CN108890153A - Laser processing device and laser processing - Google Patents
Laser processing device and laser processing Download PDFInfo
- Publication number
- CN108890153A CN108890153A CN201810832566.9A CN201810832566A CN108890153A CN 108890153 A CN108890153 A CN 108890153A CN 201810832566 A CN201810832566 A CN 201810832566A CN 108890153 A CN108890153 A CN 108890153A
- Authority
- CN
- China
- Prior art keywords
- laser
- pulse
- processing
- acousto
- optic modulator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The object of the present invention is to provide the laser processing devices and laser processing that shorten process time when processing to substrate.A kind of laser processing device, it is characterized in that, with laser oscillator and acousto-optic modulator, the laser oscillator vibrates laser pulse, the acousto-optic modulator takes out processing pulse based on the laser pulse exported from the laser oscillator, the laser processing device is provided with control unit, the control unit controls the acousto-optic modulator for the continuous laser pulse respectively, the different multiple processing pulses of energy are taken out within the duration of oscillation of the laser pulse, one Working position is processed using the multiple processing pulse taken out from identical laser pulse.
Description
The application be the applying date be on June 29th, 2016, application No. is 201610498855.0, entitled " laser
The divisional application of the patent application of processing unit (plant) and laser processing ", entire contents are hereby expressly incorporated by reference.
Technical field
The present invention relates to the laser processing devices and laser processing for using laser to process substrate.
Background technique
For example, when being punched to the substrate for being laminated with metal layer on resin layer, such as disclosed in patent document 1
As, it takes and metal layer is punched using the first laser pulse from laser oscillator, recycle subsequent sharp
Light pulse is fought each other the method that the resin layer under porose metal layer is punched.
But in the method, due to using separated laser pulse for metal layer and resin layer, there is processing
Time elongated disadvantage.
Existing technical literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2001-313471 bulletin
Summary of the invention
Therefore, it is an object of the present invention to when processing to substrate, shorten process time.
In invention disclosed herein, representative laser processing device it is characterized in that, have laser oscillator and
Acousto-optic modulator, the laser oscillator vibrate laser pulse, and the acousto-optic modulator is based on exporting from the laser oscillator
The laser pulse take out processing pulse, the laser processing device is provided with control unit, and the control unit controls the sound
Optical modulator respectively, takes out different multiple of energy for the continuous laser pulse within the duration of oscillation of the laser pulse
Pulse is processed, a Working position is processed using the multiple processing pulse taken out from identical laser pulse.
In addition, representative laser processing is it is characterized in that, will be through laser generation in invention disclosed herein
The laser pulse of device oscillation inputs acousto-optic modulator, and processing pulse is taken out in the acousto-optic modulator, in the laser processing
In method, using the acousto-optic modulator, respectively for the continuous laser pulse, within the duration of oscillation of the laser pulse
The different multiple processing pulses of energy are taken out, a Working position utilizes the multiple processing taken out from identical laser pulse
Pulse is processed.
According to the present invention, multiple processing pulses are taken out from a laser pulse, therefore, can shorten process time.
Detailed description of the invention
Fig. 1 is the time diagram of the laser drilling device of one embodiment of the invention.
Fig. 2 is the block diagram of the laser drilling device of one embodiment of the invention.
(a) of Fig. 3~(c) is the section for the process for illustrating the laser drilling device of one embodiment of the invention
Figure.
Specific embodiment
Embodiment
Fig. 2 is the block diagram of the laser drilling device of one embodiment of the invention.In Fig. 2, the substrate 1 to be punched is placed on not
On the workbench of diagram.2 be the laser oscillator for vibrating laser pulse L1, and 3 be the laser arteries and veins for making to export from laser oscillator 2
L1 is rushed along the acousto-optic modulator (hreinafter referred to as " AOM ") of machine direction and non-processing direction branch, 4 be by AOM 3 to
The laser pulse L2 of machine direction branch exposes to the electrical scanner (galvano scanner) of the punch position of substrate 1.The electricity
Scanner 4 is by rotating scanning laser pulse L2.5 are absorbed in AOM 3 to the laser pulse L3 of non-processing direction branch
Damper.
