 2011-09-30 | 2014-04-30 | 日东电工株式会社 | Adhesive, adhesive layer and adhesive sheet |
| EP3076145A1 (en) * | 2015-03-31 | 2016-10-05 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Textile material with incorporated elastomer sensors |
| CN105131527A (en) * | 2015-09-17 | 2015-12-09 | 重庆市锦艺硅材料开发有限公司苏州分公司 | Copper clad laminate with low dielectric constant and manufacturing method of copper clad laminate |
Non-Patent Citations (2)
| Title |
|---|
| "Effect of Micro- and Nano-Particle Fillers at Low Percolation Threshold on the Dielectric and Mechanical Properties of Polyurethane/Copper Composites";Putson, C;Jaaoh, D;Meauma, N;Muensit, N;《JOURNAL OF INORGANIC AND ORGANOMETALLIC POLYMERS AND MATERIALS》;20120914;第22卷(第6期);第1301页右栏，1303-1304页图3-5 * |
| "Enhanced permittivity in flexible carbon-fiber and acrylic-polyurethane composites";Pan, Shibing; Wang, Zhongyang; Chen, Min;《MATERIALS LETTERS 》;20171015;第205卷;第45页左栏，图1，第46页图2(a)(b) * |
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