CN108878640B - Method for enhancing connection strength of ceramic wafer and surface electrode layer in piezoelectric ceramic wafer - Google Patents
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Abstract
The invention relates to a method for enhancing the connection strength between a ceramic piece and a surface electrode layer in a piezoelectric ceramic piece, which comprises the following steps: the electrode layer is removed while grooves which are distributed in parallel are formed on at least one surface of the upper surface and the lower surface of the piezoelectric ceramic piece, then the surface electrode layer is plated on the surface of the piezoelectric ceramic piece, where the grooves are formed, so as to enhance the connection strength between the surface electrode layer and the ceramic piece in the piezoelectric ceramic piece, and the depth of each groove is greater than the thickness of the surface electrode layer.
Description
Technical Field
The invention relates to a method for enhancing the connection strength of a ceramic sheet and a surface electrode layer in a piezoelectric ceramic sheet, in particular to the connection of the piezoelectric ceramic and an electrode metal layer, particularly to the firmness and reliability of a piezoelectric ceramic sheet-electrode layer metal layer joint surface and a ceramic sheet-adhesive-ceramic sheet joint surface, and belongs to the field of piezoelectric ceramic.
Background
By utilizing the piezoelectric effect of the piezoelectric ceramics, devices with various purposes can be designed and manufactured. Such as ceramic speakers, microphones, and sound pick-ups used in electroacoustic devices; underwater acoustic transducer for underwater communication and detection, fish detector; ceramic surface wave devices and ceramic transformers for use in radars, televisions, and computers; piezoelectric accelerometers and piezoelectric gyroscopes used in navigation; ceramic filter and ceramic discriminator for use in communication and telemetry equipmentA machine; ceramic pressure gauges and flow meters used in precision measurements; ceramic ultrasonic transducer for ultrasonic flaw detection, ultrasonic cleaning and ultrasonic imaging[1-2]。
When the piezoelectric ceramic chip component is used, an electrode metal layer is needed, silver electrode slurry is usually coated on the upper surface and the lower surface of a test piece, and a silvery white conductive silver layer is formed on the ceramic chip through a high-temperature (500-600 ℃) sintering infiltration process for electrifying. There are various methods of applying the metal electrode: silver-fired electrodes, electroless nickel-plated electrodes, aluminum-sprayed electrodes, copper-sprayed electrodes, sputtered gold, silver electrodes, evaporated metal electrodes, and the like[3-4]。
Because the thermal expansion coefficient, dielectric constant and the like of the electrode metal layer are greatly different from those of the ceramic material, if the electrode layer is not firmly combined with the ceramic, the following problems often occur due to the influences of factors such as long-term placement, climate change and the like: the bonding strength between the electrode layer and the ceramic is reduced, the electrode layer discolors, peels or even falls off, and the piezoelectric ceramic piece can not be used continuously[5]。
In addition, in the piezoelectric ceramic laminated device, the connection between the ceramic plates is mostly bonded by epoxy and phenolic resin adhesives, under the long-time action of a time field, an alternating electric field and a force field, the combination between the ceramic plates and the electrode layer and between the ceramic plates is not firm any more, and the separation between the plates and the metal layer of the electrode and the separation between the ceramic plates and the metal layer of the electrode frequently occur, so that the failure of the device is caused[6]. These are the common problems in the use of the piezoelectric ceramic integrated device.
In the conventional report, in chinese patent "a zirconia-based ceramic-to-metal joint and a method for joining the same" published under the publication number CN104788116A, a nickel-based alloy is used as a solder for joining a metal and a ceramic in the zirconia-based ceramic-to-metal joint. In the patent "metal-ceramic-substrate" (chinese publication No. CN102421725A), direct bonding (DCB method) or active solder is used to bond with ceramic material. Patent ZrO2In the method for connecting ceramic and metal (Chinese publication No. CN107129316A), metal/ZrO is connected by upper and lower electrodes2Applying a constant direct current to the ceramic, electrifying, preserving heat and coolingZrO is completed to room temperature2Ceramic to metal connections. In the patent "ceramic and metal connection method" (chinese publication No. CN102020483A), an aluminum brazing process is used to connect an aluminum or aluminum alloy workpiece. Furthermore, according to the description of a reliable contact-connection structure of the piezoelectric actuator in DE19646676C1, small frictional forces (external stresses) can lead to the electrodes peeling off from the ceramic component, which can ultimately render the ceramic component unusable. In summary, in order to improve the connection strength between the ceramic and the metal, flux or alloy is mostly used in high temperature soldering, but the temperature required for soldering is usually more than several hundred degrees, the process is complicated, and the connection between the ceramic and the metal layer is not firm. Whether the ceramic plates are firmly connected with the electrode metal layer or not reflects the performance of a single ceramic plate, and the multiple ceramic plates are integrated into a device to influence the success or failure of the whole device; in the case of a laminated device bonded by piezoelectric ceramic plates, the connection between the ceramic plates, namely the connection between the ceramic plates-a bonding agent-the ceramic plates is firm or not, directly determines the service life of the ceramic plate integrated device in practical use.
