CN108896238A - A kind of array pressure sensor - Google Patents
A kind of array pressure sensor Download PDFInfo
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- CN108896238A CN108896238A CN201810782502.2A CN201810782502A CN108896238A CN 108896238 A CN108896238 A CN 108896238A CN 201810782502 A CN201810782502 A CN 201810782502A CN 108896238 A CN108896238 A CN 108896238A
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- Prior art keywords
- flexible package
- lid
- pressure sensor
- package lid
- substrates
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L15/00—Devices or apparatus for measuring two or more fluid pressure values simultaneously
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The present invention provides a kind of array pressure sensors, including：Package substrates are configured to plate；Multiple sensing chips, multiple sensing chips include the first sensing chip, the second sensing chip and other sensing chips；Multiple flexible package lids, it is configured to deformable, flexible package lid includes the first flexible package lid, second flexible package lid and other flexible package lids, first flexible package lid lid closes in package substrates, and it is formed by bending first chamber, first sensing chip is arranged in first chamber, second flexible package lid is arranged to adjacent with the first flexible package lid, and second chamber is formed between the first flexible package lid, second sensing chip is arranged in second chamber, other flexible package lids are arranged to adjacent with the second flexible package lid, and other chambers are formed between the second flexible package lid, other sensing chips are arranged in other chambers.Multiple sensing chips can be set in multiple chambers, can so detect ambient pressure more accurately.
Description
Technical field
The present invention relates to sensor device technical field more particularly to a kind of array pressure sensors.
Background technique
In the conventional hydraulic braking of automobile, by the operation of brake pedal so that brake fluid pressure is applied on master cylinder
And then be applied on wheel cylinder, to be braked.When wheel cylinder is applied to the brake force on brake friction disk greater than tire and ground
Stiction when, wheel can skid on road surface, cause brake force decline and the decline of wheel steering power (because of tire and ground
Dynamic friction coefficient be less than confficient of static friction), it is necessary to prevent this slipping phenomenon to ensure optimum braking effect.Meanwhile must also
The steering locking phenomenon that not can control deflecting roller when braking must be prevented, and needs to drive work in emergency turn, braking in a turn etc.
Phenomena such as placement is turned on one's side under condition, steering force is insufficient.It is therefore proposed that a kind of controllable automobile for applying the hydraulic coupling on wheel cylinder is antilock
Dead system and electric stabilizing system prevent the generations of these phenomenons, which consists essentially of multiple solenoid valves, for controlling
The electronic control unit (ECU) of solenoid valve, hydraulic accumulator are with, hydraulic pump and pressure sensor.Pressure sensor for sense with
The relevant master cylinder pressure of pedal force, and the pressure conversion sensed is passed to electronic control unit at electric signal, it is controlled electronically
Unit controls brake operating based on the received electrical signal.
Pressure sensor structure used at present is as shown in Figure 1, pressure sensor is mounted on automobile electronic stabilization system liquid
In the valve block for pressing control unit.Pressure sensor mainly includes electrical signal, protective case, sensor circuit board, support
Skeleton, electronic induction module, the components such as mechanical induction module.Mechanical induction module lower part is sealingly fixed to together with valve block.
Electronic induction module is connected and fixed in the upper end of mechanical induction module.Support frame plays the work of support, fixation and circuit connection
With support frame is lined with several electric conductors.Electrical signal and support frame upper end are fixed and establish circuit connection.It passes
Sensor circuit board establishes circuit connection and fixation by supporting block and support frame.Electronic induction module passes through link block and support
Skeleton establishes circuit connection and fixation, and by the cooperation of the extended structure of the slot structure of itself and support frame to make sense electronics
Module is answered to fix with support frame.Protective case (is generally sealed by end connecting and mechanical induction module mating connection
Welding connecting mode), while passing through the fixed support frame of end support structure.
The working principle of pressure sensor is as follows：When driver's brake pedal, brake fluid from the channel of valve block into
Enter the conduction hole of mechanical induction module and wherein generates certain pressure, the film sensing unit of the upper end of mechanical induction module
It will be deformed caused by pressure in conduction hole on the strain resistor of electronic induction module by reference, so that electronic induction module generates
Corresponding initial electrical signal, which is transmitted to handled in sensor circuit board after again by electric signal export electricity
Son, spring, electric signal receiving terminal are transmitted on the circuit board of electronic control unit, and then electronic control unit is to hydraulic control
Solenoid valve, hydraulic pump in unit issue instruction to control braking process.
