CN108912357A - APU/Cu flexible composite film with dielectric constant and the preparation method and application thereof - Google Patents
APU/Cu flexible composite film with dielectric constant and the preparation method and application thereof Download PDFInfo
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- CN108912357A CN108912357A CN201810575979.3A CN201810575979A CN108912357A CN 108912357 A CN108912357 A CN 108912357A CN 201810575979 A CN201810575979 A CN 201810575979A CN 108912357 A CN108912357 A CN 108912357A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2375/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
- C08J2375/04—Polyurethanes
- C08J2375/14—Polyurethanes having carbon-to-carbon unsaturated bonds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
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Abstract
The invention discloses a kind of APU/Cu flexible composite film and the preparation method and application thereof with dielectric constant.The preparation method includes the following steps：Step 1：Copper powder is added in acroleic acid polyurethane, and carries out mechanical stirring；Step 2：Solution after mechanical stirring is subjected to ultrasonic vibration；Step 3：By the solution spraying after ultrasonic vibration on substrate；Step 4：It cools down at room temperature, the APU/Cu flexible composite film with dielectric constant is made.The present invention temperature tolerance excellent using acroleic acid polyurethane has been obtained a kind of almost not by temperature and frequency influence and with certain dielectric constant, low-loss flexible composite film by adulterating copper powder under the premise of guaranteeing that simple process, manufacturing cost are low.The present invention extends polymer-based dielectric material and becomes in temperature, the scope of application of the rather harsh environments such as middle low frequency, has widened the use limitation of electric and electronic device, plays certain progradation for the later integrated development of microelectronic field.
Description
Technical field
The present invention relates to macromolecules and electromagnetic material technical field, and in particular to a kind of acrylic acid with dielectric constant is poly-
Urethane (APU)/copper (Cu) flexible composite film and the preparation method and application thereof.
Background technique
Dielectric constant, characterization is the dielectric property of dielectric material or the physical parameter of polarization property, which can represent Jie
The size of material charge storage ability, also referred to as capacitivity.In information age 21 century, with the raising of scientific and technological level, electricity
Gas electronic device is also grown rapidly, and is widely used in middle low frequency field, however in order to adapt to the high speed development of microelectronic industry, mesh
Such preceding device is mainly with micromation, and integration, multifunction etc. is developing direction.Join just because of this physics of dielectric constant
Number, dielectric material play irreplaceable role in this electromagnetic material technical field of electric and electronic.In addition, it is for physics
The interdisciplinary fields such as, optics also have relatively broad application prospect and important scientific meaning.
In microelectronic field, what is pursued sometimes is not often the high dielectric constant of material, but can be more severe
It is normal in environment, continue working there is certain dielectric constant and the lower dielectric material of loss, such as relative to Gao Jie
The ceramic matric composite of electric constant, it is not easy to be processed, and dielectric loss is often larger；Although and polymer-based composite is simultaneously
Without this characteristic of high dielectric constant, but it can be on the basis of with certain dielectric constant, and easy processing is simultaneously applied to all
Such as middle low frequency, temperature becomes higher and waits particular job environment.
Chinese patent CN107057065A utilizes the designability of polymer molecular chain side group, in side group phenyl ring or xenyl
Segmented structure meta position introduces straight chain rigid radical and is prepared for a kind of polymer with low-k；Chinese patent
CN106139915A is micro- by being prepared for a kind of high dielectric constant comprising high dielectric constant modifying agent and membrane material in micro- ultrafiltration membrane
Ultrafiltration membrane.In the above patent, although the former polymer has certain flexibility, the shadow of temperature changing environment is not accounted for
It rings, although the latter improves the dielectric constant of medium, but its operating temperature, frequency are again less than guarantee.
Summary of the invention
APU/Cu flexible composite film that the object of the present invention is to provide a kind of with dielectric constant and preparation method thereof with
Using to solve above-mentioned problem of the prior art.