Reference documents:
[1] zhan fuchang, wanglikun, modern piezoelectricity (upper) [ M ]. beijing: scientific press, 2001;
[2] chen Daren, summary of piezoelectric ceramic micro-displacement actuators electronic components and materials, 1994, 13[1 ]: 2-7.;
[3]Jiangtao Zeng，Kunyu Zhao，Wei Ruan，Xuezheng Ruan，Liaoying Zheng，andGuorong Li，Contribution to the large and stable electric field induced strainfor textured Pb(Mg1/3Nb2/3)0.675Ti0.325O3ceramics，Appl.Phys.Lett.2016，109：052905.；
[4]Mingli Chen，Zhijun Xu，Ruiqing Chu，et al.Physica B 433(2014)43–47.；
[5]Wei Zhao，Wei Ruan，Jiangtao Zeng，Lizhu Huang，Kunyu Zhao，LiaoyingZheng，Huarong Zeng，Yibo Zhou，Heji Yang，Xuezheng Ruan，and Guorong Li，Observation of an unusual optical switching effect in relaxor ferroelectricsPb(Mg1/3Nb2/3)O3-Pb(Zr0.53,Ti0.47)O3transparent ceramics，Appl.Phys.Lett.104，062907(2014).；
[6] new development of the polypropylene and ceramic capacitor medium, electronic components and materials, and increase in the journal in 2000.
Disclosure of Invention
In order to overcome the problem that the connection between the ceramic and the metal layer is not firm, the invention provides a method for enhancing the connection strength between a ceramic sheet and a surface electrode layer in a piezoelectric ceramic sheet, which comprises the following steps: the electrode layer is removed while grooves which are distributed in parallel are formed on at least one surface of the upper surface and the lower surface of the piezoelectric ceramic piece, then the surface electrode layer is plated on the surface of the piezoelectric ceramic piece, where the grooves are formed, so as to enhance the connection strength between the surface electrode layer and the ceramic piece in the piezoelectric ceramic piece, and the depth of each groove is greater than the thickness of the surface electrode layer.
According to the invention, the electrode layer is removed while the grooves which are distributed in parallel are formed on at least one surface of the piezoelectric ceramic piece of which the upper surface is plated with the electrode layer, the removed electrode layer is larger than the thickness of the electrode layer by controlling the depth of the grooves, and then a new surface electrode layer (the component and the thickness of which are the same as those of the electrode layer of the original piezoelectric ceramic piece) is plated on the surface of the piezoelectric ceramic piece on which the grooves are formed, so that the contact area between the surface electrode layer in the piezoelectric ceramic piece and the ceramic piece is increased, a firm joint surface is formed, and the surface electrode layer is difficult to peel off while the piezoelectric dielectric property of the.
Preferably, the depth of the groove is 0.1-0.2 mm.
Preferably, the thickness of the piezoelectric ceramic piece is 1-2 mm.
Preferably, the ratio of the depth of the groove to the thickness of the piezoelectric ceramic piece is 1: (10-15), preferably 1: 10. within the range, the tensile strength and the compressive strength of the piezoelectric ceramic piece can be not influenced while the contact area is increased. If the depth of the groove is deeper, the tensile strength and the compressive strength of the piezoelectric ceramic piece are reduced; and the depth of the groove is shallow, so that the connection strength of the ceramic and the surface electrode layer cannot be increased by the groove.
Preferably, the surface electrode layer is made of one of Cu, Ag and Au, and has a thickness of 0.8-1.0 um.
Preferably, the width of the groove and/or the distance between adjacent grooves is 0.4-0.6 mm; preferably, the width of the grooves is the same as the spacing between adjacent grooves.
Preferably, the cross section of the groove is rectangular, inverted trapezoid or circular arc.
On the other hand, the invention also provides the piezoelectric ceramic sheet with the grooves distributed on the surface, which is prepared by the method.
