CN108856567A - Diode bending pins mechanism - Google Patents
Diode bending pins mechanism Download PDFInfo
- Publication number
- CN108856567A CN108856567A CN201810909844.6A CN201810909844A CN108856567A CN 108856567 A CN108856567 A CN 108856567A CN 201810909844 A CN201810909844 A CN 201810909844A CN 108856567 A CN108856567 A CN 108856567A
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- CN
- China
- Prior art keywords
- bending
- machine table
- plate
- placing groove
- driven wheel
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F1/00—Bending wire other than coiling; Straightening wire
- B21F1/004—Bending wire other than coiling; Straightening wire by means of press-type tooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F23/00—Feeding wire in wire-working machines or apparatus
- B21F23/005—Feeding discrete lengths of wire or rod
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Wire Processing (AREA)
Abstract
The present invention relates to electric elements processing technique fields, specially diode bending pins mechanism, including bending mechanism, bending mechanism includes machine table, placing groove is provided in machine table, machine table two sides are provided with bending plate, connecting rod is provided between bending plate and machine table, connecting rod one end is fixedly connected with machine table, the connecting rod other end and bending plate are hinged, bending plate is provided with bending slot close to the side of machine table, winding roller is provided with below placing groove, winding roller and machine table are rotatablely connected, the free end of bending plate is connected with rope between winding roller, hold-down mechanism is provided with above machine table, hold-down mechanism includes thread bush, threaded rod is threaded in thread bush vertically, threaded rod bottom end is rotatably connected to pressing plate, pressing plate interval offsets with machine table.It is consistent that the present invention solves the problems, such as that existing bending device not can guarantee semiconductor bending degree.
Description
Technical field
The present invention relates to electric elements processing technique fields, specially diode bending pins mechanism.
Background technique
Semiconductor refers to material of the electric conductivity between conductor and insulator under room temperature.Semiconductor is in radio, TV
It has a wide range of applications on machine and thermometric.If diode is exactly the device using semiconductor fabrication.No matter from science and technology or warp
From the perspective of Ji development, the importance of semiconductor is all very huge.Today most electronic product, as computer,
Core cell in mobile phone or digital audio tape all has extremely close association with semiconductor.
It in the process of semiconductor, needs to bend the pin of semiconductor, existing bending process mostly uses
Manual operation, it is inefficient.Although these equipment are chiefly used in assembly line processing on the market there is also some bending devices,
The degree that not can guarantee each semiconductor bending in process is consistent, to influence the quality of semiconductor.
Summary of the invention
The invention is intended to provide diode bending pins mechanism, semiconductor bending not can guarantee to solve existing bending device
The consistent problem of degree.
In order to achieve the above object, the present invention provides the following technical solutions：
Diode bending pins mechanism, including bending mechanism, bending mechanism include machine table, and placement is provided in machine table
Slot, machine table two sides are provided with bending plate, and connecting rod is provided between bending plate and machine table, and connecting rod one end is fixed with machine table
Connection, the connecting rod other end and bending plate are hinged, and bending plate is provided with bending slot, setting below placing groove close to the side of machine table
There is winding roller, winding roller and machine table are rotatablely connected, and the free end of bending plate is connected with rope, machine table between winding roller
Top is provided with hold-down mechanism, and hold-down mechanism includes thread bush, is threaded with threaded rod, threaded rod bottom end in thread bush vertically
It is rotatably connected to pressing plate, pressing plate interval offsets with machine table.
The principle of this programme is：
Placing groove is for placing semiconductor, and bending plate is for realizing the bending of semiconductor pin, and hold-down mechanism is for compressing
Semiconductor in placing groove can be moved down by driving threaded rod to rotate in thread bush by thread bush band dynamic pressure plate,
To compress the semiconductor in placing groove, semiconductor moving influence bending effect during bending is prevented.Semiconductor is in a row
It is placed in placing groove, so that being driven by winding roller take-up curved in the bending plate of the pin insertion machine table two sides of semiconductor
Folded plate rotation, so that the pin being inserted in bending plate is bent, is achieved in the bending of semiconductor pin.
This programme has the beneficial effect that：
1, by the way that semiconductor to be put into placing groove, make to pass through winding roller in the bending slot on its pin insertion bending plate
Take-up drives bending plate to rotate the bending that semiconductor pin can be completed, easy to operate, without human intervention, improves semiconductor
The efficiency of processing.
2, by semiconductor at draining into placing groove, and the pin of all semiconductors is inserted into bending plate, passes through drive
The bending of all semiconductor pins can be realized in dynamic bending plate rotation, realizes the batch machining of semiconductor, all semiconductors
Pin is inserted into same bending plate, can be guaranteed the consistency of all semiconductor pin bending degrees, be improved semiconductor
Quality.
