CN108891365B - Intelligent cabin system for automobile and automobile using same - Google Patents

Abstract

The invention provides an intelligent cabin system for an automobile, which comprises a vehicle-mounted information entertainment system, a digital virtual instrument system, a left rear seat entertainment system, a right rear seat entertainment system, a vehicle-mounted navigator system and a high-heat-dissipation SOC chip, wherein the intelligent cabin system is connected with the five subsystems through the high-heat-dissipation SOC chip. The SOC chip has a particularly good heat dissipation effect due to the fact that the composite material is used in the packaging.

Description

Intelligent cabin system for automobile and automobile using same

Technical Field

The invention belongs to the field of automobiles, particularly belongs to the technical field of automobile electronics, and relates to an intelligent cabin system for an automobile and the automobile using the system.

Background

The vehicle-mounted entertainment system supports various audio and video inputs, such as connection of wired devices such as a CD/DVD, a USB/SD card and an iPod player, connection of a wireless network such as Bluetooth/WiFi, a GPS navigation module, front/rear camera video input, mobile digital television receiving and the like. The user's requirement for the system sound effect processing is also richer, and even the effect of home theater is to be achieved. Meanwhile, with the rapid development of automotive electronic technology, the vehicle-mounted entertainment system is also continuously upgraded, and with the increasing and enhancing of functions, the vehicle-mounted electronic system becomes more and more complex. These sophisticated in-vehicle entertainment media systems basically rely on SOC chips.

With the rapid development of integrated circuit technology towards submicron or nanometer scale, how to reduce the power consumption and improve the heat dissipation of the integrated circuit is a very important issue. Power consumption and heat dissipation problems limit further improvements in chip performance and increase the cost of integrated circuits in order to reduce the ever increasing power consumption of chips due to the rapid increase in integration and performance. Low power consumption can save packaging costs and extend battery life of mobile portable devices. Therefore, research and application of low power consumption and high heat dissipation design techniques are important directions for chip design in the future.

Many current SOC chips have power consumption of tens of watts or even hundreds of watts under the conditions of more than ten million gates of integration level and gigahertz clock frequency, and huge power consumption increases the temperature of the chips, thereby bringing problems to the reliability of the chips. With the bottleneck effect of power consumption problem in the system design of deep submicron and nanometer process condition appearing increasingly, the low power consumption design is the main challenge facing the design of the SOC chip.

CN106814666A (prior application of the present inventor) discloses an intelligent cockpit system with one set and multiple screens, which includes a vehicle-mounted infotainment system, a digitized virtual instrument panel, a left rear seat infotainment system, a right rear seat infotainment system, a vehicle-mounted navigator, an SOC chip and an MCU chip, and is characterized in that: the intelligent cabin system is connected with the five subsystems through an SOC chip, receives information sent by the subsystems and controls the subsystems, and therefore the five subsystems are integrated into a set of unified intelligent cabin system. The entire contents of this patent document are incorporated herein by reference.

CN107933458A discloses a vehicle multimedia control system, which comprises: the system comprises an original vehicle multimedia device, an upgrading multimedia device and an original vehicle operating device, wherein the original vehicle operating device is connected with the upgrading multimedia device, and the upgrading multimedia device is connected with the original vehicle multimedia device; the original vehicle operating device is used for receiving a current operating instruction input by a user and sending the current operating instruction to the multimedia upgrading device; the upgrading multimedia device is used for judging the type of the current operation instruction, sending the current operation instruction to the original vehicle multimedia device when the current operation type belongs to a preset operation type, and responding to the current operation instruction when the current operation instruction does not belong to the preset operation type; and the original vehicle multimedia device is used for receiving the current operation instruction sent by the upgrading multimedia device and responding to the current operation instruction.

CN104483687A discloses an automobile multimedia device, it includes operation module and operation module, and operation module includes host system, serial units, the control unit, DC power supply, external antenna and wireless communication module, and the control unit connects serial units, DC power supply, external antenna and wireless communication module respectively, and host system connects the serial units, wireless communication module include antenna element, receiving element, data interface and computer, antenna element connects the receiving element, and the receiving element connects data interface, and data interface connects the computer.

CN103287348A discloses an automobile multimedia device, which includes a display unit, a control unit, a detection unit and a signal unit, wherein the display unit is connected to the control unit, the detection unit is connected to the detection unit, the signal unit is connected to the display unit, the display unit is used for multimedia image display and touch control, the control unit is used for turning off or turning on the display unit according to the result detected by the detection unit, and the signal unit is used for sending a corresponding signal to an external multimedia computer according to the result of touch control by the display unit.

CN207489012U discloses an SOC chip, wherein the SOC chip comprises: the non-connection module coprocessor is electrically connected with the non-connection module coprocessor and comprises a primary awakening module and a clock data recovery module; the primary wake-up module is electrically connected with the non-connection module coprocessor and used for detecting the field intensity of a radio frequency field where the SOC chip is located, and when the field intensity is detected to be larger than a preset value, a first wake-up instruction is sent to the non-connection module coprocessor; the non-connection module coprocessor is electrically connected with the clock data recovery module; the clock data recovery module is used for entering a working state according to the first wake-up instruction, extracting a clock signal of an input radio frequency signal and sending a wake-up indication signal to the non-connection module coprocessor according to the clock signal; the non-connected module coprocessor is also used for determining whether to wake up the SOC chip according to the wake-up indication signal.