In another aspect, the present invention further provides a laminated layer, where the laminated layer includes at least the above piezoelectric ceramic sheets with grooves distributed on the surfaces, and an adhesive layer located between adjacent piezoelectric ceramic sheets. According to the invention, a plurality of piezoelectric ceramic plates with grooves on the surfaces (preferably, the piezoelectric ceramic plates with grooves distributed on the upper and lower surfaces) are bonded through the adhesive, so that the connection strength between the piezoelectric ceramic plates can be enhanced.
The invention adopts a technical scheme that: the upper surface and the lower surface of the piezoelectric ceramic chip are provided with grooves with certain depth by using a grooving process, and because the grooving depth (a few tenths of millimeters) is larger than the thickness of an electrode layer (a few tenths of micrometers), the electrode metal layer on the ceramic chip is completely cut off after grooving, and then new surface electrode layers (electrode metal layers) are plated on the two surfaces of the piezoelectric ceramic chip. Experiments prove that the surface electrode layer (electrode metal layer) and the ceramic wafer with the groove on the surface are combined very firmly, the electrode metal layer is not easy to peel off, and the piezoelectric dielectric property of the ceramic wafer after the electrode metal layer is plated in the groove is basically unchanged. Meanwhile, bonding a plurality of piezoelectric ceramic pieces with grooved plated electrodes into a lamination by using a resin binder, and performing tensile test on the lamination to compare the tensile test with the tensile test of the lamination bonded by a plurality of piezoelectric ceramic pieces without grooves. According to the invention, the connection strength between the ceramic wafer and the surface electrode layer in the piezoelectric ceramic wafer is enhanced, so that the ceramic wafer and the surface electrode layer (electrode metal layer) are connected more firmly, and the connection strength between the piezoelectric ceramic wafer and the wafer is greatly improved.
Compared with the prior art, the invention has the beneficial effects that: and (3) forming a plurality of grooves on at least one of the upper surface and the lower surface of the piezoelectric ceramic piece by adopting a grooving process (removing all electrode layers on the surface of the piezoelectric ceramic piece), and plating surface electrode layers on the surface of the ceramic piece with the grooves. At this moment, the contact surface of the ceramic plate and the surface electrode layer is not a smooth plane any more, the concave-convex surface formed by the groove is rough, and the friction coefficient of the rough surface is greatly increased, so that the surface electrode layer and the ceramic plate with the concave-convex surface are combined very firmly. In addition, a plurality of piezoelectric ceramic pieces with grooves on the surfaces are bonded together by using an adhesive (such as resin), and the tensile strength of the laminated piezoelectric ceramic piece bonded by the piezoelectric ceramic pieces with grooves on the surfaces is greatly improved, which shows that the method greatly improves the interface connection strength between the piezoelectric ceramic pieces and the adhesive and the piezoelectric ceramic pieces, and provides a method for prolonging the service life of the piezoelectric ceramic integrated device in the field of electroacoustic.
Drawings
FIG. 1 is a schematic view of a portion of an ungrooved piezoceramic wafer;
FIG. 2 is a schematic view of a portion of a grooved piezoelectric ceramic wafer;
FIG. 3 is a schematic view of a piezoceramic wafer-binder-piezoceramic wafer junction surface in a stack formed by the bonding of non-grooved piezoceramic wafers;
FIG. 4 is a schematic view of a piezoceramic wafer-binder-piezoceramic wafer junction surface in a stack formed by the bonding of piezoceramic wafers with grooves distributed on the surfaces;
FIG. 5 is another schematic view of another possible piezoceramic wafer-binder-piezoceramic wafer junction surface in a stack formed by the bonding of piezoceramic wafers with grooves distributed on the surfaces;
fig. 6 is a schematic structural view of a stack of multiple piezoelectric ceramic sheets bonded together.
Detailed Description
The present invention is further illustrated by the following examples, which are to be understood as merely illustrative and not restrictive.
In the invention, grooves with certain depth are carved on at least one surface (for example, the upper surface and the lower surface) of the piezoelectric ceramic piece plated with the electrode layer, and if the grooves are deeper, the tensile strength and the compressive strength of the piezoelectric ceramic piece are reduced; and the depth of the groove is shallow, the connection strength of the ceramic and the surface electrode layer cannot be increased through the groove, and through the optimization of the scheme, the depth of the groove is 0.1-0.2 mm, so that the ratio of the depth of the groove to the thickness of the piezoelectric ceramic piece is about 1: (10-15), plating a surface electrode layer after grooving, and keeping the performance parameters of the obtained piezoelectric ceramic piece unchanged.
