CN108893635A - High thermal conductivity isotropism carbonaceous mesophase spherules enhance Cu-base composites preparation method - Google Patents
High thermal conductivity isotropism carbonaceous mesophase spherules enhance Cu-base composites preparation method Download PDFInfo
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- CN108893635A CN108893635A CN201810676578.7A CN201810676578A CN108893635A CN 108893635 A CN108893635 A CN 108893635A CN 201810676578 A CN201810676578 A CN 201810676578A CN 108893635 A CN108893635 A CN 108893635A
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- Prior art keywords
- carbonaceous mesophase
- mesophase spherules
- powder
- base composites
- thermal conductivity
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- 239000002131 composite material Substances 0.000 title claims abstract description 37
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 24
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 21
- 239000010439 graphite Substances 0.000 claims abstract description 21
- 239000000843 powder Substances 0.000 claims abstract description 16
- 238000005245 sintering Methods 0.000 claims abstract description 16
- 229910052802 copper Inorganic materials 0.000 claims abstract description 13
- 239000010949 copper Substances 0.000 claims abstract description 13
- 239000011812 mixed powder Substances 0.000 claims abstract description 5
- 238000009826 distribution Methods 0.000 claims abstract 3
- 239000000463 material Substances 0.000 claims description 14
- 239000000320 mechanical mixture Substances 0.000 claims description 12
- 238000002156 mixing Methods 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 5
- 238000012856 packing Methods 0.000 claims description 5
- 238000004321 preservation Methods 0.000 claims description 5
- 238000010792 warming Methods 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 4
- 238000005303 weighing Methods 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 2
- 238000012545 processing Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000002708 enhancing effect Effects 0.000 abstract description 3
- 239000007769 metal material Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 8
- 239000010410 layer Substances 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 5
- 229910021382 natural graphite Inorganic materials 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000002490 spark plasma sintering Methods 0.000 description 3
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- OUADMZZEIRSDSG-NKFUZKMXSA-N C1N2C(C(C(C)=C(N)C3=O)=O)=C3[C@@H](CO)[C@@]2(OC)[C@@H]2[C@H]1N2 Chemical compound C1N2C(C(C(C)=C(N)C3=O)=O)=C3[C@@H](CO)[C@@]2(OC)[C@@H]2[C@H]1N2 OUADMZZEIRSDSG-NKFUZKMXSA-N 0.000 description 1
- 238000005411 Van der Waals force Methods 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000000445 field-emission scanning electron microscopy Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000009715 pressure infiltration Methods 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 239000002296 pyrolytic carbon Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/05—Mixtures of metal powder with non-metallic powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/105—Sintering only by using electric current other than for infrared radiant energy, laser radiation or plasma ; by ultrasonic bonding
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/0084—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ carbon or graphite as the main non-metallic constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/105—Sintering only by using electric current other than for infrared radiant energy, laser radiation or plasma ; by ultrasonic bonding
- B22F2003/1051—Sintering only by using electric current other than for infrared radiant energy, laser radiation or plasma ; by ultrasonic bonding by electric discharge
Abstract
A kind of high thermal conductivity isotropism carbonaceous mesophase spherules enhancing Cu-base composites preparation method, belongs to metal material field, Cu-base composites are made of fine copper powder, carbonaceous mesophase spherules.Fine copper body of powder fraction is 40%-80%, and carbonaceous mesophase spherules volume fraction is 20%-60%.Production craft step is：First the fine copper powder of corresponding body distribution ratio and carbonaceous mesophase spherules powder are mixed, then mixed-powder is put into togerther graphite jig and carries out discharge plasma sintering, obtain the carbonaceous mesophase spherules-Cu-base composites with high-volume fractional, highly thermally conductive, high-compactness and near-isotropic.Carbonaceous mesophase spherules-Cu-base composites prepared by the present invention, consistency is high, Tissue distribution uniformly, it can be achieved that produce in enormous quantities, production cost is low, degree of being practical is high, there is preferable comprehensive performance, its thermal conductivity near-isotropic, the direction XY can reach 415.61Wm‑1·K‑1, Z-direction can reach 357.27Wm‑1·K‑1.Thermal expansion coefficient is under room temperature in 3.4-6.4 × 10‑6K‑1Between fluctuate, consistency reaches 99.2% or more.