CN107391232A discloses a system-level chip SOC and SOC system, which belongs to the technical field of data encryption processing, the SOC includes: one or more cores; an internal secure memory located inside the SOC, the internal secure memory being initialized through an internal secure memory interface and storing data from a processor inside the internal secure memory.

CN202110536U discloses an SOC chip supporting multiple display screens, which includes a microprocessor controller module and an electronic book display screen control module, and is characterized in that the electronic book display screen control module includes at least two electronic book display screen controllers for controlling EPD panels of electronic book display screens in different modes.

KR2013-0027658A discloses a semiconductor device comprising a System On Chip (SOC) and at least one wide input/output memory device, the SOC includes a plurality of SOC bump groups respectively providing input/output channels independent of each other, the at least one wide input/output memory device is stacked on the system-on-chip to transmit/receive data to/from the system-on-chip through the SOC bump groups, the SOC bump groups are arranged and the at least one wide input/output memory device is configured, such that one of the wide input/output memory devices can be mounted on the SOC to be connected to all SOC bump groups, or so that two wide input/output memory devices, each connected to half of the SOC bump groups, can be mounted on the SOC.

KR2015-0138892a discloses a method for controlling a battery state of charge (SOC) of a hybrid vehicle, comprising the steps of: determining, by a controller, a driving load of the vehicle based on a driving pattern for each speed of the vehicle and an inclination of the vehicle; determining, by the controller, a calibration value based on the drive load and a main battery SOC state; and adjusting, by the controller, an auxiliary battery SOC state according to two driving load modes based on the calibration value, the two driving load modes including a high load mode and a low load mode.

JP2015-032487a discloses an SOC display device for a hybrid vehicle that can intuitively grasp a current SOC and a change in a running mode according to a change in the SOC. An SOC display device of a hybrid vehicle having an EV travel mode and an HV travel mode has a display device that displays a movement flag that moves in accordance with an increase or decrease in SOC and a fixed flag that is disposed along a movement range of the movement flag.

"SoC chip design method and standardization", chapter student et al, "computer research and development", 2002, 39(1):1-8, point out with the rapid development of integrated circuit technology, the integrated circuit has entered the system on chip (SoC) design era, the integration level of SoC chip is higher and higher, the integration level and operating frequency on the single-chip are higher and higher, the time requirement of putting into the market is shorter and shorter, in order to realize such SoC chip, the designer is more and more dependent on the reuse of IP module, for this reason, the standardization of SoC IP module and on-chip bus structure has been introduced, the system level description language based on C/C + + extension class library and the SoC design method based on platform have been discussed.

In the prior art, although it is recognized that an increase in power consumption density causes a chip temperature to rise, thereby affecting the reliability of a circuit. However, basically, the power consumption of the SOC chip is reduced only from the structural design of the chip. In fact, the structural design of the chip is limited by many factors, and it is difficult to overcome the power consumption and heat generated by the rapid increase of the chip integration level from the start of the structural design of the chip (e.g., optimization of logic mechanisms), and a certain chip performance is often sacrificed to save power consumption. The prior art lacks comprehensive means to address this problem.

There is a need in the art for a method of effectively reducing power consumption of an SOC chip, improving heat dissipation performance of the SOC chip without reducing performance thereof, and for an intelligent cabin system for an automobile using the SOC chip.

Disclosure of Invention

In order to solve the problems of power consumption and heat dissipation caused by high integration of the SOC chip, the inventor of the present invention, after intensive research and a great number of experiments, organically combines chip structure design and packaging technology (including selection and use of packaging materials) through joint research and development with many parties in colleges and universities and scientific research institutes based on the prior patent application, and reduces device failure rate through good heat dissipation, thereby reducing energy consumption of the SOC chip and further effectively solving the above problems.

In one aspect of the present invention, there is provided a smart cockpit system for an automobile, the system comprising: the system comprises a vehicle-mounted information entertainment system (namely a subsystem), a digital virtual instrument system (namely the subsystem), a left rear seat entertainment system (namely the subsystem), a right rear seat entertainment system (namely the subsystem), a vehicle-mounted navigator system (namely the subsystem) and a high-heat-dissipation SOC chip (namely a chip subsystem); the intelligent cabin system is connected with the five subsystems through a high-heat-dissipation SOC chip, receives information sent by the subsystems and controls the subsystems, so that the five subsystems are integrated into a set of unified intelligent cabin system; the intelligent cabin system respectively controls different display screens and/or digital instruments through different virtual machines, so that different display devices can simultaneously display different contents; and, optionally, the high thermal dissipation SOC chip includes a digital die and a Flash die packaged together in a stacked manner.

Preferably, the high heat dissipation SOC chip is packaged using a heat dissipation packaging material. The high-heat-dissipation SOC chip packaged by using the heat-dissipation packaging material instead of traditional plastics can dissipate heat in time, so that the accumulation of temperature and the rise of temperature are reduced.