The following exemplarily illustrates the method for enhancing the connection strength between the ceramic plate and the surface electrode layer in the piezoelectric ceramic plate provided by the present invention.
And after a groove is formed on the surface of the piezoelectric ceramic piece, plating an electrode on the surface. The surface electrode layer can be made of one of Cu, Ag and Au. The thickness of piezoceramics piece can be 1 ~ 2mm, and the degree of depth of recess can be 0.1 ~ 0.2mm, and the ratio of recess degree of depth and piezoceramics piece thickness can be 1: (10-15), preferably 1: 10. the thickness of the electrode layer is usually 0.8-1.0 μm, the depth of the groove is 0.1-0.2 mm, the depth of the groove is far greater than the thickness of the electrode layer, and the distance between the groove and the groove is equal to or less than the width of the groove, so that the electrode layer of the piezoelectric ceramic plate is cut off after the groove is cut. Preferably, the grooves are distributed on the surface of the piezoceramic wafer in parallel. The grooving mode can adopt scraper cutting, inner circle or outer circle cutting machine. In an alternative embodiment, the width of the grooves and/or the spacing between adjacent grooves is 0.4-0.6 mm.
The shape of the groove can be various shapes such as a strip, an arc, an inverted trapezoid and the like. The overall shape of the groove can be linear or curved.
And plating a surface electrode layer on the surface of the ceramic wafer with the grooves on the surface to obtain the piezoelectric ceramic wafer with the grooves on the surface. Wherein, the surface electrode layer can be at least one of Cu, Ag and the like. The thickness of the surface electrode layer is usually 0.8 to 1.0 μm. It should be noted that the electrode layer material and thickness in the present invention may be selected to meet the conductivity requirements. And plating a surface electrode layer on the surface of the piezoelectric ceramic piece, wherein the surface electrode layer is plated in one of chemical plating, magnetron sputtering, thermal evaporation or electron beam evaporation and the like.
And (3) mutually superposing the piezoelectric ceramic plates with the grooves distributed on the surfaces by using a bonding agent to obtain a lamination. The bonding and stacking manner may be that the grooves on the piezoelectric ceramic plates are stacked correspondingly, as shown in fig. 4. Alternatively, the grooves may be stacked in a staggered manner, as shown in fig. 5. The adhesive can be phenolic aldehyde, epoxy and other high molecular resin adhesives, including single-component and multi-component adhesives. As an example, a plurality of piezoelectric ceramic sheets having grooves distributed on the surface thereof were bonded to each other by a resin adhesive in a laminate manner as shown in fig. 6, and a tensile test was performed on the laminate to compare tensile properties with those of a laminate in which a plurality of piezoelectric ceramic sheets having no grooves were bonded.
In general, a plurality of grooves are engraved on the upper and lower surfaces of the piezoelectric ceramic sheet, the electrode layer is cut off while the grooves are engraved, and then the electrodes are plated on the surface of the piezoelectric ceramic sheet. Therefore, a firm joint surface is formed between the ceramic sheet with the groove surface and the newly plated surface electrode layer. Tensile force experiments prove that the surface electrode layer is firmly attached to the surface of the ceramic chip.
In the piezoelectric ceramic sheet with the grooves distributed on the surface, the connection between the ceramic sheet and the surface electrode layer is abnormally firm, and the tensile strength between the piezoelectric ceramic sheet and the sheet in the laminated layer bonded by the grooved ceramic sheet is also greatly improved.
The present invention will be described in detail by way of examples. It is also to be understood that the following examples are illustrative of the present invention and are not to be construed as limiting the scope of the invention, and that certain insubstantial modifications and adaptations of the invention by those skilled in the art in light of the foregoing description are intended to be included within the scope of the invention. The specific process parameters and the like of the following examples are also only one example of suitable ranges, i.e., those skilled in the art can select the appropriate ranges through the description herein, and are not limited to the specific values exemplified below.
According to the invention, the blades with different specifications are selected to groove and plate electrodes on the piezoelectric ceramic chip and the piezoelectric dielectric property parameters of the ceramic chip are tested, and the performance parameters of the piezoelectric ceramic chip plated with the electrodes after groove notching are maintained unchanged when the specification of the blade is selected to be about 0.5mm, namely the width of a groove is about 0.5mm, and the tensile strength of the joint surface of the ceramic chip and the surface electrode layer is higher. Therefore, the specification of the cutting blade for grooving the piezoelectric ceramic plate in the following embodiments is 0.4-0.6 mm.
