CN108859149A - Forming method, water proof ring and the electronic product accessory of water proof ring - Google Patents
Forming method, water proof ring and the electronic product accessory of water proof ring Download PDFInfo
- Publication number
- CN108859149A CN108859149A CN201810633885.7A CN201810633885A CN108859149A CN 108859149 A CN108859149 A CN 108859149A CN 201810633885 A CN201810633885 A CN 201810633885A CN 108859149 A CN108859149 A CN 108859149A
- Authority
- CN
- China
- Prior art keywords
- water proof
- silica gel
- proof ring
- electronic product
- ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 91
- 238000000034 method Methods 0.000 title claims abstract description 25
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 83
- 239000000741 silica gel Substances 0.000 claims abstract description 78
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 78
- 239000003292 glue Substances 0.000 claims abstract description 33
- 238000000465 moulding Methods 0.000 claims abstract description 11
- 238000004073 vulcanization Methods 0.000 claims abstract description 8
- 230000001680 brushing effect Effects 0.000 claims abstract description 7
- 238000004026 adhesive bonding Methods 0.000 claims abstract 2
- 230000002093 peripheral effect Effects 0.000 claims description 15
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 239000010703 silicon Substances 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 abstract description 8
- 238000004140 cleaning Methods 0.000 abstract description 5
- 239000000463 material Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000003825 pressing Methods 0.000 description 4
- 239000000499 gel Substances 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005243 fluidization Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Abstract
The present invention provides a kind of forming methods of water proof ring, are put into the electronic product accessory type chamber of waterproof ring mould after electronic product accessory is needed molding position brushing glue；Solid-state silica gel is cut into predetermined amount and is placed in the feed opening of waterproof ring mould；It is intracavitary to squeeze the waterproof ring that the solid-state silica gel in feed opening flows into solid-state silica gel in waterproof ring mould, passes through glue gluing between solid-state silica gel and electronic product accessory；Vulcanization reaction is occurred by high temperature in waterproof ring mould by the intracavitary solid-state silica gel of waterproof ring, to be integrally formed out silica gel water proof ring on electronic product accessory, therefore, the intracavitary residue glue of waterproof ring is less, the convenient cleaning to waterproof ring chamber.The present invention also provides water proof rings made of a kind of forming method water proof ring, and integrally formed with the electronic product accessory of water proof ring.
Description
Technical field
The present invention relates to the accessory technical field of electronic product more particularly to a kind of forming methods of water proof ring, water proof ring
And electronic components.
Background technique
Existing electronic device, such as mobile phone, tablet computer are provided with the electronic products accessory such as Kato and thimble, mesh
Before, the preparation method of the waterproof construction on Kato and thimble generally there are several types of：The good silica gel ring of formed solid is inserted in institute
It states on Kato or thimble, liquid-state silicon gel is molded on the Kato or thimble, and will by the way of point glue sticking
Silica gel is directly put on the Kato or thimble.However, the silica gel ring of above-mentioned formed solid is during the manufacturing due to public affairs
Poor problem may will affect the waterproof effect for the silica gel ring being socketed on the Kato or thimble；It is molded into using liquid-state silicon gel
Type method is easy to appear the intracavitary residue glue of type of excessive glue and waterproof ring mould not easy cleaning etc. since the mobility of liquid-state silicon gel is high
Problem and the waterproof performance and production efficiency for influencing silica gel ring；And by the way of point glue sticking production efficiency is low and precision
It is low, to keep the waterproof performance of silica gel ring lower.
Summary of the invention
The purpose of the present invention is to provide a kind of waterproof performance, the intracavitary residue glue of high and waterproof ring mould type is less prevents
The forming method of hydrosphere, the water proof ring made of the forming method of the water proof ring, and it is provided with the electronics of the water proof ring
Product accessories.