It is known in the art that as power density increases, chip temperature will increase, thereby affecting circuit reliability. The increased temperature of the chip also causes hot carriers, electromigration, and other problems, and also causes electrical circuits to be short-circuited or open-circuited. Generally, if the temperature of a chip rises by 10 degrees, the reliability of the device is reduced by half. Excessive power consumption has a great influence on the reliability of the system, and excessive power consumption causes the temperature of the system to rise, and the failure rate of the system to rise due to the temperature rise. Research shows that when the temperature is higher than 85 ℃, the failure rate of the system can be increased by 1 time when the temperature of the system is increased by 10 ℃. Integrated circuits consume a large amount of energy, most of which will become heat to be dissipated, so in order to ensure the normal operating temperature of the chip, effective heat dissipation technology must be adopted. This requires significant cost to solve the chip cooling and packaging problems to avoid chip heating.

It has been reported that the package is changed from plastic to ceramic, however, since the package-specific ceramic itself is expensive, and more importantly, the rigidity of the ceramic brings great difficulty to the packaging process, which will be greater in the highly integrated SOC chip, resulting in an increase of more than 4 times in the price of the package. Another solution adopted at present is to add a heat dissipation fan to dissipate heat when the power consumption of the chip is higher than 50W. However, the use of the heat dissipation fan has very large limitations in the vehicle cabin system, and firstly, the heat dissipation fan is limited in space, and in addition, the vehicle electric control system itself is a high-heat environment, so that heat is difficult to dissipate.

Therefore, the invention provides the high-heat-dissipation packaging material and a preparation method thereof. Preferably, the heat dissipation packaging material is an organic-inorganic composite material. More preferably, the organic-inorganic composite material is a composite of beryllium oxide ceramic powder and poly (bisphenol a-co-epichlorohydrin).

Preferably, the weight ratio of beryllium oxide ceramic powder to poly (bisphenol a-co-epichlorohydrin) in the composite is (1:10) - (1:1), preferably (1:10) - (1: 5).

Preferably, the beryllium oxide ceramic powder has an average particle size of 5nm to 80nm, more preferably 10 to 50 nm.

Preferably, the particles of the beryllium oxide ceramic powder are uniformly embedded in the polymer network of poly (bisphenol a-co-epichlorohydrin).

Preferably, the poly (bisphenol A-co-epichlorohydrin) has a weight average molecular weight of 35,000-50,000, preferably 40,000-45,000.

Preferably, the poly (bisphenol a-co-epichlorohydrin) is glycidol terminated.

In a preferred embodiment, the complex is prepared by the following method: dissolving poly (bisphenol A-co-epichlorohydrin) in a cosolvent of n-butanol and toluene (preferably in a weight ratio of 1:1), fully stirring to obtain a polymer solution, adding beryllium oxide ceramic powder (or adding a colloidal solution of the beryllium oxide ceramic powder in the cosolvent of n-butanol and toluene) in proportion, fully stirring at room temperature until the polymer solution and the beryllium oxide ceramic powder are uniformly mixed, and evaporating to remove the solvent to obtain the composite of the beryllium oxide ceramic powder and the poly (bisphenol A-co-epichlorohydrin).

More preferably, the particle surface of the beryllium oxide ceramic powder is modified with propionic acid, that is, the beryllium oxide ceramic powder is modified with propionic acid on the particle surface.

The modification is preferably carried out by the following method: adding propionic acid (preferably in excess) to the beryllium oxide ceramic powder, stirring at room temperature for 12-24 hours, then collecting the formed precipitate by centrifugation to obtain a wet filter cake, washing with ethyl acetate to remove excess propionic acid, adding the propionic acid-modified wet filter cake of the beryllium oxide ceramic powder which is not dried to a cosolvent of n-butanol and toluene in a weight ratio of 1:1, carrying out ultrasonic treatment on the mixture to completely disperse the beryllium oxide ceramic powder into the cosolvent of n-butanol and toluene, and then evaporating to remove the cosolvent to obtain propionic acid-modified beryllium oxide ceramic powder; alternatively, without removal of the co-solvent, a colloidal solution of beryllium oxide ceramic powder can be obtained, which can be used directly to prepare composites of beryllium oxide ceramic powder with poly (bisphenol a-co-epichlorohydrin).

The inventors of the present invention have found that the amount of beryllium oxide ceramic powder and poly (bisphenol a-co-epichlorohydrin) is preferably in the above range to obtain a suitable thermal conductivity and packaging effect. Research shows that as the proportion of the beryllium oxide ceramic powder is increased, the average distance between particles of the beryllium oxide ceramic powder is reduced, the heat transfer resistance is reduced, the thermal conductivity is obviously improved, however, the plasticity and the processability of the packaging material are obviously reduced, the application range of the packaging material is severely limited, the packaging material is difficult to use in the packaging of the SOC chip structure of the invention, and the process cost is increased. And when the proportion of the beryllium oxide ceramic powder is reduced, the beryllium oxide ceramic powder cannot play an effective heat conduction role. Tests show that for the organic-inorganic composite material used as the heat dissipation packaging material, when the content of the beryllium oxide ceramic powder is 20%, the thermal conductivity of the packaging material can reach 0.979W/(m.K), which is about 570% higher than that of an organic silicon encapsulating material without the beryllium oxide ceramic powder. The synergistic combination of the organic-inorganic materials of the present invention significantly improves the thermal conductivity of the encapsulating material with little influence on the workability, and the present invention combines a good balance of thermal conductivity and workability, which was not expected previously.