6 be the whole control unit of the movement of control device entirety, such as is realized by the processing unit of process control,
Including several parts.7 be the laser generation control unit for exporting laser generation command signal S, and laser generation command signal S instruction exists
Laser oscillator 2 vibrates each laser pulse L1, and 8 be the AOM of the AOM driving signal D of the branch operation of output control AOM 3
Control unit, 9 be the inspection stream (galvano) of inspection stream (galvano) the action control signal G of the movement of output instruction electrical scanner 4
Control unit.Part or all in these control units can also be provided separately with whole control unit 6.
It should be noted that each composition part, connecting line basically illustrate to illustrate the present embodiment and are recognized in Fig. 2
To be necessary part, and whole needed for not being shown as laser drilling device.
Fig. 1 shows the time diagram of laser drilling device shown in Fig. 2.
When carrying out hole machined to new position, inspection stream action control signal G unlatching then rotates electrical scanner 4, inspection flowing
Making control signal G closing then makes electrical scanner 4 static.If inspection stream action control signal G is closed, laser generation command signal
S opens the stipulated time, and the laser pulse L1 from laser oscillator 2 is begun to ramp up, if laser generation command signal S is closed,
Then laser oscillator 2 starts the decaying of laser pulse L1.
If laser generation command signal S is opened, AOM driving signal D is opened into (ON) t2 time after its t1 time,
In addition, AOM driving signal D is opened the t4 time after its t3 time if laser generation command signal S is closed.It is driven in AOM
In the period that dynamic signal D is opened, the laser pulse L1 of AOM 3 is input to along machine direction branch, is applied as laser pulse L2
Add to electrical scanner 4.In addition, being input to the laser pulse L1 of AOM 3 within the period that AOM driving signal D closes (OFF)
Along non-processing direction branch, damper 5 is applied to as laser pulse L3.
That is, in the present embodiment, during exporting a laser pulse L1 for one Kong Ercong laser oscillator 2 of processing
It is interior, before the energy of laser pulse L1 reaches peak value, i.e. laser pulse L1 start decaying before special time period t2 and laser arteries and veins
Rush L1 energy cross peak value after, i.e. laser pulse L1 start the special time period t4 after decaying, successively AOM drives twice for output altogether
Signal D.
It should be noted that examine stream action control signal G if secondary AOM driving signal D is closed and open, electricity
Scanner 4 starts to rotate, to carry out hole machined to new position.
Fig. 3 is for illustrating using laser drilling device described above to the base for being laminated with metal layer on resin layer
The sectional view of process when plate is punched, (a) of Fig. 3 show the state before processing, and (b) of Fig. 3 shows processing
The state of midway, (c) of Fig. 3 show the state after processing.In Fig. 3,22 be positioned at the surface for the substrate 1 to be punched
The metal layer of side for example formed by copper foil, 23 be the resin layer under the metal layer 22,24 be located at resin layer 23 it
Under the metal layer for example formed by copper foil.
According to above laser drilling device, as shown in Figure 1, special time period t2 during starting before decaying, from
AOM 3 exports the big laser pulse L2 of energy threshold, and as a result, as shown in (b) of Fig. 3, main processing is located at the surface one of substrate 1
The high metal layer 22 of the threshold value of the machining energy of side.Then, after this, as shown in (c) of Fig. 3, start to decline next
Special time period t4 during subtracting afterwards, the low resin layer 23 of the main threshold value for processing machining energy, ultimately forms arrival metal
The hole 25 of layer 24.
According to the above embodiments, when the feelings punched to the substrate 1 for being laminated with metal layer 22 on resin layer 23
Under condition, metal layer 22 is processed during due to before decaying the laser pulse L1 vibrated by laser oscillator 2, is starting to decline
Resin layer 23 is processed during after subtracting, therefore, feelings during can be before not extending laser pulse L1 especially and starting decaying
Under condition, both metal layer 22 and resin layer 23 are processed using a laser pulse.
In turn, it is taken due to the low resin layer 23 of the threshold value to machining energy using during the energy after starting to decay is small
Processing laser pulse out, thus be not in energy it is excessive and the case where lead to the shape defect in hole on resin layer 23.
Thus, it is possible to realize the processing in high speed and the hole of high-quality.