In order to solve the above-mentioned technical problems, the present invention provides a kind of forming methods of water proof ring, by electronic product accessory
It is put into the electronic product accessory type chamber of waterproof ring mould after needing molding position brushing glue；Solid-state silica gel is cut into predetermined
It measures and is placed in the feed opening of the waterproof ring mould；Squeezing the solid-state silica gel in the feed opening makes the solid-state silica gel stream
The dynamic waterproof ring entered in the waterproof ring mould is intracavitary, passes through glue between the solid-state silica gel and the electronic product accessory
Glue closes；Vulcanization reaction is occurred by high temperature in the waterproof ring mould by the intracavitary solid-state silica gel of the waterproof ring,
To be integrally formed out silica gel water proof ring on the electronic product accessory.
The present invention provides a kind of water proof rings, are made of the forming method of above-mentioned water proof ring, and the water proof ring includes connecting
Female connector body and the bulge loop for being convexly equipped in the outer peripheral surface for connecting body, the connector sleeve body by integral forming is in electronic product accessory
On, the bulge loop can make waterproof performance more stable.
The present invention also provides a kind of electronic product accessories, including ontology and above-mentioned water proof ring, offer on the ontology
Container, the water proof ring are shaped in the container by solid-state silica gel.
The forming method of water proof ring of the present invention is placed with the solid-state silicon of predetermined amount in the feed opening of the waterproof ring mould
Glue, squeezing the solid-state silica gel in the feed opening makes the solid-state silica gel flow into the waterproof ring in the waterproof ring mould
It is intracavitary, and the electronic product accessory is shaped in by the way that vulcanization reaction is occurred by high temperature in the waterproof ring mould
On.Waterproof ring due to flowing into the waterproof ring mould it is intracavitary be solid-state silica gel, intracavitary residual of the waterproof ring
Glue is less, convenient to clean to the waterproof ring chamber；And excessive glue problem will not occur, can improve keeps the water proof ring anti-
Aqueous energy.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in embodiment
Attached drawing is briefly described, it should be apparent that, the accompanying drawings in the following description is some embodiments of the present invention, general for this field
For logical technical staff, without creative efforts, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is the flow chart of the forming method of water proof ring of the present invention.
Fig. 2 is the structural schematic diagram of a wherein embodiment for the molding waterproof ring mould of water proof ring of the present invention.
Fig. 3 is that structure of the water proof ring of the present invention under the molding water proof ring mold clamping state of a wherein embodiment is shown
It is intended to.
Fig. 4 is the structural schematic diagram of a wherein embodiment for water proof ring of the present invention.
Fig. 5 is the dimensional decomposition structure diagram of a wherein embodiment for accessory of the invention.
Fig. 6 is the assembling figure of Fig. 5.
Fig. 7 is the schematic perspective view of another embodiment of water proof ring of the present invention.
Fig. 8 is the structural schematic diagram of another embodiment of the molding waterproof ring mould of water proof ring of the present invention.
Fig. 9 is structural representation of the water proof ring of the present invention under the molding water proof ring mold clamping state of another embodiment
Figure.
Figure 10 is the structural schematic diagram of another embodiment of water proof ring of the present invention.
Figure 11 is the dimensional decomposition structure diagram of another embodiment of accessory of the invention.
Figure 12 is the assembling figure of Figure 11.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under that premise of not paying creative labor
Embodiment shall fall within the protection scope of the present invention.
In the description of the embodiment of the present invention, it is to be understood that the orientation of instructions such as term " on ", "lower" " left side " " right side " or
Positional relationship is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description of the present invention and simplification of the description, without
It is not to imply or device or element that instruction is signified must have a particular orientation, be constructed and operated in a specific orientation, therefore not
It can be interpreted as limitation of the present invention.
Also referring to Fig. 1 to Fig. 6, the present invention provides a kind of molding dies of water proof ring, include the following steps：
Step S1：Electronic product accessory 40 is needed to be put into after molding position brushing glue the electronics of waterproof ring mould 20
In product accessories type chamber 26；
Step S2：Solid-state silica gel 30 is cut into predetermined amount and is placed in the feed opening 221 of the waterproof ring mould 20；
Step S3：Squeezing the solid-state silica gel 30 in the feed opening 221, to flow into the solid-state silica gel 30 described anti-
In waterproof ring chamber 28 in hydrosphere mold 20, pass through glue 60 between the solid-state silica gel 30 and the electronic product accessory 40
It is glued；
Step S4：By the solid-state silica gel 30 in the waterproof ring chamber 28 by high temperature in the waterproof ring mould 20
Vulcanization reaction occurs, to be integrally formed out silica gel water proof ring 70 on the electronic product accessory 40.