In order to achieve the above objectives, the preparation of the present invention provides a kind of APU/Cu flexible composite film with dielectric constant
Method comprising following steps：
Step 1：Copper powder is added in acroleic acid polyurethane, and carries out mechanical stirring；
Step 2：Solution after mechanical stirring is subjected to ultrasonic vibration；
Step 3：By the solution spraying after ultrasonic vibration on substrate；
Step 4：It cools down at room temperature, the APU/Cu flexible composite film with dielectric constant is made.
The preparation method of the above-mentioned APU/Cu flexible composite film with dielectric constant, wherein acroleic acid polyurethane with
The volume ratio of copper powder is (81-99)：(1-19).
The preparation method of the above-mentioned APU/Cu flexible composite film with dielectric constant, wherein churned mechanically time
It is 10-60 minutes.
The preparation method of the above-mentioned APU/Cu flexible composite film with dielectric constant, wherein the time of ultrasonic vibration
It is 10-60 minutes.
The preparation method of the above-mentioned APU/Cu flexible composite film with dielectric constant, wherein the method for the spraying
For：Solution after ultrasonic vibration is added to spray gun, using spray gun spraying on substrate.
The preparation method of the above-mentioned APU/Cu flexible composite film with dielectric constant, wherein the substrate is poly- four
Vinyl fluoride plate.
The preparation method of the above-mentioned APU/Cu flexible composite film with dielectric constant, wherein when cooling at room temperature
Between be 24-60 hours.
The present invention also provides a kind of APU/Cu flexibility with dielectric constant that above-mentioned preparation method is prepared is multiple
Close film.
The above-mentioned APU/Cu flexible composite film with dielectric constant, wherein the thickness of APU/Cu flexible composite film
For 0.2-0.8mm.
The present invention also provides a kind of above-mentioned APU/Cu flexible composite films with dielectric constant to prepare electronics device
Application in part.
Compared with the existing technology, the invention has the advantages that：
The present invention is using the excellent temperature tolerance of acroleic acid polyurethane, by adulterating copper powder, guarantee simple process, manufacture at
It has been obtained under the premise of this is low a kind of almost not by temperature and frequency influence and multiple with certain dielectric constant, low-loss flexibility
Close film.The present invention extends polymer-based dielectric material and becomes in temperature, the scope of application of the rather harsh environments such as middle low frequency, technique
Process is simple, and cost is relatively low.The present invention has widened the use limitation of electric and electronic device, integrated for later microelectronic field
Development plays certain progradation.
Detailed description of the invention
Fig. 1 is the dielectric constant and frequency relation figure of APU/Cu flexible composite film obtained；
Fig. 2 is the dielectric constant and temperature relation figure of APU/Cu flexible composite film obtained (under 50KHz).
Specific embodiment
Below in conjunction with attached drawing, by specific embodiment, the invention will be further described, these embodiments are merely to illustrate
The present invention is not limiting the scope of the invention.
The preparation method of the present invention provides a kind of APU/Cu flexible composite film with dielectric constant comprising following
Step：
Step 1：Copper powder is added in acroleic acid polyurethane, and carries out mechanical stirring；Preferably, acroleic acid polyurethane with
The volume ratio of copper powder is (81-99)：(1-19)；The churned mechanically time is 10-60 minutes；
Step 2：Solution after mechanical stirring is subjected to ultrasonic vibration；Preferably, the time of ultrasonic vibration is 10-60 points
Clock；
Step 3：By the solution spraying after ultrasonic vibration on substrate；Preferably, the method for the spraying is：Ultrasound is shaken
Solution after swinging is added to spray gun, using spray gun spraying on substrate；The substrate is polyfluortetraethylene plate；
Step 4：It cools down at room temperature, the APU/Cu flexible composite film with dielectric constant is made；Preferably, cold at room temperature
But time is 24-60 hours.
The present invention also provides a kind of APU/Cu flexibility with dielectric constant that above-mentioned preparation method is prepared is multiple
Close film；Preferably, the APU/Cu flexible composite film with a thickness of 0.2-0.8mm.
The present invention also provides a kind of above-mentioned APU/Cu flexible composite films with dielectric constant to prepare electronics device
Application in part.
