CN108878384A - The hanging lead frame structure in the island integrated antenna package Zhong Ji - Google Patents
The hanging lead frame structure in the island integrated antenna package Zhong Ji Download PDFInfo
- Publication number
- CN108878384A CN108878384A CN201810758688.8A CN201810758688A CN108878384A CN 108878384 A CN108878384 A CN 108878384A CN 201810758688 A CN201810758688 A CN 201810758688A CN 108878384 A CN108878384 A CN 108878384A
- Authority
- CN
- China
- Prior art keywords
- lead frame
- dao
- integrated antenna
- zhong
- antenna package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49575—Assemblies of semiconductor devices on lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The hanging lead frame structure in the island integrated antenna package Zhong Ji of the invention, technical purpose be to provide it is a kind of using single base island structure, realize the hanging lead frame structure in the island integrated antenna package Zhong Ji of the packaging body for obtaining increasing independent I/O interface quantity.It include lead frame Ji Dao and pin, thread is empty between the lead frame Ji Dao and pin, lead frame Ji Dao connection two sides hangs muscle；The present invention realizes TO252 series of products using single Ji Dao and increases the technical effect of I/O interface, and improves the size for being applicable in chip, applies suitable for integrated antenna package.
Description
Technical field
The present invention relates to a kind of leads of IC mount structures, more specifically, being related to base in a kind of integrated antenna package
The hanging lead frame structure in island.
Background technique
In the prior art, lead frame is carried as the chip of integrated circuit in the integrated antenna package of TO packing forms
Body is one kind by means of bonding material（Spun gold, aluminium wire, copper wire）Realize that chip internal circuits exit and the electrical of outer lead connect
It connects, forms the key structure part of electric loop, it plays the function served as bridge connected with outer lead, most semiconductors
It is required in integrated circuit using lead frame, lead frame is a kind of base mostly important in electronics and information industry encapsulation field
Plinth material.Currently, the lead frame of existing frequently-used TO252 series includes several frame lists being sequentially connected in series by dowel
Member, each frame unit includes matrix and pin area, and matrix includes heat sink area and slide glass area, and the slide glass area is equipped with
Chip mounting groove, the pin area are equipped with several pins, and the top of in-between pin is equipped with connection sheet, the top of other pins
Equipped with welding section, pin area is connect by the connection sheet with matrix, and the heat sink area is equipped with heat release hole.Currently, existing
TO252 series lead wire frame only a kind of can produce obtains the packaging body that independent I/O interface quantity is 6, but such lead frame
It is Ji Dao to be separated into two, thus the chip size that can be accommodated substantially reduces；On the outside of the packaging body that this class framework obtains simultaneously
There is exposing on the island Liang Geji, is easy hidden danger occur because of moist or tin sticky under high-pressure situations；TO252 series in current techniques
Lead frame, there are the technological deficiency of potential faults, becomes those skilled in the art in the packaging body for increasing independent I/O interface
Technical problem anxious to be resolved.
Summary of the invention
Technical purpose of the invention is to overcome to have in technology, and leads of IC frame is mentioned by the way that Ji Dao is designed as two
The packaging body of the independent I/O interface of increase of confession there is technical issues that, provide it is a kind of using single base island structure,
Realize the hanging lead frame structure in the island integrated antenna package Zhong Ji for the packaging body for obtaining increasing independent I/O interface quantity.
To realize the above technical purpose, the technical scheme is that：
The hanging lead frame structure in the island integrated antenna package Zhong Ji includes lead frame Ji Dao and pin, the lead frame
Thread is empty between Ji Dao and pin, lead frame Ji Dao connection two sides hangs muscle.
The hangs muscle is equipped with gap structure.
The hangs muscle setting lug boss locks material structure.
It include lead frame Ji Dao and pin, the lead frame Ji Dao is not attached to pin, that is, draws when implementing
Thread is empty between wire frame Ji Dao and pin, and Ji Dao is supported by two sides hangs muscle, while increasing lock material structure design in hangs muscle newly.
The beneficial effects of the invention are as follows：The technology that TO252 series of products increase I/O interface is realized using single Ji Dao
Effect, and the size for being applicable in chip is improved, it is 2.15mm * 3.13mm that existing lead frame maximum, which accommodates chip size,
And lead frame of the invention can then accommodate having a size of the chip of 2.9782mm * 3.7782mm be packaged.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of one embodiment of the invention；
Fig. 2 is the structural schematic diagram of hangs muscle in one embodiment of the invention.
Specific embodiment
In conjunction with Fig. 1 and Fig. 2, the specific embodiment that the present invention will be described in detail, but claim is not limited in any way.