It has also been found that when the beryllium oxide ceramic powder modified by propionic acid is used, better effects can be obtained than the unmodified beryllium oxide ceramic powder, for example, the thermal conductivity can be improved by more than 60%. As shown in fig. 2, when the beryllium oxide ceramic powder is modified with propionic acid, the hydroxyl groups on the surface form hydrogen bonds with the hydroxyl groups of poly (bisphenol a-co-epichlorohydrin), so that the bonding property of the beryllium oxide ceramic powder with poly (bisphenol a-co-epichlorohydrin) is significantly improved, the increase of the bonding force improves the composite effect, the dispersion of the beryllium oxide ceramic powder particles is facilitated, and the segregation between the beryllium oxide ceramic powder particles and the poly (bisphenol a-co-epichlorohydrin) can be prevented, so that the heat conduction effect is significantly improved.

Preferably, the SOC chip of the present invention includes a processor arm module (e.g., arm7 module), a JTAG synchronization module, an SRAM module, an EMI module, a timer module timer, a universal serial port controller UART, a dedicated serial port controller subart, an interrupt controller module, a power consumption management module, a data receiving module, and a Flash module. The system comprises an arm module, a JTAG synchronization module, an SRAM module, an EMI module, a timer module, a universal serial port controller (UART), a special serial port controller (SUART), an interrupt controller module, a power consumption management module and a data receiving module, wherein the arm module, the JTAG synchronization module, the SRAM module, the EMI module, the timer module, the UART, the SUART, the interrupt controller module, the power consumption management module and the data receiving module can be integrated to form a digital bare chip (also can be considered to be integrated on the digital bare chip), and the Flash.

In the intelligent cockpit system for the automobile of the present invention, preferably, the SOC chip with high heat dissipation includes 1 digital bare chip and 2 Flash bare chips, and the 2 Flash bare chips are respectively disposed on two sides of the digital bare chip.

Preferably, the SOC chip includes chip input and output pins (i.e., IO pads) and power/ground pins (i.e., P/G pads), where one P/G Pad is inserted every 1-2 IO pads.

As known in the art, the power consumption distribution of a chip is mainly influenced by the IO Pad arrangement, the number of P/G pads and the setting position. When the IO Pad arrangement is determined, a logic unit related to an IO signal is generally placed near the IO Pad in consideration of optimizing timing characteristics. If the IO Pad is continuously placed and no P/G Pad exists nearby, the local current requirement is too large, so that the power supply of the area is insufficient, further the function failure is caused, and higher power consumption is caused. In order to ensure good power supply, the existing technology generally inserts one P/G Pad every 3-5 IO pads. However, the inventor finds that the setting density of the P/G Pad cannot meet the power supply requirement effectively with the increase of the SOC integration degree, and although it is thought that the higher density P/G Pad setting is adopted, the excessive setting density leads to the remarkable increase of the heat generation amount, the existing packaging material cannot meet the high density setting, and therefore, one P/G Pad is generally inserted every 3-5 IO pads. According to the invention, the packaging material with the high heat conduction effect is adopted to replace the traditional plastic such as a silica gel packaging material, so that the higher setting density of the P/G Pad is allowed to be adopted, and the requirement of high integration of the SOC chip can be met.

Preferably, the SOC chip further comprises a plurality of IP hardmac (or IP blocks), and the IP hardmac is disposed around the chip.

Preferably, the SOC chip further includes a power management module and a gated clock module.

Clock gating techniques are particularly critical for power reduction. With the rapid development of deep submicron integrated circuits and system SOC chips, the scale of single chip circuits is increasing, making controlling chip power consumption one of the major challenges in the art. The power management module is also particularly significant for power reduction, which usually needs to be combined with a gated clock module to effectively reduce power consumption. Therefore, the invention adopts the following setting modes of the power management module and the gated clock module: the dynamic power consumption control of the chip is realized by the power management module, the power management module manages the switches of the gated clock modules of other modules of each SOC chip, and the power consumption is reduced by closing the clock input of the currently unused module.

For example, in the SOC chip of the present invention, there may be 8 modules, such as 3 universal serial controllers UART, 3 dedicated serial controllers subart, timer module timer, and data receiving module, which are controlled to be turned off by the power management module via the gated clock module, and these several modules are in a weak coupling relationship, and when one module works, other modules may be turned off, for example, when the data receiving module works, other modules may be in an off state.

More preferably, to dynamically manage power consumption, 8 gated clocks (which may be designed in accordance with conventional assembly logic) are designed before the clock of 8 modules. By turning on the gated clock, the operation of some modules is realized and the rest modules are turned off, so that the power consumption is dynamically managed and reduced.

