CN108899246A - A kind of acceleration overload absorbing switching device - Google Patents
A kind of acceleration overload absorbing switching device Download PDFInfo
- Publication number
- CN108899246A CN108899246A CN201810929589.1A CN201810929589A CN108899246A CN 108899246 A CN108899246 A CN 108899246A CN 201810929589 A CN201810929589 A CN 201810929589A CN 108899246 A CN108899246 A CN 108899246A
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- China
- Prior art keywords
- low pass
- high pass
- fixed
- terminals
- pass
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H35/00—Switches operated by change of a physical condition
- H01H35/14—Switches operated by change of acceleration, e.g. by shock or vibration, inertia switch
- H01H35/141—Details
- H01H35/142—Damping means to avoid unwanted response
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- Details Of Connecting Devices For Male And Female Coupling (AREA)
Abstract
The present invention provides a kind of acceleration overload absorbing switching devices, including low pass terminals, high pass terminals, guide sleeve and dynamic touch group；Low pass terminals and high pass terminals are individually fixed in guide sleeve both ends；Dynamic touch group is placed in guide sleeve, dynamic touch group can move in guide sleeve, and conducting is fixed with spring between low pass terminals or high pass terminals, dynamic touch group and high pass terminals and dynamic touch group is connected in its natural state in low pass terminals.The present invention passes through low pass terminals, high pass terminals, guide sleeve, the dynamic structure settings such as touch group and absorbing mould group, it can effectively ensure the stability of low pass acceleration overload signal, dynamic touch group resonant energy can especially be absorbed by the prepressing deformation of absorbing reed, reduce resonance amplitude, guarantee vibration processes contact reliable contacts always, realizes the working characteristics of high-quality.
Description
Technical field
The present invention relates to a kind of acceleration overload absorbing switching devices.
Background technique
The continuous improvement required with modern action system reliability, it is desirable that flight course control system provides reliable continuous
Overload signal, so that command system accurately identifies control system command status and provides judgment basis.As being dynamic
Make system provide overload signal acceleration overload switch, the success or failure of work directly determines moving system execution task at
It loses.
Summary of the invention
In order to solve the above technical problems, the present invention provides a kind of acceleration overload absorbing switching device, which is spent
It carries absorbing switching device and passes through low pass terminals, high pass terminals, guide sleeve, the dynamic structure settings such as touch group and absorbing mould group,
It can effectively ensure the stability of low pass acceleration overload signal.
The present invention is achieved by the following technical programs.
A kind of acceleration overload absorbing switching device provided by the invention, including low pass terminals, high pass terminals, guiding
Set and dynamic touch group；Low pass terminals and high pass terminals are individually fixed in guide sleeve both ends；Dynamic touch group is placed in guide sleeve,
Dynamic touch group can move in guide sleeve, conducting in low pass terminals or high pass terminals, move touch group and high pass terminals it
Between be fixed with spring dynamic touch group be connected in its natural state in low pass terminals；；Touch is moved in low pass terminals direction
Absorbing mould group is fixed on the end face of group makes the contact between low pass terminals and dynamic touch group be Elastic Contact.
The low pass terminals pass through low pass substrate by low pass wiring pin and constitute, and the inner end soldering of low pass wiring pin is fixed with
Low pass contact chip.
The low pass substrate be it is discoid, low pass wiring pin and low pass contact chip are four and are uniformly distributed along the circumference, and four are low
It connects contact and forms contour contact ring, low pass contact chip inner end has arcuation raised by contour contact ring external position；In low pass bushing
Fixing gasket is held, be uniformly distributed along the circumference at least two inclined absorbing reeds on washer, and washer and absorbing reed constitute absorbing mould group.
The high pass terminals pass through high pass substrate by high pass wiring pin and constitute, and the soldering of high pass wiring pin inner end is fixed with height
Contact is connected, high pass wiring pin center is fixed with common end wiring pin, and common end wiring pin circuit connection is in dynamic touch group.
The high pass substrate be it is discoid, high pass wiring pin and high pass contact chip are four and are uniformly distributed along the circumference, four height
It connects contact and forms contour contact ring, high pass contact chip inner end has arcuation raised by contour contact ring external position.