Above-mentioned pressure sensor structure, since the support frame during being fixed with whole electronics thereon is directly with electronic induction
Module has a rigid connection, and the coupling force of sensor and spring can be transmitted in electronic induction module to make electronic induction mould
Block is interfered, the pressure signal distortion for causing electronic control unit to receive.Protective case also has a strong effect support frame,
The active force, which can be also transmitted in electronic induction module, leads to distorted signals.Above-mentioned signal interference is especially generated in vehicle driving
Bigger deviation can be generated after vibration.Moreover, when manufacturing pressure sensor, since assembly protective case can pass through support rib
Frame is transmitted to assembly force in electronic induction module, it is necessary to carry out calibration appropriate after the assembly is completed to compensate this " precompressed
It is difficult to increase manufacture for the deviation that power " generates.Meanwhile it is mold injection part, and the copper of liner larger area that support frame is general
Plate material, it is at high cost.
Summary of the invention
In view of the above problems in the prior art, the object of the present invention is to provide a kind of array pressure sensor, packets
It includes：
Package substrates are configured to plate；
Multiple sensing chips, the multiple sensing chip include the first sensing chip, the second sensing chip and other sensings
Chip；
Multiple flexible package lids, be configured to it is deformable, the flexible package lid include the first flexible package lid, second
Flexible package lid and other flexible package lids, the first flexible package lid lid closes in the package substrates, and is formed by bending
First chamber, first sensing chip are arranged in the first chamber, the second flexible package lid be arranged to it is described
First flexible package lid is adjacent, and second chamber is formed between the first flexible package lid, second sensing chip
Be arranged in the second chamber, other flexible package lids be arranged to it is adjacent with the second flexible package lid, and with institute
It states and is formed with other chambers between the second flexible package lid, other sensing chips are arranged in other chambers；
Wherein, other sensing chips include locate first sensing chip and second sensing chip it is multiple its
Its sensing chip, other flexible package lids include more except the first flexible package lid and the second flexible package lid
A other flexible package lids, other chambers are the chamber between other flexible package lids.
Further, the first flexible package lid, the second flexible package lid and other flexible package lids are equal
It is arranged in the package substrates.
Further, the package substrates are elastic substrates.
Further, the part that the first flexible package lid is contacted with the package substrates is provided with first seal；
The part that the second flexible package lid is contacted with the package substrates is provided with second seal；
The part that other flexible package lids are contacted with the package substrates is provided with other sealing elements.
Further, each flexible package lid include erecting bed and with the integrally formed connection of the erecting bed
Portion；
The interconnecting piece is contacted with the package substrates.
Further, the erecting bed is for installing the sensing chip.
Further, it is arranged with an elastic component outside the interconnecting piece, described elastic component one end is fixed on the package substrates
On, the other end is connected with the interconnecting piece, and the elastic component is arranged to make the flexible package lid return when external force is removed.
Further, the elastic component is spring.
Further, each sensing chip includes multiple sensing sites, each sensing site in the multiple sensing chip
It is upper that there is a kind of sensitive material.
Further, it is not identical to be selected as identical, not identical or part for the sensitive material of the multiple sensing chip.
In the present invention, multiple chambers are set between package substrates and multiple flexible package lids, so as in multiple chambers
The indoor multiple sensing chips of setting, can so detect ambient pressure more accurately.And the shape of the flexible package lid
It can be adjusted according to the shape and size of sensing chip, applicability is stronger, so as to apply in a variety of different scenes
And expand the application field of the gas sensor.Further, since the part that flexible package lid is in contact with package substrates
Material be selected as elastic material, it is possible thereby to make the flexible package lid return when external force is removed, guarantee the normal of device
Running, and the service life of array-type sensor can be extended.
According to the following detailed description of specific embodiments of the present invention in conjunction with the accompanying drawings, those skilled in the art will be brighter
The above and other objects, advantages and features of the present invention.
Detailed description of the invention
It, below will be to required in embodiment or description of the prior art in order to illustrate more clearly of technical solution of the present invention
The attached drawing used is briefly described.It should be evident that drawings in the following description are only some embodiments of the invention, it is right
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings
Its attached drawing.