Preferably, in the intelligent cockpit system for an automobile of the present invention, the intelligent cockpit system employs a virtualization technology to virtualize hardware resources of an SOC chip, abstract physical resources into a virtual resource pool, then segment the virtual resources, and create a plurality of virtual machines on the virtual resource pool according to user requirements, where each virtual machine runs a different operating system, and each virtual machine is responsible for controlling one subsystem, so as to implement a control function for five different subsystems based on the same hardware platform.

Preferably, the intelligent cabin system further comprises an MCU chip connected with various vehicle-mounted buses and information transfer components through the MCU chip to complete receiving, sending and preprocessing of various communication signals, serving as a communication front-end machine of the SOC chip to reduce the load of the SOC chip, and the SOC chip supports CPU and GPU hardware virtualization acceleration to enhance the computing power of each virtual machine.

Preferably, the intelligent cabin system is further provided with a central control module, the central control module is connected with the touch display screen, the intelligent cabin system is provided with a wireless interconnection control module, the wireless interconnection control module is used for connecting the vehicle-mounted terminal and the intelligent equipment, a display interface of the intelligent equipment is shared to the vehicle-mounted terminal, and control over the intelligent equipment is achieved.

Preferably, the intelligent cabin system is provided with a wireless charging module, and a power supply is provided for the intelligent cabin system in a wireless transmission mode.

Preferably, the wireless charging module comprises a rechargeable battery submodule and an electronic control submodule, and the rechargeable battery submodule is electrically connected with the intelligent cabin system to supply power to the intelligent cabin system. More preferably, the electronic control sub-module has a first antenna coupled to a second antenna of the vehicle power system (e.g., vehicle motor) such that the electronic control sub-module uses the wireless charging signal to charge the rechargeable battery sub-module. More preferably, the electronic control sub-module may control the time of coupling and the degree of coupling.

Preferably, the first antenna and the second antenna each include a ferrite pot core preform and a solenoid disposed around a mandrel of the ferrite pot core preform.

During operation of the wireless charging module 100, the SOC chip 106 periodically monitors the state of charge of the rechargeable battery sub-module 108. The SOC chip 106 periodically transmits the state of charge on the rechargeable battery sub-module 108 to the electronic control sub-module 102 via the bi-directional data communication link 112. The electronic control sub-module 102 receives periodic updates from the SOC chip 106 regarding the state of charge on the rechargeable battery sub-module 108 via the bi-directional data communication link 112. The electronic control module 102 identifies a state of charge on the rechargeable battery submodule 108 and compares a value of the charge on the rechargeable battery submodule 108 to a threshold value. In one example approach, the threshold is 80% of the charge on a fully charged battery. If the value of the charge on the rechargeable battery submodule 108 has dropped below a threshold, the electronic control submodule 102 determines that the battery needs to be charged. If the battery requires charging, the electronic control sub-module 102 wirelessly transmits charging information to the SOC chip 106 via the wireless charging link 114 and simultaneously opens the coupling to enable charging. The rechargeable battery sub-module 108 may power the cabin system 110. Thus, this example may enable discontinuous charging, where the charging signal is not always transmitted wirelessly, but rather is transmitted discontinuously based on the state of charge of the rechargeable battery sub-module 108.

The wireless charging module overcomes the problem of battery overcharge caused by a wired charging system, and can bring higher freedom degree to the design of a cabin system. In addition, the charging state is a discontinuous transmission mode, so that electric energy can be saved, and the waste of limited electric energy in the automobile can be effectively reduced. In addition, the rechargeable battery submodule is arranged in the wireless charging module, so that the stability of a power supply system of the cabin can be effectively guaranteed. If the direct connection is made to the power supply system of the automobile, the automobile is not sufficiently powered during the peak of power utilization, and the voltage of the power supply system of the automobile is usually unstable, which may cause performance fluctuation or damage to a cabin system with rich functions and therefore high power consumption. Furthermore, the load, in particular the peak load, of the battery of the vehicle power supply system can be reduced.

In addition, the wireless charging module realizes intelligent intercommunication and control with the SOC chip, and can improve the good complementation and adaptability of the power supply performance and the SOC chip performance.

In another aspect of the invention, an automobile is provided, which comprises the intelligent cabin system for the automobile. More preferably, the vehicle is an electric vehicle.

For ease of understanding, the terms of the present invention are explained as follows: HUD: head Up displays (Head Up displays) are currently a popular flight aid used in aircraft. By heads-up is meant that the pilot is able to see the important information he needs without having to lower his head. Head-up displays were first presented on military aircraft to reduce the frequency with which pilots need to look down at the instruments, avoiding interruptions in attention and loss of Awareness of the state (status Awareness). Because the convenience of HUD and can improve flight safety, the installation is also pursued in many times to the civil aviation aircraft. At present, a head-up display is also commonly adopted on an automobile so as to enable an automobile driver to know important driving information without looking at an instrument with a head down.