The molding die of water proof ring of the present invention is placed with consolidating for predetermined amount in the feed opening 221 of the waterproof ring mould 20
State silica gel 30, squeezing the solid-state silica gel 30 in the feed opening 221 makes the solid-state silica gel 30 flow into the water proof ring mould
In waterproof ring chamber 28 in tool 20, and it is integrally formed by the way that vulcanization reaction is occurred by high temperature in the waterproof ring mould 20
In on the electronic product accessory 40.In waterproof ring chamber 28 due to flowing into the waterproof ring mould 20 is solid-state silica gel
30, therefore, the residue glue in the waterproof ring chamber 28 is less, the convenient cleaning to the waterproof ring chamber 28；And it will not go out
Existing excessive glue problem, can improve the waterproof performance of the water proof ring.
Specifically, as shown in Fig. 2, the waterproof ring mould 20 includes the upper mold 22 and lower mold that can be buckled togather
24, the electronic product accessory type chamber 26 and the waterproof ring chamber are formed after the upper mold 22 and lower 24 make-up of mold
28, the electronic product accessory type chamber 26 is connected with the waterproof ring chamber 28.The knot of the electronic product accessory type chamber 26
Structure is consistent with the structure of the electronic product accessory 40.
In the present embodiment, the feed opening 221 is opened on the upper mold 22, and the upper mold 22 is also provided with connection
Glue feeding channel 223 between the feed opening 221 and the waterproof ring chamber 28, the solid-state silica gel 30 in the feed opening 221
Enter in the waterproof ring chamber 28 in flow-like after squeezing and by the glue feeding channel 223.
The mold 22 further includes material pressing device, and the material pressing device is used for the solid-state silica gel in the feed opening 221
30 squeeze to the waterproof ring chamber 28.The material pressing device includes a compressing rod 80, the compressing rod 80 be inserted into it is described into
When expecting in hole 221 and the glue feeding channel 223, the solid-state silica gel 30 in the feed opening 221 is extruded and flows into the waterproof
In ring chamber 28.
As shown in Figures 5 and 6, the electronic product accessory 40 in the present embodiment is a thimble, and the thimble includes an ontology
42 and the silica gel water proof ring 70.Cap body of the ontology 42 including a body of rod 422 and the one end for being convexly equipped in the body of rod 422
424.A container 425, the silica gel waterproof are offered on the outer peripheral surface of the one end of the body of rod 422 far from the cap body 424
Circle 70 is shaped in the container 425.
As shown in figure 4, the silica gel water proof ring 70 in the present embodiment includes a connection body 72 and is convexly equipped in the connector sleeve
One bulge loop 74 of one end of the outer peripheral surface of body 72.The connection body 72 is shaped in the container 425, the bulge loop
The 74 protrusion containers 425, the bulge loop 74 can make the waterproof performance of the silica gel water proof ring 70 more stable.The connector sleeve
Body 72 is in cylinder-shaped, and the bulge loop 74 extends along the periphery of the connection body 72, and the outer surface of the bulge loop 74 is circular arc
Face, to facilitate sealing against for the silica gel water proof ring 70 and outer member.
As shown in fig. 6, when the silica gel water proof ring 70 is shaped on the ontology 42, the silica gel water proof ring 70
The outer surface of connection body 72 flushed with the outer peripheral surface of the body of rod 422, the bulge loop 74 of the silica gel water proof ring 70 protrudes institute
State the outer peripheral surface of the body of rod 422.