Fig. 1 is the schematic diagram of array pressure sensor according to an embodiment of the invention；
Drawing reference numeral：
1- package substrates, the first sensing chip of 21-, the second sensing chip of 22-, the other sensing chips of 23-, 31- first are soft
Property cap, 32- the second flexible package lid, the other flexible package lids of 33-, 41- first seal, 42- second seal, 43-
Other sealing elements.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with attached drawing to embodiment party of the present invention
Formula is described in further detail.
Fig. 1 shows the schematic diagram of array pressure sensor according to an embodiment of the invention.Such as Fig. 1 institute
Show, a kind of array pressure sensor, including：Package substrates 1, are configured to plate；Multiple sensing chips, the multiple sensing
Chip includes the first sensing chip 21, the second sensing chip 22 and other sensing chips 23；Multiple flexible package lids, are configured to
Deformable, the flexible package lid includes the first flexible package lid 31, the second flexible package lid 32 and other flexible package lids
33, the lid of the first flexible package lid 31 closes in the package substrates 1, and is formed by bending first chamber, first sensing
Chip 21 is arranged in the first chamber, and the second flexible package lid 32 is arranged to and 31 phase of the first flexible package lid
Neighbour, and second chamber is formed between the first flexible package lid, second sensing chip 22 is arranged described second
In chamber, other flexible package lids 33 be arranged to it is adjacent with the second flexible package lid 32, and with it is described second flexible
Other chambers are formed between cap, other sensing chips 23 are arranged in other chambers；Wherein, described other
Sensing chip 23 includes a number of other sensing chips 23 for locating first sensing chip 21 and second sensing chip 22, institute
It includes a number of other except the first flexible package lid 31 and the second flexible package lid 32 for stating other flexible package lids 33
Flexible package lid 33, other chambers are the chamber between other flexible package lids 33.
The first flexible package lid 31, the second flexible package lid 32 and other flexible package lids 33 are respectively provided with
In the package substrates 1.
The package substrates 1 are elastic substrates.The part that the first flexible package lid 31 is contacted with the package substrates 1
It is provided with first seal 41；It is close that the part that the second flexible package lid 32 is contacted with the package substrates 1 is provided with second
Sealing 42；The part that other flexible package lids 33 are contacted with the package substrates 1 is provided with other sealing elements 43.
Each flexible package lid include erecting bed and with the integrally formed interconnecting piece of the erecting bed；The connection
Portion is contacted with the package substrates 1.The erecting bed is for installing the sensing chip.
It is arranged with an elastic component outside the interconnecting piece, described elastic component one end is fixed in the package substrates 1, the other end
It is connected with the interconnecting piece, the elastic component is arranged to make the flexible package lid return when external force is removed.
The elastic component is spring.Each sensing chip includes multiple sensing sites in the multiple sensing chip, each
There is a kind of sensitive material on sensing site.The sensitive material of the multiple sensing chip is selected as identical, not identical or part
It is not identical.
In the present invention, multiple chambers are set between package substrates 1 and multiple flexible package lids, so as in multiple chambers
The indoor multiple sensing chips of setting, can so detect ambient pressure more accurately.And the shape of the flexible package lid
It can be adjusted according to the shape and size of sensing chip, applicability is stronger, so as to apply in a variety of different scenes
And expand the application field of the gas sensor.Further, since the part that flexible package lid is in contact with package substrates 1
Material be selected as elastic material, it is possible thereby to make the flexible package lid return when external force is removed, guarantee the normal of device
Running, and the service life of array-type sensor can be extended.
Above description sufficiently discloses a specific embodiment of the invention.It should be pointed out that being familiar with the field
Range of any change that technical staff does a specific embodiment of the invention all without departing from claims of the present invention.
Correspondingly, the scope of the claims of the invention is also not limited only to previous embodiment.
Claims (10)
1. a kind of array pressure sensor, which is characterized in that including：
Package substrates are configured to plate；
Multiple sensing chips, the multiple sensing chip include the first sensing chip, the second sensing chip and other sensing chips；
Multiple flexible package lids, are configured to deformable, and the flexible package lid includes the first flexible package lid, second flexible
Cap and other flexible package lids, the first flexible package lid lid closes in the package substrates, and is formed by bending first
Chamber, first sensing chip are arranged in the first chamber, and the second flexible package lid is arranged to and described first
Flexible package lid is adjacent, and second chamber is formed between the first flexible package lid, the second sensing chip setting
In the second chamber, other flexible package lids be arranged to it is adjacent with the second flexible package lid, and with described
Other chambers are formed between two flexible package lids, other sensing chips are arranged in other chambers；
Wherein, other sensing chips include a number of other biographies for locating first sensing chip and second sensing chip
Sense chip, other flexible package lids include except the first flexible package lid and the second flexible package lid it is multiple its
Its flexible package lid, other chambers are the chamber between other flexible package lids.