Example 1:
the upper surface and the lower surface of the piezoelectric ceramic piece with the thickness of 1.5mm are grooved and then cleaned, and an electrode layer (surface electrode layer) is plated with copper, wherein the groove depth is 0.1mm, the groove width is 0.5mm, and the groove distance is about 0.5 mm. The preparation method of the copper electrode layer is sputtering evaporation, and the thickness of the copper electrode layer is 0.8 mu m. Sputtering is one of physical vapor deposition, and a magnetic field is introduced on the surface of a target cathode (copper, silver and the like), and the magnetic field is utilized to restrain charged particles to improve the plasma density so as to increase the sputtering rate, so that an electrode metal layer (copper, silver and the like) can be prepared on a substrate (such as ceramic, single crystal and the like), and a piezoelectric ceramic sheet with grooves distributed on the surface is obtained. Then, the non-grooved piezoelectric ceramic plate (with copper electrodes on the upper and lower surfaces and a thickness of 0.8 μm) was compared with 6 piezoelectric ceramic plates each having grooves on the surface by a tensile test of a copper electrode metal layer (see table 1).
The two piezoelectric ceramic sheets, i.e., the non-grooved piezoelectric ceramic sheet (fig. 3) and the grooved piezoelectric ceramic sheet (fig. 4), were screen-printed with epoxy resin adhesive, and 10 sheets were bonded together to form a laminate, in the manner shown in fig. 6 and 4. Six laminations are respectively made on two piezoelectric ceramic plates which are not grooved and grooved, and the laminations are heated and solidified and are compared in a tension test (see table 2).
Table 1 shows the tensile test comparison of the copper electrode metal layers of two piezoelectric ceramic sheets:
(remark: thickness of copper electrode piezoelectric ceramic plate is 1.5mm, contact area of tensile test is 78.5mm2)。
Table 2 is a comparison of tensile tests of stacks bonded by copper electrode piezoelectric ceramic sheets without grooves:
(remark: thickness of copper electrode piezoelectric ceramic plate is 1.5mm, contact area of tensile test is 21.2mm2)。
Example 2:
the upper surface and the lower surface of the piezoelectric ceramic piece with the thickness of 1.5mm are subjected to grooving and then cleaned, and an electrode layer (surface electrode layer) is plated with silver, wherein the grooving depth is 0.15mm, the grooving width is 0.4mm, and the groove distance is about 0.4 mm. The preparation method of the silver electrode layer is sputtering evaporation, the thickness of the silver electrode layer is about 0.8 mu m, and the piezoelectric ceramic plate with the grooves distributed on the surface is obtained. The tensile force test of the silver electrode metal layer was compared between the piezoelectric ceramic sheet (with silver electrodes on the upper and lower surfaces and a thickness of 0.8 μm) without grooves and 6 piezoelectric ceramic sheets each with grooves on the surface (see table 3).
The two piezoelectric ceramic sheets, i.e., the non-grooved piezoelectric ceramic sheet (fig. 3) and the grooved piezoelectric ceramic sheet (fig. 4), were screen-printed with a phenol resin adhesive, and 10 sheets were bonded together to form a laminate, in the manner shown in fig. 6 and 4. Six laminations are respectively made on two piezoelectric ceramic plates which are not grooved and grooved, and the laminations are heated and solidified and are compared in a tension test (see table 4).
Table 3 shows the comparison of the tensile test of the silver electrode metal layer of two ceramic wafers:
(remark: silver electrode piezoelectric ceramic plate thickness is 1.5mm, contact area in tensile test is 78.5mm2)。
Table 4 is a comparison of tensile force tests for stacks bonded with ungrooved, grooved silver electrode piezoceramic wafers:
(remark: silver electrode piezoelectric ceramic plate thickness is 1.5mm, contact area of tensile test is 21.2mm2)。
As seen from the data in tables 1 and 3, the adhesion of the electrode metal layer after grooving is greatly enhanced for the two ceramic sheets with different electrode metal layers on the surfaces, which indicates that the ceramic with grooves on the surfaces is combined with the electrode metal layer more firmly. The data in table 2 shows that the average pressure at the maximum load of the six laminated layers bonded by the piezoelectric ceramic sheets without grooving is 14.6MPa, the average pressure at the maximum load of the laminated layers bonded by the piezoelectric ceramic sheets with grooves on the surfaces is 23.5MPa, the tensile strength of the laminated layers bonded by the piezoelectric ceramic sheets with grooves on the surfaces is increased by 60.9%, and the data in table 4 shows that the tensile strength of the laminated layers bonded by the piezoelectric ceramic sheets with grooves on the surfaces is increased by 57.9%, which indicates that the tensile strength of the laminated layers bonded by the piezoelectric ceramic sheets after grooving is greatly increased.