The dynamic touch group is that U-shaped movable contact spring forms by two pieces of sections, and the U-shaped turn of bilge of two blocks of movable contact springs is opposite and passes through
It covers nut on screw, screw to fix, the lateral surface between two blocks of movable contact springs is fixed with clump weight, and the U-shaped lateral edge of movable contact spring is outside
Inclination；Spring suit is fixed on clump weight.
The clump weight side is fixed with feather key, and the position that feather key is corresponded on guide sleeve inner wall is provided with slot.
Low pass bushing is fixed on the low pass substrate inner face, low pass substrate outer end is set with the fixed lid of fixed low pass；?
In floor projection, the part that low pass wiring pin is more than low pass substrate inner face is completely covered in low pass bushing, and low pass contact chip is more than
Low pass bushing.
High pass bushing is fixed on the high pass substrate inner face, high pass substrate outer end is set with the fixed lid of fixed high pass；?
In floor projection, the part that high pass wiring pin is more than high pass substrate inner face is completely covered in high pass bushing, and high pass contact chip is more than
High pass bushing；Limit sleeve is fixed on the outside of high pass bushing, spring suit is fixed on limit sleeve.
The washer side is along there is boss-shaped prominent, so that washer rotary spacing.
The beneficial effects of the present invention are：Pass through low pass terminals, high pass terminals, guide sleeve, dynamic touch group and absorbing
The structure settings such as mould group can effectively ensure the stability of low pass acceleration overload signal, especially can be by the pre- of absorbing reed
Compressive strain absorbs dynamic touch group resonant energy, reduces resonance amplitude, guarantees vibration processes contact reliable contacts always, realizes high
The working characteristics of quality.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the invention；
Fig. 2 is the enlarged diagram of low pass terminals and dynamic touch group contact position in Fig. 1；
Fig. 3 is the bottom view of absorbing mould group in Fig. 2.
In figure：11- low pass wiring pin, 12- low pass substrate, 13- low pass contact chip, 14- low pass bushing, 15- low pass are fixed
Lid, 16- washer, 17- absorbing reed, 21- high pass wiring pin, 22- high pass substrate, 23- high pass contact chip, 24- high pass bushing,
The fixed lid of 25- high pass, 26- limit sleeve, the common end 27- wiring pin, 31- nut, 32- screw, 33- movable contact spring, 34- clump weight,
35- feather key, 41- guide sleeve, 42- spring.
Specific embodiment
Be described further below technical solution of the present invention, but claimed range be not limited to it is described.
A kind of acceleration overload absorbing switching device as shown in Figure 1, including low pass terminals, high pass terminals, guiding
Set 41 and dynamic touch group；Low pass terminals and high pass terminals are individually fixed in 41 both ends of guide sleeve；It is placed in guide sleeve 41 dynamic
Touch group, dynamic touch group can move in guide sleeve 41, and conducting moves touch group and high pass in low pass terminals or high pass terminals
Spring 42 is fixed between terminals is connected dynamic touch group in its natural state in low pass terminals；；In low pass terminals
Absorbing mould group is fixed on towards the end face for moving touch group makes the contact between low pass terminals and dynamic touch group be elastic connecting
Touching.
The low pass terminals pass through low pass substrate 12 by low pass wiring pin 11 and constitute, the inner end soldering of low pass wiring pin 11
It is fixed with low pass contact chip 13.
The low pass substrate 12 be it is discoid, low pass wiring pin 11 and low pass contact chip 13 are four and are uniformly distributed along the circumference,
Four low pass contact chips 13 form contour contact ring, and 13 inner end of low pass contact chip has arcuation raised by contour contact ring external position.
The high pass terminals pass through high pass substrate 22 by high pass wiring pin 21 and constitute, and the soldering of 21 inner end of high pass wiring pin is solid
Surely there is high pass contact chip 23,21 center of high pass wiring pin is fixed with common end wiring pin 27,27 circuit of common end wiring pin
It is wired to dynamic touch group.
The high pass substrate 22 be it is discoid, high pass wiring pin 21 and high pass contact chip 23 are four and are uniformly distributed along the circumference,
Four high pass contact chips 23 form contour contact ring, and 23 inner end of high pass contact chip has arcuation raised by contour contact ring external position.