Description
Technical field
The invention belongs to metal material field, in particular to a kind of carbonaceous mesophase spherules-Cu-base composites (Meso-
Carbon Microbead-Copper Matrix Composites, MCMB-CMC) preparation method.
Background technique
Efficient thermal conductive property, theoretical thermally conductive up to 2000Wm can be showed on graphite basal plane orientation-1·K-1.Vertical
In graphite flake layer direction, the Van der Waals force between graphite flake layer is combined, and piece interlayer theory spacing isIt is much larger than
Spacing in graphite flake layer between adjacent carbon atomTherefore the scattering being subject to is being propagated perpendicular to graphite flake layer direction phonon
Effect is big, and thermal conductivity is lower, and theoretical value is only 6Wm-1·K-1。
Natural graphite has high anisotropy, and graphite flake layer direction thermal conductivity is in 50-1500Wm-1·K-1Between.
The size of its in-plane thermal conductivity is mainly determined by the structure of graphite flake layer.The structure phase of pyrolytic graphite and natural graphite
Seemingly, only its crystal grain along the similar graphite monocrystalline of graphite synusia direction high orientation graphite, by pyrolytic carbon at pressure (10MPa)
Lower high-temperature heat treatment (3300 DEG C or more) obtains, and bedding angle thermal conductivity is up to 1600-2000Wm-1·K-1.Natural graphite and
Pyrolytic graphite thermal conductivity all has thermal conductivity high anisotropy.
Copper as engineering material has excellent electric conductivity and high heating conduction, thermal conductivity 400Wm-1·
K-1, thermal expansion coefficient is 17 × 10-6K-1.Therefore, it is answered by double connectivity structures that natural graphite or pyrolytic graphite particle and copper form
Condensation material (NGCMC, Natural Graphite-Copper Matrix Composites) or (PGCMC, Pyrolytic
Graphite-Copper Matrix Composites) there is excellent heating conduction and lesser thermal expansion coefficient, it is high property
It can most promising one of the encapsulating material of new generation of electronics.Currently, NGCMC or PGCMC material is more mature
Preparation method mainly has high temperature and pressure sintering process, gas or mechanical pressure infiltration method and SPS sintering process.These methods can spirit
The type of design matrix alloy composition and reinforcement living, thus have unique advantage in terms of the designability of material property.
But the thermal conductivity of NGCMC or PGCMC composite material has the anisotropy of height, the direction XY and Z-direction differ greatly.
In actual application by numerous obstacles.
Summary of the invention
The invention aims to solve the thermal conductivity of traditional NGCMC or PGCMC composite material with high anisotropy
Problem provides a kind of high thermal conductivity isotropism carbonaceous mesophase spherules enhancing Cu-base composites and preparation method thereof, can use compared with
Low production cost directly prepares the highly thermally conductive MCMB-CMC composite material of near-isotropic.
A kind of high thermal conductivity isotropism carbonaceous mesophase spherules enhancing Cu-base composites preparation method, composite material is by fine copper
Powder, carbonaceous mesophase spherules composition, wherein fine copper body of powder fraction is 40%-80%, and fine copper powder average particle size is 15-95
μm.Carbonaceous mesophase spherules volume fraction is 20%-60%, and carbonaceous mesophase spherules average grain diameter is 1-100 μm；
The present invention mixes carbonaceous mesophase spherules and fine copper powder using mechanical mixing, and the mechanical mixture time will foot
It is enough long to guarantee being sufficiently mixed for carbonaceous mesophase spherules and fine copper powder, then mixed-powder is packed into Φ 10mm graphite together
Mold carries out discharge plasma sintering (Spark Plasma Sintering, abbreviation SPS), obtains with high-volume fractional, height
Carbonaceous mesophase spherules-Cu-base composites of thermal conductivity, high-compactness and near-isotropic.Specific process step is：
1. weighing：By the proportion of corresponding requirements, carbonaceous mesophase spherules and fine copper powder are weighed；
2. mixing：The powder of weighing is subjected to mechanical mixture, mixing powder machine revolving speed is 60rpm, mixed powder machine revolving speed be not easy it is excessively high,
Mixing time is 6-8h；
3. prepared by composite material：Powder packing Jing Guo mechanical mixture is entered into Φ 10mm graphite jig and carries out plasma discharging
Sintering, sintering pressure 40MPa are warming up to 800-950 DEG C of heat preservation 5-10 minutes, with furnace cooling by water to room temperature to get in
Between phase carbosphere-Cu-base composites.