In Fig. 1, including cooling fin 1, chip carrier 2 and it is equipped with the hangs muscle 3 connecting with 2 two sides of chip carrier, in core
2 other side of piece carrier is equipped with the terminal pin 4 that thread is empty between carrier 2, further includes the middle muscle 5 having on terminal pin 4, with 3 phase of hangs muscle
Company's muscle 6 and outer muscle 7 even；Each chip package frame forms a frame unit as minimum unit, every 4 minimum units；
Inside composed frame unit, use hangs muscle 3 between chip carrier 2 is connected, and extends out and hangs muscle in 3 middle of hangs muscle
Wide company's muscle 6 is connected with middle muscle 5, meanwhile, cooling fin 1 is connect with the other side of the cooling fin of adjacent minimum unit；It is formed
Frame unit outside, the hangs muscle 3 in the left side of chip carrier 2 is connected with outer muscle 7；This structural integrity realize chip package and
It cuts.
The pin that centre is connected with chip carrier 2 is separated, can not changed on existing TO leadframe base by the present invention
Increase packaging body I/O interface quantity in the case where becoming chip carrier size, while also avoiding technology due to by Ji Dao points
Two are cut into which existing encapsulation finished product is easily made when dampness or the edge Ji Dao tin must exist when being mounted on PCB
Situations such as at short circuit, to cause failure hidden danger.The present invention is after separating middle pin with chip carrier 2, in chip carrier
Two sides have increased hangs muscle newly, and lug boss is arranged in hangs muscle；I.e. newly-increased lock material structure design, can effectively eliminate in rib cutting process because of knife
Tool acts on the hidden danger so that plastic-sealed body cracking, meanwhile, thin neck notch design up and down is added on the left and right lug boss of hangs muscle
It is beneficial to prevention plastic-sealed body cracking.
Claims (3)
1. the hanging lead frame structure in the island integrated antenna package Zhong Ji, it is characterized in that：It include lead frame Ji Dao and pin, institute
It is empty to state thread between lead frame Ji Dao and pin, lead frame Ji Dao connection two sides hangs muscle.
2. the hanging lead frame structure in the island integrated antenna package Zhong Ji according to claim 1, it is characterized in that：The hangs muscle
It is equipped with gap structure.
3. the hanging lead frame structure in the island integrated antenna package Zhong Ji according to claim 1, it is characterized in that：The hangs muscle
Lug boss is set and locks material structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810758688.8A CN108878384A (en) | 2018-07-11 | 2018-07-11 | The hanging lead frame structure in the island integrated antenna package Zhong Ji |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810758688.8A CN108878384A (en) | 2018-07-11 | 2018-07-11 | The hanging lead frame structure in the island integrated antenna package Zhong Ji |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108878384A true CN108878384A (en) | 2018-11-23 |
Family
ID=64301185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810758688.8A Pending CN108878384A (en) | 2018-07-11 | 2018-07-11 | The hanging lead frame structure in the island integrated antenna package Zhong Ji |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108878384A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108831874A (en) * | 2018-08-07 | 2018-11-16 | 广东气派科技有限公司 | The encapsulating structure of integrated circuit |
| CN116441752A (en) * | 2023-04-27 | 2023-07-18 | 广州丰江微电子有限公司 | High-precision positioning lead frame cutting system |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080061413A1 (en) * | 2006-09-07 | 2008-03-13 | Ralf Otremba | Semiconductor component having a semiconductor die and a leadframe |
| CN205542762U (en) * | 2016-01-25 | 2016-08-31 | 广东气派科技有限公司 | Paster packaging lead frame structure of super thin space |
| CN106229271A (en) * | 2016-08-22 | 2016-12-14 | 四川明泰电子科技有限公司 | A kind of DIP multi-chip package lead frame and method for packing thereof |
| CN205911302U (en) * | 2016-07-29 | 2017-01-25 | 广东气派科技有限公司 | CPC packaging lead frame structure |
| CN205911303U (en) * | 2016-07-29 | 2017-01-25 | 广东气派科技有限公司 | CPC8 packaging lead frame structure of six pins |
-
2018
- 2018-07-11 CN CN201810758688.8A patent/CN108878384A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080061413A1 (en) * | 2006-09-07 | 2008-03-13 | Ralf Otremba | Semiconductor component having a semiconductor die and a leadframe |
| CN205542762U (en) * | 2016-01-25 | 2016-08-31 | 广东气派科技有限公司 | Paster packaging lead frame structure of super thin space |
| CN205911302U (en) * | 2016-07-29 | 2017-01-25 | 广东气派科技有限公司 | CPC packaging lead frame structure |
| CN205911303U (en) * | 2016-07-29 | 2017-01-25 | 广东气派科技有限公司 | CPC8 packaging lead frame structure of six pins |
| CN106229271A (en) * | 2016-08-22 | 2016-12-14 | 四川明泰电子科技有限公司 | A kind of DIP multi-chip package lead frame and method for packing thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108831874A (en) * | 2018-08-07 | 2018-11-16 | 广东气派科技有限公司 | The encapsulating structure of integrated circuit |
| CN116441752A (en) * | 2023-04-27 | 2023-07-18 | 广州丰江微电子有限公司 | High-precision positioning lead frame cutting system |
| CN116441752B (en) * | 2023-04-27 | 2023-11-21 | 广州丰江微电子有限公司 | High-precision positioning lead frame cutting system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181123 |
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| RJ01 | Rejection of invention patent application after publication |