The dynamic touch group is that U-shaped movable contact spring 33 forms by two pieces of sections, and the U-shaped turn of bilge of two blocks of movable contact springs 33 is opposite to each other simultaneously
It covers nut 31 on screw 32, screw 32 to fix, the lateral surface between two blocks of movable contact springs 33 is fixed with clump weight 34, movable contact spring
33 U-shaped lateral edge is inclined outwardly；The suit of spring 42 is fixed on clump weight 34.
34 side of clump weight is fixed with feather key 35, and the position that feather key 35 is corresponded on 41 inner wall of guide sleeve is provided with
Slot.
Low pass bushing 14 is fixed on 12 inner face of low pass substrate, 12 outer end of low pass substrate is set with fixed low pass and fixes
Lid 15；In floor projection, the part that low pass wiring pin 11 is more than 12 inner face of low pass substrate is completely covered in low pass bushing 14, low
Contact 13 is connected more than low pass bushing 14；14 inner end fixing gasket 16 of low pass bushing is uniformly distributed along the circumference at least two on washer and inclines
Oblique absorbing reed 17, washer 16 and absorbing reed 17 constitute absorbing mould group.
High pass bushing 24 is fixed on 22 inner face of high pass substrate, 22 outer end of high pass substrate is set with fixed high pass and fixes
Lid 25；In floor projection, the part that high pass wiring pin 21 is more than 22 inner face of high pass substrate is completely covered in high pass bushing 24, high
Contact 23 is connected more than high pass bushing 24；Limit sleeve 26 is fixed on the outside of high pass bushing 24, the suit of spring 42 is fixed on limit sleeve
On 26.
16 side of washer is along there is boss-shaped prominent, so that 16 rotary spacing of washer.
When processing, first then low pass wiring pin 11 and low pass substrate 12 are brazed 4 low pass contact chips 13 through sinter molding
Form contour contact ring；High pass terminal portion is similar, first by high pass wiring pin 21 and high pass substrate 22 through sinter molding, later
It is riveted common end wiring pin 27 on high pass substrate 22, is then brazed 4 high pass contact chips 23 and forms contour contact ring；Use screw
32 assemble movable contact spring 33, and set top nut 31 is fixed, then assemble clump weight 34, then feather key 35 is assembled；When general assembly, according to
It is secondary that limit sleeve 26, high pass bushing 24 are mounted in 41 end of guide sleeve, high pass terminals are partly then passed through into high pass bushing 24 and are mounted in
On 41 lower end limited step of guide sleeve, and lid 25 being fixed with high pass and tightens fixation, spring 42 is inserted in clump weight 34 with one end
After limited step, then with the other end from 41 low pass end of guide sleeve be packed into, be sequentially loaded into washer 16, low pass bushing 14, low pass later
Terminals, the fixed lid 15 of last low pass tighten fixation.
Under original state, acceleration overload switchs low-pass signal and connects, and signal path is that 11-low pass of low pass wiring pin connects
22-common end of contact 13-movable contact spring, 33-clump weight, 34-spring, 42-limit sleeve, 26-high pass substrate wiring pin 27, when quick
When feeling external acceleration overload, touch group compressed spring 42 is moved to high pass wiring end motion, the movable contact spring 33 close to low pass end is first
It is disengaged with low pass contact chip 13, low-pass signal is interrupted, until the movable contact spring 33 and high pass contact chip 23 close to high go side after disconnection
Before contact, high and low messenger is interrupted, and after movable contact spring 33 and the contact of high pass contact chip 23, exports high pass overload signal, signal
Access is：High pass wiring pin 21-high pass contact chip 23-movable contact spring, 33-clump weight, 34-spring, 42-limit sleeve, 26-high pass
22-common end of substrate wiring pin 27 is overloaded when external acceleration and is disappeared, dynamic touch group restore under the action of a spring 42 again to
Original state.