2. array pressure sensor according to claim 1, which is characterized in that the first flexible package lid, described
Second flexible package lid and other flexible package lids are arranged in the package substrates.
3. array pressure sensor according to claim 1, which is characterized in that the package substrates are elastic substrates.
4. array pressure sensor according to claim 2, which is characterized in that the first flexible package lid with it is described
The part of package substrates contact is provided with first seal；
The part that the second flexible package lid is contacted with the package substrates is provided with second seal；
The part that other flexible package lids are contacted with the package substrates is provided with other sealing elements.
5. array pressure sensor according to claim 2, which is characterized in that each flexible package lid includes peace
Fill platform and with the integrally formed interconnecting piece of the erecting bed；
The interconnecting piece is contacted with the package substrates.
6. array pressure sensor according to claim 5, which is characterized in that the erecting bed is for installing the biography
Sense chip.
7. array pressure sensor according to claim 5, which is characterized in that be arranged with an elasticity outside the interconnecting piece
Part, described elastic component one end are fixed in the package substrates, and the other end is connected with the interconnecting piece, and the elastic component is arranged to
Make the flexible package lid return when external force is removed.
8. array pressure sensor according to claim 7, which is characterized in that the elastic component is spring.
9. array pressure sensor according to claim 1, which is characterized in that each biography in the multiple sensing chip
Sense chip includes multiple sensing sites, has a kind of sensitive material on each sensing site.
10. array pressure sensor according to claim 9, which is characterized in that the sensitivity of the multiple sensing chip
It is not identical that material is selected as identical, not identical or part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810782502.2A CN108896238A (en) | 2018-07-17 | 2018-07-17 | A kind of array pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810782502.2A CN108896238A (en) | 2018-07-17 | 2018-07-17 | A kind of array pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108896238A true CN108896238A (en) | 2018-11-27 |
Family
ID=64349858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810782502.2A Withdrawn CN108896238A (en) | 2018-07-17 | 2018-07-17 | A kind of array pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108896238A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113567026A (en) * | 2021-08-09 | 2021-10-29 | Oppo广东移动通信有限公司 | Limb part and intelligent machine device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203479449U (en) * | 2013-09-09 | 2014-03-12 | 任良元 | Structure of pressure sensor |
| CN104089737A (en) * | 2014-06-25 | 2014-10-08 | 西安交通大学 | High-sensitivity laminated type flexoelectric pressure sensor |
| CN107748192A (en) * | 2017-10-12 | 2018-03-02 | 黄晓敏 | A kind of multi-layer graphene gas sensor |
| CN107870225A (en) * | 2017-11-06 | 2018-04-03 | 余帝乾 | A kind of flexible stereo encapsulates gas sensor |
| CN107884444A (en) * | 2017-11-06 | 2018-04-06 | 余帝乾 | A kind of flexible array gas sensor chip |
-
2018
- 2018-07-17 CN CN201810782502.2A patent/CN108896238A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203479449U (en) * | 2013-09-09 | 2014-03-12 | 任良元 | Structure of pressure sensor |
| CN104089737A (en) * | 2014-06-25 | 2014-10-08 | 西安交通大学 | High-sensitivity laminated type flexoelectric pressure sensor |
| CN107748192A (en) * | 2017-10-12 | 2018-03-02 | 黄晓敏 | A kind of multi-layer graphene gas sensor |
| CN107870225A (en) * | 2017-11-06 | 2018-04-03 | 余帝乾 | A kind of flexible stereo encapsulates gas sensor |
| CN107884444A (en) * | 2017-11-06 | 2018-04-06 | 余帝乾 | A kind of flexible array gas sensor chip |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113567026A (en) * | 2021-08-09 | 2021-10-29 | Oppo广东移动通信有限公司 | Limb part and intelligent machine device |
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| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20181127 |
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| WW01 | Invention patent application withdrawn after publication |