CN108866594A - A kind of electroplate liquid and its electro-plating method for uranium foil nickel plating - Google Patents

A kind of electroplate liquid and its electro-plating method for uranium foil nickel plating Download PDF

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Publication number
CN108866594A
CN108866594A CN201810951085.XA CN201810951085A CN108866594A CN 108866594 A CN108866594 A CN 108866594A CN 201810951085 A CN201810951085 A CN 201810951085A CN 108866594 A CN108866594 A CN 108866594A
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China
Prior art keywords
electroplate liquid
plating
nickel
uranium
uranium foil
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CN201810951085.XA
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CN108866594B (en
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于宁文
罗志福
邓新荣
沈亦佳
向学琴
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China Institute of Atomic of Energy
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China Institute of Atomic of Energy
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/06Wires; Strips; Foils
    • C25D7/0614Strips or foils
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/12Electroplating: Baths therefor from solutions of nickel or cobalt
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/12Electroplating: Baths therefor from solutions of nickel or cobalt
    • C25D3/14Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
    • C25D3/16Acetylenic compounds

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

The invention belongs to electroless plating techniques fields, are related to a kind of electroplate liquid and its electro-plating method for uranium foil nickel plating.The electroplate liquid contains metal cation salt 400-500g/L, conductive salt 3-8g/L, brightener 10-50mg/L, leveling agent 5-20g/L;The pH of the electroplate liquid is 3.5-4.5.Electroplate liquid for the nickel plating of uranium foil of the invention has more ideal performance, can preferably carry out uranium foil nickel plating using electroplate liquid and its electro-plating method of the invention, keep the performance for the coating being prepared more excellent.Electroplate liquid and its electro-plating method of the invention can increase substantially covering power, reduce coating gap, so as to meet slightly enriched uranium foil target part target requirement, provide basis to complete target piece preparation.Meanwhile it is few using electroplate liquid of the invention and its electro-plating method completion plating process generation waste liquid, the pollution to environment can be reduced, environmental protection is conducive to.