The forming process of silica gel water proof ring 70 on thimble in the present embodiment is as follows：
Select suitable solid-state silica gel, that is, select suitable solid-state silica gel materials；
The water proof ring mould is placed in by the inner surface brushing glue of the container 425 of the thimble, and by the thimble
In the electronic product accessory type chamber 26 of tool 20, at this point, the waterproof of the corresponding waterproof ring mould 20 of the container 425 of the thimble
Ring chamber 28；
The solid-state silica gel materials of predetermined amount are cut into the feed opening 221 that sizeable fritter is put into the water proof ring mould 20
It is interior；
The solid-state silica gel materials in the feed opening 221, which are squeezed, by the compressing rod 80 of material pressing device is allowed to fluidisation through institute
It states glue feeding channel 223 to enter in the waterproof ring chamber 28, the solid-state silica gel materials is made to be contained in the container of the thimble
In 425, the glue on inner surface that the solid-state silica gel materials pass through the container 425 of the thimble is pasted on the thimble
On；
By high temperature sulphur is occurred into for the solid-state silica gel materials in the waterproof ring chamber 28 in the waterproof ring mould 20
Change reaction, makes to be integrally formed the silica gel water proof ring 70 for providing the connector sleeve body 72 and bulge loop 74 on the thimble, at this point, institute
The outer surface for stating the connection body 72 of the silica gel water proof ring 70 of silica gel water proof ring 70 and the outer peripheral surface of the body of rod 422 are neat
Flat, the bulge loop 74 of the silica gel water proof ring 70 protrudes the outer peripheral surface of the body of rod 422；
After point mould, the thimble with the silica gel water proof ring 70 is taken out, and tests to the thimble, tear side and subsequent open
Processing.
Silica gel water proof ring 70 on thimble in the present embodiment is extruded by solid-state silica gel flows into the water proof ring mould
In the waterproof ring chamber 28 of tool 20, and institute is shaped in by the way that vulcanization reaction is occurred by high temperature in the waterproof ring mould 20
It states on thimble.Therefore, the residue glue in the waterproof ring chamber 28 of the mold 20 is less, easy cleaning, and high production efficiency, waterproof
Performance is good.
Referring to Fig. 7, Fig. 7 is the schematic perspective view of another embodiment of water proof ring of the present invention.In another embodiment
In, the capillary groove 76 of annular can also be offered on the outer surface of the bulge loop 74 of the silica gel water proof ring 70 of the thimble, it is described anti-
Sink 76 can be further improved the waterproof performance of the silica gel water proof ring 70 of the thimble.
Also referring to Fig. 1 and Fig. 8 to Figure 12, the forming method of another embodiment of water proof ring and above-mentioned wherein one
The forming method of embodiment is identical, the difference is that：Electronic product accessory type chamber in the mold 20 of another embodiment
The electronic product accessory type chamber 26 and waterproof ring chamber of 26a and waterproof ring chamber 28a and the mold 20 of an above-mentioned wherein embodiment
28 shape is different, and the water proof ring 70a structure obtained from is slightly different.
In another embodiment, the forming method of the water proof ring 70a also includes the following steps：
Step S1：Electronic product accessory 40a is needed to be put into after molding position brushing glue the electricity of waterproof ring mould 20
In sub- product accessories type chamber 26a；
Step S2：Solid-state silica gel 30 is cut into predetermined amount and is placed in the feed opening 221 of the waterproof ring mould 20；
Step S3：Squeezing the solid-state silica gel 30 in the feed opening 221, to flow into the solid-state silica gel 30 described anti-
In waterproof ring chamber 28a in hydrosphere mold 20, pass through glue between the solid-state silica gel 30 and the electronic product accessory 40a
60 is glued；
Step S4：Make the solid-state silica gel 30 in the waterproof ring chamber 28a in the waterproof ring mould 20 by high temperature and
Vulcanization reaction occurs, to be integrally formed out silica gel water proof ring 70a on the electronic product accessory 40a.
The forming method of the water proof ring 70a of another embodiment of the present invention makes in the waterproof ring chamber 28a of mold 20
Residual silicon is also less, and excessive glue problem will not occur in easy cleaning mold, and can improve makes the water proof ring waterproof performance.