More than, the present invention is illustrated based on embodiment, but embodiment is the example of the invention for ease of understanding, it can
Various modifications are made to carry out various displacements to the constituent in embodiment or add other ingredient etc..Therefore, of the invention
It is not limited to embodiment.
For example, in the above embodiment, during starting after decaying, AOM driving signal D is made only to open (ON) one
It is secondary but it is also possible to be, during this period, by make AOM driving signal D open such as two it is inferior repeatedly, repeatedly to be processed.This
Sample can mitigate the impact to resin layer 23, get the good hole of quality in the region.In turn, it is able to suppress to metal layer 24
Impact.
In addition, in the above embodiment, illustrating to be laminated with metal layer 22, metal respectively up and down in resin layer 23
Multilayer board of the case where substrate of layer 24 is punched but it is also possible to be the different other materials of the threshold value of machining energy.Example
Such as, resin layer 23 can also be replaced with ceramic layer.
Description of symbols
1 substrate, 2 laser oscillator
3 AOM, 4 electrical scanner
The whole control unit of 5 damper 6
7 laser generation control unit, 8 AOM control unit
9 inspection flow control parts 22,24 metal layers
23 resin layer, 25 hole
D AOM driving signal G inspection stream action control signal
L1~L3 laser pulse S laser generation command signal
Claims (5)
1. a kind of laser processing device, which is characterized in that there is laser oscillator and acousto-optic modulator, the laser oscillator makes
Laser pulse oscillation, the acousto-optic modulator take out processing pulse based on the laser pulse exported from the laser oscillator,
The laser processing device is provided with control unit, and the control unit controls the acousto-optic modulator for continuous described sharp
Light pulse respectively, takes out the different multiple processing pulses of energy, a Working position benefit within the duration of oscillation of the laser pulse
It is processed with the multiple processing pulse taken out from identical laser pulse.
2. laser processing device according to claim 1, which is characterized in that
About the multiple processing pulse taken out by the acousto-optic modulator, the energy of subsequent processing pulse is lower than first
Process the energy of pulse.
3. a kind of laser processing, which is characterized in that the laser pulse vibrated through laser oscillator is inputted into acousto-optic modulator,
And processing pulse is taken out in the acousto-optic modulator,
It is respectively for the continuous laser pulse, sharp at this using the acousto-optic modulator in the laser processing
The different multiple processing pulses of energy are taken out in the duration of oscillation of light pulse, a Working position is utilized from identical laser pulse
The multiple processing pulse taken out is processed.
4. laser processing according to claim 3, which is characterized in that
About the multiple processing pulse taken out by the acousto-optic modulator, make the energy of subsequent processing pulse lower than first
Processing pulse energy.
5. laser processing according to claim 4, which is characterized in that
The base that is laminated with metal layer is mainly processed on resin layer using processing pulse first in the multiple processing pulse
The metal layer of plate, and the resin layer is mainly processed in the postimpulse processing pulse of the first processing using following.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-173462 | 2015-09-03 | ||
| JP2015173462 | 2015-09-03 | ||
| JP2016075926A JP6817716B2 (en) | 2015-09-03 | 2016-04-05 | Laser processing equipment and laser processing method |
| JP2016-075926 | 2016-04-05 | ||
| CN201610498855.0A CN106493476B (en) | 2015-09-03 | 2016-06-29 | Laser processing device and laser processing method |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610498855.0A Division CN106493476B (en) | 2015-09-03 | 2016-06-29 | Laser processing device and laser processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108890153A true CN108890153A (en) | 2018-11-27 |