The present invention enhances copper-based, preparation thermal conductivity near-isotropic using the isotropic carbonaceous mesophase spherules of high thermal conductivity
Composite material.The composite material can preferably meet the use of electronic component and integrated circuit board package and heat sink material
It is required that.
MCMB-CMC composite material prepared by the present invention, compared with existing NGCMC and PGCMC encapsulating material have with
Under advantage：
1. carbonaceous mesophase spherules-carbon/carbon-copper composite material isotropism thermal conductivity excellent in combination with carbonaceous mesophase spherules
Can, the series of advantages of the high thermal conductivity of extremely low hot expansibility and copper, electric conductivity and plasticity, in Electronic Packaging and
There are huge development and application potentiality in heat sink material field.
2. preparing high-compactness MCMB-CMC composite material using discharge plasma sintering, it is approximate each that thermal conductivity may be implemented
To carbonaceous mesophase spherules-Cu-base composites of the same sex, while MCMB-CMC composite material solves diamond reinforced Cu-matrix and answers
The problem of condensation material (DCMC) material subsequent mechanical processing difficulties, reduces production cost.
In conclusion present invention MCMB-CMC composite material produced has near-isotropic high heat conductance, low-heat
The preparation method of the excellent properties of the coefficient of expansion, the composite material is simple and reliable, and thermal conductivity isotropism degree is preferable.
Detailed description of the invention
Fig. 1 is discharge plasma sintering process schematic of the invention；
Fig. 2 is the FESEM photo of carbonaceous mesophase spherules powder in example；
Specific embodiment
Embodiment 1：Carbonaceous mesophase spherules-Cu-base composites are prepared at 800 DEG C
By average grain diameter be 50 μm carbonaceous mesophase spherules and average grain diameter be 48 μm copper powder according to setting volume ratio
Rate carries out mechanical mixture, mixes 6 hours on batch mixer.
Powder packing Jing Guo mechanical mixture is entered into Φ 10mm graphite jig and carries out discharge plasma sintering, sintering pressure is
40MPa is warming up to 800 DEG C of heat preservations 5-10 minutes, with furnace cooling by water to room temperature to get copper-based compound to carbonaceous mesophase spherules-
Material.
Embodiment 2：Carbonaceous mesophase spherules-Cu-base composites are prepared at 850 DEG C
By average grain diameter be 50 μm carbonaceous mesophase spherules and average grain diameter be 48 μm fine copper powder according to setting body
Product mixes 6 hours on batch mixer than carrying out mechanical mixture.
Powder packing Jing Guo mechanical mixture is entered into Φ 10mm graphite jig and carries out discharge plasma sintering, sintering pressure is
40MPa is warming up to 850 DEG C of heat preservations 5-10 minutes, with furnace cooling by water to room temperature to get copper-based compound to carbonaceous mesophase spherules-
Material.
Embodiment 3：Carbonaceous mesophase spherules-Cu-base composites are prepared at 900 DEG C
By average grain diameter be 50 μm carbonaceous mesophase spherules and average grain diameter be 48 μm fine copper powder according to setting body
Product mixes 6 hours on batch mixer than carrying out mechanical mixture.
Powder packing Jing Guo mechanical mixture is entered into Φ 10mm graphite jig and carries out discharge plasma sintering, sintering pressure is
40MPa is warming up to 900 DEG C of heat preservations 5-10 minutes, with furnace cooling by water to room temperature to get copper-based compound to carbonaceous mesophase spherules-
Material.
It is used herein that a specific example illustrates the principle and implementation of the invention, it is described above be in order to
It facilitates the understanding of the method and its core concept of the invention.It should be pointed out that for those skilled in the art,
Without departing from the invention herein, can be with several improvements and modifications are made to the present invention, these improvement and modification also fall into this
In invention scope of protection of the claims.