From the fracture situation, the non-grooved piezoelectric ceramic sheet bonded laminate was all broken in the electrode metal layer, i.e., the electrode was peeled off, while the piezoelectric ceramic sheet bonded laminate with the grooves distributed on the surface was all broken in the ceramic (table 2, table 4). The tensile strength is shown to reach the limit that the ceramic is broken, and the ceramic sheet-adhesive-ceramic sheet joint surface is not broken, which shows that the grooving process increases the firmness of the joint surface.
In summary, the ceramic sheet-electrode layer junction surface of the electrode plated after notching and the ceramic sheet-adhesive-ceramic sheet junction surface formed by bonding the piezoelectric ceramic sheet with the notches distributed on the surface increase the interface contact area, and increase the usage of the metal layer and the adhesive, and the excessive usage is filled in the plane parallel to the piezoelectric ceramic sheet, i.e. embedded in the ceramic instead of being stacked in the vertical direction, so that the situation that the electrode is easy to peel off due to the fact that the thickness of the electrode metal layer is too thick in the vertical direction is avoided. Also, the laminate does not suffer from a decrease in adhesive strength due to an increase in the amount of glue in the vertical direction (the adhesive strength of the glue layer is inversely proportional to the thickness). The piezoelectric ceramic plates with the grooves distributed on the surfaces are bonded to form ceramic plate-adhesive-ceramic plate bonding surfaces (figures 4 and 5), a plurality of bent angles of nearly 90 degrees are added at the grooves, adhesive layers are filled at the bent angles, when the laminated device is actually used, a shearing force is generated at the bent angles due to the tensile stress, the compressive stress and the electric field acting force in the vertical direction, the direction of the shearing force forms a certain angle with the vertical direction, the shearing force on the side surface is a component force, the magnitude of external force in the vertical direction (the tensile stress, the compressive stress and the electric field acting force applied to the laminated device) can be reduced, and finally, the resultant force is reduced, namely the force acting on the adhesive layers of the laminated device is reduced. Therefore, the overall bonding strength of the laminated device is greatly improved.
Although the grooving process increases the production cost to a certain extent, the grooving process has high requirements on the firmness, reliability and durability of devices in the piezoelectric ceramic electroacoustic field needing high-precision positioning, such as adaptive optical detection, radar detection and the like. The application in these high-precision fields can produce benefits far superior to the cost expense produced by the grooving process. The method is practical and has wide prospect, and can improve the firmness of the piezoelectric ceramic chip and the piezoelectric device.
Claims (10)
1. A method for enhancing the connection strength between a ceramic piece and a surface electrode layer in a piezoelectric ceramic piece is characterized by comprising the following steps: forming grooves which are distributed in parallel on at least one surface of the upper surface and the lower surface of the piezoelectric ceramic piece, removing the electrode layer, plating a surface electrode layer on the surface of the piezoelectric ceramic piece, where the grooves are formed, so as to enhance the connection strength between the surface electrode layer in the piezoelectric ceramic piece and the ceramic piece, wherein the depth of each groove is greater than the thickness of the surface electrode layer; the depth of the groove is 0.1-0.2 mm.
2. The method of claim 1, wherein the thickness of the piezoceramic wafer is 1-2 mm.
3. The method of claim 1, wherein the ratio of the depth of the groove to the thickness of the piezoceramic wafer is 1: (10-15).
4. The method of claim 3, wherein the ratio of the depth of the groove to the thickness of the piezoceramic wafer is 1: 10.
5. the method according to claim 1, wherein the surface electrode layer is made of one of Cu, Ag and Au, and has a thickness of 0.8-1.0 μm.
6. The method of claim 1, wherein the width of the grooves and/or the spacing between adjacent grooves is 0.4 to 0.6 mm.
7. The method of claim 6, wherein the width of the grooves and the spacing between adjacent grooves are the same.
8. The method of claim 1, wherein the grooves have a cross-section of a rectangular, inverted trapezoidal, or circular arc shape.
9. A piezoceramic sheet with distributed grooves on its surface prepared according to the method of any one of claims 1 to 8.
10. A stack comprising at least two surface-grooved piezoceramic wafers according to claim 9, and an adhesive layer between adjacent surface-grooved piezoceramic wafers.
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