Family
ID=58278435
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610498855.0A Active CN106493476B (en) | 2015-09-03 | 2016-06-29 | Laser processing device and laser processing method |
| CN201810832566.9A Pending CN108890153A (en) | 2015-09-03 | 2016-06-29 | Laser processing device and laser processing |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610498855.0A Active CN106493476B (en) | 2015-09-03 | 2016-06-29 | Laser processing device and laser processing method |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JP6817716B2 (en) |
| KR (2) | KR102176899B1 (en) |
| CN (2) | CN106493476B (en) |
| TW (2) | TWI692384B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111730220A (en) * | 2019-03-22 | 2020-10-02 | 维亚机械株式会社 | Laser processing apparatus and laser processing method |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7125254B2 (en) * | 2017-10-12 | 2022-08-24 | ビアメカニクス株式会社 | LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD |
| JP7043128B2 (en) | 2018-01-31 | 2022-03-29 | 住友重機械工業株式会社 | Laser control device and laser processing method |
| CN108683068B (en) * | 2018-03-14 | 2020-06-09 | 深圳市创鑫激光股份有限公司 | Laser control method, electronic control device, laser drilling equipment and storage medium |
| JP2020151736A (en) * | 2019-03-19 | 2020-09-24 | 住友重機械工業株式会社 | Laser control device and pulse laser output device |
| JP6822699B1 (en) * | 2019-09-24 | 2021-01-27 | フェニックス電機株式会社 | Laser irradiation device and surface roughening treatment method using it |
| WO2024024338A1 (en) * | 2022-07-27 | 2024-02-01 | パナソニックホールディングス株式会社 | Laser processing device, control method, and program |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1061874A (en) * | 1990-09-19 | 1992-06-10 | 株式会社日立制作所 | Multi-pulse laser beam generation method and device |
| JP2001313471A (en) * | 2000-02-24 | 2001-11-09 | Matsushita Electric Works Ltd | Method for forming viahole of wiring board |
| CN1659750A (en) * | 2002-04-02 | 2005-08-24 | 三菱电机株式会社 | Laser processing system and laser processing method |
| JP2006082120A (en) * | 2004-09-17 | 2006-03-30 | Sumitomo Heavy Ind Ltd | Laser beam machining method and laser beam irradiation device |
| CN104117774A (en) * | 2013-04-26 | 2014-10-29 | 维亚机械株式会社 | Laser machining method |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6420937B1 (en) * | 2000-08-29 | 2002-07-16 | Matsushita Electric Industrial Co., Ltd. | Voltage controlled oscillator with power amplifier |
| JP3838064B2 (en) * | 2001-09-28 | 2006-10-25 | 松下電器産業株式会社 | Laser control method |
| US7616669B2 (en) * | 2003-06-30 | 2009-11-10 | Electro Scientific Industries, Inc. | High energy pulse suppression method |
| US7133182B2 (en) * | 2004-06-07 | 2006-11-07 | Electro Scientific Industries, Inc. | AOM frequency and amplitude modulation techniques for facilitating full beam extinction in laser systems |
| JP2006043747A (en) * | 2004-08-06 | 2006-02-16 | Sumitomo Heavy Ind Ltd | Method and apparatus for laser machining |
| US7187755B2 (en) * | 2004-11-02 | 2007-03-06 | General Electric Company | Electron emitter assembly and method for generating electron beams |
| CN101095033A (en) * | 2004-12-30 | 2007-12-26 | 通明国际科技有限公司 | Laser-based material processing methods, system and subsystem for use therein for precision energy control |
| TWI336572B (en) * | 2007-01-05 | 2011-01-21 | Univ Nat Chiao Tung | A joint channel estimation and data detection method for stbc/ofdm systems |
| WO2009012913A1 (en) * | 2007-07-21 | 2009-01-29 | Keming Du | Optical arrangement for generating multi-beams |
| JP5338334B2 (en) * | 2009-01-21 | 2013-11-13 | オムロン株式会社 | Laser light source device and laser processing device |
| WO2011016176A1 (en) * | 2009-08-03 | 2011-02-10 | 東芝機械株式会社 | Pulse laser machining apparatus and pulse laser machining method |
| JP5511644B2 (en) * | 2010-12-07 | 2014-06-04 | 住友重機械工業株式会社 | Laser processing apparatus and laser processing method |
| WO2013073133A1 (en) * | 2011-11-14 | 2013-05-23 | Canon Kabushiki Kaisha | Laser processing apparatus, method of laser processing, method of fabricating substrate, and method of fabricating inkjet head |