Specifically, as can be seen from figures 8 and 9, the waterproof ring mould 20 include the upper mold 22 that can be buckled togather and
The electronic product accessory type chamber 26a and described anti-is formed after lower mold 24, the upper mold 22 and lower 24 make-up of mold
Hydrosphere type chamber 28a, the electronic product accessory type chamber 26a are connected with the waterproof ring chamber 28a.The electronic product accessory
The structure of type chamber 26a is consistent with the structure of the electronic product accessory 40a.
As shown in Figure 10 to Figure 12, the electronic product accessory 40a in the present embodiment is a Kato, and the Kato includes one
The body 42a and silica gel water proof ring 70a.The ontology 42a includes a bracket 422a and the one end for being convexly equipped in the bracket 422a
Card cap 424a.The bracket 422a offers a container 425a, institute on the outer peripheral surface of one end of the card cap 424a
Silica gel water proof ring 70a is stated to be shaped in the container 425a.
Silica gel water proof ring 70a in the present embodiment includes a connection body 72a and is convexly equipped in the outer of the connection body 72a
One bulge loop 74a of the side of circumferential surface.The connection body 72a is shaped in the container 425a, and the bulge loop 74a is convex
The container 425a out, that is, the bulge loop 74a protrudes the outer peripheral surface of the bracket 422a.The bulge loop 74a can make the silicon
The waterproof performance of glue water proof ring 70a is more stable.The connection body 72a is in the ring body of strip, and the bulge loop 74a is along the company
The periphery of female connector body 72 extends, and the bulge loop 74a is provided with inclined slide guide face facing away from the side of the connection body 72a
77, that is, the bulge loop 74a is provided with the slide guide face 77 facing away from the side of the card cap 425a.When the Kato is inserted into electronics
When in the clamping groove of device, slide guide is played in the slide guide face 77, facilitates the Kato to be inserted into the clamping groove, and described convex
Ring 74a is closely connected to the inner surface of the clamping groove, to have the function of waterproof and dust-proof.
The forming process of the silica gel water proof ring 70a of the present embodiment is identical as above-mentioned silica gel water proof ring 70, and details are not described herein.
In other embodiments, corresponding production can be opened up with shape in mold 20 according to the structure of electronic product accessory
Product type chamber and the waterproof ring chamber, are shaped in different shape for silica gel water proof ring, different types of electronic product is matched
On part.
It is the embodiment of the embodiment of the present invention above, it is noted that those skilled in the art are come
It says, without departing from the principles of the embodiments of the present invention, several improvements and modifications can also be made, these improvements and modifications
It is considered as protection scope of the present invention.
Claims (14)
1. a kind of forming method of water proof ring, which is characterized in that include the following steps：
Step S1：Electronic product accessory is needed to be put into after molding position brushing glue the electronic product accessory of waterproof ring mould
In type chamber；
Step S2：Solid-state silica gel is cut into predetermined amount and is placed in the feed opening of the waterproof ring mould；
Step S3：Squeezing the solid-state silica gel in the feed opening flows into the solid-state silica gel in the waterproof ring mould
Waterproof ring is intracavitary, passes through glue gluing between the solid-state silica gel and the electronic product accessory；
Step S4：It is anti-that vulcanization is occurred by high temperature in the waterproof ring mould by the intracavitary solid-state silica gel of the waterproof ring
It answers, to be integrally formed out silica gel water proof ring on the electronic product accessory.
2. the forming method of water proof ring according to claim 1, which is characterized in that in the step S1, the electronics
Product accessories offer container in the position for needing to form the silica gel water proof ring, in the inner surface brushing adhesive of the container
Water.
3. the forming method of water proof ring according to claim 1, which is characterized in that in the step S3, the electronics
Product accessories offer container, the container and the waterproof ring mould in the position for needing to form the silica gel water proof ring
Interior waterproof ring chamber connection, the solid-state silica gel of mobility flow into the space between the container and the waterproof ring chamber
It is interior.