Touch group is moved as a result, and spring 42 forms spring --- quality system, and oscillatory type moves touch group compressed spring 42 and exists
Harmonic moving is done along 42 telescopic direction of spring in inner cavity in guide sleeve 41, if resonance amplitude is less than low pass contact chip 13 and movable contact spring 33
Effective contacting travel (i.e. low pass contact chip 13 be in curve inwardly deformation state), then low pass overload signal reliably exports, if
Resonance amplitude is greater than or equal to effective contacting travel (low pass contact chip 13 is in nature extended state), then low pass overload signal goes out
Existing hit or even interruption.Because general action acceleration is small (low pass acceleration is less than 1g) in practice, the initial precompressed counter-force of spring 42
Small, spring --- quality system resonance point is low, and is in the rigid collision way of contact between dynamic touch group and low pass bushing 14, vibrates humorous
When vibration move touch group because with 14 rigid collision of low pass bushing, rebound be displaced be well over effective contacting travel, cause low pass to be overloaded
There is hit or even interruption in signal, and the setting of absorbing mould group can effectively change this rigid collision way of contact, weaken or even
The resonant energy for eliminating the combination of vibration processes clump weight reaches and guarantees that overload cut-out low pass overload signal reliably exports.
Due to the setting of absorbing mould group, between low pass bushing 14 and dynamic touch group, by absorbing reed 17 and spring 42
Initial precompressed active force reach balance；When vibration processes move touch group and resonance occurs for spring 42, touch group and absorbing are moved
The way of contact of mould group is flexible contact, and spring --- quality system resonant energy is directly absorbed by absorbing reed 17, resonance vibration
Width reduces, it is ensured that clump weight combination is less than contact system reliably effective contacting travel in the displacement of resonance directions, to be managed
The low-pass signal continuity thought.Meanwhile the slot of 16 boss of washer feather key 35 corresponding with guide sleeve 41 has rotation stop effect, prevents from inhaling
Vibration mould group axially rotates the force position for causing absorbing reed 17 to be applied to dynamic touch group and changes, to guarantee acceleration
The stability of overload cut-out low pass acceleration overload value.
Claims (10)
1. a kind of acceleration overload absorbing switching device, including low pass terminals, high pass terminals, guide sleeve (41) and dynamic touch
Group, it is characterised in that：Low pass terminals and high pass terminals are individually fixed in guide sleeve (41) both ends；It is placed in guide sleeve (41)
Dynamic touch group, dynamic touch group can move in guide sleeve (41), conducting in low pass terminals or high pass terminals, move touch group and
Spring (42) is fixed between high pass terminals is connected dynamic touch group in its natural state in low pass terminals；It is connect in low pass
Absorbing mould group is fixed on the end face of the dynamic touch group of line end direction makes the contact between low pass terminals and dynamic touch group be bullet
Property contact.
2. acceleration overload absorbing switching device as described in claim 1, it is characterised in that：The low pass terminals are by low pass
Wiring pin (11) is constituted across low pass substrate (12), and the inner end soldering of low pass wiring pin (11) is fixed with low pass contact chip (13),.
3. acceleration overload absorbing switching device as claimed in claim 2, it is characterised in that：The low pass substrate (12) is circle
Plate-like, low pass wiring pin (11) and low pass contact chip (13) are four and are uniformly distributed along the circumference, four low pass contact chip (13) compositions
Contour contact ring, low pass contact chip (13) inner end have arcuation raised by contour contact ring external position.
4. acceleration overload absorbing switching device as described in claim 1, it is characterised in that：The high pass terminals are by high pass
Wiring pin (21) is constituted across high pass substrate (22), and the soldering of high pass wiring pin (21) inner end is fixed with high pass contact chip (23), high
It connects stitch (21) center to be fixed with common end wiring pin (27), wiring pin (27) circuit connection in common end is in dynamic touch
Group.
5. acceleration overload absorbing switching device as claimed in claim 4, it is characterised in that：The high pass substrate (22) is circle
Plate-like, high pass wiring pin (21) and high pass contact chip (23) are four and are uniformly distributed along the circumference, four high pass contact chip (23) compositions
Contour contact ring, high pass contact chip (23) inner end have arcuation raised by contour contact ring external position.
6. acceleration overload absorbing switching device as described in claim 1, it is characterised in that：The dynamic touch group is cut by two pieces
Face is that U-shaped movable contact spring (33) forms, and the U-shaped turn of bilge of two pieces of movable contact springs (33) is opposite and on screw (32), screw (32)
It covers nut (31) to fix, the lateral surface between two pieces of movable contact springs (33) is fixed with clump weight (34), the U-shaped lateral edge of movable contact spring (33)
It is inclined outwardly；Spring (42) suit is fixed on clump weight (34).