Claims (2)
1. a kind of high thermal conductivity isotropism carbonaceous mesophase spherules enhance Cu-base composites preparation method, it is characterized in that composite material
It is made of fine copper powder, carbonaceous mesophase spherules, wherein fine copper body of powder fraction is 40%-80%, and partial size is 15-95 μm；In
Between phase carbosphere volume fraction be 20%-60%, carbonaceous mesophase spherules powder diameter be 1-100 μm；
Preparation process mixes carbonaceous mesophase spherules and fine copper powder using mechanical mixing, and the mechanical mixture time is enough
It is long to guarantee being sufficiently mixed for carbonaceous mesophase spherules and fine copper powder, then mixed-powder is packed into graphite jig progress together
Discharge plasma sintering obtains carbonaceous mesophase spherules-Cu-base composites of thermal conductivity near-isotropic, and prepares compound
Material density is high, Tissue distribution is uniform.
2. a kind of high thermal conductivity isotropism carbonaceous mesophase spherules enhance Cu-base composites preparation method as described in claim 1,
It is characterized in that, processing step is：
1) is weighed：By the proportion of corresponding requirements, carbonaceous mesophase spherules powder and fine copper powder are weighed；
2) is mixed：The powder of weighing is subjected to mechanical mixture, mixing powder machine revolving speed is 60rpm, and revolving speed was not easy during mixed powder
Height, mixing time 6-8h；
3) prepared by composite material：Powder packing Jing Guo mechanical mixture is entered into Φ 10mm graphite jig and carries out plasma discharging burning
Knot, sintering pressure 40MPa are warming up to 800-950 DEG C of heat preservation 5-10 minutes, arrive centre with furnace cooling by water to room temperature
Phase carbosphere-Cu-base composites.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810676578.7A CN108893635A (en) | 2018-06-27 | 2018-06-27 | High thermal conductivity isotropism carbonaceous mesophase spherules enhance Cu-base composites preparation method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810676578.7A CN108893635A (en) | 2018-06-27 | 2018-06-27 | High thermal conductivity isotropism carbonaceous mesophase spherules enhance Cu-base composites preparation method |
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| Publication Number | Publication Date |
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| CN108893635A true CN108893635A (en) | 2018-11-27 |
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| CN201810676578.7A Pending CN108893635A (en) | 2018-06-27 | 2018-06-27 | High thermal conductivity isotropism carbonaceous mesophase spherules enhance Cu-base composites preparation method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113770362A (en) * | 2021-08-25 | 2021-12-10 | 北京科技大学 | Preparation method of oriented carbon nanotube-metal matrix composite heat conducting disc |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102586704A (en) * | 2012-03-23 | 2012-07-18 | 北京科技大学 | High thermal conductivity graphite whisker/copper composite and preparation method thereof |
| CN104647827A (en) * | 2015-03-11 | 2015-05-27 | 上海工程技术大学 | Copper alloy-steel bimetallic composite material and preparation method and application thereof |
-
2018
- 2018-06-27 CN CN201810676578.7A patent/CN108893635A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102586704A (en) * | 2012-03-23 | 2012-07-18 | 北京科技大学 | High thermal conductivity graphite whisker/copper composite and preparation method thereof |
| CN104647827A (en) * | 2015-03-11 | 2015-05-27 | 上海工程技术大学 | Copper alloy-steel bimetallic composite material and preparation method and application thereof |
Non-Patent Citations (3)
| Title |
|---|
| 全小盾等: "《煤化学与煤分析》", 30 April 2012, 中国质检出版社 * |
| 陈盛: "《化学素养教程》", 28 February 2006, 厦门大学出版社 * |
| 黄启忠: "《高性能炭/炭复合材料的制备、结构与应用》", 31 December 2010, 中南大学出版社 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113770362A (en) * | 2021-08-25 | 2021-12-10 | 北京科技大学 | Preparation method of oriented carbon nanotube-metal matrix composite heat conducting disc |
| CN113770362B (en) * | 2021-08-25 | 2022-08-12 | 北京科技大学 | Preparation method of oriented carbon nanotube-metal matrix composite heat conducting disc |
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Application publication date: 20181127 |