4. the forming method of water proof ring according to claim 1, which is characterized in that in the step S3, the charging
Glue feeding channel is offered between hole and the waterproof ring chamber, mobility solid-state silicon enters the waterproof by the glue feeding channel
Ring is intracavitary.
5. the forming method of water proof ring according to claim 1, which is characterized in that further include step after step s4
Suddenly：The upper die body of the waterproof ring mould is separated with lower mold body, takes out the electronic product accessory for having the silica gel water proof ring,
It is tested and tears side open.
6. a kind of water proof ring, which is characterized in that using the forming method of water proof ring according to any one of claims 1 to 5
It is made, the water proof ring includes the bulge loop for the outer peripheral surface for connecting body and being convexly equipped in the connection body, the connection body one
It is body formed on electronic product accessory, the bulge loop can make waterproof performance more stable.
7. water proof ring according to claim 6, which is characterized in that the outer surface of the bulge loop is arc surface.
8. water proof ring according to claim 6, which is characterized in that offer capillary groove on the outer surface of the bulge loop.
9. water proof ring according to claim 6, which is characterized in that the bulge loop is arranged facing away from the side of the connection body
There is slide guide face.
10. a kind of electronic product accessory, which is characterized in that the waterproof including ontology and as described in any one of claim 6 ~ 9
It encloses, offers container on the ontology, the water proof ring is shaped in the container by solid-state silica gel.
11. electronic product accessory according to claim 10, which is characterized in that the ontology is thimble, the thimble packet
It includes the body of rod and is convexly equipped in the cap body of one end of the body of rod, the container is opened in the one end of the body of rod far from the cap body
Outer peripheral surface on.
12. electronic product accessory according to claim 11, which is characterized in that the appearance of the connection body of the water proof ring
Face is flushed with the outer peripheral surface of the body of rod, and the bulge loop of the water proof ring protrudes the outer peripheral surface of the body of rod.
13. electronic product accessory according to claim 10, which is characterized in that the ontology is Kato, the Kato packet
Bracket and card cap are included, the container is opened in the bracket on the outer peripheral surface of one end of the card cap.
14. electronic product accessory according to claim 13, which is characterized in that the bulge loop of the water proof ring protrudes the support
The outer peripheral surface of frame, the bulge loop are provided with slide guide face facing away from the side of the card cap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810633885.7A CN108859149A (en) | 2018-06-19 | 2018-06-19 | Forming method, water proof ring and the electronic product accessory of water proof ring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810633885.7A CN108859149A (en) | 2018-06-19 | 2018-06-19 | Forming method, water proof ring and the electronic product accessory of water proof ring |
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|---|---|
| CN108859149A true CN108859149A (en) | 2018-11-23 |
Family
ID=64339944
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810633885.7A Pending CN108859149A (en) | 2018-06-19 | 2018-06-19 | Forming method, water proof ring and the electronic product accessory of water proof ring |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111092337A (en) * | 2019-12-26 | 2020-05-01 | 江苏道融电子科技有限公司 | Automobile high-pressure waterproof connector and production process thereof |
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| US20170043515A1 (en) * | 2015-08-13 | 2017-02-16 | Chih-Chia WEI | Thermoplastic Shell Assembly Formed Integrally by Embedding and Injection and Method for Manufacturing the Shell Assembly |
| CN205122879U (en) * | 2015-11-03 | 2016-03-30 | 上海华章信息科技有限公司 | Waterproof SIM card cassette of waterproof construction and side -draw formula |
| CN207116802U (en) * | 2017-06-29 | 2018-03-16 | 信音电子(中国)股份有限公司 | Improve the electric connector in waterproof construction |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111092337A (en) * | 2019-12-26 | 2020-05-01 | 江苏道融电子科技有限公司 | Automobile high-pressure waterproof connector and production process thereof |
| CN111092337B (en) * | 2019-12-26 | 2021-06-08 | 江苏道融电子科技有限公司 | Automobile high-pressure waterproof connector and production process thereof |
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Application publication date: 20181123 |