Embodiment 1：
(1) 9 grams of acroleic acid polyurethane are weighed, (be converted into volume unit is 99 to 1 gram of copper powder:1)；
(2) load weighted copper powder is added in acroleic acid polyurethane, and carries out mechanical stirring 30 minutes；
(3) solution after mechanical stirring is carried out ultrasonic vibration 30 minutes；
(4) solution after ultrasonic vibration is added to high viscosity spray gun, the polytetrafluoroethyl-ne being ready for is sprayed on using spray gun
On alkene plate；
(5) it cools down 48 hours at room temperature, obtains APU/Cu flexible composite film.
Embodiment 2：
(1) 7 grams of acroleic acid polyurethane are weighed, (be converted into volume unit is 96 to 3 grams of copper powder:4)；
(2) load weighted copper powder is added in acroleic acid polyurethane, and carries out mechanical stirring 30 minutes；
(3) solution after mechanical stirring is carried out ultrasonic vibration 30 minutes；
(4) solution after ultrasonic vibration is added to high viscosity spray gun, the polytetrafluoroethyl-ne being ready for is sprayed on using spray gun
On alkene plate；
(5) it cools down 48 hours at room temperature, obtains APU/Cu flexible composite film.
Embodiment 3：
(1) poly- 5 grams of ammonia of acrylic acid are weighed, (be converted into volume unit is 91 to 5 grams of copper powder:9)；
(2) load weighted copper powder is added in acroleic acid polyurethane, and carries out mechanical stirring 30 minutes；
(3) solution after mechanical stirring is carried out ultrasonic vibration 30 minutes；
(4) solution after ultrasonic vibration is added to high viscosity spray gun, the polytetrafluoroethyl-ne being ready for is sprayed on using spray gun
On alkene plate；
(5) it cools down 48 hours at room temperature, obtains APU/Cu flexible composite film.
Embodiment 4：
(1) 3 grams of acroleic acid polyurethane are weighed, (be converted into volume unit is 81 to 7 grams of copper powder:19)；
(2) load weighted copper powder is added in acroleic acid polyurethane, and carries out mechanical stirring 30 minutes；
(3) solution after mechanical stirring is carried out ultrasonic vibration 30 minutes；
(4) solution after ultrasonic vibration is added to high viscosity spray gun, the polytetrafluoroethyl-ne being ready for is sprayed on using spray gun
On alkene plate；
(5) it cools down 48 hours at room temperature, obtains APU/Cu flexible composite film.
The warm change of APU/Cu flexible composite film prepared by 1-4 of the embodiment of the present invention/frequency change-dielectric properties are passed through
AgilentE4980al tests table and mating alternating temperature console test (surveying room temperature is 40 to 105 DEG C), as a result such as Fig. 1 and figure
Shown in 2.As seen from the figure, the present invention temperature tolerance excellent using acroleic acid polyurethane is guaranteeing technique letter by adulterating copper powder
Just, obtained under the premise of manufacturing cost is low a kind of almost not by temperature and frequency influence and with certain dielectric constant, low damage
The flexible composite film of consumption.The present invention extends polymer-based dielectric material and becomes in temperature, and the rather harsh environments such as middle low frequency are fitted
With range, process flow is simple, and cost is relatively low.The present invention has widened the use limitation of electric and electronic device, is later micro- electricity
The integrated development of subdomains plays certain progradation.
It is discussed in detail although the contents of the present invention have passed through above preferred embodiment, but it should be appreciated that above-mentioned
Description is not considered as limitation of the present invention.After those skilled in the art have read above content, for of the invention
A variety of modifications and substitutions all will be apparent.Therefore, protection scope of the present invention should be limited to the appended claims.
Claims (10)
1. a kind of preparation method of the APU/Cu flexible composite film with dielectric constant, which is characterized in that include the following steps：
Step 1：Copper powder is added in acroleic acid polyurethane, and carries out mechanical stirring；
Step 2：Solution after mechanical stirring is subjected to ultrasonic vibration；
Step 3：By the solution spraying after ultrasonic vibration on substrate；
Step 4：It cools down at room temperature, the APU/Cu flexible composite film with dielectric constant is made.