Description

A kind of electroplate liquid and its electro-plating method for uranium foil nickel plating
Technical field
The invention belongs to electroless plating techniques fields, are related to a kind of electroplate liquid and its electro-plating method for uranium foil nickel plating.
Background technique
Can using slightly enriched uranium target LEU (235U mass percentage content 19.75%) or high-enriched uranium target HEU (235U mass hundred Divide and be greater than 90.0% than content) production fission molybdenum99Mo, but slightly enriched uranium target LEU uranium core and high-enriched uranium target HEU uranium core are different. Due to slightly enriched uranium target LEU uranium core using pure metal LEU (235U mass percentage content 19.75%), it is possible to it is rolled into very thin Uranium foil, and uranium foil is clipped in two concentric circles aluminum barrel interlayers, outer aluminum barrel-uranium foil-interior aluminum barrel is caused closely to be adjacent to.And anti- Fission fragment damage in order to prevent in heap irradiation process is answered, the slightly enriched uranium surface target LEU is needed to cover one layer of fission reflective barrier layer.
Material of the nickel as fission reflective barrier layer is generally selected, fission is prepared using the method in uranium surface electroless nickel layer Reflective barrier layer.In order to be conducive to the heat that target piece discharges the generation of uranium foil in irradiation process, it is desirable that uranium foil surface nickel coating and uranium Foil is tightly combined and thickness is uniform.And according to the requirement of production uranium target, the superiority and inferiority of nickel-plating bath, electroplating time, plating behaviour Complexity of work etc. has important influence to the quality of uranium foil surface nickel coating.
Therefore, the electroplate liquid for selecting a kind of Optimum formulae is the key that ensure uranium foil coating high quality.Ideal electroplate liquid Answer metal ions cathodic reduction polarization larger, grain size is small, gap is small, coating that is fine and close, having good adhesion to obtain; Answer stable and electrically conductive property good;It should make the velocity-stabilization of metal electrodeposition, struck capacity is larger;Answer at low cost, small toxicity.
Summary of the invention
Primary and foremost purpose of the invention is to provide a kind of electroplate liquid for uranium foil nickel plating, can have more ideal property Can, and it can be preferably used for uranium foil nickel plating, keep the performance for the coating being prepared more excellent.
In order to achieve this, the present invention provides a kind of electroplate liquid for uranium foil nickel plating, institute in the embodiment on basis The electroplate liquid stated contains metal cation salt 400-500g/L, conductive salt 3-8g/L, brightener 10-50mg/L, leveling agent 5-20g/ L;The pH of the electroplate liquid is 3.5-4.5.
The principle of the present invention is as follows:
The heat that release uranium foil generates is conducted in irradiation process in order to be conducive to target piece, it is desirable that uranium foil surface nickel thickness of coating Uniformly.Metallic uranium easily aoxidizes in air and can adsorb the impurity such as greasy dirt;And uranium also easily aoxidizes in aqueous solution, makes The more coarse and coating hole of conventional DC coating crystallization obtained is obvious, to directly influence the quality of nickel coating.Electricity The covering power of plating solution has very important influence to the quality of coating.
Shown in the calculation formula such as formula (1) of general covering power.The inverse (plating solution conductivity) of the resistivity of electroplate liquid with The product of the ratio (size of cathodic polarization) of cathodic overvoltage, current density change determines covering power.The conductivity of electroplate liquid Higher, cathodic polarization is bigger, and covering power is higher.
Covering power=1/ ρ Δ n/ Δ i (1)
In formula, the resistivity of P=electroplate liquid, the variation of Δ i=current density, the variation of Δ n=concentration.
By formula (1) it is found that in order to improve the covering power of uranium foil surface nickel layer, select suitable electro-deposition inhibitor (poly- Close object) and leveling agent be very important.In addition, covering power also relies on cathode-current density, in operation it must also be noted that Control current density.
Metal cation salt, that is, main salt in plating solution formula of the invention is for carrying out coating deposition, and concentration is to coating Degree of roughness, current density and electroplating velocity have an impact.
Conductive salt in plating solution formula of the invention can promote anodic solution.Anion (such as chloride ion) in conductive salt Concentration is too low to will lead to anodic passivity;Excessive concentration will increase coating internal stress, influence quality of coating.
Brightener in plating solution formula of the invention assigns miniaturization precipitation particles coating bright property and flexibility, simultaneously Flatten coating.When uranium foil is immersed in electroplate liquid, brightener is equably adsorbed on its surface, with coating in electroplating process Grow up and coating surface is made to become smaller, electrodeposit reaction can be promoted.
Leveling agent in plating solution formula of the invention can reduce liquid-gas, liquid-solid interface tension, and bubble hydrogen is made to be difficult to stop Cathode surface is stayed in, to reduce the formation of pin hole.Under the action of leveling agent, on uranium foil surface, the anion of Specific adsorption exists Monomolecular film is formed under electrostatic interaction, alleviates local current convergence, to have the function that eliminate stress, is plated to improve Ability.
In a preferred embodiment, the present invention provides a kind of electroplate liquid for uranium foil nickel plating, wherein described Metal cation salt is selected from one or more of nickel sulfamic acid, methane sulfonic acid nickel, nickel sulfate.
In a preferred embodiment, the present invention provides a kind of electroplate liquid for uranium foil nickel plating, wherein described Conductive salt is selected from nickel chloride and/or nickelous bromide.
In a preferred embodiment, the present invention provides a kind of electroplate liquid for uranium foil nickel plating, wherein described Brightener is selected from silica and/or sodium vinyl sulfonate.
In a preferred embodiment, the present invention provides a kind of electroplate liquid for uranium foil nickel plating, wherein described The average particle size of brightener is 0.01-1 μm.
In a preferred embodiment, the present invention provides a kind of electroplate liquid for uranium foil nickel plating, wherein described Leveling agent is selected from dodecyl sodium sulfate and/or N, N- diethyl propargylamine sulfate.
A second object of the present invention is to provide a kind of methods for carrying out the nickel plating of uranium foil using aforementioned electroplate liquid, with can be more Good carry out uranium foil nickel plating, keeps the performance for the coating being prepared more excellent.
In order to achieve this, basis embodiment in, the present invention provide it is a kind of using aforementioned electroplate liquid progress uranium foil Cathode uranium foil is placed in aforementioned electroplate liquid with anode nickel foil and is electroplated by the method for nickel plating, the method.
In a preferred embodiment, the present invention provides a kind of side that the nickel plating of uranium foil is carried out using aforementioned electroplate liquid Method, wherein electroplating temperature is 35-50 DEG C.
In a preferred embodiment, the present invention provides a kind of side that the nickel plating of uranium foil is carried out using aforementioned electroplate liquid Method, wherein electroplating voltage is 10-30V, electroplating current density 10-30A/dm2, electroplating time is 20-40 minutes.
In a preferred embodiment, the present invention provides a kind of side that the nickel plating of uranium foil is carried out using aforementioned electroplate liquid Method is wherein stirred continuously in electroplating process, to reduce the generation of polymer.
The beneficial effects of the present invention are, the electroplate liquid for the nickel plating of uranium foil of the invention has more ideal performance, Uranium foil nickel plating can be preferably carried out using electroplate liquid and its electro-plating method of the invention, makes the performance for the coating being prepared more It is excellent.
Electroplate liquid and its electro-plating method of the invention can increase substantially covering power, reduce coating gap, so as to Enough meet slightly enriched uranium foil target part target requirement, provides basis to complete target piece preparation.Meanwhile using electroplate liquid of the invention and its Electro-plating method completion plating process generation waste liquid is few, can reduce the pollution to environment, be conducive to environmental protection.
Detailed description of the invention
Fig. 1 is the Electronic Speculum testing result for the nickel coating that the electroplate liquid of the formula 1 of embodiment 1 is electroplated.
Fig. 2 is the Electronic Speculum testing result for the nickel coating that the electroplate liquid of the formula 2 of embodiment 1 is electroplated.
Specific embodiment
A specific embodiment of the invention is made further instructions with attached drawing with reference to embodiments.
Embodiment 1:The preparation of uranium foil surface nickel coating
Electroplate liquid is prepared after mixing according to the formula of such as the following table 1.
1 plating solution formula of table composition
Note:The average particle size of silica and sodium vinyl sulfonate is 0.1-1 μm.
Cathode uranium foil is drawn with anode nickel foil with copper conductor, is suspended in the electroplate liquid of table 1 being respectively formulated respectively, not (600rpm) is electroplated under disconnected stirring, and specific plating conditions are as shown in table 2 below.
Table 2 is respectively formulated the plating conditions of electroplate liquid
Embodiment 2:The detection of nickel coating
Thickness of coating is carried out to the nickel coating that the electroplate liquid of each formula number according to embodiment 1 is electroplated and (uses X-ray Calibrator is detected) it is examined with plating layer porosity (according to patch filter paper method detection as defined in GB 5935), as a result such as the following table 3 institute Show.In addition, the Electronic Speculum testing result difference for the nickel coating that the electroplate liquid of formula 1,2 is electroplated is as shown in Figure 1, 2.
The testing result of 3 nickel coating of table
Obviously, various changes and modifications can be made to the invention without departing from essence of the invention by those skilled in the art Mind and range.If in this way, belonging to the model of the claims in the present invention and its equivalent technology to these modifications and changes of the present invention Within enclosing, then the present invention is also intended to include these modifications and variations.Above-described embodiment or embodiment are only to the present invention For example, the present invention can also be implemented with other ad hoc fashions or other particular form, without departing from of the invention Main idea or substantive characteristics.Therefore, the embodiment of description is regarded as illustrative and non-limiting in any way.This The range of invention should be illustrated that any variation equivalent with the intention and range of claim also should include by appended claims Within the scope of the invention.