3, setting hold-down mechanism compresses the semiconductor in placing groove above bending mechanism, can prevent semiconductor from bending
During move, ensure that the processing effect of semiconductor.
Further, bending mechanism side is provided with feeding mechanism, and feeding mechanism includes conveyer belt, and the discharging end of conveyer belt is set
It is equipped with feeding passage, feeding passage is connected to placing groove, and sliding is provided with sliding block in feeding passage, and feeding passage is located remote from slot
One end be provided with runner, bias is connected with push rod on runner, and push rod is hinged with sliding block.Conveyer belt is for semiconductor to be delivered to
In feeding passage, runner is for driving push rod to rotate, to reciprocatingly slide in feeding passage with movable slider, sliding block will be for that will send
Semiconductor in material channel is pushed in placing groove, and this completes the conveyings of semiconductor, without human intervention, improve and partly lead
The processing efficiency of body.
Further, bending mechanism is provided with driving mechanism far from the side of feeding mechanism, and driving mechanism includes lever, lever
Limit plate is provided between bending plate, limit plate and lever one end are connected with spring, and the lever other end is connected with driving wheel, main
Driving wheel two sides are respectively arranged with the first driven wheel and the second driven wheel, and driving wheel is alternately nibbled with the first driven wheel and the second driven wheel
It closes, conveyer belt, runner and threaded rod are connect with the first driven wheel, and winding roller is connect with the second driven wheel.First driven wheel is used
In driving conveyer belt, runner and threaded rod rotation, the second driven wheel is for driving winding roller to rotate, and driving wheel is for driving first
Driven wheel or the second driven wheel rotation, by push lever bring it about swing so that driving wheel and the first driven wheel or
The engagement of second driven wheel, spring is used for so that lever resets.It so can be realized feeding mechanism, hold-down mechanism and bending mechanism
The automatic conversion of working condition improves the processing efficiency of semiconductor without human intervention.
Further, sliding is provided with push plate in placing groove, and push plate is connected with mandril, and mandril interval is connected with actively with lever
One end of wheel offsets.Rows of semiconductor can move in placing groove under the promotion of sliding block, and semiconductor moves in placing groove
It is mobile that push plate can be pushed when dynamic, to push mandril mobile, mandril is swung for activation lever, thus driving wheel is driven to move
It is dynamic, without human intervention, improve the processing efficiency of semiconductor.
Further, pressing plate bottom is provided with several fixed links, and several fixations for fixed link insertion are provided in placing groove
Hole.In the fixation hole that fixed link when pressing plate and machine table offset on pressing plate is inserted into placing groove, half is so enabled to
Conductor is fixed more to be consolidated, and the processing effect of semiconductor is further improved.
Further, fixed link is irony, and magnet is provided in fixation hole.Fixed link is adsorbed by magnet, so can
Further increase the fixed effect of semiconductor.
Detailed description of the invention
Fig. 1 is that the present invention removes the front view after feeding mechanism；
Fig. 2 is that the present invention removes the top view after hold-down mechanism.
Specific embodiment
It is further described below by specific embodiment：
Appended drawing reference in Figure of description includes：Bending plate 1, rope 11, bending slot 12, connecting rod 13, pressing plate 14, screw thread
Bar 15, thread bush 16, fixed link 17, push plate 18, placing groove 19, fixation hole 20, magnet 21, machine table 22, winding roller 23, limit
Plate 24, spring 25, lever 26, the second driven wheel 27, driving wheel 28, the first driven wheel 29, mandril 30, feeding passage 31, transmission
Band 32, sliding block 33, push rod 34, runner 35.
As shown in Figure 1, diode bending pins of the present invention mechanism, including bending mechanism, bending mechanism include machine table 22,
Offer placing groove 19 in machine table 22,22 two sides of machine table are mounted on bending plate 1, two bending plates 1 and machine table 22 it
Between be mounted on connecting rod 13, one end of each connecting rod 13 is welded in machine table 22, each 13 other end of connecting rod with bending
Plate 1 is hinged.Each bending plate 1 offers bending slot 12 close to the side of machine table 22.Coiling is installed below placing groove 19
Roller 23, winding roller 23 and machine table 22 are rotatablely connected, and the free end of bending plate 1 is connected with rope 11 between winding roller 23.
Hold-down mechanism is installed, hold-down mechanism includes thread bush 16, is threaded with screw thread vertically in thread bush 16 above machine table 22
Bar 15,15 bottom end of threaded rod are rotatably connected to pressing plate 14, and 14 interval of pressing plate offsets with machine table 22.If 14 bottom of pressing plate is welded with
The fixed link 17 of dry irony, offers several fixation holes 20 being inserted into for fixed link 17 in placing groove 19, in each fixation hole 20
It is mounted on magnet 21.