2. the preparation method of the APU/Cu flexible composite film with dielectric constant as described in claim 1, which is characterized in that
The volume ratio of acroleic acid polyurethane and copper powder is (81-99)：(1-19).
3. the preparation method of the APU/Cu flexible composite film with dielectric constant as described in claim 1, which is characterized in that
The churned mechanically time is 10-60 minutes.
4. the preparation method of the APU/Cu flexible composite film with dielectric constant as described in claim 1, which is characterized in that
The time of ultrasonic vibration is 10-60 minutes.
5. the preparation method of the APU/Cu flexible composite film with dielectric constant as described in claim 1, which is characterized in that
The method of the spraying is：Solution after ultrasonic vibration is added to spray gun, using spray gun spraying on substrate.
6. the preparation method of the APU/Cu flexible composite film with dielectric constant as described in claim 1, which is characterized in that
The substrate is polyfluortetraethylene plate.
7. the preparation method of the APU/Cu flexible composite film with dielectric constant as described in claim 1, which is characterized in that
The cooling time is 24-60 hours at room temperature.
8. a kind of APU/Cu with dielectric constant that the preparation method as described in any one of claim 1-7 is prepared
Flexible composite film.
9. as claimed in claim 8 with the APU/Cu flexible composite film of dielectric constant, which is characterized in that APU/Cu is flexible
Laminated film with a thickness of 0.2-0.8mm.
10. a kind of APU/Cu flexible composite film with dielectric constant as claimed in claim 8 is in preparing electronic device
Application.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810575979.3A CN108912357B (en) | 2018-06-06 | 2018-06-06 | APU/Cu flexible composite film with dielectric constant and preparation method and application thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810575979.3A CN108912357B (en) | 2018-06-06 | 2018-06-06 | APU/Cu flexible composite film with dielectric constant and preparation method and application thereof |
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| Publication Number | Publication Date |
|---|---|
| CN108912357A true CN108912357A (en) | 2018-11-30 |
| CN108912357B CN108912357B (en) | 2021-02-19 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103764781A (en) * | 2011-09-30 | 2014-04-30 | 日东电工株式会社 | Adhesive, adhesive layer and adhesive sheet |
| CN105131527A (en) * | 2015-09-17 | 2015-12-09 | 重庆市锦艺硅材料开发有限公司苏州分公司 | Copper clad laminate with low dielectric constant and manufacturing method of copper clad laminate |
| EP3076145A1 (en) * | 2015-03-31 | 2016-10-05 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Textile material with incorporated elastomer sensors |
-
2018
- 2018-06-06 CN CN201810575979.3A patent/CN108912357B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103764781A (en) * | 2011-09-30 | 2014-04-30 | 日东电工株式会社 | Adhesive, adhesive layer and adhesive sheet |
| EP3076145A1 (en) * | 2015-03-31 | 2016-10-05 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Textile material with incorporated elastomer sensors |
| CN105131527A (en) * | 2015-09-17 | 2015-12-09 | 重庆市锦艺硅材料开发有限公司苏州分公司 | Copper clad laminate with low dielectric constant and manufacturing method of copper clad laminate |
Non-Patent Citations (2)
| Title |
|---|
| PAN, SHIBING; WANG, ZHONGYANG; CHEN, MIN: ""Enhanced permittivity in flexible carbon-fiber and acrylic-polyurethane composites"", 《MATERIALS LETTERS 》 * |
| PUTSON, C;JAAOH, D;MEAUMA, N;MUENSIT, N: ""Effect of Micro- and Nano-Particle Fillers at Low Percolation Threshold on the Dielectric and Mechanical Properties of Polyurethane/Copper Composites"", 《JOURNAL OF INORGANIC AND ORGANOMETALLIC POLYMERS AND MATERIALS》 * |
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| CN108912357B (en) | 2021-02-19 |
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