Claims (10)

1. a kind of electroplate liquid for uranium foil nickel plating, it is characterised in that:The electroplate liquid contains metal cation salt 400-500g/ L, conductive salt 3-8g/L, brightener 10-50mg/L, leveling agent 5-20g/L;The pH of the electroplate liquid is 3.5-4.5.
2. electroplate liquid according to claim 1, it is characterised in that:The metal cation salt is selected from nickel sulfamic acid, first One or more of base nickel sulphonic acid, nickel sulfate.
3. electroplate liquid according to claim 1, it is characterised in that:The conductive salt is selected from nickel chloride and/or nickelous bromide.
4. electroplate liquid according to claim 1, it is characterised in that:The brightener is selected from silica and/or ethylene Base sodium sulfonate.
5. electroplate liquid according to claim 1, it is characterised in that:The average particle size of the brightener is 0.01-1 μm.
6. electroplate liquid according to claim 1, it is characterised in that:The leveling agent be selected from dodecyl sodium sulfate and/ Or N, N- diethyl propargylamine sulfate.
7. a kind of method of uranium foil nickel plating, it is characterised in that:Cathode uranium foil is placed in right with anode nickel foil and wanted by the method It asks and is electroplated in electroplate liquid described in any one of 1-6.
8. according to the method described in claim 7, it is characterized in that:Electroplating temperature is 35-50 DEG C.
9. according to the method described in claim 7, it is characterized in that:Electroplating voltage is 10-30V, electroplating current density 10- 30A/dm2, electroplating time is 20-40 minutes.
10. according to the method described in claim 7, it is characterized in that:It is stirred continuously in electroplating process, to reduce the production of polymer It is raw.
CN201810951085.XA 2018-08-20 2018-08-20 Electroplating solution for uranium foil nickel plating and electroplating method thereof Active CN108866594B (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3726768A (en) * 1971-04-23 1973-04-10 Atomic Energy Commission Nickel plating baths containing aromatic sulfonic acids
CN102041528A (en) * 2009-10-13 2011-05-04 北京中科三环高技术股份有限公司 Additive for bright nickel plating technology for permanent magnetic material
CN106400059A (en) * 2016-09-26 2017-02-15 河南理工大学 Electrolyte additive used for electroforming high hardness and low stress nickel workpiece

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3726768A (en) * 1971-04-23 1973-04-10 Atomic Energy Commission Nickel plating baths containing aromatic sulfonic acids
CN102041528A (en) * 2009-10-13 2011-05-04 北京中科三环高技术股份有限公司 Additive for bright nickel plating technology for permanent magnetic material
CN106400059A (en) * 2016-09-26 2017-02-15 河南理工大学 Electrolyte additive used for electroforming high hardness and low stress nickel workpiece

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