In conjunction with Fig. 2 it is found that being slidably fitted with push plate 18 in placing groove 19, mandril 30, machine table are connected on rear side of push plate 18
22 rear sides are equipped with driving mechanism, and driving mechanism includes the lever 26 being transversely mounted, 22 left side of 26 left end of lever and machine table
Limit plate 24 is installed, limit plate 24 and 26 left end of lever are connected with spring 25 between bending plate 1.26 right end of lever is connected with master
Driving wheel 28,30 interval of mandril offset with driving wheel 28, and 28 front and rear sides of driving wheel is separately installed with the first driven wheel 29 and
Two driven wheels 27, driving wheel 28 are alternately engaged with the first driven wheel 29 and the second driven wheel 27, conveyer belt 32, runner 35 and screw thread
Bar 15 is connected with belt with the first driven wheel 29, is also connected with belt between winding roller 23 and the second driven wheel 27.Machine table
22 installed in front feeding mechanisms, feeding mechanism include the conveyer belt 32 being transversely mounted, and it is logical that the right side of conveyer belt 32 is equipped with feeding
Road 31, feeding passage 31 are connected to placing groove 19.Sliding block 33, the rotation of 31 outer end of feeding passage are slidably fitted in feeding passage 31
Runner 35 is installed, bias is connected with push rod 34 on runner 35, and push rod 34 and sliding block 33 are hinged.
When being bent using pin of the present invention to semiconductor, external connection power mechanism drives driving wheel 28 to rotate, power
Mechanism uses motor, and when initial, driving wheel 28 is engaged with the first driven wheel 29, and the first driven wheel 29 is driven by belt pass respectively
Band 32, runner 35 and threaded rod 15 is sent to rotate.Semiconductor is placed on transmission with the state that its pin is located at 32 two sides of conveyer belt
On band 32, semiconductor is sent in feeding passage 31 by conveyer belt 32 one by one, and runner 35 drives push rod 34 thereon to rotate, thus
The sliding block 33 connecting with push rod 34 is driven to reciprocatingly slide in feeding passage 31, so that the semiconductor in feeding passage 31 be pushed
To placing groove 19, the semiconductor in placing groove 19 gradually increases and pushes push plate 18 toward moving on rear side of machine table 22, same in this
When, threaded rod 15 rotates in thread bush 16, so that the pressing plate 14 of 15 bottom end of threaded rod be driven to move down.
When push plate 18, which is pushed into, to offset with 19 rear end of placing groove, pressing plate 14 just offsets to compress with machine table 22 and place
Semiconductor in slot 19, the fixed column of 14 bottom of pressing plate is just inserted into the fixation hole 20 on placing groove 19, in fixation hole 20
Magnet 21 adsorbs the fixed column of irony, so that pressing plate 14 preferably compresses the semiconductor in placing groove 19.Simultaneously, with push plate
The mandril 30 of 18 connections just pushes lever 26 to rotate counterclockwise, to drive the driving wheel 28 and the first driven wheel on lever 26
29 are disengaged from and engage with the second driven wheel 27, and conveyer belt 32, runner 35 and threaded rod 15 stop operating at this time, and second
Driven wheel 27 drives winding roller 23 to start turning.Take-up when winding roller 23 rotates pulls two 1 directions of bending plate by rope 11
Machine table 22 rotates, and since the pin of semiconductor is plugged in the bending slot 12 on bending plate 1, and pressing plate 14 compresses semiconductor,
Therefore bending plate 1 is able to drive the pin of semiconductor when rotating that deformation occurs, to realize the bending of semiconductor pin.Using this hair
It is bright that semiconductor pin is completed, the pin of all semiconductors is inserted into bending plate 1, bending plate 1 can be right when rotating
The pin of all semiconductors is bent, and thereby ensures that the consistency of semiconductor pin bending degree.
What has been described above is only an embodiment of the present invention, and the common sense such as well known specific structure and characteristic are not made herein in scheme
Excessive description.It, without departing from the structure of the invention, can be with it should be pointed out that for those skilled in the art
Several modifications and improvements are made, these also should be considered as protection scope of the present invention, these all will not influence what the present invention was implemented
Effect and patent practicability.The scope of protection required by this application should be based on the content of the claims, in specification
The records such as specific embodiment can be used for explaining the content of claim.
Claims (6)
1. diode bending pins mechanism, it is characterised in that：Including bending mechanism, bending mechanism includes machine table, in machine table
Be provided with placing groove, machine table two sides are provided with bending plate, be provided with connecting rod between bending plate and machine table, connecting rod one end with
Machine table is fixedly connected, and the connecting rod other end and bending plate are hinged, and bending plate is provided with bending slot close to the side of machine table, described
Winding roller is provided with below placing groove, winding roller and machine table are rotatablely connected, and the free end of bending plate connects between winding roller
It is connected to rope, is provided with hold-down mechanism above the machine table, hold-down mechanism includes thread bush, is threadedly coupled vertically in thread bush
There is threaded rod, threaded rod bottom end is rotatably connected to pressing plate, and pressing plate interval offsets with machine table.