An ECU: the number of Electronic Control Units (ECUs) on automobiles is increasing, and some high-end luxury cars are equipped with more than 70 ECUs, wherein an airbag system, a brake system, a chassis Control system, an engine Control system, a wire Control system and the like are all safety related systems. When the system fails, the system must be switched to a safe state or a degraded mode, so that casualties caused by system function failure are avoided. The failure may be due to a specification error (e.g., incomplete security requirements), an artificially caused error (e.g., software bug), an environmental impact (e.g., electromagnetic interference), and the like. In order to realize the functional safety design of an electronic/electric system on an automobile, the road vehicle functional safety standard ISO26262 is officially released in 2011, and provides a guide for developing an automobile safety related system, and the basis of the standard is the functional safety standard IEC 61508 of an electronic/electric/programmable electronic system applicable to any industry.

ASIL: (automatic Safety integrity Level of automobile), when a system is designed for functional Safety in the ISO26262 standard, an important step in the early stage is to perform hazard analysis and risk assessment on the system, identify the hazard of the system and evaluate the risk Level of the hazard, namely ASIL Level. ASIL has four grades, A, B, C, D for each, where a is the lowest grade and D is the highest grade. Then, at least one security objective is determined for each hazard, the security objective being the highest level security requirement of the system, the system level security requirement is derived from the security objective, and the security requirements are distributed to the hardware and software. The ASIL level determines the requirement on the system security, and the higher the ASIL level, the higher the security requirement on the system, and the higher the cost for realizing security, which means that the higher the diagnostic coverage of hardware, the stricter the development process, the increased corresponding development cost, the prolonged development period, and the strict technical requirement. ISO26262 proposes a method of reducing the ASIL level on the premise of meeting the safety objective, ASIL decomposition, which can solve the above-described difficulties in development.

IVI: the In-Vehicle information system is a Vehicle-mounted comprehensive information processing system formed by adopting a Vehicle-mounted special central processing unit and based on a Vehicle body bus system and internet service. The IVI can realize a series of applications including three-dimensional navigation, real-time road conditions, IPTV, auxiliary driving, fault detection, vehicle information, vehicle body control, mobile office, wireless communication, online-based entertainment functions, TSP (telematics Service provider) Service and the like, and greatly improves the vehicle electronization, networking and intelligentization levels.

AVB: the Ethernet Audio/Video Bridging is a new IEEE802 standard, which supports various Audio and Video-based network multimedia applications by guaranteeing Bandwidth, limiting delay (Latency) and Time synchronization (Time synchronization) on the basis of the traditional Ethernet network. The AVB focuses on enhancing the real-time audio and video performance of the traditional Ethernet, simultaneously keeps 100% backward compatibility with the traditional Ethernet, and is the next generation network audio and video real-time transmission technology with great development potential.

AVM: panoramic parking image system (also known as AVM panoramic monitoring image system, 360 degree panoramic camera, 360 degree panoramic image system, 360 degree panoramic parking system, 360 degree panoramic visual system, 360 degree panoramic system of backing a car), through installing 4 super wide angle cameras around the automobile body, gather the image around the vehicle simultaneously, through processing such as "real-time image distortion reduction butt joint technique" that Pujieli is proprietary carries out distortion reduction-visual angle conversion-image concatenation-image enhancement to the image, finally form a seamless complete car week panoramic aerial view. The system not only can display a panoramic view, but also can simultaneously display a single view in any direction; the driver can accurately read the position and the distance of the obstacle by matching with the scale line.

MCU: a Microcontroller Unit (also called a Single chip microcomputer) or a Single chip microcomputer (mcu) is to reduce the frequency and specification of a Central Processing Unit (CPU), and integrate peripheral interfaces such as a memory (memory), a counter (Timer), a USB, an a/D converter, a UART, a PLC, a DMA, etc., and even an LCD driving circuit on a Single chip to form a chip-level computer, which is controlled by different combinations for different applications. Such as mobile phones, PC peripherals, remote controls, even automotive electronics, industrial stepper motors, robotic arm controls, etc., can see the silhouette of the MCU.

SOC (System on Chip), also known as System on Chip, means that it is a product, an integrated circuit with a specific purpose, which contains the complete System and has the full content of embedded software. Meanwhile, the method is a technology for realizing the whole process from the determination of system functions to the software/hardware division and completing the design.

The invention realizes the integration and control of a plurality of sets of vehicle-mounted electronic information entertainment systems through a systematized hardware system, realizes a multi-frequency control mode of one machine, and each display part can simultaneously and independently display different contents. The design scheme simplifies the overall control architecture of the vehicle-mounted electronic system, reduces the design difficulty and the manufacturing cost, meets the diversified display requirements of users, and improves the user experience. The unified simplified hardware structure lays a solid foundation for subsequent function expansion. Based on the hardware structure, the next generation cabin system can be created.

In addition, the invention organically combines the reduction of power consumption and the improvement of heat dissipation by using a new method of reducing power consumption and improving heat dissipation of the SOC chip, allows the SOC chip to have higher integration level and running power, and improves the permission condition for the expansion of the functions of the cabin system. Particularly, according to the invention, through the design of the specific heat dissipation packaging material, the degree of freedom of the design of the SOC chip, such as the arrangement mode of the pins, is improved, so that the heat dissipation effect can be improved and the risk possibly caused by poor heat dissipation can be reduced under the condition of not reducing the performance of the SOC chip.