7. acceleration overload absorbing switching device as claimed in claim 6, it is characterised in that：Clump weight (34) side is solid
Surely there are feather key (35), the position that feather key (35) is corresponded on guide sleeve (41) inner wall is provided with slot.
8. acceleration overload absorbing switching device as described in claim 1, it is characterised in that：Low pass substrate (12) inner end
It is fixed on face low pass bushing (14), low pass substrate (12) outer end is set with the fixed lid (15) of fixed low pass；It is low in floor projection
The part that low pass wiring pin (11) are more than low pass substrate (12) inner face is completely covered in logical bushing (14), and low pass contact chip (13) is super
Cross low pass bushing (14)；Low pass bushing (14) inner end fixing gasket (16), be uniformly distributed along the circumference on washer at least two inclined suctions
Vibrating piece (17), washer (16) and absorbing reed (17) constitute absorbing mould group.
9. acceleration overload absorbing switching device as described in claim 1, it is characterised in that：High pass substrate (22) inner end
It is fixed on face high pass bushing (24), high pass substrate (22) outer end is set with the fixed lid (25) of fixed high pass；It is high in floor projection
The part that high pass wiring pin (21) are more than high pass substrate (22) inner face is completely covered in logical bushing (24), and high pass contact chip (23) is super
Cross high pass bushing (24)；It is fixed with limit sleeve (26) on the outside of high pass bushing (24), spring (42) suit is fixed on limit sleeve (26)
On.
10. acceleration overload absorbing switching device as claimed in claim 8, it is characterised in that：Washer (16) the side edge
There is boss-shaped prominent, so that washer (16) rotary spacing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810929589.1A CN108899246A (en) | 2018-08-15 | 2018-08-15 | A kind of acceleration overload absorbing switching device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810929589.1A CN108899246A (en) | 2018-08-15 | 2018-08-15 | A kind of acceleration overload absorbing switching device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108899246A true CN108899246A (en) | 2018-11-27 |
Family
ID=64354681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810929589.1A Pending CN108899246A (en) | 2018-08-15 | 2018-08-15 | A kind of acceleration overload absorbing switching device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108899246A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110739178A (en) * | 2019-09-16 | 2020-01-31 | 北京空间机电研究所 | acceleration switch with single mass block of double springs |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101369499A (en) * | 2007-08-16 | 2009-02-18 | 贵州航天电器股份有限公司 | High-precision overload switch |
| CN201270221Y (en) * | 2008-09-02 | 2009-07-08 | 贵州航天电器股份有限公司 | Acceleration relay overload sensitive mechanism mass block |
| CN101488417A (en) * | 2008-01-18 | 2009-07-22 | 鹏智科技(深圳)有限公司 | Shock switch |
| CN101667507A (en) * | 2008-09-04 | 2010-03-10 | 贵州航天电器股份有限公司 | Acceleration overload switch with high and low pass two-way acceleration signal output |
| CN201622942U (en) * | 2010-03-17 | 2010-11-03 | 江山市电器技术开发有限公司 | Novel static contact device of indoor high-voltage grounding switch |
-
2018
- 2018-08-15 CN CN201810929589.1A patent/CN108899246A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101369499A (en) * | 2007-08-16 | 2009-02-18 | 贵州航天电器股份有限公司 | High-precision overload switch |
| CN101488417A (en) * | 2008-01-18 | 2009-07-22 | 鹏智科技(深圳)有限公司 | Shock switch |
| CN201270221Y (en) * | 2008-09-02 | 2009-07-08 | 贵州航天电器股份有限公司 | Acceleration relay overload sensitive mechanism mass block |
| CN101667507A (en) * | 2008-09-04 | 2010-03-10 | 贵州航天电器股份有限公司 | Acceleration overload switch with high and low pass two-way acceleration signal output |
| CN201622942U (en) * | 2010-03-17 | 2010-11-03 | 江山市电器技术开发有限公司 | Novel static contact device of indoor high-voltage grounding switch |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110739178A (en) * | 2019-09-16 | 2020-01-31 | 北京空间机电研究所 | acceleration switch with single mass block of double springs |
| CN110739178B (en) * | 2019-09-16 | 2022-07-29 | 北京空间机电研究所 | Double-spring single-mass acceleration switch |
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Application publication date: 20181127 |