| CN103920993B (en) * | 2014-04-18 | 2015-12-09 | 苏州东山精密制造股份有限公司 | Multi-platform laser-processing system |
-
2016
- 2016-04-05 JP JP2016075926A patent/JP6817716B2/en active Active
- 2016-05-31 TW TW107124051A patent/TWI692384B/en active
- 2016-05-31 TW TW105117003A patent/TWI675714B/en active
- 2016-06-13 KR KR1020160073130A patent/KR102176899B1/en active IP Right Grant
- 2016-06-29 CN CN201610498855.0A patent/CN106493476B/en active Active
- 2016-06-29 CN CN201810832566.9A patent/CN108890153A/en active Pending
-
2018
- 2018-06-28 JP JP2018122626A patent/JP2018167327A/en active Pending
- 2018-07-27 KR KR1020180087893A patent/KR20180089896A/en not_active Application Discontinuation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1061874A (en) * | 1990-09-19 | 1992-06-10 | 株式会社日立制作所 | Multi-pulse laser beam generation method and device |
| JP2001313471A (en) * | 2000-02-24 | 2001-11-09 | Matsushita Electric Works Ltd | Method for forming viahole of wiring board |
| CN1659750A (en) * | 2002-04-02 | 2005-08-24 | 三菱电机株式会社 | Laser processing system and laser processing method |
| JP2006082120A (en) * | 2004-09-17 | 2006-03-30 | Sumitomo Heavy Ind Ltd | Laser beam machining method and laser beam irradiation device |
| CN104117774A (en) * | 2013-04-26 | 2014-10-29 | 维亚机械株式会社 | Laser machining method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111730220A (en) * | 2019-03-22 | 2020-10-02 | 维亚机械株式会社 | Laser processing apparatus and laser processing method |
| CN111730220B (en) * | 2019-03-22 | 2024-04-23 | 维亚机械株式会社 | Laser processing apparatus and laser processing method |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201834776A (en) | 2018-10-01 |
| CN106493476B (en) | 2019-12-13 |
| KR20170028244A (en) | 2017-03-13 |
| TWI692384B (en) | 2020-05-01 |
| CN106493476A (en) | 2017-03-15 |
| TW201722604A (en) | 2017-07-01 |
| TWI675714B (en) | 2019-11-01 |
| JP2017047471A (en) | 2017-03-09 |
| JP2018167327A (en) | 2018-11-01 |
| JP6817716B2 (en) | 2021-01-20 |
| KR102176899B1 (en) | 2020-11-10 |
| KR20180089896A (en) | 2018-08-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108890153A (en) | Laser processing device and laser processing | |
| JPH11145581A (en) | Method and equipment for drilling printed board | |
| TW202132034A (en) | Laser processing apparatus, methods of laser-processing workpieces and related arrangements | |
| US7807944B2 (en) | Laser processing device, processing method, and method of producing circuit substrate using the method | |
| JP4320926B2 (en) | Laser drilling method and apparatus | |
| CN102802360B (en) | Anti-breakdown isolated laser hole blasting method in PCB processing | |
| JP2019089082A (en) | Laser processing method | |
| TW202035048A (en) | Laser processing apparatus and laser processing method | |
| CN110340520A (en) | A kind of pulse dislocation laser processing, device and system | |
| CN106301270A (en) | The manufacture method of SAW device | |
| CN105101681B (en) | A kind of HDI plate manufacture crafts for improving the de- pad of blind hole | |
| CN108941901A (en) | A kind of laser mark printing device and method | |
| DE102017207795A1 (en) | LASER PROCESSING DEVICE | |
| CN204221031U (en) | A kind of automatic drilling mechanism | |
| JP7125254B2 (en) | LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD | |
| JP2004142082A (en) | Method and device for working plan | |
| JP2018188331A (en) | Laser processing method | |
| JP2005268423A (en) | Method for manufacturing wiring board using laser | |
| JP3651585B2 (en) | Laser processing method | |
| JP2019025505A (en) | Laser beam machining apparatus and laser beam machining method | |
| JP3937311B2 (en) | Laser processing method | |
| Kanki et al. | Pulse laser irradiation control method for blind via-hole drilling of printed wiring boards based on high-speed camera monitoring | |
| CN110695514A (en) | Method for multi-laser composite processing of layered composite material | |
| JP2004114094A (en) | Boring method with laser beam to prepreg sheet | |
| CN109618508A (en) | A kind of HDI board manufacturing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20181127 |