Drawings

Fig. 1 is a block diagram of a smart cockpit system for an automobile according to the present invention;

FIG. 2 is a graph showing the bonding performance of propionic acid-modified beryllium oxide ceramic powder with poly (bisphenol A-co-epichlorohydrin) in composites of the invention;

fig. 3 is an exemplary block diagram illustrating a wireless battery charging module.

Detailed Description

The following are specific examples and comparative examples illustrating the present invention, but the present invention is not limited thereto.

Example 1

Referring to fig. 1, the intelligent cockpit system with one machine for multiple frequencies of the present invention is shown, which includes a vehicle-mounted infotainment system, a digitized virtual instrument panel, a left rear seat entertainment system, a right rear seat entertainment system, a vehicle-mounted navigator, an SOC chip (intel apollo lake) and an MCU chip. The intelligent cockpit system is characterized in that the intelligent cockpit system is connected with the five subsystems through an SOC chip, receives information sent by the subsystems and controls the subsystems, and therefore the five subsystems are integrated into a set of unified intelligent cockpit system. The intelligent cabin system virtualizes hardware resources of an SOC chip through a virtualization technology, abstracts physical resources into a virtual resource pool, then divides the virtual resources, creates 2 virtual machines on the virtual resource pool according to user requirements, runs different Operating Systems (OS) in each virtual machine, one virtual machine is responsible for controlling a vehicle-mounted electronic entertainment system (IVI), and the other virtual machine is responsible for controlling a digital instrument panel (HUD), so that the control functions of the five different subsystems are realized on the basis of the same hardware platform; the intelligent cabin system is connected with various vehicle-mounted buses and information transmission components through the MCU chip, completes the receiving, sending and preprocessing of various communication signals, serves as a communication front-end machine of the SOC chip, and reduces the load of the SOC chip. Referring to fig. 1, the intelligent cockpit system respectively controls different display screens and/or digital instruments through different virtual machines, ensures that different display devices can simultaneously display different contents, and thereby seamlessly supports the use and interaction of multiple high-definition screens such as a vehicle-mounted infotainment system, a digital instrument and a vehicle-mounted navigator through one hardware platform, meets the diversified information display requirements of users, improves the user experience, supports the hardware virtualization acceleration of a CPU and a GPU to enhance the computing power of each virtual machine, is provided with a central control module connected with a touch display screen, is provided with a wireless interconnection control module for connecting a vehicle-mounted terminal and intelligent devices, shares the display interface of the intelligent devices to the vehicle-mounted terminal and realizes the control of the intelligent devices, and is provided with a wireless charging module, and providing a power supply for the intelligent equipment in a wireless transmission mode.

Example 2

50mL of excess propionic acid was added to 4g of beryllium oxide ceramic powder (obtained from Jiangsu Dingqi technologies Co., Ltd., average particle size of about 15nm), after stirring at room temperature for 24 hours, the resulting precipitate was collected by centrifugation as a wet cake, and washed 3 times with ethyl acetate to remove excess propionic acid, the wet cake of propionic acid-modified, undried beryllium oxide ceramic powder was added to 50g of a cosolvent of n-butanol and toluene at a weight ratio of 1:1, which was sonicated for 1 hour, and the precipitated solid was completely dispersed in the cosolvent of n-butanol and toluene to obtain a colloidal solution of propionic acid-modified nano beryllium oxide ceramic powder particles.

30g of poly (bisphenol A-co-epichlorohydrin) was dissolved in 200mL of a cosolvent of n-butanol and toluene, the colloidal solution of propionic acid-modified nano beryllium oxide ceramic powder particles in the cosolvent of n-butanol and toluene described above was added to the polymer solution, homogenized at room temperature, and then the solvent was removed at 60 ℃ to prepare a composite of beryllium oxide ceramic powder and poly (bisphenol A-co-epichlorohydrin).

Example 2

The SOC chip was packaged using the composite prepared in example 2 using MCM packaging technology (completed by product electronics), and the packaged SOC chip was applied to the cabin system of example 1 to test heat dissipation. The test cabin system was run at full load for 3 hours of SOC chip temperature. The SOC chip temperature was tested to be about 50 ℃.

Comparative example 1

Example 2 was repeated, differing from example 2 only in that the encapsulating material was electronic silicone gel (RTV, available from believe silicone (china) ltd). The test cabin system was run at full load for 3 hours of SOC chip temperature. The SOC chip temperature was tested to be about 79 ℃.

It is clear from the above examples and comparative examples that the composite material of the present invention has a particularly good heat dissipation effect when used as an encapsulating material. Such heat dissipation results in very high redundancy for chip design, for example, allowing insertion of one P/G Pad every 1-2 IO pads in the design of an SOC chip, thereby improving powerful power supply for an integrated circuit without causing the temperature of the SOC chip to be too high. The reduction of the temperature of the chip can also improve the reliability of the circuit, reduce the problems of hot carriers, electromigration and the like, and avoid short circuit or open circuit of an electronic circuit and the failure rate of a device, thereby effectively reducing the power consumption.