2. diode bending pins according to claim 1 mechanism, it is characterised in that：The bending mechanism side is provided with
Feeding mechanism, feeding mechanism include conveyer belt, and the discharging end of conveyer belt is provided with feeding passage, feeding passage and the placing groove
Connection, the interior sliding of feeding passage are provided with sliding block, and one end that feeding passage is located remote from slot is provided with runner, and bias connects on runner
It is connected to push rod, push rod and the sliding block are hinged.
3. diode bending pins according to claim 2 mechanism, it is characterised in that：The bending mechanism is far from feeder
The side of structure is provided with driving mechanism, and driving mechanism includes lever, and limit plate is provided between lever and the bending plate, limit
Plate and lever one end are connected with spring, and the lever other end is connected with driving wheel, and driving wheel two sides are respectively arranged with the first driven wheel
With the second driven wheel, driving wheel is alternately engaged with the first driven wheel and the second driven wheel, and the conveyer belt, runner and threaded rod are equal
It is connect with the first driven wheel, the winding roller is connect with the second driven wheel.
4. diode bending pins according to claim 3 mechanism, it is characterised in that：Sliding is provided in the placing groove
Push plate, push plate are connected with mandril, and one end that mandril interval is connected with driving wheel with the lever offsets.
5. diode bending pins according to claim 4 mechanism, it is characterised in that：The pressing plate bottom is provided with several
Fixed link is provided with several fixation holes for fixed link insertion in the placing groove.
6. diode bending pins according to claim 5 mechanism, it is characterised in that：The fixed link is irony, institute
It states and is provided with magnet in fixation hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810909844.6A CN108856567A (en) | 2018-08-10 | 2018-08-10 | Diode bending pins mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810909844.6A CN108856567A (en) | 2018-08-10 | 2018-08-10 | Diode bending pins mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108856567A true CN108856567A (en) | 2018-11-23 |
Family
ID=64318535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810909844.6A Pending CN108856567A (en) | 2018-08-10 | 2018-08-10 | Diode bending pins mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108856567A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109648005A (en) * | 2018-12-28 | 2019-04-19 | 温州易正科技有限公司 | A kind of pin apparatus for bending of electronic component |
| CN109926517A (en) * | 2019-03-21 | 2019-06-25 | 成都凯天电子股份有限公司 | Radial capacitor forming method |
| CN110451001A (en) * | 2019-07-26 | 2019-11-15 | 珠海市赛科自动化有限公司 | A kind of inductive bent detection packaging facilities |
| CN113333628A (en) * | 2021-05-21 | 2021-09-03 | 田文勇 | Pin dog-ear device is used in piezo-resistor production |
| CN113458281A (en) * | 2021-07-06 | 2021-10-01 | 覃利 | Forming machine for semiconductor integrated processing |
| CN114289634A (en) * | 2022-03-09 | 2022-04-08 | 南通皋鑫科技开发有限公司 | Pin bending and forming device of surface mount diode |
-
2018
- 2018-08-10 CN CN201810909844.6A patent/CN108856567A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109648005A (en) * | 2018-12-28 | 2019-04-19 | 温州易正科技有限公司 | A kind of pin apparatus for bending of electronic component |
| CN109926517A (en) * | 2019-03-21 | 2019-06-25 | 成都凯天电子股份有限公司 | Radial capacitor forming method |
| CN109926517B (en) * | 2019-03-21 | 2024-03-26 | 成都凯天电子股份有限公司 | Radial capacitor forming method |
| CN110451001A (en) * | 2019-07-26 | 2019-11-15 | 珠海市赛科自动化有限公司 | A kind of inductive bent detection packaging facilities |
| CN113333628A (en) * | 2021-05-21 | 2021-09-03 | 田文勇 | Pin dog-ear device is used in piezo-resistor production |
| CN113458281A (en) * | 2021-07-06 | 2021-10-01 | 覃利 | Forming machine for semiconductor integrated processing |
| CN113458281B (en) * | 2021-07-06 | 2023-01-13 | 深圳市豪锐科技有限公司 | Forming machine for semiconductor integrated processing |
| CN114289634A (en) * | 2022-03-09 | 2022-04-08 | 南通皋鑫科技开发有限公司 | Pin bending and forming device of surface mount diode |
| CN114289634B (en) * | 2022-03-09 | 2022-05-17 | 南通皋鑫科技开发有限公司 | Pin bending and forming device of surface mount diode |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181123 |