This written description uses examples to disclose the invention, including the best mode, and also to enable any person skilled in the art to make and use the invention. The patentable scope of the invention is defined by the claims, and may include other examples that occur to those skilled in the art. Such other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insubstantial differences from the literal languages of the claims. All citations referred to herein are incorporated herein by reference to the extent that no inconsistency is made.

Claims (10)

1. The intelligent cabin system for the automobile comprises five subsystems and a high-heat-dissipation SOC chip, wherein the five subsystems are a vehicle-mounted information entertainment system, a digital virtual instrument system, a left rear seat entertainment system, a right rear seat entertainment system and a vehicle-mounted navigator system, and the system is characterized in that:

the intelligent cabin system is connected with the five subsystems through a high-heat-dissipation SOC chip, receives information sent by the subsystems and controls the subsystems, so that the five subsystems are integrated into a set of unified intelligent cabin system;

the intelligent cabin system respectively controls different display screens and/or digital instruments through different virtual machines, so that different display devices can simultaneously display different contents; and

the high heat dissipation SOC chip comprises a digital bare chip and a Flash bare chip, wherein the digital bare chip and the Flash bare chip are packaged together in a stacking mode;

the high heat dissipation SOC chip is a high heat dissipation SOC chip packaged by using a heat dissipation packaging material, the heat dissipation packaging material is an organic-inorganic composite material, the organic-inorganic composite material is a composite of beryllium oxide ceramic powder and poly (bisphenol A-co-epichlorohydrin), in the composite, the weight ratio of the beryllium oxide ceramic powder to the poly (bisphenol A-co-epichlorohydrin) is 0.1-1, the average particle size of the beryllium oxide ceramic powder is 5nm-80nm, the weight average molecular weight of the poly (bisphenol A-co-epichlorohydrin) is 35,000-50,000, and the particles of the beryllium oxide ceramic powder are uniformly embedded in a polymer network of the poly (bisphenol A-co-epichlorohydrin);

the beryllium oxide ceramic powder is modified by propionic acid on the surface of particles, and the modification is carried out by the following method: adding propionic acid into beryllium oxide ceramic powder, stirring at room temperature for 12-24 hours, then collecting formed precipitates by centrifugation to obtain a wet filter cake, washing with ethyl acetate to remove excessive propionic acid, adding the wet filter cake of propionic acid modified beryllium oxide ceramic powder which is not dried into a cosolvent of n-butanol and toluene in a weight ratio of 1:1, carrying out ultrasonic treatment on the mixture to completely disperse the beryllium oxide ceramic powder into the cosolvent of the n-butanol and the toluene, and then evaporating to remove the cosolvent to obtain the propionic acid modified beryllium oxide ceramic powder.

2. The intelligent cabin system for the automobile according to claim 1, wherein: the high-heat-dissipation SOC chip comprises 1 digital bare chip and 2 Flash bare chips, wherein the 2 Flash bare chips are respectively arranged on two sides of the digital bare chip.

3. The intelligent cabin system for the automobile according to claim 2, wherein: the SOC chip comprises chip input and output pins (IO Pad) and power line/ground line pins (P/G Pad), wherein one P/GPad is inserted every 1-2 IO pads.

4. The smart cabin system for an automobile according to claim 1 or 2, wherein: the intelligent cabin system adopts a virtualization technology to virtualize hardware resources of the SOC chip, abstracts physical resources into a virtual resource pool, then divides the virtual resources, creates a plurality of virtual machines on the virtual resource pool according to user requirements, runs different operating systems in each virtual machine, and controls one subsystem, so that the control function of five different subsystems is realized based on the same hardware platform.

5. The smart cabin system for an automobile according to claim 1 or 2, wherein: the intelligent cabin system also comprises an MCU chip which is connected with various vehicle-mounted buses and information transmission components through the MCU chip to complete the receiving, sending and preprocessing of various communication signals, and the MCU chip is used as a communication front-end machine of the SOC chip to reduce the load of the SOC chip, and the SOC chip supports the virtualization acceleration of CPU and GPU hardware so as to enhance the computing capacity of each virtual machine.

6. The smart cabin system for an automobile according to claim 1 or 2, wherein: the intelligent cabin system is further provided with a central control module, the central control module is connected with the touch display screen, the intelligent cabin system is provided with a wireless interconnection control module, the wireless interconnection control module is used for being connected with the vehicle-mounted terminal and the intelligent equipment, a display interface of the intelligent equipment is shared to the vehicle-mounted terminal, and the intelligent equipment is controlled.

7. The smart cabin system for an automobile according to claim 1 or 2, wherein: the intelligent cabin system is provided with a wireless charging module and provides a power supply for the intelligent cabin system in a wireless transmission mode.

8. The intelligent cockpit system for automobile of claim 7, said wireless charging module comprising a rechargeable battery sub-module and an electronic control sub-module, said rechargeable battery sub-module being electrically connected to the intelligent cockpit system to provide power thereto.

9. Automobile comprising a smart cabin system for an automobile according to any of claims 1-8.

10. The automobile of claim 9, which is an electric automobile.

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